CN102115905A - Supply pipe and mixed liquid storage container equipped therewith - Google Patents
Supply pipe and mixed liquid storage container equipped therewith Download PDFInfo
- Publication number
- CN102115905A CN102115905A CN2010101885540A CN201010188554A CN102115905A CN 102115905 A CN102115905 A CN 102115905A CN 2010101885540 A CN2010101885540 A CN 2010101885540A CN 201010188554 A CN201010188554 A CN 201010188554A CN 102115905 A CN102115905 A CN 102115905A
- Authority
- CN
- China
- Prior art keywords
- plate type
- supply
- pipe
- liquid storage
- type member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
- C25D17/04—External supporting frames or structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Accessories For Mixers (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
The invention provides a supply pipe and a mixed liquid storage container equipped therewith.The supply pipe is equipped with a plate-shaped member and the internal of the plate-shaped member can be combined.The plate-shaped member generates a turbulent flow for the mixing of the flow liquid.According to one embodiment of the invention, the supply pipe and the mixed liquid storage container equipped therewith can provide uniformly mixed liquid and the liquid is supplied.
Description
The cross reference of related application
The application requires the right of priority to the 10-2009-0134093 korean patent application of Korea S Department of Intellectual Property submission on December 30th, 2009, and its disclosed full content is incorporated into this by quoting as proof.
Technical field
The present invention relates to supply-pipe and mixing liquid storage tank with this supply-pipe.
Background technology
Make printed circuit board (PCB) and can comprise multiple electroplating technology.Can carry out electroplating technology by electroplating solution being caused the substrate that is applied with voltage.Here, electroplating solution can be made of the mixture of multiple solution, therefore, if this multiple solution does not have uniform mixing, then can produce the plating deviation.
Therefore, need mixed uniformly electroplating solution to improve galvanized quality.Especially, along with the trend when the development of forward direction smaller szie circuit pattern, the uniform mixing of electroplating solution is directly related with the deviation in electroplating, and therefore, presses for the solution of this problem.
Summary of the invention
The invention provides a kind of mixing liquid storage tank that the supply-pipe of mixed uniformly liquid can be provided and have this supply-pipe.
An aspect of of the present present invention provides a kind of supply-pipe that is bonded to its inner plate type member that has.This plate type member turbulization is so that the fluxion mixing.
This plate type member can following mode combination: make this template member parallel with the flow direction of liquid.This plate type member can be configured to a plurality of plate type members.
A plurality of template members can be arranged in the delegation.Distance between any two adjacent plate type members can be shorter than the length of plate type member.
In any two adjacent plate type members one can tilt with respect in these any two adjacent plate type members another.Any two adjacent plate type members can be vertically disposed.
Another aspect of the present invention provides a kind of mixing liquid storage tank.Mixing liquid storage tank according to an embodiment of the invention can comprise: aforesaid supply-pipe with link to each other with this supply-pipe and the holding tank of storage of liquids.
Additional aspect of the present invention and advantage will partly be set forth in the following description, and partly apparent from specification sheets, perhaps can know by practice of the present invention.
Description of drawings
Fig. 1 is the diagrammatic sketch that the electroplating technology that uses mixing liquid storage tank according to an embodiment of the invention is shown.
Fig. 2 is the skeleton view of mixing liquid storage tank according to an embodiment of the invention.
Fig. 3 is the skeleton view of supply-pipe according to an embodiment of the invention.
Embodiment
By the following drawings and description, the features and advantages of the present invention will become apparent.
Hereinafter with reference to accompanying drawing according to a particular embodiment of the invention mixing liquid storage tank is described in more detail.Those identical or corresponding parts all are endowed identical reference number and have nothing to do with figure number, and have omitted the multiple description.
Fig. 1 is the diagrammatic sketch that the electroplating technology that uses mixing liquid storage tank 100 according to an embodiment of the invention is shown.As shown in Figure 1, can be by voltage being applied to substrate 10, jet electro-plating solution on substrate 10 is sent into substrate 10 in the horizontal direction continuously simultaneously and is carried out electroplating technology then.
