CN101366323A - 柔性载体上的接线盒 - Google Patents

柔性载体上的接线盒 Download PDF

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CN101366323A
CN101366323A CN200680050026.0A CN200680050026A CN101366323A CN 101366323 A CN101366323 A CN 101366323A CN 200680050026 A CN200680050026 A CN 200680050026A CN 101366323 A CN101366323 A CN 101366323A
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flexible substrate
contactor
terminal box
contact element
conducting strip
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J·D·威廉姆斯
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Neoconix Inc
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Neoconix Inc
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0311Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
    • H05K2201/0397Tab
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10378Interposers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49156Manufacturing circuit on or in base with selective destruction of conductive paths
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218Contact or terminal manufacturing by assembling plural parts with deforming
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Abstract

本发明涉及一种柔性、可扩展、热机电的柔性接线盒。在一种构造中,该柔性接线盒包括柔性衬底、第一导电层和第二导电层、以及连续涂覆在导电层和衬底通孔上的镀层。第一导电层和第二导电层粘附到柔性衬底的相对两侧,并且具有与至少一子组通孔相匹配的多个凸起的接触元件。第一导电层和第二导电层上彼此相对的至少一些接触元件通过镀层彼此电连通。

Description

柔性载体上的接线盒
该专利申请要求在2005年11月3日提交的、序列号为11/265,205的美国专利申请的优先权,在此通过引用并入该申请的全部内容。
技术领域
本发明涉及接线盒,更具体地说,涉及一种构筑在柔性载体上的柔性(compliant)、可扩展、热机电可再连接和可再安装的接线盒。
背景技术
用来连接诸如印刷电路板等组件的传统接线盒可以通过多种技术制造。一种常用的方法是利用冲压金属弹簧,冲压金属弹簧被形成然后分别插入到绝缘载体中形成一组电子连接元件。绝缘载体通常由刚性的非导电材料制成。另一种制造接线盒的方法包括利用各向异性的导电胶粘剂、注塑导电胶粘剂、束状电线导电元件和通常在刚性载体中、的金属小固体件。
在电子工业中二维的柔性电路是容易获得而且广为公知的。例如,可以利用柔性电路的通常应用领域有手机、板对板连接器(boardto board)和平板显示器中。
