CN101467163B - 传输带的处理过程 - Google Patents

传输带的处理过程 Download PDF

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Publication number
CN101467163B
CN101467163B CN2007800213523A CN200780021352A CN101467163B CN 101467163 B CN101467163 B CN 101467163B CN 2007800213523 A CN2007800213523 A CN 2007800213523A CN 200780021352 A CN200780021352 A CN 200780021352A CN 101467163 B CN101467163 B CN 101467163B
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liner
electric power
net
coil
band
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CN101467163A (zh
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安德烈·科特
德特勒弗·达斯契克
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Checkpoint Systems Inc
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Checkpoint Systems Inc
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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Abstract

一种高效地制造可形成备用标签的多个EAS或者RFID标签或者镶嵌物的方法。该方法仅仅利用低初粘度的胶粘剂可释放地固定到衬垫上的RFID芯片带或者电容器带的第一网状物和固定到第二衬垫上的线圈或者天线的第二网状物。在标引这两个网状物之后，可选择地加热和加压被应用到芯片带或者电容器带上以传送它们并且电力连接它们到相应的线圈或者天线上。其中芯片带和电容器两者都被用于共用天线，另外的带的第三网状物使用在此方法中。

Description

传输带的处理过程
技术领域
本发明涉及安全标签，特别是，公开一种应用电容器带或者芯片带到天线上以形成EAS或者RFID安全标签的方法。
背景技术
电子物品监视(EAS)安全标签，通常包括一个谐振电路，其利用至少一个线圈和至少一个电容器，当暴露到预定电磁场(例如，8.2兆赫)时，它们运行以产生共振，其中EAS标签暴露到此电磁场上。仅仅举例来说，该线圈和电容器刻蚀在基片上，从而多圈的传导迹线(因此形成该线圈)产生一个传导迹线的垫片，该垫片形成一个电容器板。在基片的另一侧，对另一个传导迹线垫片刻蚀，以形成第二电容器极板，同时电线接头从这个第二极板到基片的第一侧上的线圈的另一端穿过该基片；然后，该非传导的基片作为两个传导迹线垫片之间的电介质来形成一个电容器。因而，形成一个谐振电路。在市场上可获得多种不同类型的共振标签产品，并且在公开的专利中得到描述，例如，美国专利Nos.5,172,461；5,108,822；4,835,524；4,658,264和4,567,473，所有这些描述和公开了电子监视标签构件。然而，为了正确的操作，这种产品利用、并且甚至要求基片——这些基片利用在基片两个表面上的传导材料的型式侧面来做适当的操作。必须在两个基片面上利用特殊的传导结构和制造技术，以制造这样的共振标签产品。现有的EAS标签结构具有许多缺陷。例如，因为必须在可利用标签的两侧上利用特殊型式和蚀刻技术来产生适当的电路，这增加了单位加工时间以及成本。而且，还增加了生产所需的制造机器的复杂性。通常，复杂的光刻蚀加工过程用于形成该电路结构。如所理解的，两侧的光刻蚀通常是费时的并且需要在两侧上型式的精确对准。两侧上的型式还需要附加的材料，因而增加了单位的材料成本。美国专利No.5,781,110(habeger等)公开了在螺线的感应元件顶部上应用电介质墨汁物质以形成电容的元件。
特别涉及射频识别(RFID)标签，RFID标签包括一个集成电路(IC)，其连接到前述谐振电路或者连接到天线(例如，偶极)上，该天线响应于预定电磁场(例如，13.56兆赫)来发送信息信号。近来，通过将传导的凸缘电力耦合到相应的IC触点上，IC的附件已经完成以形成一个＂芯片带＂。然后，该芯片电连接到谐振电路或者天线上。例如，美国专利Nos.6,940,408(Ferguson等)；6,665,193(Chung等)；6,181,287(Beigel)和6,100,804(Brady等)。
