CN101582419A - Device and system for mini surface-mount device - Google Patents

Device and system for mini surface-mount device Download PDF

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Publication number
CN101582419A
CN101582419A CNA2009101454123A CN200910145412A CN101582419A CN 101582419 A CN101582419 A CN 101582419A CN A2009101454123 A CNA2009101454123 A CN A2009101454123A CN 200910145412 A CN200910145412 A CN 200910145412A CN 101582419 A CN101582419 A CN 101582419A
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Prior art keywords
led
lead frame
housing
lead
chip carrier
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Granted
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CNA2009101454123A
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CN101582419B (en
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亚历克斯·陈
王璇
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Cree Huizhou Solid State Lighting Co Ltd
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Cree Hong Kong Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Abstract

The invention relates to a device and a system for a mini surface-mount device. In one embodiment, a surface-mount device comprises a casing having opposed, first and second main surfaces, side surfaces, and end surfaces. A lead frame partially encased by the casing comprises (1) an electrically conductive LED chip carrier part having a surface carrying a linear array of LEDs adapted to be energized to produce in combination a substantially full range of colors, each LED having a first electrical terminal and a second electrical terminal, the first terminal of each of the LEDs being electrically and thermally coupled to the chip carrying surface of the chip carrier part; and (2) electrically conductive connection parts separate from the chip carrier part, each of the connection parts having a connection pad, the second terminal of each of the LEDs being electrically coupled to the connection pad of a corresponding one of the connection parts with a single wire bond. The linear array of LEDs extends in a first direction, and each of the chip carrier part and connection parts has a lead. The leads may be disposed in parallel relationship with each other and extend through the end surfaces of the casing in a second direction, the second direction being orthogonal to the first direction. An array of the surface-mount devices may be used in an LED display such as an indoor LED screen.

Description

The device and the system that are used for mini surface-mount device
The present invention relates in general to the electronics assembling, more particularly, relates to the surface mounted device (SMD) that is used for light-emitting diode display.
Background of invention
Technical field
In recent years, in the existing greatly improvement of light emitting diode (LED) technical elements, introduced brightness LED with the color fidelity raising. Since these improved LED and improved image processing techniques, Can obtain the LED video screen of large-scale, full color and they are now generally used. Large LED Display generally includes the combination of independent LED panel, its image definition that provides by neighbor it Between distance or claim pixel pitch to determine.
Be used for having relatively large pixel pitch and generally including discrete led array from the outdoor display that bigger distance is watched.In discrete led array, redness, green and the blue led that drives a branch of independent installation be it seems unit as a panchromatic pixels to form the beholder.On the other hand, require nearerly, comprise as the indoor screen of 3mm or nearer pixel pitch being loaded with the panel that is installed in redness, green and blue led on the single SMD chipset that each chipset forms a pixel.Less relatively SMD is attached on the driver printed circuit board (PCB) (PCB).
Although the indoor and outdoors display all can greatly to 145 ° or even bigger big off-axis angle scope in watch, along with the increase of viewing angle has perceptible color fidelity loss.In addition, the material that the material of each LED assembly and/or be used to is installed each LED may have reflection characteristic, and this can further reduce color fidelity owing to produce undesired light reflection and/or dazzle.
Also have, know in the art people, the electronic building brick of SMD and many other types, no matter they comprise integrated circuit or the discrete element such as diode or power transistor, all can give out the heat that is enough to carry out heat management.Heat management target in the electronics assembling design is the working temperature that maintains source circuit or element binding side, so that its enough low (for example 110 ℃ or lower) are to prevent the premature failure of element.People use usually and comprise that conduction-type heat is delivered in interior various cooling strategies.Realize that in electronic building brick the hot a kind of traditional approach that transmits of the conduction-type that is used to dispel the heat is that heat can be left along the lead-in wire conduction of device.Yet lead-in wire does not have enough quality or exposed surface area that effective heat radiation is provided usually.For example, mainly be that the high density LED of the light in the visible part of electromagnetic spectrum may produce a large amount of heat sending, use such conventional art to be difficult to these heat that dissipate.
