CN101252815B - Solder tray local tin plating method on circuit board - Google Patents
Solder tray local tin plating method on circuit board Download PDFInfo
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- CN101252815B CN101252815B CN 200810027133 CN200810027133A CN101252815B CN 101252815 B CN101252815 B CN 101252815B CN 200810027133 CN200810027133 CN 200810027133 CN 200810027133 A CN200810027133 A CN 200810027133A CN 101252815 B CN101252815 B CN 101252815B
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Abstract
The invention discloses a method for local tinning to the bonding pad on a circuit substrate, which enables lead-free tin plasma to be brushed to the spot welding position bonding pad of the circuit substrate through a steel mesh; the circuit substrate brushed with the lead-free tin plasma passes through the five areas of a reflow soldering machine for operating parameters in sequence, to form liquid tin coating covered in the entire spot welding position bonding pad, and after the circuit substrate cools, solid tin coating is formed in the spot welding position bonding pad. The invention utilizes the steel mesh to brush the lead-free tin plasma to the bonding pad of a common substrate, and utilizes the reflow soldering machine and depends on the wetting property of soldering flux, and the diffusion and the self positioning effect of the tin plasma to accomplish the tinning process of the bonding pad, the tin coating meets the process requirements of the thickness and the smoothness, and provides good basic conditions for the subsequent spot welding working procedure, and the manufacturer does not require to purchase special substrates for the substrate supplier, therefore, the production efficiency can be greatly improved, the qualified rate of the product can be increased, and the production cost of the enterprise can be reduced.
Description
Technical field
The present invention relates to a kind of zinc-plated processing method, particularly a kind of solder tray local tin plating method on circuit board is applied to solder tray local on the substrate is plated the occasion of unleaded pure tin with the means of spot welds enamelled wire.
Background technology
At present, on substrate pads the unleaded pure tin of plating with the welding enamelled wire method still uses is the traditional-handwork way, it is manual ferrochrome welding lacquered wire, its specific operation process is: earlier with enamelled wire broken lacquer in the tin stove, the assembly crewman uses ferrochrome heating tin silk then, utilization adds tin to pad and enamelled wire is welded on the pad, thereby finish enamelled wire is welded to assembly process on the substrate pads, this manual welding method has following shortcoming: 1, traditional handicraft will be operated the broken lacquer of enamelled wire respectively, pad adds the tin program, production stage is more loaded down with trivial details, cause the low of production efficiency, owing to be the whole welding assembling process of manual operation, human factors such as operator's welding operation qualification can influence production efficiency greatly; 2, the operator's is professional directly relevant with welding reliability, higher to welding the higher operator's welding quality of skilled operation degree, and the tin on, the pad even as zinc-plated thickness can wrap up enamelled wire etc. fully, and on the contrary, then welding quality is lower.Professional unevenly make that the welding quality fluctuation is bigger, influence the acceptance rate of product.
In addition, also the method for available spot welding is welded enamelled wire, add man-hour carrying out substrate spot welding, the zinc-plated thickness of some welding position pad reaches 15～25 microns on the technological requirement substrate, just good soldering reliability can be arranged, and the zinc-plated thickness of common substrate that substrate supplier provides is generally 4～10 microns, zinc-plated thickness like this can't reach welding requirements, so manufacturer is often to substrate supplier buying specific substrate, this specific substrate is to have increased special handling procedure in the wicking link, increases zinc-plated thickness.But; increasing zinc-plated thickness is a very special requirement after all concerning the substrate processing industry; substrate supplier is realized very difficulty of this technology; thereby the process-cycle of causing substrate prolongs, processing cost increases; and made substrate substandard phenomenons such as zinc-plated in uneven thickness, coating is thin partially occur through regular meeting, adds man-hour when using this kind substrate to carry out spot welding, and welding reliability is poor; tin on the some welding position pad can not wrap up enamelled wire fully, causes and produces fraction defective up to 10%.
Summary of the invention
The purpose of this invention is to provide a kind of solder tray local tin plating method on circuit board that can enhance productivity, increase the product fine rate and reduce production costs.
