CN101681818A - 用于穿过金属封装形成隔离的导电触点的工艺 - Google Patents

用于穿过金属封装形成隔离的导电触点的工艺 Download PDF

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CN101681818A
CN101681818A CN200880016591A CN200880016591A CN101681818A CN 101681818 A CN101681818 A CN 101681818A CN 200880016591 A CN200880016591 A CN 200880016591A CN 200880016591 A CN200880016591 A CN 200880016591A CN 101681818 A CN101681818 A CN 101681818A
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迈克尔·纳什内尔
杰弗里·豪尔顿
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Abstract

本发明揭示一种穿过金属衬底形成隔离的导电触点的方法，其包括穿过所述衬底形成至少一个通孔。清洁每一通孔的侧壁且给所述侧壁涂覆非导电层。通过阳极化或通过电介质的薄膜沉积形成所述非导电层。在用所述非导电层涂覆之后将导电填充物(例如，导电油墨或环氧树脂)置于所述通孔中。本发明还教示一种根据所述方法制作的外壳组件。

Description

用于穿过金属封装形成隔离的导电触点的工艺
技术领域
本发明一般来说涉及一种用于在金属性衬底中形成电隔离的触点的方法及一种包括通过本文所揭示的方法形成的电隔离触点的设备。
背景技术
金属经常用作包括消费者电子器件在内的各种产品的外壳。铝是有时使用的一种金属，在使用铝的情况下经常将其阳极化。在铝封装的情况下，经常对其进行机械加工或挤压。为增加化学及机械强健性，可将铝阳极化，从而形成数微米厚的坚韧绝缘氧化铝层。所述阳极化提供防止铝的氧化的坚韧表面。可用染料浸泡所述阳极化以为封装提供色彩。
发明内容
一种形成电隔离触点的方法通过在金属性衬底中形成通孔开始。所述通孔包括在其上形成电绝缘层的侧壁。用导电填充物填充所述通孔。
形成所述电绝缘层的方式的一个实例是阳极化。另一实例是薄膜沉积。
在一个实例中，可在形成所述电绝缘层之前清洁所述通孔。
还提供包括多个隔离的导电触点的封装，例如外壳部分。所述外壳部分可包括由金属衬底制成的部分。通过在衬底中形成通孔来在其中形成隔离的导电触点。用电绝缘材料涂覆所述通孔的侧壁。
本发明的这些及其它实例更加详细地描述于下文中。
附图说明
本文的描述参照附图，其中在数个视图中相同的参考编号指代相同的部件，且图式中：
图1是图解说明在金属性衬底中形成隔离的电触点的动作序列的实例的流程图；
图2是图解说明在金属性衬底中形成隔离的电触点的动作序列的第二实例的流程图；
图3A示意性地图解说明在衬底中形成通孔；
图3B示意性地图解说明清洁衬底中的通孔；
图3C示意性地图解说明阳极化衬底中的通孔的侧壁；
图3D示意性地图解说明用导电材料填充图3C的通孔；
图4A示意性地图解说明在衬底的凹坑区域中形成多个通孔；
图4B示意性地图解说明清洁衬底的凹坑区域中的多个通孔；
图4C示意性地图解说明阳极化多个通孔的侧壁；
图4D示意性地图解说明用导电材料填充多个通孔；
图4E示意性地图解说明用导电材料填充多个通孔；
图4F一同示意性地图解说明填充有导电材料的凹坑与填充有导电材料的通孔；及
图5是其中形成有通孔的经阳极化金属性封装的示意图。
具体实施方式
本发明揭示一种在金属性衬底中形成一个或一个以上隔离的电触点的方法。在金属衬底中钻通孔。可使用蚀刻来清洁所述通孔的侧壁。在所述通孔侧壁上形成非导电涂层。在一个实例中，将所述通孔侧壁阳极化。在另一实例中，使用薄膜沉积工艺用电介质涂覆所述通孔侧壁。然后将导电材料插入所述通孔中。在一个实例中，所述导电材料是导电油墨。在另一实例中，所述导电材料是导电环氧树脂。由于所述通孔侧壁是非导电的，因此电信号及/或电流可穿过所述导电材料而不会在所述衬底的体中接地或泄漏。
参照图1，其显示图解说明与形成隔离的电触点的一个实例相关联的动作的示意性流程图。参照动作2，提供金属性衬底。在此实例中，所述金属是铝，因为其可容易地阳极化，但其它金属也可容易地阳极化，例如钛及铌。在动作3中，在所述衬底中形成至少一个通孔。可使用激光器、脉动激光器、钻孔机、EDM等来形成所述通孔。在形成通孔之后，在动作4中清洁其若干侧壁(或，举例来说，当形成一个连续壁时则是一个侧壁)。在动作4中，也可清洁整个衬底。清洁技术的实例包括但不限于高压气喷、超声波清洁、细粒度打磨及/或化学蚀刻。化学蚀刻的实例将是氢氧化钠碱性蚀刻。在动作5中，将通孔的侧壁阳极化。在动作5中，如果所述衬底尚未经阳极化，那么也可将其阳极化。可使用类型I或类型II阳极化。在本文所示实例中，在形成通孔之后将整个衬底阳极化。然而，可在形成任一通孔之前将所述衬底阳极化。在动作6中，用导电材料填充通孔。导电材料的实例包括导电油墨(例如以商标名Anapro销售的那些导电油墨)或导电环氧树脂(例如以商标名Masterbond销售的那些导电环氧树脂)。以商标名Anapro销售的环氧树脂包括散布在具有相当低的粘性的溶剂中的银纳米微粒。
通过图1中所图解说明的方法形成的隔离的电触点可用于各种应用，包括但不限于天线及触摸传感器。