而且，已经确定EAS电路或者RFID电路的电容性元件的形成是如何在实际上控制EAS谐振电路或者RFID电路的调谐，以适当地响应于所需的电磁场。本申请的专利权人，也就是Checkpoint系统公司，已经于2005年10月25日申请了，标题为＂电容器带＂的美国申请No.60/730,053，其公开了一种挠性电容器带，其应用到天线电路上以形成EAS安全标签。
然而，仍然需要大量地应用多个芯片带或电容器带并且高效地实现此过程。本发明的方法提供对此问题的解决方案。
在此应用的所有参考在此以它们的整体结合。
发明内容
一种包括多个带部件的网状物，该带部件可释放地被固定到该网状物的衬垫部分上但与相邻的带部件分离，其中每个带部件包括薄的、通常是平面的元件，该平面的元件包含第一电力传导的平面元件、第二平面电力传导元件和集成电路，该集成电路电连接到传导元件的相应端上，其中第一电力传导的平面元件和第二平面电力传导元件固定到非导电层的第一侧上，并且其中非导电层的第二侧可释放地被固定到(例如，一种低的初粘度可移动的粘合剂)到衬垫部分上。
一种包括多个带部件的网状物，该带部件可释放地被固定到该网状物的衬垫部分上但与相邻的带部件分离，其中每个带部件包括薄的、通常是平面的元件，该平面的元件包含第一电力传导的平面元件、第二平面电力传导元件和设置在第一和第二电力传导平面元件之间的至少是部分之间的平面介质层，其中带部件显示一个所需的电容，其中第一电力传导的平面元件和第二平面电力传导元件固定到非导电层的第一侧上，并且其中非导电层的第二侧可释放地被固定到(例如，一种低的初粘度可移动的粘合剂)到衬垫部分上。
一种形成多个EAS或者RFID标签或者镶嵌物的方法，其中该方法包括：提供一个第一网状物，其包括在第一衬垫上的多个RFID芯片带或者电容器带，每个芯片带或电容器带可释放地被固定(例如，一种低的初粘度粘合剂)的到第一衬垫上，其中每个芯片带或者电容器带与相邻带分离；提供一个在第二衬垫上多个天线或者线圈的多个第二网状物；标引第一和第二网状物，从而使得一个芯片带或者一个电容器带与多个天线或者多个线圈的相应的一个对齐；并且应用选择性的加热和压力到每个芯片带或者电容器带上，以从第一衬垫释放芯片带或者电容器带，同时连接芯片带或者电容器带到多个天线或者多个线圈的相应一个上以形成EAS或者RFID标签或者镶嵌物。
一种形成多个EAS或者RFID标签或者镶嵌物的方法，其中该方法包括：提供一个第一网状物，其包括在第一衬垫上的多个RFID芯片带，每个芯片带可释放地被固定(例如，一种低的初粘度粘合剂)到第一衬垫上，其中每个芯片带与相邻带分离；提供一个第二网状物，其包括在第二衬垫上的多个RFID电容器带，每个电容器带可释放地被固定到第二衬垫上，其中每个电容器带与相邻电容器带分离；提供一个在第三衬垫上多个天线或者线圈的第三网状物；标引第一和第三网状物，从而使得一个芯片带与多个天线或者多个线圈的相应的一个对齐；并且应用选择性的加热和加压到每个芯片带或电容器带上，以从第一衬垫释放该芯片带，同时电连接芯片带到多个天线或者多个线圈的相应一个上；标引第一和第三网状物，从而使得一个电容器带与多个天线或者多个线圈的相应的一个对齐；并且应用选择性的加热和加压到每个电容器带上，以从第二衬垫释放电容器带，同时将电容器带电偶到多个天线或者多个线圈的相应一个上以形成RFID标签或者镶嵌物。
附图说明
本发明将接合附图进行描述，其中相同的附图标记表示相同部件，其中：
图1A是芯片带的放大剖视图；
图1B是电容器带的放大剖视图；
图1C是结合的芯片带和电容器带的放大剖视图；
图2是本发明芯片带的放大剖视图；
图3是保持本发明的多个芯片带的网状物的局部的顶部平面图；
图4是保持本发明的多个芯片带的网状物的放大侧视图；
图5示出了应用到线圈或者天线上的本发明的倒置的芯片带；
图6A描述了利用本发明方法中的芯片带产生示例的HF(高频)安全标签；
图6B描述了连接到图6A的HF安全标签的线圈的芯片带的放大图；
图6C描述了利用本发明方法中的芯片带和电容器带产生的另一个示例的HF(高频)安全标签；
图6D是图6A-6C的等值电路；
图7A描述了利用本发明方法中的芯片带产生示例的HF(高频)安全标签；
图7B描述了本发明的等效电路；
图8描述了用于本发明的带传送的捆扎过程的进程图；和
图9提供了示例的标签进程图，示出了EAS或者RFID标签或者镶嵌物是怎样形成为顾客使用的标签。
具体实施方式
如上所述，在本发明公开的方法涉及电容器带或者芯片带到天线或者线圈上的应用。虽然大多数附图描述了芯片带到天线的附着过程，应该理解的是它们仅仅简单描述了电容器带的附着。图1A描述了示例的芯片带2，图1B描述了示例的电容器带4，并且图1C描述了示例的结合芯片带和电容器带6，其中的详细内容在美国申请No.60/730，053中公开，其全部内容在此作为参考进行结合。因而，该方法不限于仅仅附着芯片带。在整个本说明书中使用的术语＂带＂包括任何挠性类型的芯片带、电容器、结合的芯片带/电容器带。
