CN101523571A - 柔性基板上沉积的电池层的掩模和材料限制 - Google Patents

柔性基板上沉积的电池层的掩模和材料限制 Download PDF

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CN101523571A
CN101523571A CNA200780035960XA CN200780035960A CN101523571A CN 101523571 A CN101523571 A CN 101523571A CN A200780035960X A CNA200780035960X A CN A200780035960XA CN 200780035960 A CN200780035960 A CN 200780035960A CN 101523571 A CN101523571 A CN 101523571A
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substrate
curved surface
tension force
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sheet
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S·W·斯奈德
P·C·布兰特纳
H·L·佐特威
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1028—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith

Abstract

本申请涉及掩模技术和装置，尤其涉及对将用一层或多层材料层涂覆的柔性基板进行掩模的方法和装置。该方法涉及挠曲基板以提供曲面，并在该曲面上提供柔性片以将涂层适当地涂在基板的表面上。该装置包括基板和柔性片。诸如弹簧销或离轴轧制杆的弹性材料可用于产生用于挠曲基板和/或柔性片的张力。

Description

柔性基板上沉积的电池层的掩模和材料限制
相关申请
本专利申请根据35 U.S.C.§119涉及并要求2006年9月29日提交的、题为“Masking of and Material Constraint for Depositing Battery Layers onFlexible Substrates”(柔性基板上沉积的电池层的掩模和材料限制)的美国临时专利申请S/N 60/827,865的权益，其内容通过引用结合于此。
发明领域
本申请涉及掩模技术和装置，尤其涉及对将用一个或多个材料层涂覆的柔性基板进行掩模的方法和装置。
发明背景
固态薄膜电池和其它薄膜器件通常需要阴影掩模(shadow masking)来限定电池构造的各个层。典型的平面器件构造依赖于刚性基板和掩模材料以及将基板和掩模重合在一起的硬边缘对准过程。柔性固态薄膜电池技术的出现以及作为结果较薄的基板和掩模材料的使用——两者通常是箔或带的形式——带来了限制这些柔性材料的挑战。另外，出现了在应用诸如物理气相沉积或化学气相沉积之类的典型薄膜沉积技术期间精确限定相关联的薄膜涂覆区域的挑战。如图1所示的传统方法是将电池基板110置于金属板115中的凹穴内，安装厚的刚性掩模框架105然后用夹紧机构120限制该组件。传统的方法存在很多问题。例如，厚的刚性掩模往往随着使用而弯曲，且无论所使用的夹紧压力如何都不再平坦地放置。典型的真空沉积涂层往往在掩模边缘之下渗出，因此形成不良限定的薄膜层边缘。将薄的柔性基板与传统设备结合的尝试遭遇困难，因为薄的柔性基板和掩模很少平坦且光滑地置于平面上，因此不能与所限定的凹穴边缘光滑对齐。这种放置误差导致基板表面上不良的位置重合涂层。不良的位置重合或不良的边缘限定的电池层往往在这些多层电池构造中产生不适当的电池层交互作用，结果电池失效。同样的缺点对于诸如薄膜电容器或晶体管之类的通常由一层以上的薄膜层构成的其它薄膜器件也存在。
发明内容
本发明涉及用于掩模基板的方法和装置。在一个实施例中，该方法包括挠曲基板以提供基板曲面，并在该曲面上设置至少一个柔性片。例如，基板和至少一个柔性片可以是箔或带。在特定实施例中，曲面可以是弧。在本发明的另一个实施例中，可设置至少一个基板或片或者多个基板或片。
在本发明的一个实施例中，例如，可使至少一个柔性片和/或基板受张力。可通过基本在曲面的切线方向上施加力来形成张力。在具体的实施例中，例如可通过使用弹簧销形成张力。弹簧销可包括以下中的任一种，例如：平坦片簧、弯曲片簧、卷簧加载的销、成形的和/或弯曲的片簧、扭转弹簧或管状弹簧。在另一个实施例中，可通过使用诸如弹簧构件之类的弹性材料形成张力。在又一个实施例中，例如可通过使用离轴轧制杆来形成张力。还可将扭矩用于向基板和/或柔性材料中的至少一个施加张力。
在本发明的又一个实施例中，例如可针对所设置的各个基板和/或柔性片独立地形成张力。