柔性电路通常用来在柔性载体材料内传送低速和高速的信号。为了访问内部信号,必须通过一系列通路孔(via)或者通过表面安装的焊盘和/或连接器连接到它们。
随着系统密度和性能的提高,对相互连接也提出了更严格的要求。优异电性能的一种表现在于热特性和信号完整性的改善。这可以通过将相互连接设计为允许将热平面或材料直接设计在插件(interposer)或载体上来实现。然后可以将这些零件直接与接触元件相连。对于增加其它电路和/或直接放置在插件上或内部嵌入到插件中的分立元件可以给出类似的观点。
附图说明
图1是示出柔性材料上多个连接盘(land)栅格阵列结构的示意图。
图2是例示了一种示例性连接盘栅格阵列接触器阵列的接触臂的放大截面图的示意图。
图3A至图3D是不同的示例性接触臂设计的放大立体图的示意图。
图4是根据本发明一种构造的接线盒的分解立体图的示意图。
图5A至图5D是示出了根据本发明一个方面的制造接线盒的示例性步骤的流程图。
图6是根据图5A至图5D中所示的方法制造的示例性叠层(stackup)中每一层的示意图。
具体实施方式
本发明提供了一种构筑在柔性衬底上的柔性、可扩展、热机电的接线盒,另一方面,本发明公开了该接线盒的制造方法。在采用薄的柔性衬底时,本发明提供了一种接线盒,它的柔度不仅来源于弹性接触器本身,还来源于安装接触器的柔性衬底。接线盒的总柔度等于接触器柔度与衬底柔度之和。利用柔度的提高,接线盒能够更好地容纳与之匹配的不均匀的接触器阵列。通过这种方式,可以在柔性载体或电路实现中获得期望的接线盒特性。
接线盒利用了柔度复合体系(C1+C2),C1代表薄的柔性绝缘衬底的柔度,C2代表形成在衬底上的柔性接触器阵列的柔度。这种由柔性衬底提供的附加柔度使得结合面阵列表现得如浮动的接触器阵列。与构筑在刚性衬底上的接触器相比,该方法使整个体系的弯曲性或柔度有了显著提高。
本发明利用薄的柔性衬底还避免了在衬底上预镀通孔的需要。实际上,衬底厚度的减小使得两个电路之间电接口的数量最少。由于衬底两侧上的接触器阵列相距很近,仅由薄的衬底分隔开,所以能够在将接触器阵列粘合在衬底上之后再对整个组件进行镀覆,从而形成单体(monolithic)结构。与预镀通孔相比,这种方法能够使接触器中材料的堆积最少。这种材料堆积会使接触器比期望的要硬,从而导致柔度的降低。
根据本发明的一个方面,一种示例性接线盒包括利用诸如丙烯酸的低流动性的胶粘材料接合到接触片的薄柔性KaptonTM衬底。接触片上和衬底上相对应的孔在尺寸是相互匹配的,从而提供可以收集多余胶粘剂的区域。
本发明的另一个方面提供了如下一种方法,该方法通过利用顶面和底面使得能够安放接触元件的表面积最大,从而提高总接触密度或减小间距。本发明提供了一种具有高密度排列(这里也指“密间距”,即最相邻接线盒中心之间相距的距离)的可变形接触器的接线盒,在近似低电阻和电感即分别小于15mΩ和0.5nH的条件下,接触器的工作距离大于0.2mm。
申请号为10/412,729的专利中描述了本发明中的接触器的典型机械和电特性,这些特性包括:工作范围大于5密耳(mil),接触力小于30g,具有水平和垂直分量的滑触作用(wiping action)确保了可靠度,耐久性超过十万次循环,可工作温度高于125℃,电感小于0.3nH,载流量大于1.5A,可扩展间距小于20密耳,整个工作范围的功能弹性与间距之比为0.4至0.8。申请号为10/412,729的专利还描述了制造接触器和接线盒的多种方法。
申请号为10/412,729的专利中所描述的接触器的位移范围(弹性)近似为0.12mm至0.4mm。所描述的法兰弹簧的尺寸范围近似为0.12mm至0.8mm。因此,弹性与尺寸之比近似为0.5至1.0。
按照本发明,柔性载体提供了额外的工作范围柔度。如上所述,衬底弯曲性和接触器弹性的结合,使得接线盒更加适用于非共面的情况。照这样,例如,彼此定位在不同平面上的第一接触元件阵列和第二接触元件阵列就能够共用同一柔性衬底。
柔性载体的适合衬底包括但不限于:厚度为0.5至5密耳的KaptonTM聚酰亚胺,厚度为2至5密耳的MylarTM聚酯,环氧树脂,以及TelfonTM
