CN101704224B - Solidified abrasive grinding and polishing pad with transition layer and bonding layer - Google Patents
Solidified abrasive grinding and polishing pad with transition layer and bonding layer Download PDFInfo
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- CN101704224B CN101704224B CN2009102135958A CN200910213595A CN101704224B CN 101704224 B CN101704224 B CN 101704224B CN 2009102135958 A CN2009102135958 A CN 2009102135958A CN 200910213595 A CN200910213595 A CN 200910213595A CN 101704224 B CN101704224 B CN 101704224B
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- adhesive linkage
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Abstract
The invention relates to a solidified abrasive grinding and polishing pad with a transition layer and a bonding layer, which comprises an abrasive layer (1), a rigid layer (4) and/or an elastic layer (5), wherein the abrasive layer (1) is positioned on the rigid layer (4), and the rigid layer (4) is positioned above the elastic layer (5). The solidified abrasive grinding and polishing pad is characterized in that a transition layer (2) and a bonding layer (3) are also arranged between the abrasive layer (1) and the rigid layer (4), the abrasive layer (1) is solidified on the transition layer (2), and the transition layer (2) is directly connected with the rigid layer (4) or the elastic layer (5) by the bonding layer (3). The invention is beneficial to enhancing the bonding force of the abrasive layer and the rigid layer and/or the elastic layer and has a certain toughness. Compared with the grinding and polishing pad with the same type and without the transition layer and the bonding layer, the service life of the grinding and polishing pad of the invention is enhanced by more than 60%, and the processing roughness can be enhanced by 30-40%.
Description
Technical field
The present invention relates to a kind of finisher, especially a kind of grinding and polishing processing polishing pad, specifically a kind of solidified abrasive grinding polishing pad that has transition zone and adhesive linkage.
Background technology
As everyone knows, the fields such as backlight, traffic lights even home lighting that relate to automobile room lamp, mobile phone and lcd screen are used in the LED illumination, and LED is grown on the Sapphire Substrate usually.It is predicted that 2012, global LED market scale will be up to 12,000,000,000 dollars.Because the demand of popularization, digital household appliances and the network market of standards such as TD-SCDMA promotes, the semi-conductor market of China will reach 68,600,000,000 dollars scale in 2008.Mobile phone, MP3, MP4 and digital camera are to the sought-after growth of display screen.In U.S.'s " country's igniting plan ", the optical element consumption reaches more than 40,000, and China has also started similarly " refreshing photometry is drawn ".Optical element also is widely used in weapon precise guidance system and space remote sensing system.Rapid development of high and new such as internet and mobile communication, to laser crystal (as ruby, titanium jewel, YVO
4Crystal etc.), the demand of nonlinear optical crystal (as KDP, KTP, BBO, LBO), piezo-electric crystal (crystal, lithium niobate, lithium tantalate), computer hard disc substrate etc. constantly increases.The investigation that certain mechanism announces shows that global hard disk sales volume reached more than 400,000,000 in 2006, will reach 600,000,000 in 2009.Above-mentioned material and element mostly adopt grinding and polishing as its only resource of processing eventually.In traditional free abrasive grinding and polishing process, the abrasive material utilization rate is extremely low, and working (machining) efficiency is low, the abrasive material random distribution, and the distribution density inequality causes workpiece grinding cutting amount inequality, and workpiece face shape is difficult to control.The polishing of employing solidified abrasive grinding has higher working (machining) efficiency and workpiece surface quality, reduces the treating capacity of grinding and polishing waste liquid, has alleviated environmental pollution.United States Patent (USP) 6672951 discloses a kind of concretion abrasive polishing pad, but its structure has only abrasive material and non-abrasive material.Chinese patent 101096080 and the 101428404 solidified abrasive grinding polishing pads of announcing have totally three layers of abrasive material, rigid layer and elasticity.People such as Korea S Jae Young Choi are at a study onpolishing of molds using hydrophilic fixed abrasives pad (Int.J.Mach.Tool manufac.2004, (44): 1143) propose a kind of concretion abrasive polishing pad in the article, its structure also has only two-layer.There is following problem in actual use in the solidified abrasive grinding polishing pad of this structure:
1, because abrasive material is connected by photocuring is bonding with rigid layer or elastic layer, a little less than the adhesive strength, comes off easily; Abrasive material is bonded on nonplanar mould, squeezes broken easily or breaks;
2, during grinding and polishing, be subjected to the frictional force effect, the edge easily comes off; By grinding-material edge extruding pad interface, the abrasive material monoblock is come off.