Here, electroplating solution can be to comprise the organism of metal ion and various additives and the mixture of inorganics.Inorganics can comprise for example H
2O, H
2SO
4And CuSO
4Electroplating solution is stored in the plating liquid storage tank (hereinafter, being called mixing liquid storage tank 100) and can be injected into substrate 10 by nozzle 20.
Fig. 2 is the skeleton view of mixing liquid storage tank 100 according to an embodiment of the invention.As shown in Figure 2, mix liquid storage tank 100 and can comprise holding tank 110, inlet pipe 112 and supply-pipe 120.
Supply-pipe 120 can be bonded to an end of holding tank 110.Plate type member 124 can be bonded to the inside of supply-pipe 120.Plate type member 124 can be by providing flow resistance to come turbulization to the liquid that flows through supply-pipe 120.
Because this turbulent flow, the various materials that are included in the liquid may be mixed together.Therefore, the different liqs of input holding tank 110 can mix by the turbulent flow that is generated by plate type member 124 when flowing through supply-pipe 120.
When mixing liquid storage tank 100 as the plating liquid storage tank, as in the situation of present embodiment, the various materials that are included in the electroplating solution can mix when flowing through supply-pipe 120, therefore, can prepare more uniform electroplating solution.This can prevent the inhomogeneous plating deviation that causes by electroplating solution.
Can have a plurality of plate type members 124 that are bonded to supply-pipe 120 inside in the following manner: a plurality of plate type members 124 are parallel with the flow direction of electroplating solution.Because a plurality of plate type members 124 are parallel with the flow direction of electroplating solution,, therefore, can reduce flow while turbulization in electroplating solution in minimum level ground so can minimum level ground reduce the cross-sectional area of supply-pipe 120 inside.
Adjacent plate type member 124 can vertically be set, and be provided with, can increase the turbulent effect that produces by a plurality of plate type members 124, therefore, can make the mixing effect maximization of supply-pipe 120 inside by this.
Fig. 3 is the skeleton view of supply-pipe 120 according to an embodiment of the invention.As shown in Figure 3, adjacent plate type member 124 can be separated from one another, and can be shorter than each length d 2 on the electroplating solution flow direction in two adjacent plate type members 124 apart from d1 between any two adjacent plate type members 124.
This marriage relation between the adjacent plate type member 124 can further strengthen the turbulence effects and the mixing effect of electroplating solution.
Below, suppose liquid storage tank is electroplated in three types solution input.Do not have at supply-pipe 120 under the situation of plate type member 124, the electroplating solution that flows through supply-pipe 120 is not uniform.
Have at supply-pipe 120 under the situation of the plate type member 124 that is vertically set on supply-pipe 120 inside, electroplating solution can uniform mixing when flowing through supply-pipe 120.
Therefore, the mixing liquid storage tank 100 of present embodiment can mix the various materials that are stored in the holding tank 110 equably under the situation that does not have additional mixing device.
Though described spirit of the present invention in detail with reference to specific embodiment, these embodiment only are used for the example purpose, and should not limit the present invention.Be appreciated that under the situation that does not deviate from scope and spirit of the present invention, those skilled in the art can change these embodiments or revise.
Claims (8)
1. supply-pipe has and is bonded to its inner plate type member, and described plate type member is configured to turbulization, so that fluxion mixes.
2. supply-pipe according to claim 1, wherein, described plate type member combination in the following manner: make described plate type member parallel with the flow direction of described liquid.
3. supply-pipe according to claim 1, wherein, described plate type member is configured to a plurality of plate type members.
4. supply-pipe according to claim 3, wherein, described a plurality of plate type members are configured to delegation.
5. supply-pipe according to claim 4, wherein, the distance between any two adjacent plate type members is shorter than the length of described plate type member.
6. supply-pipe according to claim 4, wherein, in any two adjacent plate type members one tilts with respect in described any two adjacent plate type members another.