为了促进多个带到多个天线或者线圈(附图标记10表示天线或者线圈)的快速和有效的附着过程，以形成EAS或者RFID安全标签或者镶嵌物，在图1A-1C中描述的带的结构在图2中示出，例如仅仅利用芯片带。本发明的带20包含RFID集成电路(IC)，诸如由飞利浦半导体，德克萨斯仪器，Impinj，STMicroelectronics等制造的，但是正如先前描述的电容器带或结合的芯片带/电容器带。特别地，IC电力地耦合21(例如，丝焊)到相应的传导(例如，铝)元件22A和22B上，其具有厚度，仅仅举例来说，在大约5微米到60微米范围内。这些传导元件22A和22B被固定(例如，经由胶粘剂23，诸如热封，水基的共同聚合体，聚氨基甲酸酯等)到非导电层或者基片24(例如，聚合体)。衬垫26利用可移动的胶粘剂28固定到基片24的相对侧上；此可移动的胶粘剂是低的初粘度并且类似于使用在静止票据上，其以
Figure G2007800213523D0004154716QIETU
商标出售，这样胶粘剂的例子是Rafsec RR27可移动丙烯酸的，或者Fasson UR1，R10，R195等。另外的胶粘剂30A/30B(例如，导电粘合剂，浆糊，带等，诸如来自Delo胶粘剂163，National Strach，Dupont，Locktite，Acheson等)应用到传导元件22A和22B的顶面32A上。
应该注意到在带20是芯片带的情况下，胶粘剂30A/30B的应用中另外的变化是，在芯片带的形成期间，也就是在集成电路电连接到传导元件22A和22B上之前，应用胶粘剂30A和30B到相应的传导元件22A和22B上。在胶粘剂30A和30B覆盖传导元件22A/22B的全部顶面32A情况下，当集成电路向下压并且电连接到相应的传导元件时，胶粘剂30A和30B被压缩，并且从集成电路下面挤出并且覆盖在集成电路的端部，从而提供芯片到传导元件22A和22B的附加固定。
如随后详细的描述的，多个这些带20设置在形成衬垫26的单个网状物上。如图3-4中最清楚示出，每个带20从它的相邻带(见切口C)隔断，其中每个带20经由可移动的粘合层28可释放地固定到衬垫26上。为了应用单个带20到天线或者线圈上，该带20如图5所示的倒置并且相应的传导元件22A和22B设置在天线或者线圈(图5)上相应的连接点上，从而使得胶粘剂30接触天线或者线圈的连接点CP1/CP2上。
特别地，如随后详细描述的，在过程中，指引每个带20以紧密设置接近于相应的天线或者线圈上。仅仅举例来说，设置在线圈网状物40上线圈的连接点CP1/CP2(其一部分在图5中示出)在图5中示出。该线圈网状物40包括多个线圈，这些线圈通过可移动的胶粘剂42(例如，类似于前述胶粘剂23，包括热封，水基的共聚物，聚氨基甲酸酯等)可移动地固定衬垫44上。因而，如随后详述的，一旦带20电连接到线圈(或者天线)，然后，每个完整的EAS(或者RFID)标签或者镶嵌物能够从衬垫44中被移去并且通过利用胶粘剂42被应用到该物品上。应该理解的是网状物40也可为天线网状物，而不是多个线圈可释放地被固定到该网状物上，而是多个天线可释放地被固定到其上。
为了电力连接带20到线圈(或者天线)上，在与相应胶粘剂30A和30B对准的位置，相对于衬垫26可选择地加热和加压(利用加热元件106A和106B)。这促使胶粘剂30A/30B将传导元件22A和22B粘合到天线连接点上。此可选择地加热同时导致可移动的胶粘剂28丢失它的初粘度，从而允许衬垫26沿着胶粘剂28被除去。在这些位置处的压力和卷曲(33和35)形成良好的电线接头；例如，卷曲作用的碎片和锐利边缘产生良好的电线接头。最后结果导致了带20被电连接到这个天线和线圈上。应该理解的是本发明的最宽的范围包括利用化学制品在带20和天线或者线圈之间形成连接，在此情况下，施加压力但是不需要卷曲。
还应该注意的是胶粘剂30A/30B最初设置在线圈或者天线上，而不是在带20本身上。
应该注意的是在芯片带/电容器带的形成中使用的胶粘剂23(例如，水基的层压粘合剂)包含＂型式胶粘剂＂。根据美国专利No.6,988,666(Appalucci等)，标题＂安全标签及其制造方法＂，和2004年11月29日申请的美国申请No.10/998,496，标题为＂在安全标签中定位电容器极板的方法以及由此形成的电容器＂，所有的内容在此作为参考进行结合，利用该型式胶粘剂23将传导材料层(例如，铝)应用到非传导基片24(例如，聚合体)上，以形成一个分层，从而形成传导元件22A/22B。该胶粘剂23是传导元件22A/22B的形式。因而，当应用刀具到导电层上(以传导元件22A/22B的所需形状)时，仍然胶着地固定到基片24上的导电层的剩下部分是传导元件22A/22B；导电层的余下部分能够移动和再循环。而且，此相同的过程(例如，利用型式的胶粘剂)用于芯片带/电容器带20所附着的线圈202或者天线302A/302B(见图5中的线圈或者天线网状物40)的形成。
