CN102214776A - Light emitting diode package, lighting device and light emitting diode package substrate - Google Patents
Light emitting diode package, lighting device and light emitting diode package substrate Download PDFInfo
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- CN102214776A CN102214776A CN2011100931245A CN201110093124A CN102214776A CN 102214776 A CN102214776 A CN 102214776A CN 2011100931245 A CN2011100931245 A CN 2011100931245A CN 201110093124 A CN201110093124 A CN 201110093124A CN 102214776 A CN102214776 A CN 102214776A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.
Description
Technical field
The invention relates to a kind of light-emitting diode (Light-Emitting Diode, LED) encapsulation, lighting device and LED package substrate, and particularly relevant for a kind of package structure for LED, lighting device and LED package substrate with a plurality of connection pads.
Background technology
Light-emitting diode (Light-Emitting Diode, LED) belong to semiconductor element, the material of its luminescence chip mainly uses the compound of III-V family chemical element, for example gallium phosphide (GaP) or GaAs (GaAs), and its principle of luminosity is to convert electrical energy into luminous energy.Specifically, light-emitting diode is by applying electric current to compound semiconductor, to disengage with the form of light with the energy that combines surplus in electric hole by electronics.Because the luminescence phenomenon of light-emitting diode is not by adding thermoluminescence or Discharge illuminating, so the life-span of light-emitting diode reached more than 100,000 hours.In addition, light-emitting diode has more advantages such as reaction speed is fast, volume is little, power saving, low pollution, high-reliability, suitable volume production, so the field that light-emitting diode is used is very extensive, as the light source of large-scale billboard, traffic signal light, mobile phone, scanner, facsimile machine and light emitting diode illuminating apparatus etc.
Fig. 1 illustrates traditional package structure for LED 50, and it has a plurality of rectilinear (vertical type) light-emitting diode chip for backlight unit 52.Because two electrodes of vertical LED chip are disposed at the end face and the bottom surface of chip respectively, therefore solid brilliantly can't be one another in series in these chip 52 of connection pad 54, and respectively routing to connection pad 56 to carry out parallel connection, so drive current that need be bigger.In addition, under configuration mode as Fig. 1, the bonding wire 58 that is connected in a chip 52 can be crossed the top of another chip 52, and the luminous efficiency of package structure for LED 50 is decreased, and has the phenomenon that the bonding wire 58 than length might rupture and stay.
Summary of the invention
(Light-Emitting Diode, LED) encapsulating structure have better reliability degree and optical quality to the invention provides a kind of light-emitting diode.
The invention provides a kind of lighting device, its package structure for LED has better reliability degree and optical quality.
The invention provides a kind of optical diode base plate for packaging, make the package structure for LED that is provided with on it have better reliability degree and optical quality.
The present invention proposes a kind of package structure for LED, comprises LED package substrate, a plurality of first light-emitting diode chip for backlight unit, a plurality of second light-emitting diode chip for backlight unit and many bonding wires.LED package comprises substrate, first connection pad, a plurality of second connection pad and the 3rd connection pad with substrate.First connection pad is disposed in the substrate.Second connection pad is disposed in the substrate and is arranged in the array of n * (n-1), and wherein n is a positive integer, and the first connection pad arranged in proximity is in second connection pad of the 1st row of array.The 3rd connection pad be disposed in the substrate and arranged in proximity in the second capable connection pad of the n-1 of array, wherein second connection pad is disposed between first connection pad and second connection pad.First light-emitting diode chip for backlight unit is solid brilliant in first connection pad and respectively to being positioned at second connection pad of the 1st row that is arranged in array.Second light-emitting diode chip for backlight unit is solid respectively brilliant in second connection pad.Each first light-emitting diode chip for backlight unit is by second connection pad of a bonding wire routing to the correspondence of the 1st row that is arranged in array, each capable pairing second light-emitting diode chip for backlight unit of second connection pad of n-1 that is arranged in array passes through a bonding wire routing to the three connection pads, and the i that is arranged in array is capable and pairing second light-emitting diode chip for backlight unit of second connection pad of j row is capable to the i+1 that is arranged in array by a bonding wire routing and second connection pad of j row, wherein 1≤i≤n-2 and 1≤j≤n.