Summary of the invention
The present invention relates to be used for the system and the equipment of surface mounted device, they can improve color fidelity and the dissipation of heat reduces undesired light reflection of institute and dazzle simultaneously.An embodiment comprises the lead frame that is used for surface mounted device, and this lead frame comprises conduction led chip carrier member, and this chip carrier member has loading and is suitable for switching on to produce the LED linear array of gamut color basically in combination.Each LED has first electric terminal and second electric terminal, and the first terminal of each among the LED is electric to load the surface with the chip that is thermally coupled to the chip carrier member.Lead frame and comprise the conducting connecting part that separates with the chip carrier member, each in these connectors has the connection cushion block.Corresponding one the connection cushion block of the second terminal electrical couplings of each among the LED to the connector.Lead frame also comprises the black housing of sealing lead frame to small part.
According to another specific one exemplary embodiment, a kind of surface mounted device is provided, this surface mounted device comprises housing, and this housing comprises the first and second relative first type surfaces, opposite side surfaces and relative end surfaces, and forms the cavity that stretches into enclosure interior from first first type surface.This surface mounted device also comprises the lead frame of being sealed by housing parts, this lead frame comprises: (1) conduction led chip carrier member, this chip carrier member has loading and is suitable for switching on to produce the surface of the LED linear array of gamut color basically in combination, each LED has first electric terminal and second electric terminal, and first electric terminal of each LED is electric to load the surface with the chip that is thermally coupled to the chip carrier member; (2) conducting connecting part that separates with the chip carrier member, each in these connectors has connection gasket, the second terminal electrical couplings of each among the LED corresponding one connection gasket to the connector.
According to a specific one exemplary embodiment again, a kind of light-emitting diode display is provided, this display comprises substrate, the surface mounted device array of arranging with vertical row and horizontal line is loaded in this substrate, in the surface mounted device each comprises dark housing and comprises the LED linear array of vertical orientation, and this LED linear array is suitable for a pixel producing FR basically color in combination and form display when energising.Signal processing and led drive circuit system electrical connect into optionally the surface mounted device array are switched on to produce visual image on display.Found that such LED linear orientation can improve color fidelity in the viewing angle of wide region.
After having read following detailed in conjunction with the accompanying drawings, it will be understood by those skilled in the art that these and other feature and advantage of the present invention, in the accompanying drawings:
Description of drawings
Fig. 1 is the stereogram according to surface mounted device of the present invention;
Fig. 2 is a vertical view embodiment illustrated in fig. 1;
Fig. 3 is as the cutaway view along the being seen Fig. 1 embodiment of line 3-3 of Fig. 2;
Fig. 4 is a upward view embodiment illustrated in fig. 1;
Fig. 5 is an end-view embodiment illustrated in fig. 1;
Fig. 6 is the stereogram according to the lead frame of an embodiment that can use in the device of Fig. 1;
Fig. 7 is a vertical view embodiment illustrated in fig. 6;
Fig. 8 is an end view embodiment illustrated in fig. 6;
Fig. 9 is according to another embodiment of surface mounted device of the present invention cutaway view along line shown in Figure 3;
Figure 10 is a upward view embodiment illustrated in fig. 9;
Figure 11 is an end-view embodiment illustrated in fig. 9;
Figure 12 is the stereogram according to an embodiment of surface mounted device of the present invention;
Figure 13 is a upward view embodiment illustrated in fig. 12;
Figure 14 is a front view embodiment illustrated in fig. 12, and its dorsal part and left side and right side are substantially similar;
Figure 15 is the dimensional drawing of overlooking according to an embodiment of surface mounted device of the present invention;
Figure 16 is the dimensional drawing of looking up embodiment illustrated in fig. 15;
Figure 17 is a right side dimensional drawing embodiment illustrated in fig. 15;
Figure 18 is the front view of employing according to the part of the LED display curtain of the surface mounted device of the embodiment of the invention;
Embodiment
Following description provides preferred embodiment of the present invention, and they are represented as implements the designed optimal mode of the present invention.Should not understand this description with the meaning of restriction, make this description and be only used for describing general principles of the present invention, protection scope of the present invention is limited by appended claims.