仅仅举例来说，图6A-6D描述了利用本发明方法的HF安全标签200，并且图7A-7B描述了利用本发明方法的UHF安全标签300。特别地，图6A描述了一个多匝线圈202，本发明的芯片带20固定到此多匝线圈202上。人们注意到在连接芯片带20到线圈202的情况下，该粘合层30A/30B还作为一个绝缘体以防止传导元件22A/22B与任何线圈通路发生短路，除了芯片带20电力连接的两个线圈通路以外。图6B是连接到线圈202的芯片带20的放大视图。图6C示出了利用本发明方法的另一个HF安全标签200A，但是电容器带20A，除了芯片带20之外，还电力连接到线圈202上；仅仅举例来说，该HF安全标签200A需要除IC提供的内部电容之外的另外的电容(在此，电容器带20A)。图6D是图6A-6C的安全标签的等效电路。图7A示出了UHF安全300，其中芯片带20连接在天线元件302A和302B之间。图7B是UHF安全标签300的等效电路。如前所述，利用美国专利No.6,988,666(Appalucci等)，标题为＂安全标签以及制造该标签的方法＂以及2004年11月29日申请的美国申请No.10/998,496，标题为＂用于在安全标签中对齐电容器板的方法以及由此形成的电容器＂中公开的方法形成多匝线圈202和天线元件302A/302B。
而且，对于在UHF范围中运行的天线而言，在天线网状物(类似在图5中示出的网状物40)上形成这些类型天线的方法在同时申请的，标题为＂用于制造EAS和RFID标签的UHF天线的方法以及由此制成的天线＂的待审查的美国申请No.11/400,893中公开，其全部内容在此作为参考进行结合。此后者处理方法利用产生非常薄的、挠性UHF天线的方法，其包括提供包含电力传导材料(例如，铝)层的导体板，该电力传导材料层具有顶面和底面，其中导体板具有大约5微米到60微米的厚度；提供一个具有顶面的衬垫板(类似于图5中的衬垫44)；设置该导体板于衬垫板上，从而使得通过一个大体上与这个导体板共同延伸的可释放固定的胶粘剂(类似于图5的胶粘剂42)，该导体板的底面可释放地被固定在衬垫板的顶面上；然后，该导体板形成一个天线所需的形状，通过使得具有所需形状的割截模与导体板相接合，于是该模刺入导体板中，而不是通过该衬垫板，从而产生具有固定到衬垫板上并且具有所需形状的模切天线。在此过程中形成的相邻天线(由此留下一个间隙46，如图5中所示)和天线网状物(参见图5中的网状物，以及图8中的附图标记104)之间除去该废料。可选择的，其中即使利用更小厚度(小于25微米)的电力传导材料的导体板，该导体板首先可靠地被固定到一个加强板(例如，纸，诸如粘合，平板印刷/胶印，致密牛皮纸，或者具有能力支撑该导体的任何纸，或者一起形成一个支撑的复合材料并且具有合成的大约50微米的厚度，或者单独的6微米到15微米的厚度)，然后该加强板的底面可释放地被固定到衬垫板的顶面上；当应用割截模时，该模切割通过导体板和加强板两者。
为了利用这些带20制造多个安全标签，图8描述了处理过程100。特别地，从而一个带的卷102和天线/线圈卷104(包含线圈或者天线网状物40)标引并且设置在加热元件106和辊(或铁砧)108之间。如图8所示，天线/卷104被定向，从而使得天线302或者线圈202面向上并且带20是面向下(这些相对位置仅仅是示例，天线可以面向下并且带可以面向上等等)。取决于形成的安全标签，该标引必须确保当连接时，带20适当地定位在线圈或者天线的接触点CP1/CP2上。特别地，在卷104上的相邻线圈202/天线202之间的间距通常不同于带卷102上相邻带20之间的间距。因而，在加热元件106/辊108运行之前，当实施相应线圈202或者天线302的正确定位时，暂停从带卷102中分配带20。一旦加热元件106/辊108被激活，衬垫26由卷带盘110卷取。在带20适当地应用到线圈202或者天线元件302上的情况下，在位置112实施机械焊接(例如，卷曲)，如结合图5先前所述的，从而形成一个特别的安全标签或者镶嵌物。在此整个说明书中使用的该术语＂镶嵌物＂意味着完整的标签(例如，EAS或者RFID安全标签)可以自已形成标签的一部分或者连接到使用在物品上或者别的方式与该物品相连的标签上。该标签/镶嵌物聚集在安全标签或者镶嵌物盘114上。
此时，该标签/镶嵌物盘114包含暴露的多个标签/镶嵌物。应该理解的是存在许多不同的方式来＂完成＂标签/镶嵌物以形成一个＂标签＂，该标签应用到一个物品上并且包括在本发明的最宽的范围内的任何标签。仅仅举例来说，图9描述了这些示例标签处理方法400的一个，其中盘114的标签/镶嵌物支撑标签。特别地，提供一个可印刷的纸盘116通过打印站128(包括辊或者铁砧130)以提供所需的标签印花到纸上。如果在盘116上的纸被胶粘地固定到衬垫117上，那么该衬垫由卷取盘119移动；另一方面，如果不存在衬垫117，那么胶粘剂121(例如，诸如标准丙烯酸的或者橡胶基的热熔性剂)就会被应用到该纸上。然后，该纸从位置123的盘114处应用到多个标签/镶嵌物的顶部，以形成标签字模(matrix)125。接下来，该标签字模125发送到切割机124和锟(或者铁砧)126上。卷取盘127从标签字模125中移去该废料，从而使得标签产品150准备应用在不同物品上。