The present invention proposes a kind of lighting device, comprises pedestal and package structure for LED.Package structure for LED comprises LED package substrate, a plurality of first light-emitting diode chip for backlight unit, a plurality of second light-emitting diode chip for backlight unit and many bonding wires.LED package comprises substrate, first connection pad, a plurality of second connection pad and the 3rd connection pad with substrate.Substrate is disposed on the pedestal.First connection pad is disposed in the substrate.Second connection pad is disposed in the substrate and is arranged in the array of n * (n-1), and wherein n is a positive integer, and the first connection pad arranged in proximity is in second connection pad of the 1st row of array.The 3rd connection pad be disposed in the substrate and arranged in proximity in the second capable connection pad of the n-1 of array, wherein second connection pad is disposed between first connection pad and second connection pad.First light-emitting diode chip for backlight unit is solid brilliant in first connection pad and respectively to being positioned at second connection pad of the 1st row that is arranged in array.Second light-emitting diode chip for backlight unit is solid respectively brilliant in second connection pad.Each first light-emitting diode chip for backlight unit is by second connection pad of a bonding wire routing to the correspondence of the 1st row that is arranged in array, each capable pairing second light-emitting diode chip for backlight unit of second connection pad of n-1 that is arranged in array passes through a bonding wire routing to the three connection pads, and the i that is arranged in array is capable and pairing second light-emitting diode chip for backlight unit of second connection pad of j row is capable to the i+1 that is arranged in array by a bonding wire routing and second connection pad of j row, wherein 1≤i≤n-2 and 1≤j≤n.
The present invention proposes a kind of LED package substrate, comprises substrate, first connection pad, a plurality of second connection pad and the 3rd connection pad.First connection pad is disposed in the substrate.Second connection pad is disposed in the substrate and is arranged in the array of n * (n-1), and wherein n is a positive integer, and the first connection pad arranged in proximity is in second connection pad of the 1st row of array.The 3rd connection pad be disposed in the substrate and arranged in proximity in the second capable connection pad of the n-1 of array, wherein second connection pad is disposed between first connection pad and second connection pad.
In one embodiment of this invention, above-mentioned the 2nd row that are arranged in array to each second connection pad of n-1 row have for the second corresponding light-emitting diode chip for backlight unit carry out solid crystalline substance crystal bonding area, carry out the routing district of routing and the groove between crystal bonding area and routing district for corresponding bonding wire, the routing district that wherein is arranged in second connection pad of the capable and j row of the i+1 of array be positioned at the capable and j row of the i+1 that is arranged in array second connection pad crystal bonding area and be arranged between the crystal bonding area of capable and second connection pad that j is listed as of the i of array.
In one embodiment of this invention, above-mentioned each second connection pad that is arranged in the 1st row of this array have for the second corresponding light-emitting diode chip for backlight unit carry out solid crystalline substance crystal bonding area, carry out the routing district of routing and the groove between crystal bonding area and routing district for corresponding bonding wire, wherein crystal bonding area is in the routing district and be arranged between the 2nd second connection pad that is listed as of array.
In one embodiment of this invention, above-mentioned each second connection pad that is arranged in the n row of array have for the second corresponding light-emitting diode chip for backlight unit carry out solid crystalline substance crystal bonding area, carry out the routing district of routing and the groove between crystal bonding area and routing district for corresponding bonding wire, wherein crystal bonding area is in the routing district and be arranged between second connection pad that the n-1 of array is listed as.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
Fig. 1 is the vertical view of traditional a kind of package structure for LED.
Fig. 2 is the vertical view of the package structure for LED of one embodiment of the invention.
Fig. 3 is the partial perspective view of the package structure for LED of Fig. 2.
Fig. 4 is the vertical view of the LED package of Fig. 2 with substrate.
Fig. 5 is the end view of the package structure for LED of Fig. 2.
Fig. 6 is the upward view of the package structure for LED of Fig. 2.
Fig. 7 is the vertical view of the package structure for LED of another embodiment of the present invention.
Fig. 8 is the vertical view of the LED package of Fig. 7 with substrate.
[main element symbol description]
52: light-emitting diode chip for backlight unit
54,56: connection pad
58,140,340: bonding wire
60: lighting device
50,100,300: package structure for LED
110,310: the LED package substrate
112,312: substrate
112a: first surface
112b: second surface
114,314: the first connection pads
116,316: the second connection pads
116a, 316a: crystal bonding area
116b, 316b: routing district
116c, 316c: groove
118,318: the three connection pads
120,320: the first light-emitting diode chip for backlight unit
130,330: the second light-emitting diode chip for backlight unit
135: phosphor powder layer
150,350: lens
160: heat conductive pad
170: the first electrodes
180: the second electrodes
200: pedestal
Embodiment
Fig. 2 is the vertical view of the package structure for LED of one embodiment of the invention.Fig. 3 is the partial perspective view of the package structure for LED of Fig. 2.Fig. 4 is the vertical view of the LED package of Fig. 2 with substrate.Please refer to Fig. 2 to Fig. 4, the package structure for LED 100 of present embodiment comprises that LED package is with substrate 110, a plurality of first light-emitting diode chip for backlight unit 120 (illustrate is three), a plurality of second light-emitting diode chip for backlight unit 130 (illustrate is six) and many bonding wires 140 (illustrate is nine).LED package comprises substrate 112, first connection pad 114, a plurality of second connection pad 116 (illustrate is six) and the 3rd connection pad 118 with substrate 110.In one embodiment, substrate 112 has end face, and first connection pad 114 is disposed at the left area of the end face of substrate 112.The 3rd connection pad 118 is disposed at the zone, the right of the end face of substrate 112.Second connection pad 116 is disposed at the zone line of the end face of substrate 112.Second connection pad 116 is disposed between first connection pad 114 and the 3rd connection pad 118.In another embodiment, connection pad can be conductive electrode.In other embodiments, bonding wire can be electric wire.Substrate can be base plate (submount), carries seat (carrier) or circuit board.