例如，本发明的另一个实施例提供一种掩模装置，其包括用于将柔性基板紧固成弯曲状态的基板固定器以及用于在置于柔性基板的曲面上的掩模中形成张力的张力器。在一个实施例中，张力器例如可以是弹簧销或离轴轧制杆。例如弯曲状态可以是弧。
例如，本发明的另一个实施例提供一种用于掩模基板的方法，其包括以下步骤：设置基板；在基板上设置至少一个柔性片；以及在至少一个片或基板中形成张力，以使各个片的表面形成弯曲形状。在本发明的一个实施例中，例如基板和/或柔性片包括箔或带，且例如弯曲形状是弧的形式。在本发明的一个实施例中，例如，通过使用弹簧销或离轴轧制杆形成张力。
附图简述
图1是用于将基板或膜保持在固定且平坦的位置的装置(现有技术)。
图2示出平坦、平面保持结构，其中基板和柔性片的平坦度和平面度不一致。
图3描绘带有曲面的固定器，其为柔性片提供曲面。它还描绘本发明的实施例，其中通过将基板挠曲以提供弯曲的基板表面并将柔性片置于该曲面上而绷紧基板和柔性片。
图4A和4B是本发明的实施例的横截面图，其中平坦片簧和弯曲片簧分别用于将基板和柔性片紧固到曲面。
图5A和5B是本发明的实施例的横截面图，其中卷簧加载的销和成形的和/或弯曲的片簧分别用于将基板和柔性片紧固到曲面。该成形的和/或弯曲的片簧在图5C中示出。
图6A是实施例的横截面图，其中扭转弹簧用于将基板和柔性片紧固到曲面。
图6B和6C是图6A的横截面图，描绘用于将弹簧锚定在曲面上的弹簧末端。
图7A描绘实施例的横截面图，其中常规的扭转弹簧用于将基板和柔性片紧固到曲面。
图7B和7C示出用于在基板和柔性片中产生张力的矩形扭转弹簧的实施例。在图7C中更详细示出矩形扭转弹簧，该图展示了其翼形设计。
图8A和8B描绘将弹性材料用作弹簧的实施例。
图9A描绘管状弹簧的实施例的使用。
图9B描绘管状弹簧的实施例。
图9C是其中管状弹簧元件是螺旋形状的另一个实施例。
具体实施方式
应理解，本发明不限于本文所描述的特定方法、化合物、材料、制造技术、用途和应用，因为这些都可以改变。还应理解，本文所使用的术语仅用于描述特定实施例的目的，且不意在限制本发明的范围。必需注意到，如本文以及所附权利要求书中所使用地，单数形式的“一(a)”、“一(an)”以及“该”包括复数引用，除非上下文另外明确地指出。因此，例如，对“一元件”的引用是对一个或多个元件的引用，且包括本领域的技术人员已知的其等价物。类似地，对于另一个示例，对“一步骤”或“一手段”的引用是对一个或多个步骤或手段的引用，且可包括子步骤和辅助手段。所使用的所有连词应被尽可能地理解为包括的含义。因此，应将词“或”理解为具有逻辑“或”的定义，而不是逻辑“异或”的定义，除非上下文另外清楚地要求。本文所描述的结构还应被理解为指代这些结构的功能等价物。可被理解为表达近似的语言应被如此理解，除非上下文另外清楚地指示。
除非以其他方式定义，否则在这里所使用的所有技术和科学术语具有与本发明所属技术领域的一名普通技术人员所通常理解的相同的含义。描述了优选的方法、技术、器件和材料，但是与本文所述类似或等价的任何方法、技术、器件或材料可在本发明的实施和测试中使用。本文所描述的结构还应被理解为指代这些结构的功能等价物。本文所引述的所有引用可通过引用整体结合于此。
将受张力的材料的清洁、均匀薄带或箔置于平面、平坦表面可在带或箔与该表面之间形成两个基本平行、非接触面的区域。在张力诱导的力向量和平面、平坦表面之间基本没有交互作用，因此没有产生转移的向下力。相反，当在曲面上将切向力施加到薄箔或带时，实现了向下力。简单的向量分析显示即使以小的曲率半径也能产生较大的向下力。所得的向下力可有效用于形成紧密的掩模-基板界面以及由此带有良好限定的边缘的薄膜涂层。
参照图2，薄箔或带的制造很少产生均匀且平坦主体。通常有一些尽管微小但导致弯曲偏离215、216、217的误差。例如，材料的箔或带可具有翘曲、弓弯和扭曲。此外，涂覆到这种箔或带上的膜层可导致附加的弯曲误差。例如，即使实现基板或阴影掩模的完全平坦的箔或带，当涂覆的层在表面上生长时，与表面接触的涂覆膜层固有的应力可导致变形发生。更有代表性地，为了阴影掩模的目的在真空沉积工艺中必须相互层叠的基板和掩模由于切割、处理和使用而弯曲。如图2所显示的，当平坦表面205用于层叠时，即使当平行于平面施加相当大的张力时，通常也很难使箔或带215、216、217放平坦220。使箔或带放平坦所需的力可能超过箔或带材料的抗屈服力，且箔或带的损坏可能相继发生。图3显示利用在将弯曲的箔或带315、316、317置于诸如弧310之类的曲面上时所实现的转移向下力的结果320。测试示出利用如图3的实施例中的这种布置，需要相对少量的力来使这种箔或带彼此齐平地相对放置。
在示例性实施例中，例如，基板和掩模材料的箔或带可受张力地置于弧上，然后固定在适当位置以保持掩模与基板的关系和基板相对于固定器的位置。用于这种布置的简单限制机构可以是箔或带各端上的杆，其通过螺钉限制到弧形固定器的主体上。或者，基板和掩模材料的箔或带的一端可被钉固、夹紧或以其它方式固定在适当位置，张力可从第二端置于材料上，并可在保持该张力的同时将第二端钉固、夹紧或以其它方式固定在适当位置。当被固定在适当位置时，该钉固或夹紧机构现在可维持箔或带上的张力，并且可去除外部张力源。这种简单的方法可包括在各端上的固定夹紧方法。