图1示出了按照本发明的一个方面的示例性构造,其具有附于理想使用点上的连接盘栅格阵列(LGA)结构90。在这个示例中,LGA结构90被集成到柔性电路100中。照这样,任何内电路都能够直接连接到内信号层。因此,与传统方法相比,该构造提供了以下形式的电子效益:i)屏蔽接触器,ii)匹配阻抗,和iii)贯穿接线盒的匹配电子线路(trace)长度。
图2示出了按照本发明的一个方面的示例性接线盒200的截面图,其中示出了接触元件202的某些示例性尺寸部分。例如,面向弹簧部分204的远端之间的间距为5密耳。例如,接触元件202从柔性衬底100的表面到弹簧部的顶部的高度为10密耳。例如,柔性衬底100上通路孔的宽度大约为10密耳。例如,接触元件202从一个基体部外端到另一个基体部外端的宽度为16密耳。这种尺寸的接触器能够按照如下所述的本发明的方法而形成,从而使接线盒的间距确实低于50密耳且大约为20密耳或更小。
按照本发明的一个方面,一个或一组接触元件的机械性能可以通过特定的设计获得期望的工作特性。例如,可以选择每个接触元件的触点压力,以确保对某些接触元件的低电阻连接,或使接线盒的总触点压力较低。再例如,每个接触元件的弹性工作范围是能够变动的。还例如,每个接触元件的垂直高度是能够变动的。再例如,接触元件的间距和水平方向上的尺寸也是能够变动的。
图3A至图3D例示了球形栅格阵列(BGA)或LGA系统设计的示例性接触臂。如上所述,这些接触器可以采用与PCB制造中用于制造类弹簧结构相类似的工艺来形成,而且可以在形成前或形成后对接触器进行热处理。
图4是示出了按照本发明的一种构造的示例性接线盒400的组装的分解立体图。接线盒400包括位于衬底404的第一主要表面上的第一阵列接触元件402,和位于衬底404的第二主要表面上的第二阵列接触元件406。衬底404可以由KaptonTM制成,其可获为夹在两层丙烯酸404b之间的一层Kapton 404a的叠层,其中丙烯酸层用作将接触元件402和406与Kapton层404a结合在一起的胶粘剂。每一组对应的接触元件402和406优选地与由衬底404限定的通孔408对准。如下所详述的,衬底404上的通孔408优选地不是预镀的。
图4的分解图示出了制造过程的中间步骤时的接线盒400。因此,图4示出了在其所形成的金属片或金属材料片上连接在一起的接触元件阵列402和406。接下来的制造步骤是对这些片进行构图,并除去不需要的部分,使得根据需要隔离(即单立(singulate))接触元件。例如,可以对金属片进行掩模并蚀刻,从而使部分或全部接触元件单立出来。
在本发明的一个方面中,如下地形成接线盒。首先,提供柔性介电衬底404,其具有一阵列通孔408。虽然能够在衬底404的顶面和底面之间的通孔408中预镀导电通路,但是这种预镀是不必要的。实际上,由于柔性衬底404的厚度的最小化,所以接触元件402和406分别粘附在衬底404的两面上时它们彼此相距很近,由此在接下来的镀覆工艺中能够很方便地将它们连接。在一个示例中,衬底404是两面涂覆有丙烯酸层的KaptonTM
与衬底404上的一阵列通孔408相对应地,对导电金属片或多层金属片进行构图,从而形成包括基部和一个或多个弹性部分的接触元件402和406的阵列。包括弹性或弹簧部分的接触元件可以通过蚀刻、冲压或其它方法形成。利用例如与柔性介电衬底404本身一体设置的丙烯酸层将金属片202附至该衬底的第一主表面。在要包括第二组接触元件的情况下,类似地对第二导电金属片或多层金属片406进行构图,并将其附至柔性介电衬底404的第二主表面。然后可以对金属片进行构图以通过化学方法除去片上不需要的金属,从而接触元件按照需要相互隔开(即单立)。可以通过蚀刻、划刻(scribe)、冲压或其它方法来对金属片进行构图。
在一另选构造中,可以在包括经构图的接触元件的金属片附到与柔性介电衬底之后形成弹性部分的突起。在另一另选构造中,可以在接触元件形成之前除去金属片上不需要的部分。同样地,也可以在金属片附到衬底404之前除去金属片上不需要的部分。
