CN101488116B

CN101488116B - Universal serial bus

Info

Publication number: CN101488116B
Application number: CN2008100041186A
Authority: CN
Inventors: 邱修信; 倪金南; 李中和; 俞一康; 沈明祥
Original assignee: Super Talent Electronics Inc
Current assignee: Super Talent Electronics Inc
Priority date: 2008-01-17
Filing date: 2008-01-17
Publication date: 2011-04-13
Anticipated expiration: 2028-01-17
Also published as: CN101488116A

Abstract

The invention relates to a small universal serial bus device which comprises a printed circuit board component, a plurality of conducting wires and a single molding outer casing. The printed circuit board component comprises: a printed circuit board which comprises a printed circuit board handle part and a printed circuit board plug part and is provided with a first surface and a second surface opposite to each other; a plurality of metal contact points which are arranged on the first surface of the printed circuit board plug part; at least a driven element which is fixed on the second surface of the printed circuit board handle part; at least an integrated circuit grain which is not packaged and is fixed on the second surface of the printed circuit board handle part. Therefore, the small universal serial bus device has uniform thickness.

Description

Universal serial bus device

Technical field

The present invention relates to a kind of portable electron device, be meant a kind of USB (universal serial bus) (Universal-Serial-Bus, USB) portable electron device of specification of utilizing especially.

Background technology

Because the technical development of every field is grown up fast, can allow capacity small-sized, that portable storage card has super large after being assembled.Flash memory technology, for example those utilize Electrically Erasable Read Only Memory (Electrically-Erasable Programmable Read-Only Memory, EEPROM) technology manufactures and can store 125Mb or higher chip, small-sized flash memory cards is designed to have a connector, can insert a specific card reader, for example, compact flash storage card (Compact Flash is provided, CF), secure digital storage card (Secure-Digital, SD), memory stick (Memory Stick, MS) or other standardized formats use.

In recent years, the flash memory cards of being peddled all comprises a universal serial bus connector, and this USB (universal serial bus) flash memory cards does not need can insert once specific card reader the universal serial bus connector of a host computer system, for example PC (PC).These USB (universal serial bus) flash memory cards can be used to replace flexible plastic disc (floppy disks), and a USB (universal serial bus) flash memory cards just can have the memory capacity that surpasses 10 flexible plastic discs, and also can be not bigger than the stamp of a maximum aspect area.

See also Figure 24 A, it is to show a kind of existing flash memory cards with a traditional public universal serial bus connector, and flash memory chip 12 can be non-volatile (non-volatile) chip of a 128Mb, or can have other capacity.Controller chip 14 comprises a flash controller, can produce the memory location of signal with access flash storage chip 12.Controller chip also comprises a USB (universal serial bus) controller, relies on a USB (universal serial bus) to connect so that data transmission is to flash memory chip 12 continuously, and from flash memory chip 12 data transmission continuously.

Public universal serial bus connector 20 is to be fixed on the motherboard 10, it is a kind of

chip

12,14 minitype circuit board fixed thereon that has, described motherboard 10 can utilize multilayer board (Printed-Circuit Board, printed circuit board (PCB)) technology.One plastic shell (not shown) can coat described motherboard 10.

Public universal serial bus connector 20 comprises a miniature connector substrate 16, the substrate of being made with whiteware (white ceramic), black hard plastic (black rigid plastic) or other firm materials normally, be formed with 4 or more metal contact 18 on the described connector base board 16, metal contact 18 transmits the universal serial bus signal that is produced, or come received signal by controller chip 14, described universal serial bus signal comprises electronics, ground connection and different data D+, D-continuously.

Public universal serial bus connector 20 comprises a metal shell, with be coated on described connector base board 16 around, three sides of described metal shell and described connector base board 16 are in contact with one another, the upside of connector base board 16 has metal contact 18, and and described metal shell top between a big gap is arranged, the top of this metal shell and two bottom sides all are provided with hole 15, and described universal serial bus connector 20 is A type universal serial bus connectors.

See also Figure 24 B, it is to show a female USB (universal serial bus) socket connector 22, described female USB (universal serial bus) socket connector 22 can be used as one of component part (integral part) of a PC or other host computer systems, maybe can rely on cable 21 to be connected to a host computer system.Another connector base board 26 includes four metal contacts 28, is used for producing with four metal contacts of described public universal serial bus connector 20 shown in Figure 24 A being electrically connected (electrical contact).Described connector base board 26 is coated by a metal shell, but still has a little gap between described metal shell and described connector base board 26.

Rely on the metal spring 24 of described metal shell top and two bottom sides that fixing function can be provided, see also Figure 25 A and Figure 25 B, when the public universal serial bus connector 20 among Figure 25 A turned over and insert as for the female USB (universal serial bus) socket connector 22 among Figure 25 B, described metal spring 24 promptly was fixed in the hole 15 of described public universal serial bus connector 20.

See also Figure 25 A and Figure 25 B, the both is that sectional view is to highlight the connection status between described public universal serial bus connector and the female USB (universal serial bus) socket connector.Female USB (universal serial bus) socket connector 22 is in the left side, and public universal serial bus connector 20 then inserts from the right side, and with respect to the visual angle of Figure 24 A, described public universal serial bus connector 20 turns over.Metal Contact Figure 18 is formed in the lower surface of the connector base board 16 on the described public universal serial bus connector 20, metal contact 28 then is formed in the upper surface of the connector base board 26 on described female USB (universal serial bus) socket connector 22, therefore, when public universal serial bus connector 20 inserts female USB (universal serial bus) socket connector 22, described metal contact is to face one another so that be electrically connected, as shown in Figure 25 B.

Metal spring 24 is formed in the metal shell that coats connector base board 26 on described female USB (universal serial bus) socket connector 22, just in time cooperate the hole 15 of (fit into) described public universal serial bus connector 20 metal shells, this helps described connector is fixed together.

See also Figure 26, it is to show the employed Small Universal serial bus connector of a kind of existing USB (universal serial bus) flash memory cards.Volume at the public universal serial bus connector 20 shown in Figure 25 and 26 figure is bigger, especially its metal shell is comparatively heavy, and increased the cost of making, therefore, can rely on described public universal serial bus connector 30 is combined to reduce cost with motherboard 32.Described motherboard 32 is one to have the printed circuit board (PCB) fixed thereon of flash memory chip 12 and controller chip 14, described motherboard 32 is extended to is enough to hold described public universal serial bus connector 30, and is formed with metal contact 38 at the end 36 of described motherboard 32.

Width and thickness that the end 36 of described motherboard 32 comprises public universal serial bus connector 30 are the connector base boards 16 that is designed to approximately meet among Figure 24 A, plastic shell 34 is to be coated on described motherboard 32, but then be provided with an opening (opening) for metal contact 38 places, described plastic shell 34 is to cover the bottom of described public universal serial bus connector 30 and side until terminal 36, with the metal shell of simulation at the public universal serial bus connector described in the 24 figure A.

See also Figure 27 A and Figure 27 B, it is to show that described existing Small Universal serial bus connector is inserted into the sectional view of a standard female USB (universal serial bus) socket connector.Described motherboard 32 has public universal serial bus connector 30 and is formed on terminally 36, turns over from the visual angle of Figure 26, and described terminal 36 are inserted into female USB (universal serial bus) socket connector 22 from the right.

Metal contact 38 is to be positioned at surface under the described public universal serial bus connector 30, plastic shell 34 have an opening at described public universal serial bus connector 30 than lower surface, so that described contact point 38 is exposed to the open air outside, therefore, when inserting, can produce with the metal contact 28 of connector base board 26 upper surfaces of described female USB (universal serial bus) socket connector 22 and be electrically connected, as shown in Figure 27 B.

Plastic shell 34 is the gaps (gate) that help to fill up between the metal shell top edges of described motherboard 32 and female USB (universal serial bus) socket connector 22, yet, on described plastic shell 34, do not provide any hole, therefore, when public universal serial bus connector 30 inserts described female USB (universal serial bus) socket connector 22, as long as push away described metal spring 24 gently.Plastic shell 34 is to form along the thin edges of described motherboard 32, help to fill up between the metal shell edge of described connector base board 26 and described female USB (universal serial bus) socket connector 22, be above and following gap (gate), described plane, as shown in Figure 27 B.