Fig. 1-8 illustrates according to surface mounted device (SMD) 10 and the part thereof that are used for such as the specific one exemplary embodiment of the light-emitting diode display of indoor and/or outdoor LED screen.SMD 10 comprises the housing 12 that is loaded with lead frame 14, and lead frame 14 comprises a plurality of conducting connecting parts, and these conducting connecting parts comprise four connectors 16,18,20,22 (Fig. 6 is clearly shown that) in the present example.
Housing 12 can be substantially rectangular, comprises relative and parallel upper surface 24 and lower surface 26, side surface 28 and 30 and end surfaces 32 and 34.The bight of housing can be rounded with as through hole, as following in conjunction with Fig. 8 institute the most clearly as described in.
In mode for example and not limitation, and as being clearly shown that among Figure 12-14, the length overall of SMD 10 is about 2.0mm, and beam overall is about 2.0mm and high 0.90mm.
This housing also forms depression or the cavity 36 that stretches into the body of housing 12 from upper surface 24.In certain embodiments, the reflection insert or encircle 38 can be along at least a portion location of the sidepiece of cavity 36 or wall 40 and fixing, preferably by making cavity 36 and being loaded into wherein ring 38 inwardly strengthens ring 38 towards the inside of housing tapering reflexive effectiveness.
In certain embodiments, cavity 36 can be filled with packing material 42 at least in part.Packing material 42 can be protected and stablize lead frame 14 and the nationality LED by its loading on the position.In some instances, packing material 42 can cover being electrically connected of LED, lead frame connector 16,18,20,22 exposed portions and LED by cavity 36.Packing material 42 may be selected to has predetermined optical property, thereby strengthens from the light of LED projection.Packing material 42 can be made by the combination of resin, epoxides, thermoplastic condensed polymer, glass and/or other suitable material or material.In certain embodiments, can add some materials, to be enhanced to LED or from light emission, absorption and/or the chromatic dispersion of LED to packing material.
Housing 12 can by preferably not only the material of electric insulation but also heat conduction make.Such material is that people know in the art, can comprise (and unrestricted): some pottery, resin, epoxides, thermoplastic condensed polymer's (for example polyphtalamide (PPA)) and glass.In preferred embodiment, housing 12 can be made by the black ceramic material.Find that the image the SMD that adopts generates and uses black material can improve contrast in the SMD assembly in video display.
In described illustrative embodiment, SMD 10 accommodates three LED 44,46,48 that preferably send redness, green and blue light respectively, thereby these three LED produce FR basically color in combination when switching on suitably.
Shown in illustrative embodiment in, lead frame connector 16,18,20,22 comprises lead-in wire 50,52,54,56 respectively, these lead-in wires pass housing from the central area 58 of housing 12 surface, opposite ends 32 and 34 outwards protrudes out.
Connector 16 comprises the chip carrier member, and this carrier member has the center surface or the cushion block 60 of increasing, is used for along horizontal 62, and promptly the linear array that extends perpendicular to the direction of side surface 28 and 30 loads led chip 44,46,48.Lead-in wire 50,52,54,56 is parallel to each other and extend along the direction perpendicular to the direction 62 of linear led array.The width of lead-in wire can be quite little, so that when from pushing up when watching SMD 10, they almost are invisible or invisible fully.Additionally and/or alternately, lead-in wire can be blocked by housing 12 and can't see from the top.Cushion block 60 comprises the top surface of heat carrier 64, the form that heat carrier 64 is for example rectangular, pass the basal surface 66 that housing 12 extends to heat carrier 64, basal surface 66 exposes and is arranged to by the hole 68 in the lower surface 26 of housing 12 and flushes basically with lower surface 26 vertically.