Purpose of the present invention realizes by following technical scheme: a kind of solder tray local tin plating method on circuit board, will not have the slicker solder slurry by steel mesh and brush on the some welding position pad of circuit substrate; Brush the circuit substrate that does not have the slicker solder slurry and set five zones of running parameter successively through reflow machine, form the liquid tin coating that is full of whole some welding position pad, after the circuit substrate cooling, on a welding position pad, form solid-state tin coating;
Five zones that described reflow machine is set running parameter are distributed between the inlet and outlet of reflow machine successively, be respectively heating zone A, preheating zone B, soak into district C, molten tin district D and cooling zone E, the temperature of heating zone A rises to 100 ℃ gradually, the temperature of preheating zone B is 100 ℃ to 150 ℃, the temperature of soaking into district C is 150 ℃ to 220 ℃, the temperature of molten tin district D rises between 235 ℃ and 240 ℃, returns and reduce to 220 ℃ from 220 ℃, then enters cooling zone E;
Described steel mesh comprises center steel disc, the framework that is connected with center steel disc periphery, described center steel disc is provided with multicomponent not corresponding to the through hole frame of all pad groups on the substrate, each through hole shaped as frame shape and size are identical with shape, the size of its corresponding some welding position pad, are evenly distributed to few two through holes on the described through hole frame; The gross area of the through hole of described through hole frame is 1/2～2/3 with a welding position bonding pad area ratio.
The present invention utilizes steel mesh will not have the slicker solder slurry and brushes in the pad of common substrate, and utilize reflow machine, by diffusion, the self-aligning effect of scaling powder wetability and tin slurry, finish the zinc-plated process in the pad, strengthen the zinc-plated mechanized operation of pad, improved production efficiency greatly; Because above-mentioned operation major part is to utilize equipment to operate accordingly, the precision of dependence equipment can significantly improve the qualification rate of product, promptly produce the zinc-plated circuit substrate of local pad up to specification, for the operation of using spot welding machine welding enamelled wire later on provides the good basis condition, and the producer need not to substrate supplier buying specific substrate, so that enterprise reduces production costs.
The present invention passes through to set above-mentioned running parameter, and effectively utilizes the diffusion and the self-aligning effect of scaling powder wetability, tin slurry, makes the tin slurry that brushes in the common substrate pads be full of each pad, reaches the thickness and the evenness that satisfy welding requirements.
The present invention is on the steel disc of the center of steel mesh, corresponding to even distribution through hole on the through hole frame of a single point welding position pad locations, when the no slicker solder of brush is starched, no slicker solder slurry can pass through in the through hole inlet point welding position pad, and through hole forms thickness tin even, that have better evenness when evenly distribution is with assurance tin slurry process subsequent handling and starches layer; The through hole gross area is set reaches certain numerical value, after through hot melt and cooling program, be full of whole pad, guarantee welding reliability with the no slicker solder slurry that capacity is arranged.
The described type of cooling adopts natural cooling or air-cooled.
Described through hole be shaped as square, rectangle or circle.
Described center steel plate thickness is 0.1～0.2mm.When the center steel plate thickness was big, promptly through hole was darker, and during brush tin slurry, tin slurry amount is excessive, can cause away the phenomenon of tin; And the center steel disc is when thin, and through hole is more shallow, can cause tin slurry amount too little again, thereby can't satisfy the thickness requirement of welding.
Described cooled solid-state tin coating thickness is 20～25 microns.Tin coating has adequate thickness to guarantee the subsequent handling welding reliability.
Compared with prior art, advantage of the present invention is:
(1). manufacturer need not only to use common substrate to utilize the present invention zinc-plated to substrate supplier buying specific substrate, can obtain to meet the tin thickness of welding requirements, reduces the production cost of enterprise.
(2). the zinc-plated process of the present invention can realize mechanized operation, than manual operations, can significantly improve the quality of tin coating, thereby improves welding reliability, increases the product fine rate.
(3). the present invention finish zinc-plated after, can directly utilize spot welding machine with enamelled wire and solid-state tin coating spot-welded on, thereby finish enamelled wire and be welded to assembly process on the substrate pads, to break lacquer, enamelled wire and the pad welding procedure is disposable finishes, save independent operation program respectively, simplify the loaded down with trivial details operation of prior art, improved production efficiency greatly.
(4). the present invention realizes that cost is lower, has shortened procurement cycle, and manufacturer can be made by own different needs, is convenient to large-scale promotion and application.
Description of drawings
The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
Fig. 1 is the structural representation of steel mesh of the present invention, and place steel mesh on the some welding position pad of circuit substrate this moment, and the through hole frame is corresponding with some welding position pad;
Fig. 2 is the enlarged diagram of F among Fig. 1;
Fig. 3 is brushed with the temperature-time variation of the circuit substrate of no slicker solder slurry through five temperature provinces of reflow machine
Curve chart.
Among the figure, 1-center steel disc, 2-framework, 3-through hole frame, 4-point welding position pad, 5-through hole.
Embodiment
A kind of solder tray local tin plating method on circuit board of the present invention may further comprise the steps: will not have the slicker solder slurry by steel mesh and brush in the some welding position pad of circuit substrate; Brush the circuit substrate that does not have the slicker solder slurry and set five zones of running parameter successively through reflow machine, form the liquid tin coating that is full of whole some welding position pad, after the circuit substrate cooling, in a welding position pad, form solid-state tin coating.