Though Small Universal serial bus connector 30 is comparatively cheap and build is less compared with the standard universal serial bus connector, but still have a thickness of not pleasing, not using metal shell is that the volume of plug end is dwindled, but in traditional manufacture process, described USB (universal serial bus) IC is fixed on the printed circuit board (PCB) with the same side of metal contact, and the main frame that manufacturing is come out is still very thick comparatively speaking.

Therefore, in fact need a kind of smooth, small-sized public universal serial bus device, make it have a ultra-thin handle thickness, therefore make ultra-thin universal serial bus device to combine with the pocket belongings, for example key-ring and pocket instrument etc., therefore, need a kind of method of making this Small Universal serial bus device.

In addition, introduce the list of references relevant with the application:

Patent application case of the present invention is the continuation in part (CIP) of U.S. patent application case " Single-Chip Multi-Media Card/Secure Digital (MMC/SD) Controller Reading Power-On Boot Code from Integrated Flash Memory for User Storage ", its applying date is on August 28th, 2006, case number is: 11/309,594.And the continuation in part (CIP) of this U.S. patent application case former female case " Single-Chip USB Controller Reading Power-On Boot Code from Integrated Flash Memory for User Storage " that is another United States Patent (USP), its applying date is on Dec 3rd, 2003, case number is: 10/707,277, obtained at present and checked and approved registration, its U.S. Patent number is: 7,103,684.

Patent application case of the present invention is again the continuation in part (CIP) of U.S. patent application case " Low-Profile USB Device " simultaneously, and its applying date is on April 21st, 2005, and case number is: 11/112,501.

And patent application case of the present invention also is the continuation in part (CIP) of U.S. patent application case " Universal-Serial-Bus (USB) Flash-Memory Device with Metal Wrap Formed over Plastic Housing ", its applying date is on April 12nd, 2005, case number is: 10/907,700.

Patent application case of the present invention also is the continuation in part (CIP) of U.S. patent application case " Flash Memory Controller for Electronic Data Flash Card " simultaneously, and its applying date is on August 23rd, 2006, and case number is: 11/466,759.And the continuation in part (CIP) of this U.S. patent application case former female case " Electronic Data Storage Medium with Fingerprint Verification Capability " that is another United States Patent (USP), its applying date is on January 6th, 2000, case number is: 09/478,720.

Patent application case of the present invention also is the continuation in part (CIP) of U.S. patent application case " Highly Integrated Mass Storage Device with an Intelligent Flash Controller ", its applying date is on January 20th, 2004, case number is: 10/761,853.

Patent application case of the present invention also is the continuation in part (CIP) of U.S. patent application case " System and Method for Controlling Flash Memory ", and its applying date is on 02 26th, 2004, and case number is: 10/789,333.

Patent application case of the present invention also is relevant case with U.S. patent application case " Narrow Universal-Serial-BUS (USB) Flash-Memory Card with Straight Sides Using a Ball Grid-Array (BGA) Chip ", its applying date is on March 24th, 2006, case number is: 10/907,204.

Summary of the invention

At the deficiencies in the prior art, the objective of the invention is to: a kind of compact type universal serial bus device is provided, the thickness of the grip structure of wherein said universal serial bus device is actually and being of uniform thickness of the plug construction of described universal serial bus device, and with small-sized (half height) thickness of the plug construction of described universal serial bus device be coplane.Described miniplug thickness of structure is to rely on the plug reception space between the metal shell of a metal contact and a standard female USB (universal serial bus) socket connector to be decided, and described plug construction also has a width, described width is identical with the width in the space that the corresponding plug that described standard female USB (universal serial bus) socket connector is defined receives, therefore, make between described plug construction and described standard female USB (universal serial bus) socket connector, one (firm) space size of meeting is just arranged, reach the thickness of described plug construction with the integral thickness that dwindles described universal serial bus device.One printed circuit-board assembly is provided, it comprises that metal contact is formed on the first surface of a printed circuit board (PCB) (top), and all IC elements (for example: USB controller chip, flash memory chip etc.) are to be fixed on another relative surface of described printed circuit board (PCB).Then, one shell is that molded covering on the described IC element (that is to say, cover on the lower surface of described printed circuit-board assembly) that described shell comprises a plug portion, extend to respect to described metal contact, so that needed plug construction thickness to be provided; And leader's part is to cover described IC element.Described shell has a flat surfaces, parallel with described printed circuit board (PCB), and extend (for example: from the leading edge of described plug construction until the back edge of described grip structure) along the whole length of described universal serial bus device, therefore in fact the thickness of described grip structure be the same with the thickness of described plug construction, this is necessary to guarantee and certain standard female USB (universal serial bus) socket connector that is connected to, therefore, make one smooth, small-sized (approaching) structure can be easy to carry at user's pocket, or combines with an instrument (utility tool).

For achieving the above object, the technical solution used in the present invention is:

A kind of Small Universal serial bus device is characterized in that, it comprises a printed circuit-board assembly, several conducting wires and an one-piece molded shell, wherein:

Described printed circuit-board assembly comprises:

One printed circuit board (PCB), it is to comprise a printed circuit board (PCB) handle portion and a printed circuit board plug part, described printed circuit board (PCB) has opposite first and second surface;

Several metal contacts, it is arranged on the first surface of described printed circuit board plug part;

At least one passive device, it is the second surface that is fixed on described printed circuit board (PCB) handle portion;

The integrated circuit crystal grain of at least one un-encapsulated, it is the second surface that is fixed on described printed circuit board (PCB) handle portion;

Described several conducting wires, it is formed on the described printed circuit board (PCB), and each conducting wire is to be electrically connected at least one relevant metal contact, described at least one IC crystal grain and described at least one passive device;

Described one-piece molded shell, it is formed in the second surface of described printed circuit-board assembly, described at least one passive device and described at least one IC crystal grain are coated by described molding outer casing, and the whole first surface of described printed circuit board (PCB) then is to expose to the open air outside.

Compared with prior art, the advantage that adopts the present invention of technique scheme to have is:

At first, utilize the direct encapsulation technology of chip with fixing described USB controller and flash memory, usually by the surperficial technique for fixing encapsulation most area of printed circuit board (PCB) that controller and flash memory device accounted for, can thereby significantly reduce, therefore, so that universal serial bus device pin size (footprint) miniaturization effectively that manufacturing is come out, (in other words, providing a length the short and thinner device of width).

The second, the height of described IC crystal grain can reduce significantly, so that arranges at the storer through piling up, and can greatly increase the memory capacity of described universal serial bus device, and not need to increase the pin size of described universal serial bus device.In addition, whole manufacturing cost can rely on the controller and the flash memory devices of un-encapsulated to reduce, (in other words, the relevant cost of the surperficial technique for fixing encapsulation of described controller and flash memory devices is provided with attenuating).And described molding outer casing provides higher damp proof and waterproof effect compared with utilizing traditional manufacture method, and has higher crashproof effect.

So, relatively play those and utilize conventional surface technique for fixing manufacture method, utilization directly encapsulates in conjunction with chip and the manufacture method of surperficial technique for fixing according to the present invention, and then provides a kind of lower cost but to have a higher quality, and has the more storage products of small size.

According to another object of the present invention, short and small frivolous universal serial bus device described above, in the structure of bigger USB (universal serial bus) assembly, be intended for a module component (modular component), for example, in one embodiment, described short and small frivolous universal serial bus device is to be fixed in the full metal jacket, fully surround described universal serial bus device, and provide the plug portion of a standard plug cover (plug shell) at described universal serial bus device around, (in other words, therefore on described universal serial bus device formed metal contact be that the prepass that defines by described full metal jacket uses).In another specific embodiment, described universal serial bus device is to be fixed among one littler (half) metal shell, and it is the plug portion that only is enclosed in described universal serial bus device.In each specific embodiment, plastic cement partly be carried out combination with fixedly connected described universal serial bus device to described metal shell.Utilize a tool for gripping (criming tool) on described metal shell, to form depression, so that it is described Small Universal serial bus device is fixing in position, therefore, the present invention can make the universal serial bus device of low cost, high-quality, high power capacity, has graceful enclosure designs, can combine with described short and small frivolous universal serial bus device easily and easily, just like core parts (as core component).