The basal surface 66 of the body of connector 60 is suitable for being arranged to radiator or claims heat dissipater 70 one-tenth heat transfer relation, and radiator or title heat dissipater 70 are by 72 carrier bands of the substrate such as printed wiring or circuit board.Can see that heat carrier 64 can be used as effective heat abstractor owing to have relatively large quality and the cross-sectional area that is orthogonal to direction of heat flow, the heating LED44,46 that loads by cushion block 60,48 and radiator 70 between low thermal resistive path (arrow 74) is provided.Some heat also dissipate along lead-in wire 50 (arrows 76).
What remaining connector 18,20,22 comprised increasing respectively is electrically connected cushion block 78,80,82, and these are electrically connected cushion block and are arranged in central area 58 and adjacent but spaced apart with the surface 60 of connector 16 loading members.In the preferred versions of SMD, lead-in wire 50,52,54,56 is crooked squarely extending in hull outside and along the respective end surface 32 and 34 of housing, and then extend along the lower surface 26 of housing 12 crooked squarely the so that end 84,86,88,90 of lead-in wire.Lead-in wire end 84,86,88,90 flushes so that the substrate 72 below being connected to basically towards the basal surface of outer surface and heat carrier 64.The interconnection technique (comprising soldering) that lead-in wire end 84,86,88,90 can utilize many people to know is electrically connected or is attached to trace or the cushion block in the substrate 72.In a preferred embodiment, the soldering cushion block is included on the bottom of end, thereby when when each independent SMD is watched on the top, cannot see any scolder.This is favourable, because this can help prevent dazzle and improve contrast, when particularly watching by day.As the most clearly visible among Fig. 1-3, cavity 36 stretches into the enough degree of depth of enclosure interior, to expose connector cushion block 60 and 78,80,82.
Lead-in wire 50,52,54,56 end 84,86,88,90 can be depending on the execution mode of SMD, used LED, the material of housing 12, the size of SMD and/or the combination of other such factor and/or factor from the size that the end surfaces 32 and 34 of housing extends internally.In some embodiments, but outside each the lead-in wire 50,52,54,56 between cushion block gap separation 92, so that connector is electrically isolated from one another.
Connector 16,18,20,22 can be made by conducting metal or metal alloy, as the combination of copper, copper alloy and/or other suitable low-resistivity, resistant material or material.As can be noted, the thermal conductivity of the lead-in wire 50 of connector 16 can help the LED that loads from SMD 44,46,48 that thermal steering is walked to a certain extent, shown in arrow 76.
As well known, each LED 44,46,48 has a pair of electric terminal or the electrode that is called as negative electrode and anode.According to the exemplary embodiment of illustrated embodiment, the negative electrode of LED 44,46,48 is coupled to center cushion block 60, and the anode of LED is coupled to the cushion block 78,80,82 of each independent connector respectively by single wire bond.
Among the LED 44,46,48 each is by means of the interface 100 and cushion block 60 electrical couplings of conductive and heat-conductive, aforementioned interface such as scolder, binding agent, coating, film, seal, paste, grease and/or other suitable material.In a preferred embodiment, LED can utilize on the LED bottom solder bump and with cushion block 60 electrical couplings and be fixed in it, so that cannot see scolder from the top.Prevent to see that from the top scolder is favourable, can reduce reflection and better contrast is provided, in the time of especially by day.
In other embodiments, lead-in wire one or more in 50,52,54,56 can comprise that also one or more breach, through hole or hole, extension and/or other help the structure of stability, globality and/or the robustness of SMD assembly.For example, lead-in wire 50,52,54,56 can comprise breach 102,104,106,108 respectively, and they extend along the outer ledge of lead-in wire substantially.The breach of lead-in wire and/or other such structure and housing and/or packing material are assisted at least in part and are joined, to strengthen the structural stability and the globality of SMD assembly.In some embodiments, case material and/or packing material at least in part around, stretch into and/or pass one or more in the gap 92 and extend by the zone that the breach 102,104,106,108 that is formed in the lead-in wire is exposed.
