CN101694006B

CN101694006B - Electroplating anode device

Info

Publication number: CN101694006B
Application number: CN200910184877XA
Authority: CN
Inventors: 何明; 赖志明; 陈锦辉; 章力; 龙欣江
Original assignee: Jiangyin Changdian Advanced Packaging Co Ltd
Current assignee: Jiangyin Changdian Advanced Packaging Co Ltd
Priority date: 2009-10-19
Filing date: 2009-10-19
Publication date: 2011-01-05
Anticipated expiration: 2029-10-19
Also published as: CN101694006A

Abstract

The invention relates to an electroplating anode device which is used for the electroplating of a wafer. The device comprises a box body (5), the center of which is vertically provided with an upright post (51), and the upper end of the upright post (51) is provided with external threads (511); the bottom of the box body (5) is provided with a liquid storage tank (52) and a liquid communication through hole (53); the box body (5) is internally provided with a titanium plate (6), the titanium plate (6) and a lead (8) are fixed at the bottom of the box body (5) by titanium screws (7), the upper end surface of the titanium plate (6) is provided with a contact point (61), an anode (2) is arranged on the titanium plate (6) and is coated with a piece of anode cloth (4); the titanium plate (6), the anode (2) and the anode cloth (4) are all sheathed on the upright post (51) at the center of the box body (5) and screwed by fitting nuts (3); and the top of the box body (5) is provided with an upper cover (1) to form a sealed structure. The electroplating anode device is characterized in that anode mud can be sealed therein, anode conductive structure is reliable, anode utilization efficiency is high, anode arrangement space is not limited and the like.

Description

Electroplating anode device

(1) technical field

The present invention relates to a kind of electroplating anode device, be used for the plating of wafer.Belong to technical field of plating equipment.

Traditional wafer electroplating device inner anode laying method is directly anode to be exposed in bath solution, as Fig. 2, Fig. 3 and shown in Figure 4.It is by directly linking to each other with devices such as lead, hook, titanium baskets, forming the anode port of electroplating current.This mode is placed anode and is mainly had the following disadvantages:

1, is not suitable for meticulous coating product

When electroplating, anode meeting loss, and produce the anode sludge.The anode sludge is diffused in the plating bath, pollutes plating bath, and the electroplate liquid purity reduces, and electroplate liquid downgrade, the insoluble anode sludge are mingled with in the coating in electroplating process, influence coating surface quality and purity.

2, the anode conducting structure is unreliable

Anode links to each other with devices such as lead, hook, titanium baskets, does not add securing gear in addition.When electroplating, (copper, tin etc.) anode can consume, and anode is through long-time loss, can break away from devices such as lead, hook, titanium baskets or become flexible, it is unreliable to contact, in electroplating process, occur electroplating abnormal interruption, influence the stability of electroplating operations and the quality of galvanization coating.

3, the anode utilising efficiency is not high

At present, anode must be reserved enough volumes, cooperates Unit Installation such as lead, hook.Yet when electroplating, because of anode can consume, the anodic size reduces gradually, and when anode detracts to a certain degree, devices such as lead or hook can't keep excellent contact with anode, can not satisfy needs of production, must must change, and the anode utilization ratio is very low.

4, the anode placement space is restricted

Anode links to each other with hooking device, or is placed in the titanium basket, and anode is linked up with and the very big constraint of titanium basket at the placement location of plating tank.

(3) summary of the invention

The objective of the invention is to overcome above-mentioned deficiency, provide a kind of can with anode sludge sealing wherein, anode conducting reliable in structure, anode utilising efficiency height and the unrestricted electroplating anode device of anode placement space.

The object of the present invention is achieved like this: a kind of electroplating anode device, and described device comprises a box body, and this box body center vertically is provided with a column, and the column upper end is shaped on outside screw; This box body bottom offers the liquid storage groove and exchanges through hole with liquid; Be placed with the titanium plate in this box body, a titanium plate and a lead are fixed on the box body bottom by the titanium screw, the titanium plate is provided with the contact on the upper surface, place an anode on the titanium plate, cover an anode cloth on this anode, described titanium plate, anode and anode cloth all are sleeved on the column at described box body center, and screw with fitting nut; At the box body top one loam cake is installed, is formed enclosed construction.

Electroplating anode device of the present invention, the described contact opening bulk that is rectangle.

Characteristics of the present invention are:

1, the box body bottom is offered the liquid storage groove and is exchanged through hole with liquid.The intravital bath concentration of box can increase gradually along with anodic consumption, is increased to a certain degree, and metal ion content reaches to satisfy and closes in the plating bath, can form crystallization.The liquid storage groove provides condition for the diffusion of high density plating bath; Liquid exchanges through hole for the inside and outside fluid exchange of box body provides minim channel, prevents from that the intravital metal ion content of box is too high to reach full closing and separate out.Simultaneously, very little because liquid exchanges through-hole aperture, do not proceed in the plating bath so do not influence leaking outside of the anode sludge substantially.