The foregoing circuit substrate be select for use material be FR-4 cover the no slicker solder printed circuit board (PCB) of copper plating; Pad refers to that the corresponding metal covering that exposes out in components and parts position is placed in design on the substrate, it is zinc-plated, and some welding position pad refers to the pad locations that need use spot-welding technology to process, and above-mentioned lead-free tin cream composition is the paste solder of Sn96.5%, Ag 3%, Cu 0.5%.
As Fig. 1, shown in Figure 2, above-mentioned steel mesh comprises center steel disc 1, the framework 2 of center steel disc periphery, the center steel disc is provided with multicomponent not corresponding to a through hole unit of welding position pad group, every group of through hole unit is made up of the through hole frame 3 of eight corresponding points welding position pads 4, the size of a single point welding position pad 4 that the size of each through hole frame 3 and shape are corresponding with it, shape is identical, be positioned at four rectangular through holes 5 that evenly distribute on the through hole frame 3, the gross area of this through hole 5 is 1/2～2/3 of welding position pad 4 areas, the thickness of steel mesh center steel disc 1 is 0.1～0.2mm, when the no slicker solder of brush is starched, no slicker solder slurry enters on the some welding position pad of circuit substrate by above-mentioned four through holes 5, four no slicker solder slurries have so evenly distributed on a pad, these tin slurries will evenly spread on the pad, form uniform liquid tin coating, the solder mask that is provided with around each some welding position pad 4 can not flow in the adjacent pad no slicker solder slurry, can prevent away the tin phenomenon; The suitable depth of center steel disc 1 guarantees that the tin slurry amount of being brushed can be inexcessive, also can be not very few.
In addition, the shape of through hole 5 can also be shapes such as square or circle, and the number of through hole 5 also can be two, three or five etc., determines according to the different sizes of pad.
As shown in Figure 3, five zones that reflow machine is set running parameter are distributed between the inlet and outlet of reflow machine successively, be respectively heating zone A, preheating zone B, soak into district C, molten tin district D and cooling zone E, the temperature of heating zone A rises to 100 ℃ gradually, the temperature of preheating zone B is 100 ℃ to 150 ℃, the temperature of soaking into district C is 150 ℃ to 220 ℃, the temperature of molten tin district D rises between 235 ℃ and 240 ℃ from 220 ℃, return again and reduce to 220 ℃, then enter cooling zone E, brushing the circuit substrate that does not have the slicker solder slurry is positioned on the conveyer belt, pass through above-mentioned five zones successively according to the transfer rate of 65cm/min, circuit substrate did not wait through each regional time, in transport process, liquid state on the circuit substrate in the some welding position pad does not have the slicker solder slurry by the scaling powder wetability, the diffusion and the self-aligning effect of tin slurry, make the dissolving of tin slurry and form the tin coating metallurgical structure that is full of whole some welding position pad, above-mentioned self-aligning effect is meant that the solder mask on the substrate is located at around the welding position pad, and its effect is can not overflow to periphery after making no slicker solder slurry enter pad and dissolving.
At above-mentioned cooling zone E, circuit substrate is natural cooling gradually, forms solid-state tin coating in a welding position pad, and this solid-state tin coating thickness is 20～25 microns, can satisfy the thickness and the evenness of welding requirements; In addition, also can adopt air cooling way to cool off, the cooling procedure of accelerating circuit substrate shortens Production Time.
The above zinc-plated operation of the present invention has guaranteed to have the zinc-plated thickness that meets welding requirements on some welding position pads, subsequent handling is to use existing spot welding machine, after the transient current of having set spot welding machine and pressure parameter, with enamelled wire and solid-state tin coating spot-welded on, thereby finish enamelled wire and be welded to assembly process on the substrate pads, realize mechanical spot-welded on, enamelled wire breaks lacquer, pad adds steps such as tin and need not operate separately, has simplified the loaded down with trivial details operation of prior art.
Finish a postwelding, tin can wrap up enamel-covered wire fully, the reliability height of welding, after tested, after employing the inventive method is zinc-plated, carry out again the spot-welded on operation, the fraction defective of welding only has 0.6%, and the fraction defective 10% that welds than prior art has had very significant raising.