可选择的，如上所述，其中利用一种模式胶粘剂形成线圈/天线网状物40，该天线/线圈网状物40需要应用到一个单独的衬垫上，该标签/镶嵌物可从该单独衬垫上移去。特别地，包含衬垫131的盘129具有由卷取盘135所移动的它的护板133，以在其上暴露胶粘剂；可选择的，如果衬垫131不具有护板和胶粘剂，在位置137处将胶粘剂应用到衬垫上。无论在哪一种情况下，在位置139处，于是衬垫从盘114处胶着地被固定到线圈/天线网状物40的底部，以形成一个标签/镶嵌物和衬垫产品，该产品供给到纸实施阶段123上。然后，该处理方法如上所述的继续。
人们注意到盘116仅仅是举例，胶粘剂120能够直接地应用到完整的标签/镶嵌物上，然后可印刷的纸118应用到该胶粘剂120的顶部。
人们注意到，在电容器带和芯片带正在固定到通常的线圈或者天线(参见图6C)时，在图8所示的方法补充了第三网状物(未示出)，然后其还与天线网状物104一起标引。应该理解的是在该处理方法中每一种带的类型(芯片带或者电热器带)的应用都能够被应用在另一个之前。此外，第二卷带盘(未示出)还表现为从电容器带的网状物中卷取该可释放的衬垫。
虽然本发明已经结合具体的例子详细描述，本领域技术人员显然的是在不脱离本发明的精神和范围的情况下能够进行多种变化和修改。

Claims (11)

1.一种包括多个带部件的网状物，所述带部件可释放地固定到所述网状物的衬垫部分上但是与相邻的带部件分离，其中每个所述带部件包括薄的、平面的元件，所述平面的元件包含第一电力传导的平面元件、第二电力传导平面元件和设置在所述第一和第二电力传导平面元件的至少部分之间的平面的介质层，于是所述带部件显示一个所需电容，所述第一电力传导的平面元件和所述第二电力传导平面元件固定到非导电层的第一侧上，并且其中所述非导电层的第二侧可释放地被固定到所述衬垫部分上。
2.如权利要求1所述的网状物，其中所述非导电层的所述第二侧利用低初粘度的可移动胶粘剂可释放地固定到所述衬垫上。
3.如权利要求2所述的网状物，其中所述第一电力传导平面元件和所述第二电力传导平面元件包括利用胶粘剂适应于电力连接到线圈或者天线的表面。
4.如权利要求1所述的网状物，其中每个所述带部件利用隔断的所述非导电层从相邻的带部件中分离。
5.一种形成多个EAS标签或者镶嵌物的方法，所述方法包括：
提供一个第一网状物，其包括在第一衬垫上的多个电容器带，每个所述电容器带均通过低粘性胶粘剂可释放地被固定到第一衬垫上，其中每个电容器带与相邻带分离，并且其中另外的粘胶剂应用到所述电容器带的传导元件顶面上，每个所述电容器带包括薄的、平面的元件，所述平面的元件包含第一电力传导平面元件、第二电力传导平面元件和设置在所述第一和第二电力传导平面元件的至少部分之间的平面介质层，于是所述电容器带显示一个所需电容；
提供一个在第二衬垫上的多个天线或者线圈的第二网状物；
标引所述第一和第二网状物，从而使得一个所述电容器带与多个所述天线或者多个所述线圈的相应的一个对齐；和
应用选择性的加热和加压到每个所述电容器带上，以从所述第一衬垫释放所述电容器带，同时连接所述电容器带到多个所述天线或者多个所述线圈的所述相应一个上以形成EAS标签或者镶嵌物。
6.如权利要求5所述的方法，还包括卷绕对应于由此释放的所述电容器带的所述第一衬垫的一部分的步骤。
7.如权利要求5所述的方法，所述提供一个在第二衬垫上的多个天线或者线圈的第二网状物的所述步骤包括应用在所述多个天线或者线圈的每个上的导电粘合剂到每个所述电容器带被连接的地方。
8.一种形成多个RFID标签或者镶嵌物的方法，所述方法包括：
提供一个第一网状物，其包括在第一衬垫上的多个RFID芯片带，每个所述RFID芯片带通过低粘性胶粘剂可释放地被固定到第一衬垫上，并且其中每个所述RFID芯片带与相邻RFID芯片带分离；
提供一个第二网状物，其包括在第二衬垫上的多个电容器带，每个所述电容器带包括薄的、平面的元件，所述平面的元件包含第一电力传导平面元件、第二电力传导平面元件和设置在所述第一和第二电力传导平面元件的至少部分之间的平面介质层，于是所述电容器带显示一个所需电容，每个所述电容器带通过低粘性胶粘剂可释放地被固定到所述第二衬垫上，其中每个所述电容器带与相邻电容器带分离；
提供一个在第三衬垫上的多个天线或者线圈的第三网状物；
标引所述第一和第三网状物，从而使得一个所述RFID芯片带与所述多个天线或者所述多个线圈的相应的一个对齐；
应用选择性的加热和加压到每个所述RFID芯片带上以从所述第一衬垫释放所述RFID芯片带，同时电力连接所述RFID芯片带到所述多个天线一个对应天线或者所述多个线圈的所述相应一个对应线圈上；
标引所述第二和第三网状物，从而使得一个所述电容器带与所述多个天线的所述相应一个或者所述多个线圈的一个对齐；和