2, the blocky contact of oblong openings is set on the titanium plate, there is certain perk height the blocky contact of this oblong openings, has certain elastic force, and openings of sizes and quantity are set according to the anode size.The contact perk has certain elastic force behind certain altitude, roof pressure the anode of top, and the anode top reinforces fitting nut.Like this, just formed power and suppressed relation mutually, anode is in all the time by titanium plate pressured state, makes the anode contact reliable, stable.

3, the positive wire of ining succession on the titanium plate, lead is connected to power anode port (used lead is not subjected to bath corrosion).Like this, the anodic loss can not have influence on the reliability of wiring.

4, after anode is packed in the box body, on anode, cover one deck anode cloth, add loam cake then, form enclosed construction.Like this, neither influence electroplating effect, the anode sludge can be substantially enclosed in the box body again.The anode sludge be increased to a certain amount of after, unified again cleaning.

5, anode need not be reserved enough volumes and cooperates Unit Installation such as lead, hook.

Adopt the present invention to place the anodic device, compare, have following advantage with traditional anode modes of emplacement:

1, greatly reduces the possibility that plating bath is subjected to the pollution of the anode sludge, not only increased the work-ing life of plating bath, and improved the galvanization coating quality.

2, the anode conducting structure becomes reliably, stablizes, and reduces and electroplates the possibility of jumping the electricity interruption.

3, anode is largely improved work-ing life.

4, the position of anode in coating bath can rationally be arranged according to demand.

5, electroplating process is more stable.

6, anode utilising efficiency height.

(4) description of drawings

Fig. 1 is the structural representation of electroplating anode device of the present invention.

Fig. 2 is a conventional anode modes of emplacement synoptic diagram one.

Fig. 3 is a conventional anode modes of emplacement synoptic diagram two.

Fig. 4 is a conventional anode modes of emplacement synoptic diagram three.

Among the figure:

Loam cake 1

Anode 2

Fitting nut 3

Anode cloth 4

Box body 5, column 51, outside screw 511, liquid storage groove 52, liquid exchange through hole 53;

Titanium plate 6, contact 61;

Titanium screw 7

Lead 8

Hook 9

Titanium basket 10.

(5) embodiment

Referring to Fig. 1, Fig. 1 is the structural representation of electroplating anode device of the present invention.As seen from Figure 1, electroplating anode device of the present invention mainly is made up of box body 5, titanium plate 6, lead 8, anode 2, anode cloth 4 and fitting nut 3.Box body 5 centers vertically are provided with a column 51, and column 51 upper ends are shaped on outside screw 511; Box body 5 bottoms are offered liquid storage groove 52 and are exchanged through hole 53 with liquid; Place titanium plate 6 in the box body 5, titanium plate 6 and lead 8 are fixed on box body 5 bottoms by titanium screw 7, and lead 8 is connected to the power anode port.The blocky contact 61 of oblong openings is set on titanium plate 6 upper surfaces, place anode 2 on the titanium plate 6, cover anode cloth 4 on this anode 2, described titanium plate 6, anode 2 and anode cloth 4 all are sleeved on the column 51 at described box body 5 centers, and screw with fitting nut 3, so just anode 2 is clamped on the titanium plate 6; At box body 5 tops one loam cake 1 is installed, is formed enclosed construction.Like this, neither influence electroplating effect, the anode sludge can be substantially enclosed in the box body again.The anode sludge be increased to a certain amount of after, unified again cleaning.

Described box body 5 is according to the anodic resemblance, adopts PP (polypropylene) or Teflon anticorrosion materials such as (tetrafluoroethylene) to be made.Anticorrosion fibers such as anode cloth 4 employing polypropylene fibre are made.

Claims

1. an electroplating anode device is characterized in that described device comprises a box body (5), and this box body (5) center vertically is provided with a column (51), and column (51) upper end is shaped on outside screw (511); This box body (5) bottom offers liquid storage groove (52) and exchanges through hole (53) with liquid; Be placed with titanium plate (6) in this box body (5), a titanium plate (6) and a lead (8) are fixed on box body (5) bottom by titanium screw (7), titanium plate (6) is provided with contact (61) on the upper surface, titanium plate (6) is gone up and is placed an anode (2), this anode (2) is gone up and is covered an anode cloth (4), described titanium plate (6), anode (2) and anode cloth (4) all are sleeved on the column (51) at described box body (5) center, and screw with fitting nut (3); At box body (5) top one loam cake (1) is installed, is formed enclosed construction;

Described contact (61) perk has certain elastic force behind certain altitude, roof pressure the anode (2) of top;

It is very little that described liquid exchanges through hole (53) aperture, do not influence the anode sludge and leak outside and proceed in the plating bath.

2. a kind of electroplating anode device according to claim 1 is characterized in that described box body (5) adopts polypropylene or tetrafluoroethylene to be made.

3. a kind of electroplating anode device according to claim 1 is characterized in that described anode cloth (4) adopts polypropylene fibre to be made.