SMD 10 can form and/or assemble by in the various known method any.For example, housing 12 can form or molded around connector 16,18,20,22.Alternately, housing can branch be assigned to moldedly, for example is divided into subsequently the top and the bottom that can be linked by epoxides, binding agent or other suitable binding material.
In some manufacture methods, LED can be coupled to cushion block 60 before and/or assembling shell 12 molded around the connection cushion block.Alternately, LED can be coupled to cushion block 60 after connector partly is encapsulated in the housing.The cavity 36 that stretches into housing can be configured to cushion block 60 and 78,80,82 has enough parts to be exposed to the wire bond of admitting LED and being associated.
The manufacturing of connector 16,18,20,22 can realize by punching press, injection moulding, cutting, etching, bending or the combination by other known method and/or method, to form the structure of being wanted.For example, connector is metal stamping (for example punching press from the monolithic associated materials simultaneously) partly, and is crooked suitably, separates fully at last, or separates fully after forming some or all housings.
Fig. 9-11 illustrates the surface mounted device 200 according to another particular exemplary embodiment that is used for the LED display curtain with way of example.The SMD 200 of Fig. 9-11 is except having saved heat carrier 64, and is all identical with the embodiment shown in Fig. 1-8 in all respects.Therefore, the SMD of Fig. 9-11 comprises preferably black ceramic housing 202, and this housing comprises relative upper surface 204 and lower surface 206, side surface 208,210 and end surfaces 212,214.SMD 200 is mounted with lead frame 216, as in the previous example above, lead frame 216 comprises four electrical fittings, and these electrical fittings comprise chip carrier member 218 and three independent connectors (comprising connector 220) respectively and pass the lead-in wire 222,224,226,228 that the surface, opposite end 212,214 of housing outwards protrudes out from the central area 230 of housing.Chip carrier member 218 has the center surface or the cushion block 232 of the increasing that is used to admit led chip, and led chip generally includes redness, green and blue led.As in the previous example above, all the other connectors comprise the wire bond cushion block of increasing, and these wire bond cushion blocks are positioned at central area and adjacent but spaced apart with chip carrier member 218.
As in the previous example above, lead-in wire 222,224,226,228 is crooked squarely to extend along its corresponding shell ends surface and in their outsides, and then crooked squarely, so that extend along the basal surface 206 of housing 222,224,226,228 the end 234,236,238,240 of going between.The end 234,236,238,240 of lead-in wire utilize many known interconnection techniques to be electrically connected or to be bonded to trace or cushion block in the substrate 242 towards outer surface, substrate 242 is generally printed circuit board (PCB).As in the previous example above, housing has and extends the cavity 214 of enough degree of depth with the cushion block that exposes connector.Connector is preferably made by conductive metal sheet or metal alloy film, and this sheet metal or metal alloy film downcut from the sheet metal raw material by punch process, bends to their final structure then before or after forming housing around lead frame.
Each LED has a pair of electric terminal or electrode, the electric center cushion block 232 that is coupled to of negative electrode wherein, and the anode of LED then is coupled to the cushion block of each independent connector respectively by single wire bond.
Now referring to Figure 12-17, some examples of the size characteristic of each parts of SMD shown in the figure 250.Unrestricted with way of example, the size described in Figure 12-17 also can be applied to the apokoinou construction of SMD 10 or 200.The pin configuration that it may be noted that SMD 250 is arranged slightly differently with the pin configuration of SMD 10 or 200.But, the structure description that these are different be another possible embodiment, can not influence of the present invention functional.Figure 13 illustrates and can help to carry out heat management with the hot cushion block 252 from the device dissipation heat of any installation.