Summary of the invention
Weak strength when the objective of the invention is directly to be connected with rigid layer or elastic layer at existing abrasive material, the caducous problem of abrasive material designs a kind of intensity height, the solidified abrasive grinding polishing pad that has transition zone and adhesive linkage of abrasive material difficult drop-off.
Technical scheme of the present invention is:
A kind of solidified abrasive grinding polishing pad that has transition zone and adhesive linkage, comprise abrasive material 1, rigid layer 4 and/or elastic layer 5, abrasive material 1 is positioned on the rigid layer 4, rigid layer 4 is positioned on the elastic layer 5, it is characterized in that between described abrasive material 1 and rigid layer 4, also being provided with transition zone 2 and adhesive linkage 3, abrasive material 1 is cemented on the transition zone 2, and transition zone 2 passes through adhesive linkage 3 or directly links to each other with rigid layer 4 or elastic layer 5; Described abrasive material 1 is the homogeneous mixture of hydrophilic resin and abrasive material, and its thickness is 0.2～2.0mm, and described abrasive material is at least a kind of in diamond, silica, ceria, alundum (Al, carborundum, boron carbide or the zirconia; Described transition zone 2 is and the abrasive material 1 same or analogous hydrophilic resin lipoprotein mixture that does not contain abrasive material that its thickness is 0.01～1.0mm; Described adhesive linkage 3 is a ultraviolet cured adhesive, and its thickness is 0～0.2mm; Described rigid layer 4 is a kind of in lucite PMMA plate, polyvinylchloride plate, polycarbonate PC plate or the poly terephthalic acid diethylester PET plate; Described elastic layer 5 is a kind of in rubber-like polyurethane, polyolefin, styrene, polyester, polyamide or the black damping cloth.
The mass ratio of described hydrophilic resin and abrasive material 1: 0.01～0.65.
Beneficial effect of the present invention:
The present invention helps improving abrasive material and rigid layer and/or elastic layer and gets bonding force, and certain toughness is arranged.
Transition zone of the present invention adopts and the same or analogous hydrophilic resin lipoprotein mixture of abrasive material, does not just contain abrasive material, easily combines with abrasive material, improves adhesion.Adhesive linkage is a ultraviolet cured adhesive, by ultraviolet light polymerization, improves bonding force with other layers, because this layer is thinner, certain toughness is arranged, and when the processing on-plane surface, can not be squeezed broken or breaks.
Experiment showed, not improving more than 60% with the polishing pad of transition zone and adhesive linkage of service life of polishing pad of the present invention and same type, the processing roughness can improve 30-40%.
Description of drawings
Fig. 1 is an optimum structure schematic diagram of the present invention.
The specific embodiment
The present invention is further illustrated below in conjunction with drawings and Examples.
As shown in Figure 1.
A kind of solidified abrasive grinding polishing pad that has transition zone and adhesive linkage, comprise abrasive material 1, rigid layer 4 and elastic layer 5, abrasive material 1 is positioned on the rigid layer 4, rigid layer 4 is positioned on the elastic layer 5, describedly also be provided with transition zone 2 and adhesive linkage 3 at abrasive material 1 and rigid layer 4, abrasive material 1 is cemented on the transition zone 2, and transition zone 2 links to each other with rigid layer 4 by adhesive linkage 3, and rigid layer 4 links to each other with elastic layer 5; Described abrasive material 1 is the homogeneous mixture of hydrophilic resin and abrasive material, the mixing quality of hydrophilic resin and abrasive material is than 1: 0.01～0.65, its thickness is 0.2～2.0mm, and described abrasive material is at least a kind of in diamond, silica, ceria, alundum (Al, carborundum, boron carbide or the zirconia; Described transition zone 2 is and the abrasive material 1 same or analogous hydrophilic resin lipoprotein mixture that does not contain abrasive material that its thickness is 0.01～1.0mm; Described adhesive linkage 3 is a ultraviolet cured adhesive, and its thickness is 0～0.2mm (it is fused fully and do not embody with transition zone and rigid layer or elastic layer to be adhesive linkage 3); Described rigid layer 4 is a kind of in lucite PMMA plate, polyvinylchloride plate, polycarbonate PC plate or the poly terephthalic acid diethylester PET plate; Described elastic layer 5 is a kind of in rubber-like polyurethane, polyolefin, styrene, polyester, polyamide or the black damping cloth.During concrete enforcement,, also can save elastic layer 5 or rigid layer 4, improve by the surface quality of abrasive polishing materials according to by the difference of grinding and polishing object.