Description of drawings

Figure 1A and Figure 1B be according to the present invention one specific embodiment to show the last skeleton view and the section side synoptic diagram of universal serial bus device of a demonstration;

Fig. 2 A and Fig. 2 B are the plug constructions that shows the described universal serial bus device among a standard female USB (universal serial bus) socket connector and Fig. 1, the section end synoptic diagram when being respectively separately and after the combination;

Fig. 3 is that another specific embodiment shows a kind of method flow diagram of making described universal serial bus device in Figure 1A and Figure 1B according to the present invention;

Fig. 4 A and Fig. 4 B are top view and the following views that is presented at the method for using a printed circuit board (PCB) panel among Fig. 3;

Fig. 5 is according to the method described in Fig. 3, to describe a kind of view/synoptic diagram that is used for fixing surperficial technique for fixing (SMT) processing procedure of passive device on a printed circuit board (PCB);

Fig. 6 is presented at the printed circuit board (PCB) panel described in Fig. 4 B, the top view after finishing through described surperficial technique for fixing processing procedure;

Fig. 7 is the simplification view that shows the semiconductor wafer, and it is included in the method that IC uses among Fig. 3;

Fig. 8 A, Fig. 8 B and Fig. 8 C are that the grinding wafer and the wafer that are described among Fig. 7 cut processing procedure to make the simplification cross sectional side view of IC crystal grain;

Fig. 9 is according to the described method of Fig. 3, describes and utilizes a kind of crystal grain connection process with the view/synoptic diagram of IC crystal grain on a printed circuit board (PCB) shown in fixing described Fig. 8 C;

Figure 10 shows after described crystal grain connection process is finished the top view of the printed circuit board (PCB) panel in Fig. 4 B;

Figure 11 is according to the described method of Fig. 3, describes and to utilize a kind of line connection process to connect the synoptic diagram of the IC crystal grain set corresponding contact mat to the described printed circuit board (PCB) among described Fig. 8 (C);

Figure 12 shows after described line connection process is finished the top view of the printed circuit board (PCB) panel in Fig. 4 B;

Figure 13 A and Figure 13 B are according to the described method of Fig. 3, describe and utilize a molded processing procedure to form the simplification cross sectional side view on the printed circuit board (PCB) panel of a molding outer casing in described Fig. 4 B;

Figure 14 shows after described molded processing procedure is finished, at the top view of the printed circuit board (PCB) panel described in Fig. 4 B;

Figure 15 is according to the described method of Fig. 3, and describing a kind of printed circuit board (PCB) panel that is used for being segmented among Fig. 4 B becomes the independently simplification cross sectional side view of the simplification processing procedure of universal serial bus device;

Figure 16 A and Figure 16 B show after the simplification processing procedure described in described Fig. 3 is finished the following top view of described universal serial bus device;

Figure 17 A and Figure 17 B are according to the method described in Fig. 3, show after a dozen printing journeys (marking process) are complete, at the top view and the following view of the universal serial bus device described in Figure 16 A;

Figure 18 is according to another specific embodiment of the present invention, comprises the simplification cross sectional side view of the universal serial bus device of stacked memory to show one;

Figure 19 is according to another specific embodiment of the present invention, to show the simplification cross sectional side view of a single-chip universal serial bus device;

Figure 20 shows that one has the calcspar that quickflashing stores the quickflashing microcontroller IC crystal grain of block in a large number;

Figure 21 is according to another specific embodiment of the present invention, shows that one has the three-dimensional exploded view of the USB (universal serial bus) assembly of full metal jacket;

Figure 22 A and Figure 22 B are presented at front view and the rear view of the described USB (universal serial bus) assembly of Figure 21 after assembling;

Figure 23 A, Figure 23 B and Figure 23 C are according to another specific embodiment of the present invention, show that one has the three-dimensional exploded view of the USB (universal serial bus) assembly of half metal shell, the front view after the assembling and the rear view after the assembling;

Figure 24 A shows that one has the existing flash memory cards of a universal serial bus connector;

Figure 24 B shows a female USB (universal serial bus) socket connector;

Figure 25 A and Figure 25 B are the cross section views that shows connection status between described public universal serial bus connector and the female USB (universal serial bus) socket connector;

Figure 26 shows a kind of existing USB (universal serial bus) flash memory cards that utilizes a Small Universal serial bus connector;

Figure 27 A and Figure 27 B are the cross section views that shows when described existing Small Universal serial bus connector is inserted into a standard female USB (universal serial bus) socket connector.

Description of reference numerals: 10,32-motherboard; 100,100A-universal serial bus device; The 102-grip structure; The 105-plug construction; The 110-printed circuit-board assembly; 111,111-1-printed circuit board (PCB); The 112-handle portion; The 114-plug portion; 116-surface, top (first); 118-surface below (second); 118A, 118B-lower surface area; 119,119-1,119-2,119-3-contact mat; 119-5,119-6-contact mat; 12,14-chip; The 12-flash memory chip; The 120-metal contact; 130,135-IC crystal grain; 130-control IC crystal grain; 131,136-conducting wire or metallic circuit; 135-flash memory crystal grain; The 14-controller chip; 142,144,146-passive device; The 142-capacitor; The 144-oscillator; The 146-light emitting diode; The 150-plastic shell; The 151-peripheral wall; 151-1-grip surface part; The 151-1A-back edge; The 151-1B-leading edge; 151-2A, 151-2B-sidewall; 151-2-plug surface part; Flat surfaces or flat surfaces under the 152-; 152-1-handle/plug surface part; 152-2-plug cover part; The 16-connector base board; 160-1,160-2-bonding wire; The 18-metal contact; The public USB (universal serial bus) connector of 20-; The 21-cable; The female USB (universal serial bus) socket of 22-connector; The 23A-lower wall; 23B-1,23B-2-sidewall; The 24-metal spring; The 25A-lower area; 25B-1, territory, 25B-2-lateral areas; The last zone of 25C-; The 26-connector base board; The 28-metal contact; 210-makes the printed circuit board (PCB) panel; 212-makes passive device; 214-makes wafer; 220-carries out surperficial technique for fixing processing procedure at passive device; 242-wafer back-grinding processing procedure; 244-wafer cutting processing procedure; 246-crystal grain engages and piles up processing procedure; The 248-line connection process; The molded processing procedure of 250-; 260-simplification processing procedure; 270-prints processing procedure; 280-tests, packs and transport; The public universal serial bus connector of 30-; 300-printed circuit board (PCB) panel; 310-terminal edge zone; 311, the terminal line of cut of 311-1,311-2-; The 320-edge area; 321-side line of cut; 331-printed circuit board (PCB) line of cut; The 34-plastic shell; The 340-middle section; 341,341-1,341-2-central authorities line of cut; The 36-end; The 38-metal contact; The 400-semiconductor crystal wafer; The 401-semiconductor base; The many IC of 430-; The 450-moulding press; The 452-cover plate; The 456-master mold; The 458-moulding layer; The 459-flat top surface; The 500-universal serial bus device; The 511-printed circuit board (PCB); The 518-lower surface; 535-1-first flash memory chip; 535-2-second flash memory chip; 560-1-first bonding wire; 560-2-second bonding wire; The 600-universal serial bus device; The 611-printed circuit board (PCB); 630-single-chip controller or flash memory crystal grain; The 631-controller circuitry; The 632-I/O interface circuit; The 634-flash memory control; 635-1,635-2, a large amount of storage circuits of 635-3-flash; The 638-bus; The 660-bonding wire; 700-USB (universal serial bus) assembly; 710-carries part; The 711-base plate; End plate behind the 713-; End plate before the 715-; The 717-retention tab; The 720-end piece; 721-plastic cement plug construction; 723-metal covering part; 729-plastic cement lug; The 730-metal shell; The 731-peripheral wall; Passage behind the 733-(opening); Passage behind the 735-(opening); The 737-pickup groove; 738 depressed parts (little shrinkage pool); 739-depressed part (little shrinkage pool); 800-USB (universal serial bus) assembly; The 810-substrate carrier; The 811-base plate; End plate behind the 813-; End plate before the 815-; The 817-retention tab; The 820-end piece; 821-plastic cement plug construction; 823-metal covering part; 829-plastic cement lug; The 830-metal shell; The 831-peripheral wall; Passage behind the 833-; The 835-prepass; The 837-pickup groove; The 839-fixed orifice.