应用选择性的加热和加压到每个所述电容器带上，以从所述第二衬垫释放所述电容器带，同时电力连接所述电容器带到多个天线的一个对应天线或者多个线圈的相应一个对应线圈上以形成RFID标签或者镶嵌物。
9.如权利要求8所述的方法，还包括卷绕对应于所述RFID芯片带的所述第一衬垫的一部分和卷绕对应于所述电容器带的所述第二衬垫的一部分的步骤，并且该所述RFID芯片带和电容器带能从它们各自的衬垫上释放。
10.如权利要求8所述的方法，所述应用选择性加热和加压到每个所述RFID芯片带上的步骤包括将所述RFID芯片带的传导元件卷绕到所述多个天线的所述对应一个天线或者所述多个线圈的所述对应一个线圈上，其中所述应用选择性加热和加压到每个所述电容器带上的步骤包括将所述电容器带的所述第一和第二导电平面元件卷绕到所述多个天线的所述对应一个天线或者所述多个线圈的所述对应一个线圈上。
11.如权利要求8所述的方法，所述提供一个在第三衬垫上的多个天线或者线圈的第三网状物的所述步骤包括应用在所述多个天线或者线圈的每个上的导电粘合剂到每个芯片带或每个所述电容器带被连接的地方。
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Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2901041B1 (fr) * 2006-05-12 2008-10-10 Eric Heurtier Etiquette integrant une antenne anti-vol rf et un transporteur rfid uhf
US20080079587A1 (en) * 2006-09-29 2008-04-03 Ahmadreza Rofougaran Method And System For Utilizing Magnetic On-Chip Coil For Ultra High Frequency (UHF)
US8026818B2 (en) * 2006-12-20 2011-09-27 Checkpoint Systems, Inc. EAS and UHF combination tag
EP2328900B1 (en) 2008-08-11 2013-08-28 Tasmanian Alkaloids Pty. Ltd. PROCESS FOR MAKING MORPHINAN-6 alpha-OLS
US8128000B2 (en) * 2009-09-25 2012-03-06 Avery Dennison Corporation Method, system and apparatus for manufacturing a radio frequency identification device
WO2011118379A1 (ja) * 2010-03-24 2011-09-29 株式会社村田製作所 Ｒｆｉｄシステム
US8701271B2 (en) 2010-04-14 2014-04-22 Avery Dennison Corporation Method of assembly of articles
CN102237323B (zh) * 2010-04-27 2016-04-06 上海仪电智能电子有限公司 一种带负载电容的微型射频模块封装用pcb载带
CN101937523A (zh) * 2010-09-30 2011-01-05 潘泽民 可读写防盗磁条及可读写防盗标签
US9299021B2 (en) * 2010-11-11 2016-03-29 Avery Dennison Corporation RFID devices and methods for manufacturing
US20130092739A1 (en) * 2011-10-13 2013-04-18 Supreme Technic Package Co., Ltd. Simple multifuncational identification labels and their manufacturing method
US10311351B1 (en) * 2012-04-11 2019-06-04 Impinj, Inc. RFID integrated circuits with antenna contacts on multiple surfaces
WO2014204322A1 (en) * 2013-06-19 2014-12-24 Ross Robert Clarke Radio frequency identification tag
MX2017004059A (es) 2014-09-29 2017-08-28 Avery Dennison Corp Etiqueta rfid de seguimiento de neumáticos.