Below be prescription, manufacture method and the grinding polishing effect record of a concrete solidified abrasive grinding polishing pad.
(1) designs required grinding and polishing pad picture on surface, and process the mould consistent with designed picture on surface;
(2) prepare one handle clean rigid polymer matrix as rigid layer and or an elastomeric polymer standby as elastic layer;
(3) hydrophilic resin and abrasive material are fully mixed by 1: 0.01～0.65 mass ratio;
(4) mixture of hydrophilic resin and abrasive material is poured into above-mentioned mould certain thickness 0.2～2.0mm, brushed smooth; Certain thickness hydrophilic resin fall again as transition zone, and THICKNESS CONTROL is brushed smooth at 0.01～1.0mm;
(5) will be coated in as the rigid polymer of rigid layer as the ultraviolet cured adhesive of bonding agent uniformly or directly be coated on the elastic polymer matrix as elastic layer, and be pressed in the above-mentioned mould that contains mixture;
(6), make said mixture be solidificated on the rigid polymer matrix or elastic polymer matrix as rigid layer the demoulding as elastic layer by uv cure machine;
(7), then can at the bottom of the portion of rigid polymer matrix, paste one deck elastic layer 5 where necessary again if in (6) step, only used rigid layer.
Under the identical fabrication process condition, compare with the no transition zone of same abrasive material and the solidified abrasive grinding polishing pad of adhesive linkage.
| Abrasive material | Hydrophilic resin and abrasive material are 1: 0.15 by quality, and abrasive material is a diamond | Hydrophilic resin and abrasive material are 1: 0.2 by quality, and abrasive material is a diamond | Hydrophilic resin and abrasive material are 1: 0.4 by quality, and abrasive material is a cerium oxide |
| Transition zone | Thickness is 0.5mm | Thickness is 1.0mm | Thickness is 1.5mm |
| Adhesive linkage | Thickness is 0.1mm | Thickness is 0.15mm | Thickness is 0 |
| Rigid layer | The polyvinylchloride plate | The polyvinylchloride plate | Do not have |
| Elastic layer | Polyurethane | Do not have | Polyurethane |
| Machined material | Silicon chip | K9 glass | Silicon chip |
| Grinding polishing effect | The polishing pad life-span improves 100%; Surface roughness improves 35% | The polishing pad life-span improves 200%; Surface roughness improves 30% | The polishing pad life-span improves 70%; Surface roughness improves 40% |
This shows, by increasing the service life that transition zone has improved polishing pad greatly, simultaneously because the adhesive strength raising, each of pad interface is improved to grinding performance, especially the raising of marginal portion adhesive strength has also improved the polishing precision indirectly, make surface roughness obtain to a certain degree raising, therefore, set up transition zone and adhesive linkage and have crucial meaning improving the grinding and polishing processing technology.
The part that the present invention does not relate to prior art that maybe can adopt all same as the prior art is realized.
Claims (6)
1. solidified abrasive grinding polishing pad that has transition zone and adhesive linkage, comprise abrasive material (1), rigid layer (4) and elastic layer (5), abrasive material (1) is positioned on the rigid layer (4), rigid layer (4) is positioned on the elastic layer (5), it is characterized in that between described abrasive material (1) and rigid layer (4), also being provided with transition zone (2) and adhesive linkage (3), abrasive material (1) is cemented on the transition zone (2), and transition zone (2) links to each other with rigid layer (4) by adhesive linkage (3); Described abrasive material (1) is the homogeneous mixture of hydrophilic resin and abrasive material, and its thickness is 0.2～2.0mm, and described abrasive material is at least a kind of in diamond, silica, ceria, alundum (Al, carborundum, boron carbide or the zirconia; Described transition zone (2) is and the identical hydrophilic resin of abrasive material (1) that its thickness is 0.01～1.0mm; Described adhesive linkage (3) is a ultraviolet cured adhesive, its thickness≤0.2mm; Described rigid layer (4) is a kind of in lucite PMMA plate, polyvinylchloride plate, polycarbonate PC plate or the poly terephthalic acid diethylester PET plate; Described elastic layer (5) is a kind of in rubber-like polyurethane, polyolefin, styrene, polyester, polyamide or the black damping cloth.