Embodiment

See also Figure 1A and Figure 1B, it is that first specific embodiment is intended to and cross sectional side view to show looking of a Small Universal serial bus device 100 according to the present invention.Universal serial bus device generally includes a printed circuit-board assembly (printed circuit-board assembly) 110 and and is fixed on plastic shell 150 on the described printed circuit-board assembly 110.See also the upper section of Figure 1A, printed circuit-board assembly 110 comprises a printed circuit board (PCB) (printed circuit board (PCB)) 111, described printed circuit board (PCB) then comprises a printed circuit board (PCB) handle portion 112 at the rear of described printed circuit board (PCB) 111 end, and a printed circuit board plug part 114 is in the anterior end of described printed circuit board (PCB) 111.Printed circuit board (PCB) 111 is actually a planar substrates, and it has two relative faces, is respectively upper surface (the first) 116 and lower surface (the second) 118.Be formed with four metal contacts 120 on the upper surface 116 of plug portion 114, described metal contact 120 is to be shaped according to the pattern of universal serial bus specification defined and to arrange.Described printed circuit board (PCB) 111 is to form according to existing printed circuit board (PCB) process technique, therefore, metal contact 120, IC crystal grain 130 and 135 and passive device 142,144 and 146 be that circuit is interconnective, it is to rely on a network that defines in advance to comprise conducting wire (conductive trace) 131 and 136 and other conductive structures, (for example: sandwich construction FR4) and pasting between the agent is clipped in a transmitter.

According to a purpose of the present invention, passive device is surperficial technique for fixing (the Surface Mount Technology that utilizes one or more standards, SMT) to be fixed on the lower surface 118, and utilize the direct dimensional packaged circuit board (Chip-on-Board of chip, COB) (Integrated Circuit, IC) fixed by crystal grain (for example: controller IC crystal grain 130 and flash memory crystal grain 135) with one or more integrated circuit for technology.Described in Figure 1B, in described surperficial technique for fixing manufacture process, described passive device is as capacitor 142, oscillator 144 and a light emitting diode (Light Emitting Diode, LED) the 146th, be fixed on (this part will be described in detail in the back) on the contact mat that is arranged on lower surface 118, and then utilize existing unleaded reflow soldering (solder reflow) technology to be fixed on the described contact mat.In order to allow described surperficial technique for fixing processing procedure be easy to carry out, each passive device is (for example: ball grid array (Ball Grid Array to be encapsulated in any multiple known (preferably unleaded) surperficial technique for fixing package, BGA)), or the thin-type small-size encapsulation (Thin Small Outline Package, TSOP).Opposite, described IC crystal grain 130 and 135 is un-encapsulated, semiconductor " chip " is to be fixed on the lower surface 118, and utilizes the direct encapsulation technology of existing chip to be electrically connected to corresponding contact mat.For example, shown in Figure 1B, control IC crystal grain 130 is to be used to the formed bonding wire 160-1 of prior art to be electrically connected to described printed circuit board (PCB) 111, and same, 135 of flash IC crystal grain are to utilize bonding wire 160-2 to be electrically connected to described printed circuit board (PCB) 111.Passive device 142,144 and 146, IC crystal grain 130 and 135 and metal contact 120 be to rely on conducting wire or metallic circuit (conductive/metal trace) 131 and 136 interconnect, described conducting wire or metallic circuit (conductive/metal trace) 131 and 136 is to utilize existing technology to be formed on the described printed circuit board (PCB) 111, and wherein some is that dotted line is simply depicted in Figure 1A.

Shell 150 comprises molded plastic to be arranged, therefore in fact the plastic cement of all uses is the below that is positioned at printed circuit board (PCB) 111 one side of printed circuit board (PCB) (just) to form described shell 150, described shell 150 comprises that (in other words a peripheral wall 151 extends downwards, it is perpendicular to described printed circuit board (PCB) 111), and once flat surfaces or flat surfaces 152 extend and printed circuit board (PCB) 111 parallel.(For discussion purposes) according to the above discussion, described peripheral wall 151 parts are enclosed in the handle portion 112 of described printed circuit board (PCB) 111, below are referred to as grip surface part 151-1; And described peripheral wall 151 parts are enclosed in the plug portion 114 of described printed circuit board (PCB) 111, below are referred to as plug surface part 151-2.Same, described flat surfaces down or flat surfaces 152 parts cover the handle portion 112 of described printed circuit board (PCB) 111, below are referred to as grip surface part 152-1; And described flat surfaces down or flat surfaces 152 parts cover the plug portion 114 of described printed circuit board (PCB) 111, below are referred to as plug surface part 152-2.

Please consult Figure 1A again, leader's structure 102 of described universal serial bus device 100 is defined by described grip surface part 151-1, grip surface part 152-1 and the described upper surface 116 that exposes to the open air at described printed circuit board (PCB) handle portion 112; Same, 105 of plug constructions of described universal serial bus device 100 are defined by described plug surface part 151-2, plug surface part 152-2 and the described upper surface 116 that exposes to the open air in described printed circuit board plug part 114.

See also Fig. 2 A and Fig. 2 B, the thickness T 1 of described plug portion 105 and width W 1/W2 are chosen to make the inside of the female USB (universal serial bus) socket connector of (firm) conformance with standard 22 (as mentioned above) just.Seeing also Fig. 2 A, is to be approximately 2.5mm according to the universal serial bus standard setting value at the described metal contact 28 (lower surface that in other words, promptly refers to described connector base board 26) and the height H of surrounding between the lower wall 23A of described metal shell.1 of described thickness T is set to, for example: 2.4mm with the lower area 25A that guarantees described plug construction 105 and just meet described female USB (universal serial bus) socket connector 22 inside (in other words, not having apparent situation about swinging up and down occurs), and described plug construction 105 has metal contact 120 to guarantee and being electrically connected of described metal contact 28 (described in Fig. 2 B).Same, the width W 1 between described metal shell sidewall 23B-1 and 23B-2 be according to the universal serial bus standard setting value be approximately 12.0mm+/-0.1mm; The width W 2 of described plug construction 105 (width between described sidewall 151-2A and 151-2B outermost surfaces just) then is set to, for example: 12mm just meets the lower area 25A of described female USB (universal serial bus) socket connector 22 inside so that can guarantee described plug construction 105 more.Please note, described plug construction 105 is hereinafter referred to as " small-sized (low-profile) " and " half high (half-height) ", plug construction 105 described herein only is inserted into the lower area 25A (refer to that just described lateral areas territory 25B-1 and 25B-2 and last regional 25C are normally filled up by the metal shell of the public USB (universal serial bus) pin connector of a standard, but not filled up by described miniplug structure 105) of described female USB (universal serial bus) socket connector 22.

As shown in Figure 1B, according to another object of the present invention, shell 150 comprises flat surfaces once or the flat surfaces 152 that is parallel to described printed circuit board (PCB) 111, defined by a single face, therefore, first thickness T 1 of described plug construction 105 (just refer to from printed circuit board (PCB) upper surface 116 and abut against the following flat surfaces of described metal contact 120 or flat surfaces 152 between measured thickness) in fact second thickness T with described handle portion 102 2 identical (just refer to from printed circuit board (PCB) upper surface 116 and abut against the following flat surfaces of described IC 135 or flat surfaces 152 between measured thickness).That is to say that as shown in Figure 1B, universal serial bus device 100 whole length in fact all are smooth (just referring to from back edge 151-1A to leading edge 151-1B).The meaning of described word " in fact smooth " is meant that the surface, top side that described down flat surfaces or flat surfaces 152 are actually with the whole length of described universal serial bus device 100 is parallel.In Figure 1A and Figure 1B in the shown specific embodiment, the surface, top side of described universal serial bus device 100 is that the upper surface 116 by described printed circuit board (PCB) 111 is defined, and it is to be parallel to each other with following flat surfaces or flat surfaces 152 along described universal serial bus device 100 whole length.Same, described word " in fact smooth " also is to be to contain the specific embodiment that covers the following stated, wherein said shell comprises that a thin-wall construction is formed on or contacts the upper surface of described printed circuit board (PCB), in these specific embodiments, the thickness T 2 of described grip structure 102 have a little difference (for example: from the thickness T 1 of described plug construction 105 5%).

According to a purpose of the present invention, relevant for described universal serial bus device 100 so-called " smooth " be can rely on fix all IC crystal grain (chip) and described universal serial bus device 100 other electronic components at the lower surface 118 (the relative another side that just refers to described metal contact 120) of described printed circuit board (PCB) 111 to reach described purpose, therefore, the minimum thickness of described universal serial bus device 100 integral body is to be decided by described thickness T 1, between described plug construction 105 and described female USB (universal serial bus) receptacle terminal 22 (described in Fig. 2 B), described thickness T 1 must keep one just in succession, because this arrangement mode must be made way for the metal contact 120 of upper space, plug surface part 151-2 and plug cover part 152-2 may extend to the below of a distance of being scheduled to printed circuit board (PCB) 111, so that necessary thickness T 1 to be provided.Therefore, rely on described IC crystal grain 130 and 135 and passive device (for example: capacitor 142) only be fixed on the lower surface 118 of printed circuit board (PCB) 111, the gross thickness of described universal serial bus device 100 is then reduced.So; if described IC crystal grain and passive device are to be fixed on described upper surface 116; will cause the gross thickness of described USB (universal serial bus) structure to be necessary for thickness T 1 and add that IC extends to the thickness on the described printed circuit board (PCB) 111; (, also will add a protective bulkhead) if utilize this mode.