在对金属片402和406构图从而形成单独的接触元件并层压至柔性衬底404之后,就可以对整个结构进行镀覆(例如,通过化学镀)以在通孔408中形成导电线路(trace),从而经由通孔408并越过该短距离将接触元件连接到柔性介电衬底404另一侧上对应的端子。照这样,本发明就能够避免为了形成经由通孔408的导电线路而对衬底404进行预镀所额外消耗的时间和费用。在最终的组装中,经由通孔408的金属线路将第一主表面的接触元件连接到第二主表面的相对的接触元件,从而形成一种单体结构。
可选择地,如图4所示,可以按照环绕每个通孔408的环形图案在衬底404表面预形成导电线路410。这种导电环410能够增强金属片上的接触元件与形成在衬底404中的导电线路之间的电子连接。
正如本领域普通技术人员所应当理解的,上述形成图4中的接线盒400的方法可以用作许多不同的制造工艺的一部分,这些制造工艺例如根据特殊应用的需要进一步镀覆。例如,如下将详述的,在将衬底404(没有预镀的)与片402和406层压在一起、对片402和406进行化学单立、并对整个结构进行镀覆使片402和406上对应的接触元件连接在一起之后,可以再对该结构进行附加的镀覆(如硬质金或软金)以满足特定的性能要求(例如,接触精加工要求)。因此,尽管这里描述的是特定的方法,但应理解本发明可广泛适用于任何能够从避免对衬底上的通孔进行预镀的方法或构造中受益的任何应用。
为了例示本发明的一种示例性实施过程,图5A至图5D的流程图概述了形成接触元件的示例性方法500。方法500还涉及利用掩模、化学蚀刻、成形和层压技术成批制造接触元件。方法500生产能够用于诸如插件的可分离接线盒中的多个高度设计的电子接触器。或者,接触器可以直接集成到衬底成为连续线路,其然后用作永久性板载接线盒。但是,与利用附加的掩模或蚀刻步骤形成三维弹簧部分不同,它们是按平面阵列制造的,然后再成形为三维形状。
如图5A所示,方法500开始于步骤502,在该步骤中,为接触片选择基体弹簧材料,例如铍铜合金(Be-Cu)、弹簧钢、磷青铜、或者任何其它具有合适机械性能的材料。恰当选择材料能够将接触元件制造为具有期望的机械和电子性能。选择基体材料需要考虑的一个因素是材料的工作范围。在这里,工作范围是指在满足预定的性能指标情况下可变形的接触部分能够机械地发生位移的位移范围,其中性能指标包括但不限于诸如弹性和空间记忆性的物理特性以及诸如电阻、阻抗、电感、电容和/或弹性行为的电子特性。例如,假设期望的接触电阻小于20毫欧姆,最大的容许接触荷载为40克。如果接触元件在10克的荷载下达到低于20毫欧姆的电阻范围,然后继续加载直到针对梁元件最大荷载为40克,同时保持电阻低于20毫欧姆,则接触器的荷载挠度为10g至40g。挠度和最大电阻的范围就是接触器的工作范围。
可选地,在步骤504中,在后续工序之前对片进行热处理。是否在工艺中的这一点处对片进行热处理取决于针对片所选的材料的类型。热处理通过从Cu基体固相淀积在Be上提高了基体弹簧材料的屈服应力,从而为形成接触器提供期望的机械性能。
在步骤506中,对接触元件进行设计并复制为阵列形式,以用于成批处理。一个阵列中接触器的数量是经过设计选择的,可以从接触器库中挑选,该数量可以按照接线盒的需要而改变。阵列被复制成平板(panel)形式,类似于半导体晶片上的芯片或模块(die),从而得到适于成批处理的可扩展设计。当接触器的设计完成(通常在CAD制图环境中)之后,该设计被移至Gerber格式,Gerber格式是一种转换器,它能够将待移送至制造设备的设计生成要在后续步骤中使用的主滑动触头(slide)或薄膜。
光刻技术的应用使得在平板上可以安放高密度的接触器,因此平板形式能够遍布在一个与大量接触器之间的任何地方。这种高密度的接触器优于现有方法之处在于能够利用成批工艺化学地单立接触器,而不必对单个接触器分别进行冲压和成形。方法500可以一次完成对大量接触器的构图、显影和蚀刻。
在步骤508中,对片的两面涂覆光抗蚀薄膜。干膜用于尺寸为1至20密耳的较大零件,而液体抗蚀膜用于尺寸小于1密耳的零件。
在步骤510中,利用步骤506所限定的图形,将片的顶部和底部均曝于紫外(UV)光下,然后进行显影以在抗蚀膜中限定出接触器件。希望蚀刻掉的部分就不用掩模来防护了。利用光刻工艺限定接触元件使得能够以精细分辨率来印制线,这与半导体制造工艺中所发现的类似。