2. the solidified abrasive grinding polishing pad that has transition zone and adhesive linkage according to claim 1 is characterized in that the mass ratio 1 of described hydrophilic resin and abrasive material: (0.01～0.65).
3. solidified abrasive grinding polishing pad that has transition zone and adhesive linkage, comprise abrasive material (1), rigid layer (4), abrasive material (1) is positioned on the rigid layer (4), it is characterized in that between described abrasive material (1) and rigid layer (4), also being provided with transition zone (2) and adhesive linkage (3), abrasive material (1) is cemented on the transition zone (2), and transition zone (2) links to each other with rigid layer (4) by adhesive linkage (3); Described abrasive material (1) is the homogeneous mixture of hydrophilic resin and abrasive material, and its thickness is 0.2～2.0mm, and described abrasive material is at least a kind of in diamond, silica, ceria, alundum (Al, carborundum, boron carbide or the zirconia; Described transition zone (2) is and the identical hydrophilic resin of abrasive material (1) that its thickness is 0.01～1.0mm; Described adhesive linkage (3) is a ultraviolet cured adhesive, its thickness≤0.2mm; Described rigid layer (4) is a kind of in lucite PMMA plate, polyvinylchloride plate, polycarbonate PC plate or the poly terephthalic acid diethylester PET plate.
4. the solidified abrasive grinding polishing pad that has transition zone and adhesive linkage according to claim 3 is characterized in that the mass ratio 1 of described hydrophilic resin and abrasive material: (0.01～0.65).
5. solidified abrasive grinding polishing pad that has transition zone and adhesive linkage, comprise abrasive material (1), elastic layer (5), abrasive material (1) is positioned on the elastic layer (5), it is characterized in that between described abrasive material (1) and elastic layer (5), also being provided with transition zone (2) and adhesive linkage (3), abrasive material (1) is cemented on the transition zone (2), and transition zone (2) links to each other with elastic layer (5) by adhesive linkage (3); Described abrasive material (1) is the homogeneous mixture of hydrophilic resin and abrasive material, and its thickness is 0.2～2.0mm, and described abrasive material is at least a kind of in diamond, silica, ceria, alundum (Al, carborundum, boron carbide or the zirconia; Described transition zone (2) is and the identical hydrophilic resin of abrasive material (1) that its thickness is 0.01～1.0mm; Described adhesive linkage (3) is a ultraviolet cured adhesive, its thickness≤0.2mm; Described elastic layer (5) is a kind of in rubber-like polyurethane, polyolefin, styrene, polyester, polyamide or the black damping cloth.
6. the solidified abrasive grinding polishing pad that has transition zone and adhesive linkage according to claim 5 is characterized in that the mass ratio 1 of described hydrophilic resin and abrasive material: (0.01～0.65).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2009102135958A CN101704224B (en) | 2009-11-06 | 2009-11-06 | Solidified abrasive grinding and polishing pad with transition layer and bonding layer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009102135958A CN101704224B (en) | 2009-11-06 | 2009-11-06 | Solidified abrasive grinding and polishing pad with transition layer and bonding layer |
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| CN101704224A CN101704224A (en) | 2010-05-12 |
| CN101704224B true CN101704224B (en) | 2011-05-04 |
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| CN110000679A (en) * | 2019-04-19 | 2019-07-12 | 东莞市中微纳米科技有限公司 | A kind of grinding mechanism for a grinder |
| CN111216037B (en) * | 2020-03-24 | 2021-03-30 | 河南联合精密材料股份有限公司 | Polishing pad and preparation method thereof |
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2009
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Patent Citations (5)
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| US6672951B2 (en) * | 1997-08-22 | 2004-01-06 | Micron Technology, Inc. | Fixed abrasive polishing pad |
| US6039633A (en) * | 1998-10-01 | 2000-03-21 | Micron Technology, Inc. | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
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| CN101428404A (en) * | 2008-12-22 | 2009-05-13 | 南京航空航天大学 | Fixed abrasive grinding polishing pad and method of manufacturing the same |
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| CN101704224A (en) | 2010-05-12 |
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Assignee: Zhejiang Pujiang Minrui Precision Machinery Technology Co., Ltd. Assignor: Nanjing University of Aeronautics and Astronautics Contract record no.: 2011320001070 Denomination of invention: Solidified abrasive grinding and polishing pad with transition layer and bonding layer Granted publication date: 20110504 License type: Exclusive License Open date: 20100512 Record date: 20110729 |
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