KR101892689B1 (ko) 2014-10-14 2018-08-28 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
US10049319B2 (en) 2014-12-16 2018-08-14 Avery Dennison Retail Information Services, Llc Method of assembly using moving substrates, including creating RFID inlays
US10198677B2 (en) * 2016-05-26 2019-02-05 Avery Dennison Retail Information Services, Llc RFID tag for printed fabric label and method of making
CN114781571A (zh) 2016-12-29 2022-07-22 艾利丹尼森零售信息服务公司 用于结合至可微波食品包装中的具有屏蔽结构的rfid标签
US10763588B2 (en) * 2017-01-31 2020-09-01 TenX Healthcare, Inc. Patient tracking system for monitoring patient data
EP3688669B1 (en) 2017-09-29 2021-07-28 Avery Dennison Retail Information Services, LLC Systems and methods for transferring a flexible conductor onto a moving web
WO2019065957A1 (ja) * 2017-09-29 2019-04-04 株式会社村田製作所 無線通信デバイス
WO2019068068A1 (en) * 2017-09-29 2019-04-04 Avery Dennison Retail Information Services, Llc STRAP MOUNTING TECHNIQUES FOR WIRED FORMAT ANTENNAS
SE542007C2 (en) 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
MX2019011707A (es) * 2018-02-05 2019-11-01 All Tag Corp Etiquetas de vigilancia de articulos electronicos.
JP2021522573A (ja) 2018-04-20 2021-08-30 アベリー・デニソン・リテイル・インフォメーション・サービシズ・リミテッド・ライアビリティ・カンパニーＡｖｅｒｙ Ｄｅｎｎｉｓｏｎ Ｒｅｔａｉｌ Ｉｎｆｏｒｍａｔｉｏｎ Ｓｅｒｖｉｃｅｓ， Ｌｌｃ 電子レンジ対応の食品包装に組み込むための遮蔽型ｒｆｉｄタグ
CN112352247A (zh) * 2018-04-20 2021-02-09 艾利丹尼森零售信息服务公司 使用具有rfid标签设计的屏蔽rfid带的方法
US11347992B2 (en) 2018-04-20 2022-05-31 Avery Dennison Retail Information Services Llc RFID straps with a top and bottom conductor
US11769938B2 (en) 2018-06-27 2023-09-26 Avery Dennison Retail Information Services Llc RFID tags operating in the high frequency band
DE102018005569A1 (de) * 2018-07-13 2020-01-16 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zur Herstellung von RFID Transpondern
NL2021987B1 (en) * 2018-11-13 2020-05-20 Mylaps B V A rollable antenna mat
EP4266214A3 (en) 2018-11-15 2024-02-21 Avery Dennison Retail Information Services LLC Recyclable rfid transponder components and production methods for same
EP3959657A1 (en) * 2019-04-22 2022-03-02 Avery Dennison Retail Information Services, LLC Self-adhesive straps for rfid devices
CN114514534A (zh) 2019-07-30 2022-05-17 艾利丹尼森零售信息服务有限公司 可重新定位的射频识别装置

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3724737A (en) 1971-10-06 1973-04-03 E Bodnar Spreader for slit web material
US3863857A (en) 1973-04-02 1975-02-04 Nim Cor Inc Leaf-type expansible shaft with trapper bar
US3891157A (en) 1973-06-04 1975-06-24 Beloit Corp Slitting mechanism for winder
US3989575A (en) 1975-04-16 1976-11-02 Oliver Machinery Company Split labeling apparatus
US4111378A (en) 1977-06-02 1978-09-05 Xerox Corporation Means and method for providing indicating of end portion of web material
US4135677A (en) 1977-07-14 1979-01-23 Cedco, Inc. Pneumatic shafts, chucks and lifts for roll stock
US4242663A (en) 1979-02-01 1980-12-30 Lockheed Electronics Corporation Electronic identification system
EP0070051B1 (en) 1981-07-02 1985-08-21 Agfa-Gevaert N.V. Method and apparatus for conveying and spreading material
US4498076A (en) 1982-05-10 1985-02-05 Lichtblau G J Resonant tag and deactivator for use in an electronic security system
SE441520B (sv) 1984-03-07 1985-10-14 Tetra Pak Int Anordning for avkenning av materialtjockleken i en rulle av banformigt material
US4658264A (en) 1984-11-09 1987-04-14 Minnesota Mining And Manufacturing Company Folded RF marker for electronic article surveillance systems
US4690720A (en) 1986-01-16 1987-09-01 Pamco Label Co. Method of manufacturing multilayer labels and apparatus therefor
US4717438A (en) 1986-09-29 1988-01-05 Monarch Marking Systems, Inc. Method of making tags
US4910499A (en) 1986-09-29 1990-03-20 Monarch Marking Systems, Inc. Tag and method of making same
US4835524A (en) 1987-12-17 1989-05-30 Checkpoint System, Inc. Deactivatable security tag
US5021110A (en) 1989-11-20 1991-06-04 Ko-Pack Corporation Process for manufacturing self-adhesive multilayer label
JPH0821790B2 (ja) 1990-02-15 1996-03-04 松下電器産業株式会社 ロータリーヘッド式電子部品実装装置
JP3096069B2 (ja) 1990-08-06 2000-10-10 チェックポイント・マニュファクチュアリング・ジャパン株式会社 共振タグ及びその製造方法
CH680823A5 (zh) 1990-08-17 1992-11-13 Kobe Properties Ltd
US5275868A (en) 1992-06-04 1994-01-04 Avery Dennison Corporation Label stock laminate
US5357240A (en) 1992-10-16 1994-10-18 Sensormatic Electronics Corporation EAS tag with mechanically vibrating magnetic element and improved housing and method of making same
US5264061A (en) 1992-10-22 1993-11-23 Motorola, Inc. Method of forming a three-dimensional printed circuit assembly
NZ314270A (en) 1992-11-18 1998-06-26 British Tech Group Transponder identification system: interrogator transmits inhibiting signal to disable transponders
US5751256A (en) 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
DE59510365D1 (de) 1994-05-10 2002-10-10 Meto International Gmbh Verfahren zur Herstellung eines Sicherheitsetikettenstreifens
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
ES2145436T3 (es) 1995-02-28 2000-07-01 Leyval Jean Pierre Sobre adhesivo.