在步骤512中,在针对所用材料特别选定的溶液中对片进行蚀刻。针对片所选用的每一种特定材料都有着与之相关的特定的蚀刻化学性,从而提供最佳的蚀刻特性,如蚀刻率(即,溶液完成蚀刻的效果和快慢)。这对处理量非常重要。选择的蚀刻剂还会对其它特征产生影响,如侧壁的轮廓,或者在截面图上观察到的零件的直线度。在方法500中,采用了工业中常见的化学试剂,如氯化铜、氯化铁和硫酸(sulfuric hydroxide)。经过蚀刻后,在步骤514中,抗蚀膜防护层在脱模工艺中被除去,片上只留下蚀刻后的部分。
在步骤516中,基于在步骤506中限定的图形设计成批成形工具。在一种构造中,成批成形工具包括多个排列成阵列形式的球轴承,优选地为设置在支承表面的一组开口中的多个球轴承。球轴承可以具有不同的尺寸,以对接触器施加不同大小的力,从而使同一平板上的接触器具有不同的机械特性。球轴承的曲率用于推动法兰远离片平面。可以采用其他的成形工具构造来形成不同的接触器形状。在步骤518中,通过对片应用成形工具使接触器法兰在三个轴向上成形,从而在成批处理中制造出期望的接触元件。
可选地,在步骤520中,对片进行热处理,以消除成形工艺中产生的应力区域。与步骤504相同,热处理取决于对片所选用的材料。可以依据要在片上限定的接触器的材料和尺寸进行热处理,以期获得最佳成形条件所期望的物理性能。
在步骤522中,对片进行表面处理,以提高后续的层压工艺的粘附性能。如果粘附不够充分,片就有可能从衬底上脱离或分层。表面处理的方法有多种,包括微细蚀刻和黑氧化处理。微细蚀刻用于使片的表面凹凸不平,从而有效地创造出更大的表面积(通过使表面粗糙和凹陷),以获得更好的粘附性能。
在压制之前,在步骤524中,包括组合的低流动性胶粘材料和柔性介电内层(例如,丙烯酸-Kapton-丙烯酸夹层结构)的衬底设置有孔,这些孔与法兰元件对准且置于其下面。按照本发明的一个重要方面,优选地,该衬底是没有预镀的,即在孔中没有导电线路。
在压制/层压过程中,多余的胶粘材料会流出到法兰上,这会使接触性能发生变化,从而导致接触元件不能满足电子和机械应用的需要。如果发生了这种不期望的流出,可以利用如O2等离子体去掉层积胶渣。另选地或另外地,可以将衬底上孔的做得比法兰下铜片上的开口的直径稍大一些,从而提供多余的胶粘剂可流入的排泄区。通过这种构造,例如,即使有一些丙烯酸从Kapton和铜片之间漏出,但是多余的丙烯酸也不会接触到法兰本身,因此不会改变它们的性能。在任何情况下,在镀覆之前都可以通过清理或去胶渣步骤来确保任何多余的流体都被除去了。
图6示出了按照步骤526的层压工艺中生成的示例性叠层的每一层。这种排列也可以改变为将接触元件作为内层插入。层1是顶部压板材料。层2是间隔材料,其具有位于弹簧接触元件之上的排泄孔。层3是释放(release)材料,其具有位于弹簧接触器之上的排泄孔。层4是成形接触片的顶片(如图4的402)。层5是胶粘材料(如图4的丙烯酸404b),优选地,其具有位于弹簧接触器之下的排泄孔。层6是介电内层(如图4的404a),其具有位于弹簧接触器之下和之上的排泄孔。层7是胶粘材料(如图4的丙烯酸404b),优选地,其具有位于弹簧接触器之上的排泄孔。层8是成形接触元件的底片(如图4的406)。层9是释放材料,其具有位于弹簧接触器之下的排泄孔。层10是间隔材料,其具有位于弹簧接触元件之下的排泄孔。层11是底部压板材料。
在步骤528中,优选地在使胶粘材料达到期望的粘度和流动状态的温度条件下对上述叠层进行压制。在该操作过程中,顶部和底部的接触片与内层介电材料接合在一起。在冷却一段时间后,在步骤530中,与压板上除去该叠层,留下包括如图6所示的层4至层8的平板。
在步骤532中,对平板表面和开口进行镀覆以电连接起顶部法兰和底部法兰。这种镀覆,如无电镀工艺,能够连续地淀积导电材料在顶面上、淀积到通孔以将两片接触元件连接在一起、并能进一步淀积至衬底另一侧的片上,从而形成一种单体结构。镀覆工艺为电流从板的一侧传递到另一侧创造了通路。可以考虑接线盒元件预计要承载的载流量来选择镀覆厚度。
