CN102036507B - Longitudinal connection method for printed circuit board (PCB) - Google Patents
Longitudinal connection method for printed circuit board (PCB) Download PDFInfo
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- CN102036507B CN102036507B CN 201010609745 CN201010609745A CN102036507B CN 102036507 B CN102036507 B CN 102036507B CN 201010609745 CN201010609745 CN 201010609745 CN 201010609745 A CN201010609745 A CN 201010609745A CN 102036507 B CN102036507 B CN 102036507B
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Abstract
The invention provides a longitudinal connection method for a printed circuit board (PCB). The method comprises the following steps of: 1, providing a first core board and a second core board to be longitudinally connected, a thermoplastic bonding sheet and conductive metal paste, and correspondingly providing conductor layers to be longitudinally connected on the surfaces of the first core board and the second core board respectively; 2, completely attaching and covering the thermoplastic bonding sheet on one surface, on which the conductor layer to be longitudinally connected is arranged, of the first core board; 3, ablating the bonding sheet covering the conductor layer to be longitudinally connected of the first core board and exposing the conductor layer; 4, printing the conductive metal paste on the conductor layer exposed on the first core board and pre-curing the conductive metal paste for primary forming; and 5, positioning, connecting and laminating the surface, on which the conductor layer is arranged, of the second core board to be longitudinally connected with the conductor layer on the surface, on which the conductive metal paste is printed, of the first core board, and longitudinally connecting the first core board with the second core board by using the printed conductive metal paste. In the method, the PCB is longitudinally connected without copper deposition and copper electroplating processes by using the conductive metal paste, so longitudinal connection between any conductor layers of the PCB can be realized, a product with larger thickness-diameter ratio can be manufactured, and the manufacturing cost is reduced to a certain extent.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB:Printed circuit board) technical field, relate in particular to a kind of method that adopts conductive metal slurry that pcb board is vertically connected.
Background technology
At present, in PCB circuit board making process, its method that vertically connects processing connects each layer of pcb board for first boring of employing, and then heavy copper and electro-coppering are communicated with each layer.But, use this connection processing mode need to adopt heavy copper and the electro-coppering of chemical medicinal liquid flow process, the product that can not pass through wet flow process to some is inapplicable.And heavy copper and copper plating process are subjected to the restriction of pcb board radius-thickness ratio, can not make the product of radius-thickness ratio 〉=16: 1, when pcb board reaches certain thickness, adopt present this connected mode, can very high requirement be arranged to the pcb board manufacturing equipment, also be unfavorable for the reduction of cost of goods manufactured.
Summary of the invention
The object of the invention is to, a kind of vertical method of attachment of pcb board is provided, it adopts conductive metal slurry that pcb board is vertically connected, do not need to sink the PROCESS FOR TREATMENT of copper and electro-coppering, avoided the processing of wet flow process, can realize the vertical connection between any conductor layer of pcb board, can make the higher product of radius-thickness ratio, reduce to a certain extent manufacturing cost.
For achieving the above object, the invention provides a kind of vertical method of attachment of pcb board, it comprises the steps:
Step 1 provides and treats first and second central layer that vertically connects, thermoplastic bonding sheet, reaches conductive metal slurry, and vertical conductor layer that connects is treated on first and second central layer surface respectively corresponding being provided with;
Step 2 is fitted thermoplastic bonding sheet fully and to be covered the first central layer and be provided with on the one side for the treatment of vertical bonding conductor layer;
Step 3, ablation cover the first central layer and treat the bonding sheet on the conductor layer of vertically connection and expose conductor layer;
Step 4, the conductor layer that the printed conductive metal slurry exposes on the first central layer, and the preliminary forming processes of conductive metal slurry being carried out precuring;
Step 5 will treat that one side that the second central layer that vertically connects is provided with a conductor layer conductor layer with the printed conductive metal slurry of the first central layer is located by connecting and pressing, realizes vertical connection of first and second central layer by the conductive metal slurry of printing.
In the described step 3, cover the first central layer by laser ablation and treat the bonding sheet on the conductor layer of vertically connection and expose conductor layer.
In the described step 4, the preliminary forming processes that adopts the mode of heated baking to carry out precuring to conductive metal slurry.
In the described step 5, will treat that by the mode of rivet or pin one side that the second central layer that vertically connects is provided with conductor layer and a conductor layer of the printed conductive metal slurry of the first central layer are located by connecting then pressing first.
In the described step 5, the temperature when the second central layer is provided with pressing between the conductor layer of printed conductive metal slurry of the one side of conductor layer and the first central layer is 180 ℃ to 220 ℃, and pressure is 300Psi to 500Psi.
Beneficial effect of the present invention: vertical method of attachment of pcb board provided by the present invention, it adopts conductive metal slurry that pcb board is vertically connected, do not need to sink copper and copper plating process to process, satisfy the product processing request of some flow processing that can not wet, can make the product of radius-thickness ratio 〉=16: 1; And use the method vertically to connect between any conductor layer to pcb board, reduced manufacturing process flow and the complexity of pcb board, improved the manufacturing capacity of integration density and the pcb board thickness of pcb board, and reduced to a certain extent manufacturing cost.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention is described in detail, will make technical scheme of the present invention and other beneficial effects apparent.
In the accompanying drawing,
Fig. 1 is the schematic flow sheet of vertical method of attachment one specific embodiment of pcb board among the present invention.
Embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
As shown in Figure 1, the invention provides a kind of vertical method of attachment of pcb board, it comprises the steps:
Step 1 provides and treats first and second central layer that vertically connects, thermoplastic bonding sheet, reaches conductive metal slurry, and vertical conductor layer that connects is treated on first and second central layer surface respectively corresponding being provided with.