According to another object of the present invention, specific embodiment relevant for Figure 1A and Figure 1B, surface 116 is whole upper surfaces 116 that expose to the open air at described universal serial bus device 100 on the described printed circuit board (PCB) 111, therefore, so that make have a maximum ga(u)ge and with the identical universal serial bus device 100 of described plug construction 105 thickness T 1, because metal contact 120 is formed on the described upper surface 116, and described upper surface 116 is the higher ends that define described required plug construction thickness T 1, the whole height of described universal serial bus device can rely on and exposes upper surface 116 to the open air and be reduced (that is to say, make any point of described printed circuit board (PCB) upper surface 116 become the peak of described universal serial bus device 100).Described in Figure 1A, particularly the relevant described universal serial bus device 100 of basis is special little, peripheral wall 151 extend and cover described printed circuit board (PCB) 111 peripheral side edges around, and the coboundary of described peripheral wall 151 to be upper surfaces 116 with described printed circuit board (PCB) 111 be coplane, rely on the peripheral side edges that covers described printed circuit board (PCB) 111, described peripheral wall 151 can prevent that foreign object is inserted between described printed circuit board (PCB) 111 and the shell 150, therefore, can prevent that described printed circuit-board assembly 110 from separating improperly from described shell 150.

Fig. 3 be according to the present invention another specific embodiment to show a kind of method flow diagram of making described universal serial bus device 100.At the method for described novelty, general introduction, a printed circuit board (PCB) panel is to utilize known technology to make (square 210); Passive device is to utilize surperficial technique for fixing technology to be fixed on (square 220) on the described printed circuit board (PCB) panel; Described IC crystal grain then is to utilize the direct encapsulation technology of known chip to engage (square 246) and routing joint (square 248) with crystal grain; Then, on described passive device and IC crystal grain, utilize the plastic cement of fusing to form a molding outer casing (square 250); The printed circuit board (PCB) panel is then become independently universal serial bus device (square 260) by simplification (cutting) then; Described independently universal serial bus device is printed (square 270); Then test, pack and transport described universal serial bus device (square 280) by convention.Only utilize the manufacture method of surperficial technique for fixing with respect to tradition; the method provides several advantages; first; utilize the direct encapsulation technology of chip to fix described USB controller and flash memory; usually can the minimizing that lands can be shown by the shared big quantity space of these devices, therefore the significantly miniaturization of described universal serial bus device pin size can be made.The second, rely on the execution of following described wafer grinding method, the height of crystal grain can significantly reduce, the storer that therefore helps to pile up is arranged, just like following about the content described in Figure 18.Compare and using traditional manufacture method, described molding outer casing also provides splendid damp proof and water-proof function, and has higher crashproof effect.Compare the manufacture method of utilizing surperficial technique for fixing processing procedure at the standard universal serial bus storage card, it is lower in conjunction with the cost of the processing procedure (adding molded processing procedure) of direct encapsulation of chip and surperficial technique for fixing to describe use herein.And for the method for only utilizing surperficial technique for fixing processing procedure, its raw material inventory such as flash memory and controller chip also all will utilize the direct encapsulation procedure of chip to make, so the cost of the direct encapsulation procedure of all chips has been split on encapsulation memory chip and the controller chip.So, in according to the present invention directly to encapsulate in conjunction with chip and the method for surperficial technique for fixing processing procedure, compare the method for only utilizing surperficial technique for fixing processing procedure in tradition, more can provide the cheap and higher quality of a cost price (in other words, more trustworthy), and can have the storage products of littler volume.

Below rely on reference to Fig. 4 A to Figure 17 B, shown process flow diagram among Fig. 3 will be described in detail, see also the upper section among Fig. 3, described manufacture method is begun by the material of meet the requirements (filing a bill of), comprise and make printed circuit board (PCB) panel (square 210), manufacturing passive (separation) element (square 212), for example: resistance, capacitor, diode, light emitting diode and oscillator all are to utilize the supply (or each other IC crystal grain) that surperficial technique for fixing processing procedure is packaged and make the IC wafer.

Fig. 4 A and Fig. 4 B are one certain specific embodiments according to the present invention, and the view up and down of the square 210 of a printed circuit board (PCB) panel 300 (t0) that is provided in square 210 processing procedures described in Fig. 3 is provided respectively.Described mark " tx " is to be used for indicating the state of described printed circuit board (PCB) panel in manufacture process at this, for example " t0 " is expression one initial state, and higher numeral (for example: " t1 ", " t2 " and " t3 ") is then represented the extra processing procedure that described printed circuit board (PCB) panel 300 is carried out continuously.

As shown in Fig. 4 A and Fig. 4 B, printed circuit board (PCB) panel 300 (t0) comprises wide substrate when indicating two in length in zone just like printed circuit board (PCB) 111 at 4 o'clock, each all has about Figure 1A and the described feature of Figure 1B, and Fig. 4 A is the upper surface 116 (for example: the upper surface 116 of panel 111-1 comprises metal contact 120) that shows each printed circuit board (PCB) 111; Fig. 4 B is the lower surface 118 that shows each printed circuit board (PCB) 111, please note, (for example: lower surface 118 printed circuit board (PCB) 111-1) comprises a plurality of contact mats 119 to each printed circuit board (PCB) 111, arrange according to the figure that is predetermined, so that the direct encapsulation procedure of surperficial technique for fixing and chip, this part will be described in detail as follows.

As shown in Fig. 4 A, print the printed circuit board 111 except two, panel 300 (t0) comprises terminal edge zone 310 and edge area 320, and surrounding described printed circuit board (PCB) 111, and 340 of middle sections are arranged on described two and print between the printed circuit board 111.The line of cut that is indicated is along each regional edge, cut on described printed circuit board (PCB) panel 300 (t0) with indentation or part, but not by described panel material (not cutting off), for example, terminal line of cut 311 is to be partitioned into described terminal edge zone 310 from relevant printed circuit board (PCB) 111; 321 of side lines of cut are to be partitioned into described edge area 311 from relevant printed circuit board (PCB) 111; 341 of lines of cut of central authorities are to be partitioned into described middle section 340 from relevant printed circuit board (PCB) 111.The line of cut 331 of printed circuit board (PCB) is to form along the lateral edges between the adjacent printed circuit boards 111, the panel at edge then provides pilot hole and other know the existing feature of people of described technical field, so that manufacture process, and can in the simplification process, the panel at described edge can be removed (being described below).

Please note, printed circuit board (PCB) for the universal serial bus device that only utilizes the manufacturing of surperficial technique for fixing manufacture process must be wideer than printed circuit board (PCB) 111, because need enough spaces with fixing flash memory devices through encapsulation, therefore, only include only 12 printed circuit board (PCB)s usually and be arranged in one 2 * 6 substrate with the printed circuit board (PCB) panel of surperficial technique for fixing manufacture method, yet rely on the direct method for packing of chip to fix described flash memory, this invention helps making printed circuit board (PCB) 111 to become narrower, therefore, can make each printed circuit board (PCB) panel 300 (t0) comprise that 18 printed circuit board (PCB)s 111 are arranged in one 2 * 9 substrate, rely on to increase printed circuit board (PCB) 111 quantity of each printed circuit board (PCB) panel, the present invention can provide the time of the shorter required cost of manufacture process and reduce cost.