接着,在步骤534中,在平板的两侧都涂覆上抗蚀膜。在步骤536中,对图案进行曝光和显影,从而限定出单独的接触元件。在工艺中的这一点处,形成了诸如接线盒400的接线盒,其具有通过镀孔与第二接触器阵列相连的第一接触器阵列。按照接线盒预计的应用需要,接线盒可以在这一步中单立出来,而不必进行进一步的镀覆。
但是,为满足特别的应用要求,方法500也可以继续并进行进一步的镀覆。因此,在步骤538中,确定适合的接触器抛光材料(finish)类型,例如硬金或软金。硬金通常用在要求插入次数高的领域,如测试插座。硬金本身具有杂质,这使得它更耐久。软金是纯金,所以其实际上不含杂质,通常用在插入次数相对较少的PCB或网络空间中。例如,PC中使用的壳到板插座(软金)通常能够插入1至20次,而使用硬金的其它技术通常能够插入10至1000000次。
如果接触器抛光材料为硬金,则在步骤534中将涂覆抗蚀膜以覆盖平板的两侧。然后在步骤548中,通过硬金工艺对平板进行电解Cu/Ni/Au镀覆。
在步骤550中除去抗蚀膜,然后在步骤552中利用例如电解Ni/Au作为硬质掩模来对整个平板进行蚀刻,从而完成对接触器阵列的单立。在步骤554中,在平板上规划出最终的插件轮廓,将平板分隔成单个的接线盒阵列。方法500结束于步骤556。
如果在步骤538中确定使用软金抛光,则在步骤560中利用蚀刻完成对接触元件的单立。通过步骤562中的脱模工艺将抗蚀膜除去。在步骤564中,将还公知为软金的无电镀Ni/Au镀覆在平板上,从而覆盖接触元件覆盖。在步骤554中,在平板上规划出最终的插件轮廓,将平板分隔成单个的接线盒阵列。方法500结束于步骤556。
软金抛光工艺在镀覆前将接触器单立出来。Ni/Au只镀覆在金属表面,并为接触元件提供密封结构。这有助于防止可能发生在接触器系统寿命中的潜在的腐蚀活动,因为金实质上是惰性的。镀覆前单立是用另一种金属对铜接触器进行隔离或封装,从而获得更清楚的成像和更清洁的接触器,这样降低短路的倾向。
按照本发明的其他构造,接线盒设置有具有不同工作性能的接触元件。也就是说,接线盒能够包括异质接触元件,其中这些接触元件的工作性能可以根据期望应用的需要进行选择。接触元件的工作性能是指接触元件的电子、机械,和可靠性能。通过将具有不同电子和/或机械性能的接触元件相结合,可以将接线盒制作为满足高性能互连应用的所有电子、机械和可靠性的严格要求。
按照本发明的另一种构造,通过选择形成接触器和通孔的材料、尺寸、间距热处理等,可以针对一个或一组接触元件具体设计电子性能以实现期望的特定工作特性。例如,每一个接触元件的DC电阻、RF干扰、阻抗、电感和载流量主要随着材料选择和机械性能而改变。因此,可以将一组接触元件设计为具有较低的电阻或具有低的电感。接触元件也可以被设计为在诸如热循环、热冲击和振动、腐蚀测试以及湿度测试的环境压力下不出现性能劣化或性能劣化很小。接触元件也可以被设计成满足由工业标准制定的其他可靠性要求,例如由电子工业联盟(EIA)所制定的标准。
接触元件的机械和电子性能可以通过改变下列设计参数来调整。首先,接触元件弹簧部分的厚度可以选择为提供期望的接触力。例如,当厚度约为30微米时,通常只能提供大约10克以下的小接触力;而当法兰厚度为40微米时,在同样的位移下可以提供20克的较大的接触力。也可以选择弹簧部分的宽度、长度和形状以提供期望的接触力。
其次,还可以选择接触元件所包含的弹簧部分的数量以获得期望的接触力、期望的载流量以及期望的接触电阻。例如,弹簧部分的数量加倍使得接触力和载流量大致加倍,同时将接触电阻大致减半。
第三,弹簧部分的形状也是可以设计的,以提供一定的电子和机械性能。可以通过调整弹簧的高度或基体上凸起的数量来提供期望的电子和机械性能。
本发明的可扩展性并未受限,并且可容易地适用于由于三维地形成接线盒元件而采用的光刻技术和简单的加工模具带来的生产。
出于例示和说明的目的给出了上述公开内容。并非旨在穷举或将本发明限于所公开的具体形式。本领域技术人员根据以上公开将理解还能有多种改变和变型。本发明的范围仅由所附权利要求及其等同物来限定。