Referring to Figure 18, with the form of illustrating for example part of a LED display curtain 300 of indoor screen is shown, as a rule comprise driver PCB 302, it is mounted with the exhibiting high surface installing device 304 of embarking on journey and becoming row to arrange, and each SMD forms a pixel.SMD 304 can comprise the device such as Fig. 1-8,9-11 and 12-17 illustrated embodiment.SMD device 304 is electrically connected to trace or the cushion block on the PCB 302, and PCB 302 connects into and can suitable electric signal processing and driver circuitry (not shown) be responded.
As mentioned above, each SMD is mounted with the vertical directed linear array 306 of redness, green and blue led.Found that such LED linear orientation can improve color fidelity in the viewing angle of wide region.Also through hole 308 can be set so that ceramic SMD body is better and distance contacts with PCB shortlyer.Through hole 308 also can improve the dissipation of heat.
Although illustrated and described some illustrative embodiment of the present invention, those of ordinary skill in the art can expect many versions and alternative embodiment.Can conceive such version and alternate embodiments, and they can not exceed defined the spirit and scope of the present invention in the appended claims.

Claims (11)

1. lead frame that is used for surface mounted device, described lead frame comprises:
Conduction led chip carrier member, described chip carrier member has loading and is suitable for switching on to produce the surface of the LED linear array of gamut color basically in combination, each LED has first electric terminal and second electric terminal, and first electric terminal of each among the described LED is electric to load the surface with the described chip that is thermally coupled to described chip carrier member;
With the conducting connecting part that described chip carrier member is separated, each in the described connector has the connection cushion block;
Corresponding one the connection cushion block of the second terminal electrical couplings of each among the described LED to the described connector; And
The black housing, described housing is sealed described lead frame at least in part.
2. lead frame as claimed in claim 1, it is characterized in that, described LED linear array extends along first direction, in described chip carrier member and the connector each has lead-in wire, described lead-in wire is arranged to extend each other in parallel relation and along second direction, and described second direction is perpendicular to described first direction.
3. lead frame as claimed in claim 1, it is characterized in that, described chip carrier member has electrical couplings is loaded the surface to described chip lead-in wire, described lead-in wire has a thickness, and the described chip load table face of described chip carrier member comprises the surface of heat carrier, described heat carrier loads surperficial direction extension along being orthogonal to described chip, and the thickness of described heat carrier is greater than the thickness of described chip carrier member lead-in wire.
4. lead frame as claimed in claim 1 is characterized in that described LED comprises redness, green and blue led.
5. lead frame as claimed in claim 1 is characterized in that, second electric terminal of each among the described LED is by the connection cushion block of single wire bond electrical couplings to the connector that is associated.
6. lead frame according to claim 1 is characterized in that each among the described LED is coupled to corresponding connection cushion block via scolder.
7. lead frame as claimed in claim 6 is characterized in that, from the top when watching described lead frame described scolder be sightless.
8. lead frame as claimed in claim 1 is characterized in that, described housing comprises the first and second relative first type surfaces, opposite side surfaces and relative end surfaces, and described housing forms the cavity that stretches into the inside of described housing from described first first type surface.
9. as device as described in the claim 8, it is characterized in that, the described chip load table face of described chip carrier member comprises along being orthogonal to direction that described chip loads the surface and extends to the surface of heat carrier of the basal surface of described heat carrier that the basal surface of described heat carrier exposes by the hole in second first type surface that is formed on described housing.
10. light-emitting diode display, this display comprises:
Substrate, the surface mounted device array of arranging with vertical row and horizontal line is loaded in described substrate, in the described surface mounted device each comprises dark housing and comprises the LED linear array of vertical orientation, and described LED linear array is suitable for switching on to produce FR basically color in combination and to form a pixel of described display; And
Signal processing and led drive circuit system, described Circuits System are electrically connected optionally described surface mounted device array are switched on to produce visual image on described display.
11. display as claimed in claim 10 is characterized in that, the described housing of each surface mounted device comprises circular edge, so that forms through hole when described surface mounted device is arranged in the described substrate, and described through hole helps to carry out heat management.
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