Fig. 5 is according to the square described in Fig. 3 220, describes a kind of view that is used for fixing passive device at a printed circuit board (PCB) 111-1 upper surface technique for fixing processing procedure.In the first step of described surperficial technique for fixing processing procedure, to not have lead-in wire tin cream (lead-free solder paste) and be printed on described contact mat 119-1,119-2, and 119-3, described in embodiments of the present invention contact mat is to correspond to surperficial technique for fixing element 142,144, and 146, utilize existing printing stencil (stencil) to be fit to design and the layout of described printed circuit board (PCB) 111-1, after distributing described tin cream, described panel is transported to traditional picking up and place machine (pick-and-place machine), and according to existing technology difference fixed surface technique for fixing element 142,144, and 146 to described contact mat 119-1,119-2, and on the 119-3, pick up and after process that placing element is fixing finishes when described, then with described printed circuit board (PCB) panel under a correct temperature data by the unleaded reflow soldering oven of infrared ray group (IR-reflow oven set), when described oven temperature range reaches the top, the scolder of each contact mat is melted fully on the PC plate, and this scolder through melting connects the pin of all passive devices to the routing weld pad of described PC plate.Fig. 6 shows the result of printed circuit board (PCB) panel 300 (t1) after time assembling, wherein (for example: printed circuit board (PCB) 111-1) comprise passive device 142,144 and 146, it is to be fixed on the printed circuit board (PCB) 111 by means of the surperficial technique for fixing processing procedure of finishing to each printed circuit board (PCB) 111.

Fig. 7 is to show the simplification view once the semiconductor crystal wafer 400 (t0) of finishing or making according to the square described in Fig. 3 214.Wafer 400 (t0) comprises many IC 430, described IC 430 is formed on the semiconductor substrate 401 according to existing photolithography (photolithographic) manufacturing technology, in following described example, wafer 400 (t1) comprises IC 430, and described IC 430 then comprises the USB (universal serial bus) control circuit.In relevant program, one wafer (not shown) is similar to be to comprise the flash circuit after making at wafer 400 (t1), and in another alternate embodiment (this part will be described in detail as follows), IC 430 can comprise USB controller circuit and flash both circuits.Under each situation, these wafers will be carried out processing, and are as described below, see also Fig. 8 A, Fig. 8 B and Fig. 8 C.

Fig. 8 A, Fig. 8 B and Fig. 8 C are according to the square described in Fig. 3 242, and during a wafer carried out the back-grinding processing procedure, substrate 401 was restricted at a grinding processing procedure, in order to reduce the original depth TW1 of each IC 430 integral body.Wafer 400 (t1) at first is to be fixed on to face down (to that is to say on adhesive tape, therefore described substrate layer 404 (t0) is towards the another side of adhesive tape), it is to be attached to a metal or teething ring frame (not shown) in advance, described then ring frame/wafer assembly is loaded in a vacuum chuck (vacuum chuck) (not shown), and described vacuum chuck has very level, a flat surfaces and have than the bigger diameter of wafer 400 (t0) diameter.Then, described substrate layer is ground, as shown in Fig. 8 B, have a thickness T W2 who designs in advance up to wafer 400 (t0), described degree TW2 is more described initial thickness TW1 little (as shown in Fig. 8 A).In processing procedure, utilize deionized water (de-ionized water) to be cleaned described wafer, last at the mechanical polishing processing procedure makes wafer 400 (t1) wash cleaning with more deionized water, then again to rotate with air-dry wafer 400 (t1) at a high speed.

See also Fig. 8 C, next, described wafer is cut into small pieces cuts apart IC 430, for will be according to the square described in Fig. 3 244 to make IC crystal grain 130 along predefined fringe region.After the back-grinding processing procedure is finished, the tape shifter of wafer 400 (t1) front side is removed, described wafer 400 (t1) is fixed on one has adhesive tape ring frame thereon, be to contact adhesive tape specifically with dorsal part through grinding up-to-date wafer, then with described ring frame wafer load to crystal grain cutting machine (die saw machine), described crystal grain cutting machine is to design the degree of depth that correct grain size data, X-axle and Y-axle Cutting Road (scribe lanes), width, wafer thickness and an expection surpasses cutting in advance.Then, select the cutter of a proper width according to the width of XY Cutting Road, begin to cut processing procedure, first road of wafer X-axle is cut into small pieces, with deionized water the flushing of suitable angle and press on cutter around and the wafer contact point, to clean and to wash out when the rotation of saw cutter and along silicon cutting dust that Cutting Road was produced.According to grain size size and cutting width distance, described cutting process can be indicated (index) second Cutting Road, and after all X-axle Cutting Roads were finished cutting, the wafer chuck revolved and turn 90 degrees to aim at Y-axle Cutting Road to cut.The action that described seal cuts can repeat, and finishes up to all Cutting Road cuttings of Y-axle.

Fig. 9 is according to the square described in Fig. 3 246, describes and utilizes the view of a crystal grain connection process with the flash memory IC crystal grain on the printed circuit board (PCB) 111-1 of IC crystal grain 130 shown in fixing described Fig. 8 C and described printed circuit board (PCB) panel.Described crystal grain connection process is carried out (seeing also Fig. 6) to go up at printed circuit board (PCB) panel 300 (t1), and it is to carry out after described surperficial technique for fixing processing procedure is finished.Described crystal grain connection process comprises static controller IC crystal grain 130 usually to lower surface area 118A, and described lower surface territory 118A is touched pad 119-5 to surround; And fixedly flash IC crystal grain 135 is to lower surface area 118B, and described lower surface area 118B is between two row contact mat 119-5.In a particular specific embodiment, one operator is loaded into IC crystal grain 130 and 135 on the crystal grain jointing machine (die bonder machine) according to existing technology, described operator also is loaded into many printed circuit board (PCB)s panel 300 (t1) collecting frame (magazine rack) of described crystal grain jointing machine, described crystal grain jointing machine picks up the described first printed circuit board (PCB) panel 300 (t1) from the bottom heap (bottom track) of described casket box, and selected printed circuit board (PCB) panel is transported to described crystal grain from the conveying arrangement track pastes (die bond, DB) the discrete target district of epoxide (epoxy dispensing target area), the described casket box poor mouth of reduction automatically allows described crystal grain jointing machine engage in the next one circulation that operates at crystal grain well and picks up second (new bottom piece) again with ready.Paste (die bond at described crystal grain, DB) in the discrete target district of epoxide (epoxy dispensing target area), described casket box distributes crystal grain to paste epoxide automatically, the pattern (write pattern) that writes of utilization design in advance also transmits described correct jet size size, extremely the target area 118A and the 118B of each printed circuit board (PCB) 111 of described printed circuit board (PCB) panel 300 (t1) fast.After all printed circuit board (PCB)s 111 are finished this epoxy and are partly changed the thing allocator, described printed circuit board (PCB) panel is transported to a crystal grain pastes the target area, simultaneously, in the stage of input, box-packed year one second so far empty crystal grain of printed circuit board (PCB) panel of described casket is pasted epoxide and is distributed the target area, paste the target area at described crystal grain, described mechanical arm that picks up and becket (collet) (have straight-flanked ring suction nozzle around, therefore vacuum can produce the strength of a suction from central authorities) pick up an IC crystal grain 130 and be bonded to lower surface area 118A, wherein epoxide has been distributed in described lower surface area 118A for bonding effect, then carry out this program again to place IC crystal grain 135 to described lower surface area 118B, all printed circuit board (PCB)s 111 have been finished crystal grain stickup program on the printed circuit board (PCB) panel, then, described printed circuit board (PCB) panel is transported to a quick-hardening zone (snap cure region), wherein said printed circuit board (PCB) panel is by a chamber with a heating element, and described chamber distributes the temperature that temperature to is fit to the described epoxide of heat curing (thermally cure).After solidifying, described printed circuit board (PCB) panel is transported in the dead slot (slot) of described casket box, wait for the output frame (output rack) of described crystal grain jointing machine.After receiving a new panel, described casket box rises a groove to be ready to receiving the next panel at second circulation time of described program, and described crystal grain jointing machine will repeat these step 1 till all printed circuit board (PCB) panels in input cartridge are complete.Pile up manyly for one deck storage crystal grain for the stacked die product needed, can repeat once this fabrication steps again at identical panel.Figure 10 is after described crystal grain connection process is finished, and shows the top view of described printed circuit board (PCB) panel 300 (t2).