此外,在本发明的描述中,说明书将本发明的方法和/或工艺介绍为特定顺序的步骤。但是,由于该方法或工艺并不依赖于这里提出的步骤的特定顺序,因此该方法或工艺不受限于所描述步骤的特定顺序。如本领域技术人员将理解的,其它顺序的步骤也是可行的。因此,说明书中提出的步骤的特定顺序并不对权利要求构成任何限制。另外,致力于本发明的方法和/或工艺的权利要求在书面顺序上并不受限于步骤的性能,本领域技术人员容易理解,在不脱离本发明的精神和范围的情况下,可以对顺序进行改变。

Claims (43)

1.一种柔性接线盒,包括:
柔性衬底,其具有第一表面和第二表面,该柔性衬底限定了从所述第一表面到所述第二表面的多个通孔;
第一导电层,其粘附到所述柔性衬底的第一表面上;
第二导电层,其粘附到所述柔性衬底的第二表面上,
第一导电层和第二导电层中的每一个都具有多个凸起的接触元件,这些接触元件与所述多个通孔中的至少一子组通孔相匹配;以及
镀层,其连续地涂覆在第一导电层、柔性衬底上的多个通孔、和第二导电层上,以使第一导电层和第二导电层上彼此相对的至少一些接触元件通过所述镀层彼此电连通。
2.权利要求1的接线盒,还包括位于柔性衬底的第一表面与第一导电层之间的第一胶粘层,和位于柔性衬底的第二表面与第二导电层之间的第二胶粘层。
3.权利要求2的接线盒,第一胶粘层和第二胶粘层包括低流动性的胶粘材料。
4.权利要求3的接线盒,胶粘材料包括丙烯酸。
5.权利要求1的接线盒,该接线盒具有复合柔度(C),该复合柔度由可归于柔性衬底的第一柔度(C1)和可归于凸起接触元件的第二柔度(C2)构成。
6.权利要求1的接线盒,在涂覆镀层之前柔性衬底上的多个通孔在第一表面和第二表面之间是不导通的。
7.权利要求1的接线盒,柔性衬底的厚度足以使镀层电连接相对的接触元件。
8.权利要求7的接线盒,柔性衬底的厚度范围近似为0.5至5密耳。
9.权利要求1的接线盒,该接线盒具有第一阵列接触元件和第二阵列接触元件,该第一阵列和第二阵列共用同一柔性衬底,但是彼此定位在不同的平面上。
10.权利要求1的接线盒,每一个接触元件在柔性衬底上并朝向柔性衬底上对应通孔的中心扩展。
11.权利要求1的接线盒,第一导电层和第二导电层被设置成匹配连接盘栅格阵列(LGA)或球形栅格阵列(BGA)的接触系统。
12.权利要求1的接线盒,每一个接触元件包括铍铜合金,并且所述镀层包含铜。
13.权利要求1的接线盒,进一步地包括连续涂覆在第一导电层上、柔性衬底上的多个通孔上、和第二导电层上的第二镀层。
14.权利要求1的接线盒,至少一些接触元件具有不同于其它接触元件的电子和机械性能。
15.权利要求1的接线盒,第一导电层限定有与柔性衬底上的多个通孔对齐的多个开口,第一导电层上的开口的直径小于与柔性衬底上相应孔的直径,从而提供了多余的胶粘材料可以流入的排泄区。
16.一种柔性接线盒,包括:
柔性衬底;
第一组化学单立的接触器,其粘附到柔性衬底的第一表面;
第二组化学单立的接触器,其粘附到柔性衬底的第二表面,第二表面与第一表面相对;
通过连续地涂覆在第一组单立的接触器和第二组单立的接触器的至少一些中的相应的接触器上以及在与第一组单立的接触器和第二组单立的接触器的所述至少一些中的相应的接触器相匹配的柔性衬底上的通孔上的镀层,第一组单立的接触器和第二组单立的接触器的所述至少一些中的相应的接触器彼此电连接,并且
单立的接触器包括在柔性衬底上并朝向对应通孔中心扩展的接触元件。
17.权利要求16的接线盒,进一步包括位于柔性衬底和每一个单立接触器之间的胶粘材料。
18.权利要求16的接线盒,该接线盒具有复合柔度(C),该复合柔度由可归于柔性衬底的第一柔度(C1)和可归于接触器的第二柔度(C2)构成。
19.权利要求16的接线盒,该接线盒具有第一阵列单立接触器和第二阵列单立接触器,该第一阵列和第二阵列共用同一柔性衬底,但是彼此定位在不同的平面上。
20.权利要求16的接线盒,所述第一组单立接触器和第二组单立接触器被设置成匹配连接盘栅格阵列(LGA)或球形栅格阵列(BGA)的接触系统。
21.权利要求16的接线盒,每一个接触元件包括铍铜合金,并且所述镀层包含铜。
22.权利要求16的接线盒,至少一些接触元件具有与其它接触元件不同的电子和机械性能。
23.权利要求16的接线盒,柔性衬底包括聚酰亚胺。