不同的材料在不同的施加温度下以不同的比率膨胀。例如，典型的真空沉积工艺在接纳涂层的材料中产生热。可在这种工艺中涂覆掩模和基板。这种所得的温度改变因此可导致掩模相对于基板、相对于彼此和/或相对于固定器的非均匀热膨胀。材料之间热膨胀的差异也可导致表面相互分离，通常致使掩模下面涂层的渗出。为了避免这个问题，示例性实施例可使各个箔或带独立地受张力，使得在热膨胀的情况下箔或带长度的变化能够通过张力调整设备的移动而调节。可以想到有很多方式来将必要的切向力施加到材料的这些带。
在图4A至9C显示张力调整方法的一些示例。图8A和8B中的方法与图4A至7C及9A至9C中所示的方法有些不同，因为可使用诸如橡胶之类的简单的记忆材料块，而不是例如金属弹簧或其它张力生成设备。尽管图4A至9C所示的例子示出槽或销布置，作为将弹力调整设备配合到受张力的材料的带的方式，还可使用夹紧、接合、粘接及其它方式。
图4A是本发明的一个实施例的横截面图，其中平坦片簧430固定到具有曲面460的固定器410，使得弹簧力440加载销420以将基板和柔性片415紧固到具有曲面460的固定器410。
图4B是本发明的一个实施例的横截面图，其中弯曲片簧435固定到具有曲面460的固定器410，使得弹簧力445加载销420以将基板和柔性片415紧固到具有曲面460的固定器410。
图5A是本发明的一个实施例的横截面图，其中卷簧530加载销520以将基板和柔性片515紧固到具有曲面560的固定器510。
图5B是本发明的一个实施例的横截面图，其中成形的570和/或弯曲的片簧535固定到具有曲面560的固定器510，使得弹簧力加载成形的570和/或弯曲的580片簧535以将基板和柔性片515紧固到具有曲面560的固定器510。
在图5C中描绘成形的570和/或弯曲的580片簧535的实施例。
图6A是本发明的一个实施例的横截面图，其中扭转弹簧630固定到具有曲面660的固定器610，使得弹簧力加载销620以将基板和柔性片615紧固到具有曲面660的固定器610。
图6B是图6A的横截面图，描绘用于将弹簧630锚定在具有曲面660的固定器610上的弹簧630的弯曲端650以及通过在销620处配合的基板和柔性片615而处于扭转的弹簧630的长度640。
图6C是图6A的横截面图，描绘用于将弹簧630锚定在具有曲面660的固定器610上的弹簧630的块端655以及通过在销620处配合的基板和柔性片615而处于扭转的弹簧630的长度640。
图7A是本发明的一个实施例的横截面图，其中常规卷簧730被加载以将基板和柔性片715紧固到具有曲面760的固定器710。
图7B是本发明的一个实施例的横截面图，其中矩形扭转弹簧735加载销720以在基板和柔性片715中产生张力以将其紧固到具有曲面760的固定器710。
图7C展示图7B的扭转弹簧的翼形设计，描绘用于将弹簧735锚定在具有曲面760的固定器710上的弹簧735的弹簧端750以及通过在销720处配合的基板和柔性片715而处于扭转的弹簧735的长度740。
图8A是本发明的一个实施例的横截面图，其中弹性材料830嵌入在具有曲面860的固定器810的顶部中，使得弹簧力加载销820以将基板和柔性片815紧固到具有曲面860的固定器810。
图8B是本发明的一个实施例的横截面图，其中弹性材料830嵌入在具有曲面860的固定器810的底部中，使得弹簧力加载销820以将基板和柔性片815紧固到具有曲面860的固定器810。
图9A是本发明的一个实施例的横截面图，其中管状弹簧元件930固定至销920以将基板和柔性片紧固到具有曲面960的固定器910。
图9B展示图9A的管状弹簧930的剖开部分931、932以及可熔焊、焊接、铜焊、模压或锤击到管中的销920。
图9C是又一个实施例，其展示图9A的管状弹簧元件930的螺旋剖开931、932设计以及可熔焊、焊接、铜焊、模压或锤击到管中的销920。
具体地，尽管图4A至7C和9A至9C所示的示例示出用于将受张力的材料的带保持在基板的曲面上的弹簧销布置，但还可使用例如离轴轧制杆。
本掩模方法的实施例允许使用不昂贵的掩模材料。例如，原料的薄箔或带与加工相同材料的较厚的块相比，通常生产更便宜且转换成必要的掩模开口消耗时间更少以及劳动强度更低。此外，薄箔或带使其适合于更节省成本的形式的转换，如激光、水喷射切割、蚀刻、管芯切割、剪切和冲压。
在基板箔或带的底面与弧形固定器保持均匀地相对的情况下，在典型的真空沉积工艺中产生的传导冷却可比平坦固定器更均匀。这种示例性过程有利于在整个涂覆区域上一致的膜生长、沉积速率和性质，以及由此而来的更一致的电池产品性能。
在不背离本发明的精神和范围的情况下，本领域的普通技术人员可对本发明的方法和装置作出各种变化和修改，以使其适应各种用途和条件。例如，尽管上文描述掩模柔性电池的示例方法和装置，但应理解本发明可用在各种应用中，诸如薄膜电子器件和非电器件，诸如用于图形设计。另外，不需要使器件基板弯曲来产生曲面。例如，施加掩模的器件基板可通过设计和制造而是弯曲的。如此，这些和其它变化和修改是适当的、合理的，且应该在以下权利要求的等价方案的全部范围内。