参照图2，其显示图解说明与形成隔离的电触点的另一实例相关联的动作的示意性流程图。动作2及3与参照图1所描述的那些动作相同。在在动作3中形成通孔之后，以准许在通孔侧壁上执行传统薄膜沉积工艺的方式在动作4中清洁其侧壁。在动作7中，用电介质涂覆所述通孔。可使用多种薄膜沉积技术中的任一种来在所述通孔侧壁上沉积电介质。举例来说，可使用化学气相沉积(CVD)来将二氧化硅层沉积到所述通孔侧壁上。在动作6中，如先前参照图1所描述的那样用导电材料填充所述通孔。
参照图3A到3D，其显示其中形成有隔离的电触点的金属性衬底14。如图所示，既不将衬底14阳极化也不给其涂覆电介质材料。在另一实例中，未在本文中显示，可将衬底14阳极化或给其涂覆电介质。通常，此类衬底可用于消费者电子器件封装且由铝形成。衬底14包括第一侧16及第二侧18。衬底14包括在此实例中可在0.3到1.0mm之间的厚度。如图所示，可使用激光器46来形成通孔30。一种类型的激光器46是使用圆形或螺旋图案的二极管激发固态脉动激光器。已显示具有30kHz的脉冲重复速率及～60毫微秒脉冲宽度的Nd:YAG 355nm点22在机械加工圆锥形通孔时有用。可使用其它激光器，且可使用其它技术来形成通孔30。可参照上文形成其它方式通孔30的实例。
通孔30可以是圆锥形。通孔30包括侧壁34、第一开口40及第二开口44。开口40及44中的每一者可在20到200微米(μm)之间。在一个实例中，开口40直径在约90到100微米(μm)之间，且开口44直径在约30到40微米(μm)之间。在所述实例中，许多通孔可形成具有(举例来说)100微米间距的经图案化的间隔开的阵列，例如图5中所示的阵列。视觉观察可能难以检测到开口44。举例来说，可通过使用各种表面处理来处理侧18以进一步掩饰开口44，各种表面处理的一个实例是喷珠。
可清洁通孔侧壁34。如上所述，可使用各种清洁方法。在其中会将侧壁34阳极化的实例中，清洁侧壁34改善侧壁34的阳极化。
参照图3B，将侧壁34阳极化或给其涂覆电介质材料。在图3B中，元件49示意性地表示用于参照动作4所描述的清洁的施加器及用于动作7的电介质材料(当根据动作7的沉积发生时)的施加器两者。
在侧壁34正被阳极化的情况下，可更高效地如图3C的实例中所示在阳极化侧壁34的同时阳极化整个衬底14。在此情况下，也可同时清洁整个衬底14，包括通孔侧壁34。如上所述，可使用类型I或类型II阳极化。通过阳极化侧壁34，绝缘层(在此为衬套48)在侧壁34上形成。在图2的实例中，可更高效地在形成通孔30之前提供经阳极化的金属衬底，且然后在通孔侧壁34上沉积薄膜。
在形成通孔30之前衬底14尚未经阳极化的情况下，可在阳极化侧壁34的同时阳极化第一及第二侧16及18。在其中衬底14由铝形成的实例中，所述阳极化工艺可形成5微米到75微米之间厚的氧化铝表面60。形成绝缘衬套48的经阳极化层的厚度可以是约5微米厚且不应完全封锁开口44。
参照图3D，导电填充物材料50填充通孔30。导电填充物材料50的一个实例是以商标名Anapro销售的银纳米微粒液体导电油墨，其在通孔30中干燥。可使用各种形式的填充方法用填充材料50填充通孔30。在Anapro的情况下，可使用油墨喷射方法。可使用的另一种填充材料以商标名Masterbond销售，其是可注入到通孔30中的双组分导电环氧树脂。Masterbond是液体且在其已被注入之后在通孔30中固化。由于填充材料50是导电的且侧壁34(经处理)是非导电的，因此形成了隔离的导电触点。电信号可在填充材料50不短路的情况下穿过所述填充材料50传递到衬底14中。此外，当提供多个通孔时，通孔组可与其它通孔隔离，以便可使不同的电信号穿过不同的经填充通孔。
图4A到4E图解说明形成隔离的电触点的另一实施例。如图所示，衬底14包括延伸到衬底14的厚度20中的凹坑24，使得所述衬底在凹坑24处具有厚度22。可作为所述方法的部分在衬底14中形成凹坑24，或可提供其中预先形成有凹坑24的衬底14。在所图解说明的实例中，凹坑24形成于衬底14中，从而使凹坑24的侧壁26及基底28暴露于导电衬底14。在图4A到4E所图解说明的实例中，在凹坑24的基底28处在衬底14中形成通孔30。还是在所述实例中，以类似于图3A到3D的实例的方式通过施加器48清洁通孔30。可在清洁通孔侧壁34的同时清洁凹坑24的侧壁26。
如图4C中所示，可将侧壁26、基底28及通孔侧壁34阳极化。在此情况下，可更高效地在阳极化侧壁26、基底28及通孔侧壁34的同时阳极化整个衬底14。或者，在使用铝的另一实例中，可在形成凹坑24及/或通孔30之前阳极化所述衬底。在此替代实例中，可使用(举例来说)CVD技术用电介质材料涂覆侧壁26、基底28及通孔侧壁34。
参照图4D及4E，将导电填充物50置于通孔30中。可如图4D中所示离散地将导电填充物置于通孔30中或可如图4E中所示整体地将导电填充物置于通孔30中。如图4F中所示，可用导电材料52进一步填充凹坑24。导电材料52可与导电材料50相同或可以是不同的材料。
图5图解说明具有包括隔离的电触点的区域64的经阳极化金属性封装(其可以是外壳组件)62。区域64被图解说明为包含一系列斑点以象征隔离的电触点，但在应用中，隔离的电触点可比区域64中所图解说明的斑点更难看见。区域64可用作蜂窝式电话的天线，或在另一实例中，与区域64的物理接触可用于接通或关断电子装置。此外，字母数字符号可与隔离的电触点相关联以用作按键传感器。这些传感器可能看似封装或外壳组件62的部分，但实际上接触一个或一个以上隔离的电触点。
已描述上述实施例，以便允许容易地理解本发明，而非限制本发明。相反，本发明既定涵盖所附权利要求书的范围内所包括的各种修改及等效布置，所述范围将与最广义的解释一致，以便在法律的许可下涵盖所有此类修改及等效结构。

Claims (12)

1、一种在金属性衬底中形成电隔离触点的方法，其包含：
在所述金属性衬底中形成通孔，其中所述通孔包括至少一个侧壁；
在所述通孔的所述至少一个侧壁上形成电介质衬套；及
在形成所述电介质衬套之后用导电材料填充所述通孔。
2、根据权利要求1所述的方法，其进一步包含：
在形成所述电介质衬套之前通过蚀刻工艺清洁所述通孔的所述至少一个侧壁。
3、根据权利要求1或权利要求2所述的方法，其中通过阳极化或化学气相沉积形成所述电介质衬套。
4、根据权利要求1到3中任一所述的方法，其中所述衬底由铝构成且在形成所述通孔之后阳极化所述铝以形成所述电介质衬套。
5、根据权利要求1到4中任一所述的方法，其中所述衬底包括形成于其中的凹坑，所述凹坑包括至少一个侧壁及基底且所述通孔形成于所述凹坑的所述基底中。
6、根据权利要求5所述的方法，其中用所述导电材料填充所述凹坑。
7、根据权利要求1到6中任一所述的方法，其中所述导电材料是导电油墨或银纳米微粒液体导电环氧树脂。
8、根据权利要求1到7中任一所述的方法，其中所述通孔包括具有90到200微米之间的第一直径的第一端及具有20到50微米之间的第二直径的第二端。
9、根据权利要求1到8中任一所述的方法，其中通过激光钻孔形成所述通孔。
10、一种具有多个电隔离的触点的外壳组件，所述电隔离的触点中的每一者使用根据权利要求1到9中任一所述的方法形成。
11、根据权利要求10所述的外壳组件，其包含使用所述多个隔离的电触点的天线的一部分。
12、根据权利要求10所述的外壳组件，其中所述多个电隔离的触点中的至少一者作为接通/关断开关操作。
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