7. supply-pipe according to claim 6, wherein, any two adjacent plate type members are vertically disposed.
8. mixing liquid storage tank comprises:
According to claim 1 any one described supply-pipe to the claim 7;
And
Holding tank links to each other with described supply-pipe and is configured to storage of liquids.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090134093A KR20110077494A (en) | 2009-12-30 | 2009-12-30 | Supply-pipe and mixing reservoir having the same |
KR10-2009-0134093 | 2009-12-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102115905A true CN102115905A (en) | 2011-07-06 |
CN102115905B CN102115905B (en) | 2013-02-06 |
Family
ID=44214824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101885540A Expired - Fee Related CN102115905B (en) | 2009-12-30 | 2010-05-25 | Supply pipe and mixed liquid storage container equipped therewith |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20110077494A (en) |
CN (1) | CN102115905B (en) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4643584A (en) * | 1985-09-11 | 1987-02-17 | Koch Engineering Company, Inc. | Motionless mixer |
JPH06264273A (en) * | 1993-03-10 | 1994-09-20 | Yoshitama Sugaya | Turbulent flow generator for liquid tank |
CN1284895A (en) * | 1998-01-02 | 2001-02-21 | Abb拉默斯环球有限公司 | Structured packing and element therefor |
KR20040049056A (en) * | 2002-12-03 | 2004-06-11 | 엘지전자 주식회사 | device for promoting mixing fuel and air in mixing pipe for gas radiation burner |
CN1537029A (en) * | 2001-05-07 | 2004-10-13 | 环球油品公司 | Apparatus for mixing and reacting at least tow fluids |
CN2673486Y (en) * | 2003-04-16 | 2005-01-26 | 吴民权 | Liquid-liquid fast pipeline mixer |
JP2005105976A (en) * | 2003-09-30 | 2005-04-21 | Kazuyuki Kobayashi | Air guide panel for air filter, and air filter case |
CN1780682A (en) * | 2003-04-28 | 2006-05-31 | 因迪格技术集团股份有限公司 | Method and apparatus for mixing fluids for particle agglomeration |
CN201073592Y (en) * | 2007-07-27 | 2008-06-18 | 攀枝花新钢钒股份有限公司 | Hole plate pipeline fluid mixer |
-
2009
- 2009-12-30 KR KR1020090134093A patent/KR20110077494A/en not_active Application Discontinuation
-
2010
- 2010-05-25 CN CN2010101885540A patent/CN102115905B/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4643584A (en) * | 1985-09-11 | 1987-02-17 | Koch Engineering Company, Inc. | Motionless mixer |
JPH06264273A (en) * | 1993-03-10 | 1994-09-20 | Yoshitama Sugaya | Turbulent flow generator for liquid tank |
CN1284895A (en) * | 1998-01-02 | 2001-02-21 | Abb拉默斯环球有限公司 | Structured packing and element therefor |
CN1537029A (en) * | 2001-05-07 | 2004-10-13 | 环球油品公司 | Apparatus for mixing and reacting at least tow fluids |
KR20040049056A (en) * | 2002-12-03 | 2004-06-11 | 엘지전자 주식회사 | device for promoting mixing fuel and air in mixing pipe for gas radiation burner |
CN2673486Y (en) * | 2003-04-16 | 2005-01-26 | 吴民权 | Liquid-liquid fast pipeline mixer |
CN1780682A (en) * | 2003-04-28 | 2006-05-31 | 因迪格技术集团股份有限公司 | Method and apparatus for mixing fluids for particle agglomeration |
JP2005105976A (en) * | 2003-09-30 | 2005-04-21 | Kazuyuki Kobayashi | Air guide panel for air filter, and air filter case |
CN201073592Y (en) * | 2007-07-27 | 2008-06-18 | 攀枝花新钢钒股份有限公司 | Hole plate pipeline fluid mixer |
Also Published As
Publication number | Publication date |
---|---|
KR20110077494A (en) | 2011-07-07 |
CN102115905B (en) | 2013-02-06 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130206 Termination date: 20170525 |