Claims (25)

1.一种用于掩模基板的方法，包括：
挠曲至少一个基板以提供基板曲面；以及
在所述曲面上设置至少一个柔性片。
2.如权利要求1所述的方法，其特征在于，所述基板包括箔或带。
3.如权利要求1所述的方法，其特征在于，还包括提供弧形式的所述曲面。
4.如权利要求1所述的方法，其特征在于，所述柔性片包括箔或带。
5.如权利要求1所述的方法，其特征在于，还包括使所述至少一个片受张力。
6.如权利要求1所述的方法，其特征在于，还包括使所述至少一个基板受张力。
7.如权利要求5所述的方法，其特征在于，还包括在与所述曲面基本成切线的方向上将力施加到所述至少一个片。
8.如权利要求7所述的方法，其特征在于，还包括使用从包括弹簧销或离轴轧制杆的组中选出的机构。
9.如权利要求6所述的方法，其特征在于，还包括基本在所述曲面的切线方向上将力施加到所述至少一个基板。
10.如权利要求9所述的方法，其特征在于，还包括使用从包括弹簧销或离轴轧制杆的组中选出的机构。
11.如权利要求1所述的方法，其特征在于，还包括通过向所述至少一个基板施加扭矩来形成张力。
12.如权利要求1所述的方法，其特征在于，还包括向所述至少一个片施加扭矩。
13.一种掩模装置，包括：
用于将柔性基板紧固成弯曲状态的基板固定器；
用于在置于所述柔性基板的曲面上的掩模中形成张力的张力器。
14.如权利要求13所述的装置，其特征在于，所述张力器包括：
至少一个配合构件，其与所述片配合并适合于在所述曲面的切线方向上施加力。
15.如权利要求13所述的装置，其特征在于，所述张力器选自包括弹簧销或离轴轧制杆的组。
16.如权利要求13所述的装置，其特征在于，所述弯曲状态是弧。
17.如权利要求13所述的装置，其特征在于，所述张力器适合于将张力施加到所述基板。
18.一种用于掩模基板的方法，包括：
设置至少一个基板；
在所述基板上设置至少一个柔性片；以及
在所述至少一个片或基板中形成张力，以使各个片的表面形成弯曲形状。
19.如权利要求18所述的方法，其特征在于，还包括基本在所述曲面的切线方向上将力施加到所述至少一个片。
20.如权利要求18所述的方法，其特征在于，还包括基本在所述曲面的切线方向上将力施加到所述至少一个基板。
21.如权利要求18所述的方法，其特征在于，所述基板包括箔或带。
22.如权利要求18所述的方法，其特征在于，还包括提供弧形式的所述弯曲形状。
23.如权利要求18所述的方法，其特征在于，所述柔性片包括箔或带。
24.如权利要求18所述的方法，其特征在于，还包括将扭矩施加到所述至少一个基板。
25.如权利要求24所述的方法，其特征在于，还包括使用从包括弹簧销或离轴轧制杆的组中选出的机构。
CNA200780035960XA 2006-09-29 2007-09-26 柔性基板上沉积的电池层的掩模和材料限制 Pending CN101523571A (zh)

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