Figure 11 is according to the square described in Fig. 3 248, describes and utilizes line connection process to connect described

IC crystal grain

130 and 135 synoptic diagram to corresponding contact mat 119-5 and 119-6 respectively.Described line connection process carries out as follows, finish the running of crystal grain joint when all casket boxes of printed circuit board (PCB) panel 300 (t2) (seeing also Figure 10) after, one operator transports described printed circuit board (PCB) panel 300 (t2) near a wire bonder (wire bonder, WB), and loading the casket box input frame (magazine input rack) of printed circuit board (PCB) panel 300 (t2) to described wire bonder, described wire bonder is to be prepared in advance to carry out this specific universal serial bus device with a correct formula.The coordinate (coordinates) of all IC pad 119-5 and 119-6 and P.e.c. edge connector is to be predetermined and to stylize in described wire bonder, after the described printed circuit board (PCB) panel that adheres to crystal grain is loaded to described routing bonding land, described operator assigns instruction makes wire bonder utilize optical image (optical vision) to confirm the position of the first bonding wire pin (wire bond pin) of the first storage crystal grain of first printed circuit board (PCB) on the described panel, in case first pin is correctly established, described wire bonder can be finished whole line connection process automatically at remaining panel in the like products type, for many flash layer stacked die, described printed circuit board (PCB) panel can be got back to described wire bonder and repeat the routing splice program to pile up at second.Figure 12 is after described line connection process is finished, and shows the top view of printed circuit board (PCB) panel 300 (t3).

Figure 13 A and Figure 13 B are according to the square described in Fig. 3 250, describe and utilize a molded processing procedure to form the simplification cross sectional side view of a molding outer casing layer at printed circuit board (PCB) panel 300 (t3).As shown in Figure 13 A, after described line connection process is finished, USB (universal serial bus) panel 300 (t3) is loaded into a moulding press (mold machine) 450, described moulding press 450 comprises a cover plate (cover plate) 452, be for fixed to the top of the lower surface 116 of described printed circuit board (PCB) panel 300 (t3), and define a chamber 456 and be used for being configured on IC chip, bonding wire and the passive device, these IC chips, bonding wire and passive device then are to be fixed on the described lower surface 116.Note that and do not use any moulding material on described upper surface 118.Select the method for transfer moulding (transfer molding) at this, because the high-accuracy and the low cycling time of transfer moulding die mould (transfer molding tooling).Be granular moulding material and heat in advance and be loaded into a pot or a chamber (not shown) described, described in the 13rd figure B, then utilize a piston (not shown) to pass through the known inlet (spruce) of a usefulness from described POT with described moulding material, passage (runner) and cast gate (gate) enter described master mold (mold cavity) 456, cause described melted material to coat (encapsulate) all IC chip and passive devices, and coat that all expose zone outside to the open air on the described lower surface 116 to form a moulding layer 458.Described model (mold) keep closed condition because described moulding material poured into and filled up described master mold 456 have vacant position.During this process, the wall of described cover plate 452 is heated to temperature more than the moulding material fusing point so that described material can flow more quickly all over and described master mold 456.Moulding press 450 keeps cutting out until till the curing reaction (curing reaction) of described moulding material is finished.Follow described injection molding program and carry out cool cycles, the molded ability material of described moulding layer 458 begins to solidify and harden.After in case described moulding layer 458 has enough hardness, thimble (ejector pins) is released printed circuit board (PCB) panel 300 (t4) (as shown in Figure 14) from moulding press, as shown in Figure 14, described moulding layer 458 is gone up at described printed circuit board (PCB) panel 300 (t4) and is formed a uniform planar square, and promptly flat top surface 459.

Figure 15 is according to the square described in Fig. 3 260, describes one and is used for cutting apart the independently simplification cross sectional side view of the simplification processing procedure of universal serial bus device of described printed circuit board (PCB) panel 300 (t4) one-tenth one.Described printed circuit board (PCB) panel 300 (t4) is loaded into a cutting machine (not shown), and described cutting machine is to preestablish a simplification routine to comprise the cutting position that is predetermined.The operator aims at described cutter as first line of cut of starting point (for example: terminal line of cut 311-1), the coordinate of primary importance is stored in the storer of described cutting machine, follow described cutting machine just according to predefined simplification routine, (simplification) USB (universal serial bus) panel 300 (t4) are cut in beginning automatically, for example, successively along line of cut 311-1,341-1,341-2, and 311-2, and then along described side line of cut and printed circuit board (PCB) line of cut (seeing also Fig. 4 A) to form independently universal serial bus device.Figure 16 A and Figure 16 B are the views up and down of a shown universal serial bus device 100 after described simplification processing procedure is finished.

Figure 17 A and Figure 17 B are according to the square described in Fig. 3 270, after a dozen print journey (marking process) execution, show the following top view through the universal serial bus device 100 of simplification.Again described universal serial bus device 100 after simplification is finished is carried out a dozen and print journey, the wherein LOGO of company, the USB (universal serial bus) LOGO of an appointment, RoHs LOGO, value, storage volume value or other relevant following flat surfaces or the flat surfaces 152 of data several times to be printed on shell 150, and/or the upper surface 116 of printed circuit board (PCB) 111, after the printing processing procedure is finished, described universal serial bus device 100 is put in described oven to solidify described fixedly printing ink.

See also the square 280 that is positioned at the bottom among Fig. 3, it is last in a inventive method processing procedure step, and it comprises test, packing and transports described independently universal serial bus device.See also Figure 17 A and Figure 17 B, then described universal serial bus device through printing is carried out visual examination and Electronic Testing up to specification, the universal serial bus device that is excluded through visual examination and/or Electronic Testing will be rejected from non-defective unit as faulty materials, good storage card by test then is packaged in the specially appointed customized packing box of client, and last packaged product can be transported to the customers' place with correct program according to the file of necessity.

In above-mentioned example, utilize the controller and the flash crystal grain of un-encapsulated, except can lowering whole one-tenth manufacturing cost, (that is to say, reduce and to be relevant to controller that surperficial technique for fixing finishes and the packaging cost of flash memory devices), the present invention more provides an other advantage, promptly enlarges the memory capacity of universal serial bus device 100 and don't can increase its whole volume.For example, Figure 18 shows that one piles up the simplification cross sectional side view of the universal serial bus device 500 of storer, the wherein said first flash memory chip 535-1 is fixed on a lower surface 518, and, utilize the first bonding wire 560-1 that the described first flash memory chip 535-1 is connected to printed circuit board (PCB) 511 according to above-mentioned method.Because the height D (thickness) of described IC crystal grain is than littler through the flash memory devices of encapsulation, and because the thickness T 1 of universal serial bus device 500 is the specifications of fixing, for example: 2.0mm, with regional 25A (described in Fig. 2 B) under plug construction 105 inside of guaranteeing just to meet female USB (universal serial bus) socket connector 22, the present invention one piles up in the storer arrangement, one second flash memory chip 535-2 is fixed on the first flash memory chip 535-1, and utilizes the second bonding wire 560-2 that the described second flash memory chip 535-2 is connected to printed circuit board (PCB) 511.Substitute (not shown) among the tool embodiment at another kind, the second flash memory chip 535-2 also can utilize the contact point of relevant bonding wire connection as for the described first flash memory chip 535-1, this stacked memory is arranged can significantly increase the memory capacity of described universal serial bus device, but can't increase the pin size (just referring to its thickness T 1, length and width) of described Small Universal serial bus device 500.

Figure 19 is according to another specific embodiment of the present invention, shows that one comprises the simplification cross sectional side view of the Small Universal serial bus device 600 of stacked memory.This Small Universal serial bus device 600 is and difference to some extent described in the specific embodiment before, described universal serial bus device 600 is to utilize monocrystalline controller/flash crystal grain 630 to replace USB controller and flash memory chip separately, rely on bonding wire 660 described monocrystalline controller/flash crystal grain 630 to be connected to a printed circuit board (PCB) 611 in above-mentioned mode, with as its feature, as shown in Figure 20, monocrystalline controller/flash crystal grain 630 comprises a controller circuitry 631 and a large amount of storage circuit 635-1 of one or more quickflashing square, 635-2, and 635-3, rely on a bus 638 to interconnect.Controller circuitry 631 comprises an I/O (I/O) interface circuit 632 so that transmit and receive the anti-data of instruction to/from the main frame (not shown) that described universal serial bus device 600 is inserted.Controller circuitry 631 also comprises a flash controller 634, with transmit and receive the data that transmitted by one or more inner quickflashing buses 638 to/store square 635-1,635-2 and 635-3 in a large number from quickflashing.Because inner quickflashing bus 638 is in monocrystalline controller/quickflashing crystal grain 630 inside, therefore describedly be interfaced to that quickflashing stores square 635-1,635-2 in a large number and 635-3 does not need inner pin.In one embodiment, quickflashing stores square 635-1,635-2 and 635-3 and nonrandom access in a large number, the substitute is, one instruction and one is to be used as data to be transmitted through inner quickflashing bus 638 to specify one to store the data square that square 635-1,635-2,635-3 will transmit in a large number from quickflashing with an address address, therefore, a large amount of storage square 635-1,635-2,635-3 are but that the addressing square stores in a large number, and and non-random access memory (Random Access Memory, RAM).In another specific embodiment, quickflashing stores square 635-1,635-2 in a large number, 635-3 relies on the quickflashing microcontroller of controller circuitry 631 and 632 to flock together, and stores square 635-1,635-2,635-3 in a large number to measure (map) and indication data transmission (data transaction) to selected quickflashing.Because described quickflashing microcontroller 631 (Controller circuit) is to carry out storage administration, quickflashing stores square 635-1,635-2,635-3 in a large number and is shown as single, a continuous internal host that is stored to, the details of relevant employed monocrystalline controller/quickflashing crystal grain 630 is at all United States Patent (USP)s the 7th of the present patent application people, 103, have illustratedly in 684, it incorporates list of references as this case at this.