CA2171526C (en) 1995-10-13 1997-11-18 Glen E. Mavity Combination article security target and printed label and method and apparatus for making and applying same
US5781110A (en) 1996-05-01 1998-07-14 James River Paper Company, Inc. Electronic article surveillance tag product and method of manufacturing same
DE19634473C2 (de) 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
US5867102C1 (en) 1997-02-27 2002-09-10 Wallace Comp Srvices Inc Electronic article surveillance label assembly and method of manufacture
CA2283503C (en) 1997-03-10 2002-08-06 Precision Dynamics Corporation Reactively coupled elements in circuits on flexible substrates
US6019865A (en) 1998-01-21 2000-02-01 Moore U.S.A. Inc. Method of forming labels containing transponders
DE19805031C2 (de) 1998-02-09 2002-06-13 Peter Kammer Verfahren und Vorrichtung zum Herstellen von Chipkarten
US6357503B1 (en) 1998-06-13 2002-03-19 Pasquini Und Kromer Gmbh Device for producing a strip with self-adhesive labels or other materials with parts placed underneath and a device for laterally guiding edges
JP4187278B2 (ja) * 1998-07-08 2008-11-26 大日本印刷株式会社 非接触ｉｃカードおよびその製造方法
DE19840226B4 (de) 1998-09-03 2006-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen eines Schaltungschips auf einen Träger
US6100804A (en) 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
DE10136359C2 (de) 2001-07-26 2003-06-12 Muehlbauer Ag Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders
US6988666B2 (en) 2001-09-17 2006-01-24 Checkpoint Systems, Inc. Security tag and process for making same
JP2003209421A (ja) * 2002-01-17 2003-07-25 Dainippon Printing Co Ltd 透明アンテナを有するｒｆｉｄタグ、及びその製造方法
US6665193B1 (en) 2002-07-09 2003-12-16 Amerasia International Technology, Inc. Electronic circuit construction, as for a wireless RF tag
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
JP4138508B2 (ja) * 2003-01-20 2008-08-27 トッパン・フォームズ株式会社 非接触型データ受送信体およびそのアンテナのキャパシタンス調整方法
US6925701B2 (en) * 2003-03-13 2005-08-09 Checkpoint Systems, Inc. Method of making a series of resonant frequency tags
US7259678B2 (en) 2003-12-08 2007-08-21 3M Innovative Properties Company Durable radio frequency identification label and methods of manufacturing the same
WO2005059855A1 (en) * 2003-12-16 2005-06-30 Joergensen Poul Richter Improved resonance security tag and method of producing such a tag
US7119685B2 (en) 2004-02-23 2006-10-10 Checkpoint Systems, Inc. Method for aligning capacitor plates in a security tag and a capacitor formed thereby
JP2006031336A (ja) 2004-07-15 2006-02-02 Fujitsu Ltd Ｒｆｉｄタグの製造方法
US7109867B2 (en) 2004-09-09 2006-09-19 Avery Dennison Corporation RFID tags with EAS deactivation ability
JP4743583B2 (ja) 2004-09-29 2011-08-10 大日本印刷株式会社 Ｉｃタグ付シート
US7646305B2 (en) * 2005-10-25 2010-01-12 Checkpoint Systems, Inc. Capacitor strap

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WO2007121114A3 (en) 2007-12-13
JP4659904B2 (ja) 2011-03-30
AU2007238242A1 (en) 2007-10-25
US20100083493A1 (en) 2010-04-08
TW200818561A (en) 2008-04-16
EP2005370A2 (en) 2008-12-24
JP2009533769A (ja) 2009-09-17
WO2007121114A2 (en) 2007-10-25
CA2649039A1 (en) 2007-10-25
AU2007238242B2 (en) 2011-06-09
US20070238245A1 (en) 2007-10-11
US7646304B2 (en) 2010-01-12
US7884726B2 (en) 2011-02-08
MX2008013016A (es) 2008-11-18

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