CN101973048A - Separation device for integrated circuit punching forming equipment - Google Patents
Separation device for integrated circuit punching forming equipment Download PDFInfo
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- CN101973048A CN101973048A CN2010102737404A CN201010273740A CN101973048A CN 101973048 A CN101973048 A CN 101973048A CN 2010102737404 A CN2010102737404 A CN 2010102737404A CN 201010273740 A CN201010273740 A CN 201010273740A CN 101973048 A CN101973048 A CN 101973048A
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- separation
- cutter
- separation device
- integrated circuit
- punching forming
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Abstract
The invention belongs to the field of integrated circuit punching forming and relates to a separation device for integrated circuit punching forming equipment. In the separation device, a separation cutter is provided with a convex blade facing the upper surface of a heat radiating fin. The invention has the advantages that because the separation cutter is provided with the convex blade, a precut cutting edge is added during separation processing, then the heat radiating fin can be in plastic deformation, and generated burrs are in a groove precut before during subsequent separation, but not on the surface of the heat radiating fin, thereby efficiently ensuring the quality of a product.
Description
Technical field
The invention belongs to the IC punching forming field, be specifically related to a kind of separator that is used for IC punching formation equipment.
Background technology
The encapsulation pattern of IC products just is the encapsulation pattern of main flow by dual-in-line (DIP class) for the encapsulation pattern of main flow becomes surface mount (SOP/SSOP/TSSOP/QFP class) at present, size from product, plastic-sealed body is constantly to small and exquisite slim development, and compact dimensions and the appearance requirement to product also improves constantly simultaneously.And for the manufacturing of surface mount series products, the punching molding of pin also just becomes a procedure relatively more crucial in the whole encapsulation industry.In existing punching molding operation, the arrangement of general operation is normally such: dash towards cast gate, towards air discharge duct operation → cut muscle and mould operation → separation circuit, separates later product and directly enter in the magazine, just can sell through no problem after the test.When the single face encapsulating products, the last moulding of product is directly to cut off to separate so that product separates with lead frame.According to the punch forming principle, the cut surface character of single face encapsulating products is: the fillet district---euphotic belt---fracture belt---burr, the direction of the burr 20 of the above-mentioned processing of process is just in time on fin, as shown in Figure 1, because the single face encapsulating products directly is mounted on fin on the PVC substrate, therefore burr will influence the welding of later process, causes the generation of defective products.
Summary of the invention
The purpose of this invention is to provide a kind of separator that is used for IC punching formation equipment, it is simple in structure, has eliminated the product quality hidden danger that is produced by burr effectively by this separation device processing products obtained therefrom, has guaranteed product quality.
For achieving the above object, the present invention has adopted following technical scheme: a kind of separator that is used for IC punching formation equipment, the separation cutter of this separation device is provided with the protruding sword towards heatsink upper surface.
Beneficial effect of the present invention is: be provided with protruding sword owing to separate cutter, therefore add in separation and increased the stocking cutter mouth man-hour, this moment, plastic deformation will take place in fin, when separating thereafter, the groove the inside that the burr that produces is just cut in front in advance, and can not arrive fin surface, therefore guaranteed the quality of product effectively.
Description of drawings
Fig. 1 is the product appearance figure of conventional separate mode processing gained;
Fig. 2 is a separation machining state schematic diagram of the present invention;
Fig. 3 adopts the present invention to separate the product appearance figure that processes gained.
The specific embodiment
As shown in Figure 2, a kind of separator that is used for IC punching formation equipment, the separation cutter 10 of this separation device is provided with the protruding sword 11 towards heatsink upper surface.
Described protruding sword 11 is tip-angled shape to be given prominence in the end of separating cutter 10.
Preferably, described protruding sword 11 integral body are wedge shape.
Further, the bottom face towards a side self-separation cutter 10 of heatsink upper surface of described protruding sword 11 stretches out downwards and is mutually concordant with the side of separating cutter 10, and a side that deviates from heatsink upper surface of protruding sword 11 becomes skewed and extends upward and intersect with the bottom face that separates cutter 10.
The present invention has increased the stocking cutter mouth in separation circuit, earlier heatsink upper surface is cut out " V " type, make fin generation plastic deformation, the V groove the inside that the burr that produces when separating is thereafter just cut in front in advance, and can not arrive fin surface, therefore just guarantee the quality of product effectively.
Claims (4)
1. separator that is used for IC punching formation equipment, it is characterized in that: the separation cutter (10) of this separation device is provided with the protruding sword (11) towards heatsink upper surface.
2. the separator that is used for IC punching formation equipment according to claim 1 is characterized in that: described protruding sword (11) is tip-angled shape to be given prominence in the end of separating cutter (10).
3. the separator that is used for IC punching formation equipment according to claim 2 is characterized in that: described protruding sword (11) integral body is wedge shape.
4. according to claim 2 or the 3 described separators that are used for IC punching formation equipment, it is characterized in that: the bottom face towards a side self-separation cutter (10) of heatsink upper surface of described protruding sword (11) stretches out downwards and is mutually concordant with the side of separating cutter (10), and a side that deviates from heatsink upper surface of protruding sword (11) becomes skewed and extends upward and intersect with the bottom face that separates cutter (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102737404A CN101973048A (en) | 2010-09-01 | 2010-09-01 | Separation device for integrated circuit punching forming equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102737404A CN101973048A (en) | 2010-09-01 | 2010-09-01 | Separation device for integrated circuit punching forming equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101973048A true CN101973048A (en) | 2011-02-16 |
Family
ID=43572969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102737404A Pending CN101973048A (en) | 2010-09-01 | 2010-09-01 | Separation device for integrated circuit punching forming equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101973048A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3656379A (en) * | 1969-10-22 | 1972-04-18 | Vandervell Products Ltd | Methods of cutting laminated strip material |
| CN87102025A (en) * | 1987-05-16 | 1988-12-07 | 文先忠 | The process for stamping of limit stamping-out spring song |
| US4856393A (en) * | 1985-11-22 | 1989-08-15 | Braddon George B | Method for die cutting plastic foam |
| US6401510B1 (en) * | 1999-04-07 | 2002-06-11 | 3M Innovative Properties Company | Method for stamping a part from a multi-layered strip |
| CN201816091U (en) * | 2010-09-01 | 2011-05-04 | 铜陵三佳山田科技有限公司 | Separator for integrated circuit punching and shaping equipment |
-
2010
- 2010-09-01 CN CN2010102737404A patent/CN101973048A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3656379A (en) * | 1969-10-22 | 1972-04-18 | Vandervell Products Ltd | Methods of cutting laminated strip material |
| US4856393A (en) * | 1985-11-22 | 1989-08-15 | Braddon George B | Method for die cutting plastic foam |
| CN87102025A (en) * | 1987-05-16 | 1988-12-07 | 文先忠 | The process for stamping of limit stamping-out spring song |
| US6401510B1 (en) * | 1999-04-07 | 2002-06-11 | 3M Innovative Properties Company | Method for stamping a part from a multi-layered strip |
| CN201816091U (en) * | 2010-09-01 | 2011-05-04 | 铜陵三佳山田科技有限公司 | Separator for integrated circuit punching and shaping equipment |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110216 |