Except as the independent universal serial bus device, in above-mentioned specific embodiment, described short and small frivolous universal serial bus device can be used as modular unit (modular unit), and be bonded in the USB (universal serial bus) assembly, two examples of this USB (universal serial bus) assembly will be described in next section.

Figure 21 is the three-dimensional exploded view that shows a Small Universal serial bus device 100, is fixed in the described Small Universal serial bus device 100 (it can utilize in the above-mentioned specific embodiment any to replace) comprising a full metal jacket 730.When the described Small Universal serial bus device 100 of assembling is fixed on a substrate carrier (substrate carrier) 710, therefore described Small Universal serial bus device 100 be by one before a back end plate 713 and a base plate 711 between the end plate 715 supported, end plate 715 includes retention tab (locking tabs) 717 before wherein said, then, to utilize universal serial bus device 100 and substrate carrier 710 formed sub-assemblies to slip over a prepass 735 and be fastened on (as shown in Figure 22 A) in the pickup groove 737, be defined and described prepass 735 is peripheral walls 731 by described metal shell 730 up to fixed part 717.Described depressed part (little shrinkage pool) the 738th utilizes a tool for gripping (crimping tool) to form, and the side of pressing to described universal serial bus device 100 is to fix described universal serial bus device 100 in suitable place.One terminal part 720 comprises a plastic cement plug construction 721, and when inserting the back passage 733 of described betal can 730, described plastic cement plug construction 721 can be depressed on described universal serial bus device 100.One metal covering part 723 is formed in described plastic cement plug construction 721, when described terminal part 720 whole insertions, and 723 back passages 733 (as shown in Figure 22 B) that cover described metal shells 730 of described metal covering part.Plastic cement lug 729 extends upward from plug construction 721, when described terminal part 720 whole insertions, described plastic cement lug 729 just is fastened in the described depressed part (little shrinkage pool) 739 that is formed on metal shell 730 (as shown in Figure 22 B), therefore can fix described terminal part 720 on metal shell 730.Figure 22 A and Figure 22 B show front view and the rear view of USB (universal serial bus) assembly 700 after assembling respectively.Please note that described metal shell 730 has a height H I, correspond to the internal height HI (seeing also) of standard female USB (universal serial bus) socket connector 22 with described in Fig. 2 A.Because the height of described metal shell 730 is greater than described universal serial bus device 100, metal contact 120 is to use via the prepass 735 that metal shell 730 is defined, and makes described metal shell 730 can be used as the function of the public universal serial bus connector of similar standard.

Figure 23 A, Figure 23 B and Figure 23 C show another kind of specific embodiment USB (universal serial bus) assembly 800, described USB (universal serial bus) assembly 800 comprises half metal shell 830, with as the specific embodiment of just having mentioned above similar, but more above-mentioned specific embodiment is then lighter and littler, because described metal shell 830 only has half length of described metal shell 730.Similar at USB (universal serial bus) assembly 700, assembling described USB (universal serial bus) assembly 800 is to rely on fixing described universal serial bus device 100A in a substrate carrier (substrate carrier) 810, therefore described universal serial bus device 100A be by one before a back end plate 813 and a base plate 811 between the end plate 815 supported, wherein said preceding end plate 815 includes retention tab (locking tabs) 817.Then, sub-assembly slips over a prepass 835 and is fastened on (as shown in Figure 23 B) in the pickup groove 837 up to fixed part 817, is defined and described prepass 835 is peripheral walls 831 by described metal shell 830.

One terminal part 820 comprises a plastic cement plug construction 821, and when inserting the back passage 833 of described betal can 830, described plastic cement plug construction 821 can be depressed on described universal serial bus device 100A.One metal covering part 823 is formed in described plastic cement plug construction 821, when described terminal part 820 whole insertions, and 823 back passages 833 (as shown in Figure 23 C) that cover described metal shells 830 of described metal covering part.Plastic cement lug 829 extends upward from plug construction 821, when described terminal part 820 whole insertions, described plastic cement lug 829 just is fastened in the described fixed orifice 839 that is formed on metal shell 830 (as shown in Figure 23 C), therefore can fix described terminal part 820 on described metal shell 830.

More than explanation is just illustrative for the purpose of the present invention; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within protection scope of the present invention.

Claims

1. a Small Universal serial bus device is characterized in that, it comprises a printed circuit-board assembly, several conducting wires and an one-piece molded shell, wherein:

Described printed circuit-board assembly comprises:

Described several conducting wires, it is formed on the described printed circuit board (PCB), and each conducting wire is to be electrically connected at least one relevant metal contact, described at least one integrated circuit crystal grain and described at least one passive device;

Described one-piece molded shell, it is formed in the second surface of described printed circuit-board assembly, described at least one passive device and described at least one integrated circuit crystal grain are coated by described molding outer casing, and the whole first surface of described printed circuit board (PCB) then is to expose to the open air outside.

2. a kind of Small Universal serial bus device according to claim 1, it is characterized in that: described molding outer casing comprises a flat surfaces that is parallel to described printed circuit board (PCB), and described flat surfaces also extends to described printed circuit board plug part from described printed circuit board (PCB) handle portion; The first measured thickness between described printed circuit board (PCB) first surface and described flat surfaces wherein adjacent to described metal contact, and the second measured thickness between described printed circuit board (PCB) first surface and the described flat surfaces adjacent to described integrated circuit crystal grain, both thickness is identical.

3. a kind of Small Universal serial bus device according to claim 2, it is characterized in that: described molding outer casing comprises and extending and perpendicular to a peripheral wall of described flat surfaces, and described peripheral wall is a surrounding edge of aiming at described printed circuit board (PCB).

4. a kind of Small Universal serial bus device according to claim 1, it is characterized in that: described at least one integrated circuit crystal grain is to rely on several bonding wires to extend between described at least one integrated circuit crystal grain and corresponding contact mat, to be electrically connected to described conducting wire, described contact mat is arranged on the second surface of described printed circuit board (PCB).

5. a kind of Small Universal serial bus device according to claim 4 is characterized in that: described at least one passive device comprises a lead, and described lead is to be welded on a corresponding contact mat that is arranged on described printed circuit board (PCB) second surface.

6. a kind of Small Universal serial bus device according to claim 5 is characterized in that: described at least one passive device comprises at least one resistor, a capacitor, an oscillator and a light emitting diode.

7. a kind of Small Universal serial bus device according to claim 4, it is characterized in that: at least one integrated circuit crystal grain comprises one first integrated circuit crystal grain and one second integrated circuit crystal grain, the described first integrated circuit crystal grain comprises a USB (universal serial bus) control circuit, and the described second integrated circuit crystal grain comprises a flash memory circuit.

8. a kind of Small Universal serial bus device according to claim 7, it is characterized in that: at least one integrated circuit crystal grain comprises several flash memory crystal grain, be arranged to a stack of arrangement, therefore, one first flash memory crystal grain is to be fixed on the second surface of described printed circuit board (PCB), and one second flash memory crystal grain then is to be fixed on the surface of the described first flash memory crystal grain.

9. a kind of Small Universal serial bus device according to claim 8, it is characterized in that: the described first flash memory crystal grain is to rely on first several bonding wires to be connected to described printed circuit board (PCB), and the described second flash memory crystal grain then is to rely on second several bonding wires to be connected to described first flash memory crystal grain and described printed circuit board (PCB).

10. a kind of Small Universal serial bus device according to claim 4, it is characterized in that: at least one integrated circuit crystal grain comprises a single-chip controller or quickflashing crystal grain, described single-chip controller or quickflashing crystal grain comprise controller circuitry and a large amount of storage circuits of one or more quickflashing blocks, rely on a bus to interconnect.