24.权利要求16的接线盒,连续涂覆的镀层形成单体结构。
25.权利要求16的接线盒,在涂覆连续涂覆的镀层前柔性衬底上的多个通孔在第一表面和第二表面之间没有预镀层。
26.一种制造接线盒的方法,包括:
在柔性衬底上形成多个通孔;
将导电片层压到柔性衬底,导电片具有与多个通孔相匹配的多个接触元件,每一个接触元件都具有远离柔性衬底延伸的接触法兰;以及
对导电片的部分进行化学单立,以分隔出每一个接触元件。
27.权利要求26的方法,导电片包括第一导电片,该方法进一步地包括将第二导电片层压在柔性衬底的与第一导电片相对的一侧上。
28.权利要求26的方法,层压包括在柔性衬底和导电片之间设置胶粘层,该方法进一步地包括去除多余的胶粘材料。
29.权利要求28的方法,去除步骤包括将胶粘材料曝露于O2等离子体。
30.权利要求26的方法,层压包括在柔性衬底和导电片之间设置胶粘层,该方法进一步地包括在柔性衬底和导电片之间限定一区域,多余的胶粘材料可以流入该区域而不会到达接触元件。
31.权利要求26的方法,在层压步骤前进一步地包括对导电片进行预处理。
32.权利要求26的方法,进一步地包括在柔性衬底的不同部位层压导电片。
33.权利要求32的方法,进一步地包括将柔性衬底安装为使不同部位的导电片彼此排列在不同的平面上。
34.权利要求26的方法,进一步地包括对导电片和多个通孔进行镀覆以形成单体结构。
35.权利要求26的方法,柔性衬底上的多个孔通过柔性衬底是不导通的,该方法进一步地包括在导电片上并且在多个通孔内连续地淀积镀层。
36.一种在柔性衬底上制造接线盒的方法,该方法包括以下步骤:
对导电片进行蚀刻以限定出接触器;
将接触器应用成形工具以三维地形成接触器;
将具有经蚀刻和成形的接触器的导电片层叠到柔性衬底上;
在加热的同时在柔性衬底上将具有经蚀刻和成形的接触器的导电片压制在一起;
在接触器上并且在柔性衬底的通孔内连续地淀积镀层;以及
单立出接触器中的每一个。
37.权利要求36的方法,进一步地包括在柔性衬底的两面都应用具有经蚀刻和成形的接触器的导电片;
38.权利要求37的方法,柔性衬底上的通孔在淀积镀层前没有导通路径,柔性衬底的厚度足以使镀层电连接柔性衬底两面上的导电片的相对的接触元件。
39.权利要求36的方法,进一步地包括在层叠前对导电片进行表面处理。
40.权利要求36的方法,进一步地包括对接触器进行金的接触抛光。
41.权利要求36的方法,进一步地包括将导电片设置在柔性衬底的不同部位上。
42.权利要求41的方法,进一步地包括将柔性衬底安装为使不同部位的导电片彼此排列在不同的平面上。
43.权利要求36的方法,层叠包括在导电片和柔性衬底之间设置胶粘层,并且在柔性衬底和导电片之间限定一区域,多余的胶粘材料可以流入该区域而不会到达接触元件。
CN200680050026.0A 2005-11-03 2006-11-03 柔性载体上的接线盒 Pending CN101366323A (zh)

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US20100075514A1 (en) 2010-03-25
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WO2007056169A3 (en) 2007-10-11
EP1952680A2 (en) 2008-08-06
US7587817B2 (en) 2009-09-15
US7625220B2 (en) 2009-12-01
US7891988B2 (en) 2011-02-22
US20100055941A1 (en) 2010-03-04
US20060113107A1 (en) 2006-06-01
EP1952680A4 (en) 2013-01-09
US20060276059A1 (en) 2006-12-07
US20060258183A1 (en) 2006-11-16

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