Claims (5)
1. a solder tray local tin plating method on circuit board is characterized in that: will not have the slicker solder slurry by steel mesh and brush on the some welding position pad of circuit substrate; Brush the circuit substrate that does not have the slicker solder slurry and set five zones of running parameter successively through reflow machine, form the liquid tin coating that is full of whole some welding position pad, after the circuit substrate cooling, on a welding position pad, form solid-state tin coating;
Five zones that described reflow machine is set running parameter are distributed between the inlet and outlet of reflow machine successively, be respectively heating zone A, preheating zone B, soak into district C, molten tin district D and cooling zone E, the temperature of heating zone A rises to 100 ℃ gradually, the temperature of preheating zone B is 100 ℃ to 150 ℃, the temperature of soaking into district C is 150 ℃ to 220 ℃, the temperature of molten tin district D rises between 235 ℃ and 240 ℃, returns and reduce to 220 ℃ from 220 ℃, then enters cooling zone E;
Described steel mesh comprises center steel disc, the framework that is connected with center steel disc periphery, described center steel disc is provided with multicomponent not corresponding to the through hole frame of all pad groups on the substrate, each through hole shaped as frame shape and size are identical with shape, the size of its corresponding some welding position pad, are evenly distributed to few two through holes on the described through hole frame; The gross area of through hole is 1/2～2/3 with its corresponding points welding position bonding pad area ratio on the described through hole frame.
2. solder tray local tin plating method on circuit board according to claim 1 is characterized in that: the described type of cooling adopts natural cooling or air-cooled.
3. solder tray local tin plating method on circuit board according to claim 1 is characterized in that: described through hole be shaped as square, rectangle or circle.
4. solder tray local tin plating method on circuit board according to claim 1 is characterized in that: described center steel plate thickness is 0.1～0.2mm.
5. solder tray local tin plating method on circuit board according to claim 1 is characterized in that: described cooled solid-state tin coating thickness is 20～25 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810027133 CN101252815B (en) | 2008-03-31 | 2008-03-31 | Solder tray local tin plating method on circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810027133 CN101252815B (en) | 2008-03-31 | 2008-03-31 | Solder tray local tin plating method on circuit board |
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| CN101252815A CN101252815A (en) | 2008-08-27 |
| CN101252815B true CN101252815B (en) | 2010-06-09 |
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| CN 200810027133 Expired - Fee Related CN101252815B (en) | 2008-03-31 | 2008-03-31 | Solder tray local tin plating method on circuit board |
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| CN102548244A (en) * | 2010-12-22 | 2012-07-04 | 联合汽车电子有限公司 | Assistant welding structure |
| CN102285259B (en) * | 2011-07-11 | 2014-07-09 | 淳华科技(昆山)有限公司 | Solder mask printing method for soft type printed circuit board |
| CN102625556B (en) * | 2012-03-24 | 2015-05-13 | 福州美美环保科技有限公司 | Novel atmospheric-pressure plasma discharge device |
| CN102689065B (en) * | 2012-06-05 | 2015-08-19 | 深圳珈伟光伏照明股份有限公司 | A kind of welding method of circuit board element |
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| CN105555055A (en) * | 2015-12-10 | 2016-05-04 | 深圳崇达多层线路板有限公司 | Welding method of SMD electrolytic capacitor |
| CN105643037A (en) * | 2016-03-22 | 2016-06-08 | 东莞洲亮通讯科技有限公司 | Welding process used for passive device |
| CN105813401B (en) * | 2016-05-16 | 2018-07-24 | 浪潮电子信息产业股份有限公司 | A kind of SMT steel meshes windowing design method of VGA connector |
| CN106061136A (en) * | 2016-08-08 | 2016-10-26 | 无锡宇宁智能科技有限公司 | Steel mesh structure used for electronic component reflow soldering |
| CN106231813A (en) * | 2016-09-28 | 2016-12-14 | 伟创力电子技术(苏州)有限公司 | A kind of one side the most empty method of backflow of dual platen |
| CN110449683B (en) * | 2019-07-31 | 2021-02-09 | 嘉兴军胜电子科技有限公司 | High-reliability printed circuit board assembly QFN (quad Flat No lead) assembling and welding pretreatment method |
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|---|---|---|---|---|
| CN1047603A (en) * | 1990-07-07 | 1990-12-05 | 梁植林 | The manufacture method of printed substrate |
| US5806753A (en) * | 1995-12-22 | 1998-09-15 | International Business Machines Corporation | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier |
| US6179200B1 (en) * | 1999-02-03 | 2001-01-30 | Industrial Technology Research Institute | Method for forming solder bumps of improved height and devices formed |
| CN2838958Y (en) * | 2005-10-28 | 2006-11-22 | 上海环达计算机科技有限公司 | Tin paste printer |
-
2008
- 2008-03-31 CN CN 200810027133 patent/CN101252815B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047603A (en) * | 1990-07-07 | 1990-12-05 | 梁植林 | The manufacture method of printed substrate |
| US5806753A (en) * | 1995-12-22 | 1998-09-15 | International Business Machines Corporation | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier |
| US6179200B1 (en) * | 1999-02-03 | 2001-01-30 | Industrial Technology Research Institute | Method for forming solder bumps of improved height and devices formed |
| CN2838958Y (en) * | 2005-10-28 | 2006-11-22 | 上海环达计算机科技有限公司 | Tin paste printer |
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