Step 2 is fitted thermoplastic bonding sheet fully and to be covered the first central layer and be provided with on the one side for the treatment of vertical bonding conductor layer.
Step 3, ablation covers the first central layer and treats the bonding sheet on the conductor layer of vertically connection and expose conductor layer, in this step 3, the technique that adopts laser to window covers the first central layer by laser ablation and treats the bonding sheet on the conductor layer of vertically connection and expose conductor layer.
Step 4, the conductor layer that the printed conductive metal slurry exposes on the first central layer, and the preliminary forming processes of conductive metal slurry being carried out precuring.In this step 4, the preliminary forming processes that adopts the mode of heated baking to carry out precuring to conductive metal slurry.
Step 5 will treat that one side that the second central layer that vertically connects is provided with a conductor layer conductor layer with the printed conductive metal slurry of the first central layer is located by connecting and pressing, realizes that by the conductive metal slurry of printing the first central layer is connected with the vertical of the second central layer.In this step 5, will treat that by the mode of rivet or pin one side that the second central layer that vertically connects is provided with conductor layer and a conductor layer of the printed conductive metal slurry of the first central layer are located by connecting then pressing first.As a kind of specific embodiment of the present invention, in step 5, the temperature when the second central layer is provided with pressing between the conductor layer of printed conductive metal slurry of the one side of conductor layer and the first central layer is 180 ℃ to 220 ℃, and pressure is 300Psi to 500Psi.
In sum, vertical method of attachment of pcb board provided by the present invention, it adopts conductive metal slurry that pcb board is vertically connected, do not need to sink copper and copper plating process to process, satisfy the product processing request of some flow processing that can not wet, can make the product of radius-thickness ratio 〉=16: 1; And use the method vertically to connect between any conductor layer to pcb board, reduced manufacturing process flow and the complexity of pcb board, improved the manufacturing capacity of integration density and the pcb board thickness of pcb board, and reduced to a certain extent manufacturing cost.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of the accompanying claim of the present invention.
Claims (3)
1. vertical method of attachment of a pcb board is characterized in that, comprises the steps:
Step 1 provides and treats first and second central layer that vertically connects, thermoplastic bonding sheet, reaches conductive metal slurry, and vertical conductor layer that connects is treated on first and second central layer surface respectively corresponding being provided with;
Step 2 is fitted thermoplastic bonding sheet fully and to be covered the first central layer and be provided with on the one side for the treatment of vertical bonding conductor layer;
Step 3, ablation cover the first central layer and treat the bonding sheet on the conductor layer of vertically connection and expose conductor layer;
Step 4, the conductor layer that the printed conductive metal slurry exposes on the first central layer, and the preliminary forming processes of conductive metal slurry being carried out precuring;
Step 5 will treat that one side that the second central layer that vertically connects is provided with a conductor layer conductor layer with the printed conductive metal slurry of the first central layer is located by connecting and pressing, realizes vertical connection of first and second central layer by the conductive metal slurry of printing;
In the described step 5, will treat that by the mode of rivet or pin one side that the second central layer that vertically connects is provided with conductor layer and a conductor layer of the printed conductive metal slurry of the first central layer are located by connecting then pressing first;
In the described step 5, the temperature when the second central layer is provided with pressing between the conductor layer of printed conductive metal slurry of the one side of conductor layer and the first central layer is 180 ℃ to 220 ℃, and pressure is 300Psi to 500Psi.
2. vertical method of attachment of pcb board as claimed in claim 1 is characterized in that, in the described step 3, covers the first central layer by laser ablation and treats the bonding sheet on the conductor layer of vertically connection and expose conductor layer.
3. vertical method of attachment of pcb board as claimed in claim 1 is characterized in that, in the described step 4, and the preliminary forming processes that adopts the mode of heated baking to carry out precuring to conductive metal slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010609745 CN102036507B (en) | 2010-12-28 | 2010-12-28 | Longitudinal connection method for printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010609745 CN102036507B (en) | 2010-12-28 | 2010-12-28 | Longitudinal connection method for printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
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| CN102036507A CN102036507A (en) | 2011-04-27 |
| CN102036507B true CN102036507B (en) | 2013-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010609745 Active CN102036507B (en) | 2010-12-28 | 2010-12-28 | Longitudinal connection method for printed circuit board (PCB) |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307432B (en) * | 2011-08-31 | 2013-02-13 | 东莞生益电子有限公司 | Processing application process for bonding sheet material |
| CN102523703A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Manufacturing method of back drill holes on PCB (Printed Circuit Board) |
| CN110635240A (en) * | 2019-09-11 | 2019-12-31 | 宁波信泰机械有限公司 | Heatable radome structure and production method thereof |
| CN114173477A (en) * | 2020-09-10 | 2022-03-11 | 深南电路股份有限公司 | Circuit board drilling method and device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5758413A (en) * | 1995-09-25 | 1998-06-02 | International Business Machines Corporation | Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias |
| US6976306B1 (en) * | 2004-07-12 | 2005-12-20 | Unitech Printed Circuit Board Corporation | Modular method for manufacturing circuit board |
| CN101697663A (en) * | 2008-06-24 | 2010-04-21 | 环隆电气股份有限公司 | Circuit board and method for assembling surface joint elements and circuit board |
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
-
2010
- 2010-12-28 CN CN 201010609745 patent/CN102036507B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5758413A (en) * | 1995-09-25 | 1998-06-02 | International Business Machines Corporation | Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias |
| US6976306B1 (en) * | 2004-07-12 | 2005-12-20 | Unitech Printed Circuit Board Corporation | Modular method for manufacturing circuit board |
| CN101697663A (en) * | 2008-06-24 | 2010-04-21 | 环隆电气股份有限公司 | Circuit board and method for assembling surface joint elements and circuit board |
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
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| CN102036507A (en) | 2011-04-27 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |