CN102123560B - Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof - Google Patents
Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof Download PDFInfo
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- CN102123560B CN102123560B CN201110049119A CN201110049119A CN102123560B CN 102123560 B CN102123560 B CN 102123560B CN 201110049119 A CN201110049119 A CN 201110049119A CN 201110049119 A CN201110049119 A CN 201110049119A CN 102123560 B CN102123560 B CN 102123560B
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Abstract
The invention discloses an embedded strong-current high-power PCB (Printed Circuit Board) and a manufacturing method thereof. The method comprises: (1) milling a hollow groove on a core board; (2) fixedly clamping and embedding a conductor structure member which is same as the hollow groove in shape and not larger than the core board into thickness in the hollow groove; (3) laminating a first copper foil layer on the upper surface of the core board by a first semicuring piece, and laminating a second copper foil layer on the lower surface of the core board by a second semicuring piece; (4) drilling the laminated product, performing image transfer and image making on the first and second copper foil layers, forming a circuit needed by design and a part meeting large power and circuit control on the copper foil layers, simultaneously, performing hole metallization on the formed through hole to obtain the thickness of copper needed on the hole wall, and then performing solder masking manufacture; and (5) performing blind-sink hollowing on corresponding parts, needing to be connected on the product, of the conductor structure member after solder masking, exposing the conductor structure member, drilling the conductor structure member to form wire holes connected with other external connecting pieces. Compared with the prior art, in the invention, the conductor structure member is embedded into the inner layer of the PCB, interconnection of a large-current output end and an instrument input end by utilizing holes or surfaces on the conductor structure member, simultaneously, component packaging is performed by other circuit part lines except the high-power conductor structure member embedded into the PCB so as to control the circuit, so that the original wire connection is replaced to achieve the circuit control part, and the problems in the integration process of the power and circuit control parts of strong-current high-power electronic products are solved.
Description
Technical field
The invention belongs to pcb board manufacturing technology field, high-power pcb board of particularly a kind of embedded heavy current and preparation method thereof is mainly used in the power part of heavy current great-power electronic product and controls integration partly.
Background technology
Printed circuit board (PCB) (Printed Circuit Board) is called for short PCB, claims printed board again, is one of vitals of electronic product.Electronic product with the printed circuit board manufacturing has reliability height, high conformity, mechanical strength is high, in light weight, volume is little, be easy to advantages such as standardization.Every kind of electronic equipment almost arrives computer, communication equipment, electronic radar system greatly to electronic watch, calculator for a short time, as long as there are electronic devices and components, the electric interconnection between them will use printed board.
Early stage in electronic technology development, circuit is made up of power supply, lead, switch and components and parts.Components and parts all connect with lead, and element fixedly neutral body carries out in the space.Along with development of electronic technology, it is very complicated that the function of electronic product, structure become, and component placement, interconnection wiring all receive very big spatial constraints, if use the space wire laying mode, will make electronic product become dazzled.Therefore just require electronic component and wiring to be planned through pcb board.
And along with the development of electronic product to lightweight and portability, pcb board not only and deposited its original electrical interconnection and the effect of supporting components and parts also plays with power partly and the effect partly integrated of control.Yet it is as shown in Figure 1; For realizing power part and control function partly; Present most heavy current great-power electronic product is with the output of big electric current, when the instrument input is connected; All be that to adopt certain thickness metal derby conductor (copper bar) to carry out interconnected, connect with electric wire at interconnected circuit output, input simultaneously, to realize the partly normalization of function of circuit control.
Though this connected mode can partly partly be combined the function that reaches product with circuit control etc. with the power of heavy current great-power electronic product; The link that but its assembling procedure is complicated, connect through electric wire becomes flexible easily, the strong and weak electric current of high-low pressure can not carry out simultaneously, can only separate independence; And circuit in disorder, take up room greatly, metal derby conductor (copper bar) exposes oxidation and corrosion easily in air, needs to adopt thicker metal derby conductor, causes cost higher.
Summary of the invention
In view of this; The object of the present invention is to provide high-power pcb board of a kind of embedded heavy current and preparation method thereof; Partly existing assembling procedure is complicated in the integration process, link is loosening easily, the strong and weak electric current of high-low pressure can not carry out simultaneously and circuit is in disorder, take up room big in power and control to solve present heavy current great-power electronic product, and cost is than problems such as height.
For realizing above-mentioned purpose, the present invention mainly adopts following technical scheme:
The high-power pcb board of a kind of embedded heavy current; Comprise central layer (1) and be arranged at first copper foil layer (4) of central layer (1) upper surface, second copper foil layer (5) of central layer (1) lower surface; Said first copper foil layer (4) is pressed together on the upper surface of central layer (1) through first prepreg (2); Said second copper foil layer (5) is pressed together on the lower surface of central layer (1) through second prepreg (3); Also be provided with at least one hollow slots (101) on the said central layer (1); Fixed card is embedded with the conductor structure spare (6) that a shape and thickness identical with hollow slots (101) is not more than central layer (1) in this hollow slots (101), and said conductor structure spare (6) is provided with at least two wire guides that run through (601), and said first copper foil layer (4) is provided with corresponding with above-mentioned wire guide (601) first bore a hole (401); Second copper foil layer (5) is provided with second perforation (501) corresponding with above-mentioned wire guide (601), and said wire guide (601), first perforation (401), second perforation (501) run through connection; Said first prepreg (2) is provided with first through hole (201) corresponding with wire guide (601), and second prepreg (3) is provided with and wire guide (601) corresponding second through hole (301).
Wherein said hollow slots (101) is closed holddown groove, and these closed holddown groove four limits are positioned at central layer (1), and conductor structure spare (6) fixed card is embedded in this closed holddown groove, and the metallic conductor plate can all be embedded in the central layer.
Wherein said hollow slots (101) is open holddown groove; This open holddown groove is positioned on the central layer (1); And run through central layer (1) both sides or a side; Conductor structure spare (6) fixed card is embedded in this open holddown groove, and the two ends of conductor structure spare (6) are positioned at central layer (1) both sides outside both sides or a side, and the metallic conductor plate can partly be embedded in the central layer; Be embedded in central layer for metallic conductor board part; All the other partly expose at central layer outside; Exposed metallic conductor plate surface does not externally need insulating barrier protection; Exposed part metallic conductor plate externally can random length carry out the arbitrary shape making, and the solid space that can form multidimensional connects arbitrarily.
Wherein said conductor structure spare (6) is a metallic conductor plate, and the metallic conductor buttress carries out moulding according to the shape that design embeds in the central layer, and compact dimensions is not more than the hollow slots size at central layer, and the thickness of metallic conductor plate and size do not receive any restriction.
Wherein said conductor structure spare (6) is formed by a plurality of metallic conductor plate mutual superposition; And isolate through insulating barrier between the adjacent two metallic conductor plates; The metallic conductor buttress carries out moulding according to the shape that design embeds in the central layer; Compact dimensions is not more than the hollow slots size at central layer, and the thickness of metallic conductor plate and size do not receive any restriction.
The present invention also provides the manufacture method of the high-power pcb board of a kind of embedded heavy current in addition, and it specifically comprises step:
(1), on central layer, mills out hollow slots;
(2), the conductor structure spare fixed card that and thickness identical with above-mentioned hollow slots is not more than central layer with shape is embedded in the above-mentioned hollow slots;
(3), first copper foil layer is pressed together on the upper surface of central layer through first prepreg, second copper foil layer is pressed together on the lower surface of central layer through second prepreg;
(4), the good product of above-mentioned pressing is holed; And first copper foil layer, second copper foil layer carried out image transfer and graphic making; On copper foil layer, form the design circuit and satisfy part high-power and circuit control; Simultaneously the through hole that forms after the above-mentioned boring is carried out hole metallization and handle, obtain required hole wall copper thickness, again product is hindered weldering afterwards and make;
(5), on resistance postwelding product, need the corresponding position of bonding conductor structural member to carry out blind heavy hollow out, expose conductor structure spare and on this conductor structure spare, hole, form the wire guide that is connected with other connector of outside.
Wherein also comprise between step (1) and the step (2):
Conductor structure spare is carried out palm fibre/melanism to be handled; Because conductor structure spare is a metal derby; Need carry out conductor structure spare is surpassed alligatoring; Carry out conventional brown after ultra alligatoring is accomplished and handle, brown handle comprise sour oil removing → three grade washing → alkali oil removing → three grade washing → preparatory brown → brown → Pyatyi wash → blot → dry; Ultra alligatoring is that the metal derby surface is formed the rough surface of microcosmic; Increase the specific area on metal derby surface; On the rough surface of metal derby, carry out brown; Form organic metal film, make prepreg in the pressing process together in the glue of hot conditions current downflow and organic metal film strong bonded.
Wherein also comprise after the step (5):
(6), above-mentioned wire guide being carried out hole metallization handles.
Compared with prior art; The present invention is embedded into conductor structure spare in the internal layer of pcb board; Utilize the wire guide on the conductor structure spare to form the interconnected of big current output terminal and instrument input; Realize circuit control through the circuit on the pcb board copper foil layer simultaneously; Connect thereby replace electric wire, existing assembling procedure is complicated in power and control part integration process, link is loosening easily, the strong and weak electric current of high-low pressure can not carry out simultaneously and circuit is in disorder, take up room greatly the cost problem of higher to have solved heavy current great-power electronic product.
Description of drawings
The sketch map that Fig. 1 connects through the metal derby conductor for the current output terminal of existing heavy current great-power electronic product and instrument input.
The sketch map that Fig. 2 connects through the high-power pcb board of embedded heavy current for the current output terminal of heavy current great-power electronic product of the present invention and instrument input.
Fig. 3 is the syndeton sketch map of the high-power pcb board of the embedded heavy current of the present invention.
The sketch map that Fig. 4 is closed holddown groove for central layer hollow slots of the present invention.
The sketch map that Fig. 5 is one of open holddown groove for central layer hollow slots of the present invention.
Fig. 6 is two sketch map of open holddown groove for central layer hollow slots of the present invention.
Identifier declaration among the figure: central layer 1, hollow slots 101, first prepreg 2, first through hole 201, second prepreg 3, second through hole 301, first copper foil layer 4, first perforation, 401, second copper foil layer 5, second perforation 501, conductor structure spare 6, wire guide 601.
Embodiment
Core concept of the present invention is: the present invention is embedded in conductor structure spare at the central layer of pcb board; Realize interconnected between big current output terminal and the instrument input through this conductor structure spare; Simultaneously the line design of this conductor structure spare and pcb board self is connected, to realize circuit and power control to instrument.
For setting forth thought of the present invention and purpose, will combine accompanying drawing and specific embodiment that the present invention is done further explanation below.
See also shown in Figure 2, the sketch map that Fig. 2 connects through the high-power pcb board of embedded heavy current for the current output terminal of heavy current great-power electronic product of the present invention and instrument input.Wherein connect that existing assembling procedure is complicated, link is loosening easily, the strong and weak electric current of high-low pressure can not carry out simultaneously and circuit is in disorder, take up room greatly through the metal derby conductor to the current output terminal of present heavy current great-power electronic product and instrument input; Cost is than problems such as height; The present invention utilizes the embedded PCB plate to replace original metallic piece conductor and connects electric wire; Being implemented in big current output terminal through an Embedded pcb board connects with the input of instrument; And the line design of utilizing pcb board itself simultaneously realizes the control to circuit and power; Conductor structure spare by being embedded in the pcb board central layer replaces original metallic piece conductor, replaces electric wire to connect by the line design that is arranged on the pcb board copper foil layer.
As shown in Figure 3, Fig. 3 is the syndeton sketch map of the high-power pcb board of the embedded heavy current of the present invention.The wherein said pcb board that is embedded in mainly includes central layer 1 and first copper foil layer 4 that is arranged at central layer 1 upper surface, second copper foil layer 5 of central layer lower surface; Said first copper foil layer 4 is pressed together on the upper surface of central layer 1 through first prepreg 2; Said second copper foil layer 5 is pressed together on the lower surface of central layer 1 through second prepreg 3; Also be provided with at least one hollow slots 101 on the said central layer 1; Fixed card is embedded with the conductor structure spare 6 that a shape and thickness identical with above-mentioned hollow slots is not more than central layer in this hollow slots 101; Said conductor structure spare 6 is provided with at least two wire guides that run through 601; Said first copper foil layer 4 is provided with above-mentioned wire guide 601 corresponding first perforation, 401, the second copper foil layers 5 and is provided with second perforation 501 corresponding with above-mentioned wire guide 601, and said wire guide 601, first perforation 401, second 501 threes that bore a hole are run through connection.
Wherein said first prepreg 2, second prepreg 3 are the colloid that flows; And constitute by a plurality of prepregs; These prepregs are laid on the upper and lower surface of central layer 1, can satisfy the glue amount filling in slit between conductor structure spare cross section and hollow out central layer and the thickness of insulating layer between conductor structure spare and surface conductor.
Corresponding first prepreg 2, second prepreg 3 is provided with and first through hole 201 and second through hole 301 of above-mentioned wire guide 601, first perforation, 401, second perforation, 501 corresponding connections.
Said process installs bolt additional in the hole of on pcb board, offering after accomplishing, and realizes the interconnected of the big current output terminal in pcb board and outside, instrument input through bolt locking.
Embedded PCB plate among the present invention can be designed to the syndeton with outside a plurality of big current output terminals, a plurality of instrument inputs according to user's different needs; When if current output terminal, instrument input respectively are one; In fact the conductor structure spare 6 that is adopted is exactly a metal copper plate or copper bar, realizes being connected of big current input terminal and instrument output through this metal copper plate or copper bar; If big current output terminal is one, when the instrument input is a plurality of, can connects through a plurality of wire guides on the conductor structure spare 6 601 as required this moment and export; When the electric current of input is divided into high-low pressure power electric current if desired; Then need adopt the conductor structure spare 6 of layering, the conductor structure spare of layering 6 is to be formed by a plurality of metallic conductor plate mutual superposition here, and isolates through insulating barrier between the adjacent two metallic conductor plates; It is different that the different metallic conductor plate is connected to outside power supply; And the corresponding yet corresponding difference of electric current that is input to instrument owing to isolate through insulating barrier between these metallic conductor plates, therefore short circuit phenomenon can not occur yet.
In addition; Need to prove that hollow slots described in the present invention 101 can be closed holddown groove (see figure 4), also can be open holddown groove (seeing Fig. 5, Fig. 6), if hollow slots 101 is closed holddown groove; Four limits of this closed holddown groove are positioned at central layer 1 so; And conductor structure spare 6 fixed card are embedded in this closed holddown groove, and promptly this conductor structure spare 6 all is embedded in the central layer, do not have and expose the part (Fig. 4) in central layer 1 outside.
If hollow slots 101 is open holddown groove (seeing Fig. 5, Fig. 6), this open holddown groove then is divided into full open model (Fig. 5) and semi open model (Fig. 6).If be the full open model holddown groove; Then this holddown groove is positioned on the central layer 1, and runs through the both sides of central layer 1, and conductor structure spare 6 fixed card are embedded in this full open model holddown groove; And it is outside that the two ends of conductor structure spare 6 are positioned at central layer 1 both sides; The mid portion that is conductor structure spare 6 is in central layer 1, and two ends then expose outside in central layer 1 both sides, being partly embedded in the central layer 1 in the middle of having only; If be the semi open model holddown groove; Then this holddown groove has only a side to pass central layer 1 one sides (shown in Figure 6); Conductor structure spare 6 these lateral sections are positioned at the outside of central layer 1 this side accordingly; And exposed metallic conductor plate surface does not externally need insulating barrier protection, and exposed part metallic conductor plate externally can random length carry out the arbitrary shape making, and the solid space that also can form multidimensional connects arbitrarily.
More than be the explanation that structural principle of the present invention is carried out, will combine accompanying drawing and specific embodiment that the manufacture method of embedded PCB plate of the present invention is done further description below.
The present invention also provides the manufacture method of the high-power pcb board of a kind of embedded heavy current, and it specifically comprises step:
(1), on central layer, mills out hollow slots;
Here the central layer of selecting is the FR4 central layer, selects the quantity of hollow slots and the big or small degree of depth to carry out according to user's design demand here.
(2), the conductor structure spare fixed card that and thickness identical with above-mentioned hollow slots is not more than central layer with shape is embedded in the above-mentioned hollow slots;
Here the selection of conductor structure spare is also selected according to the applied environment of pcb board accordingly, if this pcb board is used for single big electric current output, instrument input then can selects metallic copper row or copper sheet; The strong and weak electricity flow point is not exported, the connection operational environment of a plurality of instrument input if be applied in, and then should select the conductor structure spare of laminated insulation;
After conductor structure spare is selected, need carry out palm fibre/melanism to it and handle, to increase the specific area of conductor structure spare; Promote the adhesion strength of conductor structure spare and prepreg; After being embedded in conductor structure spare fixed card in the above-mentioned hollow slots then, carrying out pressing again and handle, engage with the tight of hollow slots to guarantee conductor structure spare; Be integrally formed; Its detailed process is: ultra alligatoring and brown are handled, carry out conventional brown after ultra alligatoring is accomplished and handle, brown handle comprise sour oil removing → three grade washing → alkali oil removing → three grade wash → preparatory brown → brown → Pyatyi washes → blots → dry; Ultra alligatoring is that the metal derby surface is formed the rough surface of microcosmic; Increase the specific area on metal derby surface; On the rough surface of metal derby, carry out brown; Form organic metal film, make prepreg in the pressing process together in the glue of hot conditions current downflow and organic metal film strong bonded.
(3), first copper foil layer is pressed together on the upper surface of central layer through first prepreg, second copper foil layer is pressed together on the lower surface of central layer through second prepreg;
Because central layer is an insulating material,, need form circuit at the upper and lower surface of central layer for realizing that circuit control partly connects; Be about to first copper foil layer is pressed together on central layer through first prepreg upper surface; Second copper foil layer is pressed together on the lower surface of central layer through second prepreg,, copper foil layer and central layer is pressed into an overall structure through the adhesive effect of prepreg; Conductor structure spare is then embedded the inside of central layer fully, forms the first plate of folding in advance.
(4), the good product of above-mentioned pressing is holed; And first copper foil layer, second copper foil layer carried out image transfer and graphic making; On copper foil layer, form the design circuit and satisfy part high-power and circuit control; Simultaneously the through hole that forms after the above-mentioned boring is carried out hole metallization and handle, obtain required hole wall copper thickness, again product is hindered weldering afterwards and make;
(5), on resistance postwelding product, need the corresponding position of bonding conductor structural member to carry out blind heavy hollow out, expose conductor structure spare and on this conductor structure spare, hole, form the wire guide that is connected with other connector of outside.
Also need carry out according to the design of normal pcb board in addition, formed circuit is carried out surface treatment, reach designing requirement the surface lines of product.
(6), above-mentioned wire guide being carried out hole metallization handles.
In sum; The present invention is embedded into conductor structure spare in the internal layer of pcb board; Utilize the wire guide on the conductor structure spare to form the interconnected of big current output terminal and instrument input; Realize circuit control through the circuit on the pcb board copper foil layer simultaneously; Replaced the electric wire connection, existing assembling procedure is complicated in power and control part integration process, link is loosening easily, the strong and weak electric current of high-low pressure can not carry out simultaneously and circuit is in disorder, take up room greatly the cost problem of higher to have solved heavy current great-power electronic product.
More than high-power pcb board of a kind of embedded heavy current provided by the present invention and preparation method thereof has been carried out detailed introduction; Used concrete example among this paper principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. high-power pcb board of embedded heavy current; It is characterized in that comprising central layer (1) and be arranged at first copper foil layer (4) of central layer (1) upper surface, second copper foil layer (5) of central layer (1) lower surface; Said first copper foil layer (4) is pressed together on the upper surface of central layer (1) through first prepreg (2); Said second copper foil layer (5) is pressed together on the lower surface of central layer (1) through second prepreg (3); Also be provided with at least one hollow slots (101) on the said central layer (1); Fixed card is embedded with the conductor structure spare (6) that a shape and thickness identical with hollow slots (101) is not more than central layer (1) in this hollow slots (101), and said conductor structure spare (6) is provided with at least two wire guides that run through (601), and said first copper foil layer (4) is provided with corresponding with above-mentioned wire guide (601) first bore a hole (401); Second copper foil layer (5) is provided with second perforation (501) corresponding with above-mentioned wire guide (601), and said wire guide (601), first perforation (401), second perforation (501) run through connection; Said first prepreg (2) is provided with first through hole (201) corresponding with wire guide (601), and second prepreg (3) is provided with and wire guide (601) corresponding second through hole (301).
2. the high-power pcb board of embedded heavy current according to claim 1; It is characterized in that said hollow slots (101) is closed holddown groove; These closed holddown groove four limits are positioned at central layer (1), and conductor structure spare (6) fixed card is embedded in this closed holddown groove.
3. the high-power pcb board of embedded heavy current according to claim 1; It is characterized in that said hollow slots (101) is open holddown groove; This open holddown groove is positioned on the central layer (1); And run through central layer (1) both sides or a side, conductor structure spare (6) fixed card is embedded in this open holddown groove, and an end of conductor structure spare (6) is positioned at the outside that central layer (1) one side outside or two ends lay respectively at central layer (1) both sides.
4. according to claim 1 or the high-power pcb board of 2 or 3 described embedded heavy currents, it is characterized in that said conductor structure spare (6) is a metallic conductor plate.
5. according to claim 1 or the high-power pcb board of 2 or 3 described embedded heavy currents, it is characterized in that said conductor structure spare (6) is formed by a plurality of metallic conductor plate mutual superposition, and isolate through insulating barrier between the adjacent two metallic conductor plates.
6. the high-power pcb board of embedded heavy current according to claim 1 is characterized in that said first prepreg (2) is made up of the multilayer prepreg.
7. the high-power pcb board of embedded heavy current according to claim 1 is characterized in that said second prepreg (3) is made up of the multilayer prepreg.
8. the manufacture method of the high-power pcb board of embedded heavy current is characterized in that specifically comprising step:
(1), on central layer, mills out hollow slots;
(2), the conductor structure spare fixed card that and thickness identical with above-mentioned hollow slots is not more than central layer with shape is embedded in the above-mentioned hollow slots;
(3), first copper foil layer is pressed together on the upper surface of central layer through first prepreg, second copper foil layer is pressed together on the lower surface of central layer through second prepreg;
(4), the good product of above-mentioned pressing is holed; And first copper foil layer, second copper foil layer carried out image transfer and graphic making; On copper foil layer, form the design circuit and satisfy part high-power and circuit control; Simultaneously the through hole that forms after the above-mentioned boring is carried out hole metallization and handle, obtain required hole wall copper thickness, again product is hindered weldering afterwards and make;
(5), on resistance postwelding product, need the corresponding position of bonding conductor structural member to carry out blind heavy hollow out, expose conductor structure spare and on this conductor structure spare, hole, form the wire guide that is connected with other connector of outside.
9. the manufacture method of the high-power pcb board of embedded heavy current according to claim 8 is characterized in that also comprising between step (1) and the step (2):
Conductor structure spare is carried out palm fibre/melanism to be handled.
10. the manufacture method of the high-power pcb board of embedded heavy current according to claim 8 is characterized in that also comprising after the step (5):
(6), above-mentioned wire guide being carried out hole metallization handles.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110049119A CN102123560B (en) | 2011-03-01 | 2011-03-01 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110049119A CN102123560B (en) | 2011-03-01 | 2011-03-01 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
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| CN102123560A CN102123560A (en) | 2011-07-13 |
| CN102123560B true CN102123560B (en) | 2012-10-03 |
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| CN101719604A (en) * | 2010-02-01 | 2010-06-02 | 曙光信息产业(北京)有限公司 | Connector for large-current transmission based on single circuit board |
| CN201928514U (en) * | 2011-03-01 | 2011-08-10 | 梅州博敏电子有限公司 | Embedded strong-current and large-power PCB (printed circuit board) |
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| US5672981A (en) * | 1994-09-16 | 1997-09-30 | At&T Global Information Solutions Company | Universal power interface adapter for burn-in board |
| CN1781347A (en) * | 2003-04-30 | 2006-05-31 | 日本压着端子制造株式会社 | Printed wiring board connection structure |
| CN101719604A (en) * | 2010-02-01 | 2010-06-02 | 曙光信息产业(北京)有限公司 | Connector for large-current transmission based on single circuit board |
| CN201928514U (en) * | 2011-03-01 | 2011-08-10 | 梅州博敏电子有限公司 | Embedded strong-current and large-power PCB (printed circuit board) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430922A (en) * | 2015-12-18 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Manufacturing method for embedding metal matrix into printed board |
| CN105430922B (en) * | 2015-12-18 | 2018-12-11 | 景旺电子科技(龙川)有限公司 | A kind of production method of printed board metal inlaying base |
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| Publication number | Publication date |
|---|---|
| CN102123560A (en) | 2011-07-13 |
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