Gu brilliant each first light-emitting diode chip for backlight unit 120 on first connection pad 114 is by bonding wire 140 routings or be electrically connected to second connection pad 116 of the correspondence of the 1st row that is arranged in the connection pad array.Each second connection pad, 116 pairing second light-emitting diode chip for backlight unit 130 of the 2nd row that are arranged in the connection pad array are by bonding wire 140 routings or be electrically connected to the 3rd connection pad 118.Second connection pad, 116 pairing second light-emitting diode chip for backlight unit 130 that are arranged in the 1st row of connection pad array and j row are by bonding wire 140 routings or be electrically connected to the 2nd row that is arranged in array and second connection pad 116 of j row.The scope of described j is decided to be 1≤j≤3.
Under configuration mode as package structure for LED 100, even first light-emitting diode chip for backlight unit 120 and second light-emitting diode chip for backlight unit 130 are rectilinear (illustrating to rectilinear), being arranged in second light-emitting diode chip for backlight unit 130 of same row of chip array and corresponding first light-emitting diode chip for backlight unit 120 can be by bonding wire 140 and connection pad series connection, to reduce the required drive current of package structure for LED 100.First light-emitting diode chip for backlight unit 120 electrically connects in the mode of connecting with second light-emitting diode chip for backlight unit 130.In addition, therefore the length of bonding wire 140 can shorten to avoid bonding wire 140 fractures, to stay and cross first light-emitting diode chip for backlight unit 120 and second light-emitting diode chip for backlight unit, 130 tops, to promote the reliability and the optical quality of package structure for LED 100.In one embodiment, LED package is used for load level formula (horizontal type) light-emitting diode chip for backlight unit with substrate 110.Described horizontal light-emitting diode chip for backlight unit comprises two electrodes that are positioned at its same surface.
Specifically, each second connection pad 116 have for the second corresponding light-emitting diode chip for backlight unit 130 carry out solid crystalline substance crystal bonding area 116a (being illustrated in Fig. 4), carry out the routing district 116b of routing and the groove 116c between crystal bonding area 116a and routing district 116b for corresponding bonding wire 140.By form groove 116c between crystal bonding area 116a and routing district 116b, the sealing that can avoid being used for each second light-emitting diode chip for backlight unit 130 is overflow glue to corresponding routing district 116b, so that each routing district 116b positively is electrically connected at corresponding bonding wire 140.
The routing district 116b of second connection pad 116 that is arranged in the 2nd row of connection pad array and the 2nd row is between the crystal bonding area 116b of the crystal bonding area 116b of second connection pad 116 of the 2nd row that is arranged in the connection pad array and the 2nd row and the 1st row that is arranged in the connection pad array and the 2nd second connection pad 116 that is listed as.The crystal bonding area 116a of second connection pad 116 of the 1st row that is arranged in the connection pad array is between the routing district 116b of second connection pad 116 of the 1st row that are arranged in the connection pad array and the 2nd second connection pad 116 that is listed as that is arranged in the connection pad array.The crystal bonding area 116a of second connection pad 116 of the 3rd row that is arranged in the connection pad array is between the routing district 116b of second connection pad 116 of the 3rd row that are arranged in the connection pad array and the 2nd second connection pad 116 that is listed as that is arranged in the connection pad array.By this, can really make each bonding wire 140 can not cross first light-emitting diode chip for backlight unit 120 and second light-emitting diode chip for backlight unit, 130 tops.
In addition, be different from the crystal bonding area 116a of the 2nd second connection pad 116 that is listed as that is positioned at the connection pad array and the relative position of routing district 116b owing to be positioned at the 1st row of connection pad array and the crystal bonding area 116a of the 3rd second connection pad 116 that is listed as and the relative position of routing district 116b, therefore the routing district 116b that is arranged in each second connection pad 116 of the 1st row of connection pad array and the 3rd row can be between two light-emitting diode chip for backlight unit, and be arranged in the routing district 116b of each second connection pad 116 of the 2nd row of connection pad array can be between two light-emitting diode chip for backlight unit.By this, first light-emitting diode chip for backlight unit 120 and second light-emitting diode chip for backlight unit 130 are concentrated on the middle section of substrate 112, and can dwindle the scope of the fluorescent material coating that package structure for LED 100 is carried out, to save manufacturing cost.In the 1st row of connection pad array, routing district 116b is positioned at the upside of crystal bonding area 116a.In the 3rd row of connection pad array, routing district 116b is positioned at the downside of crystal bonding area 116a.In the 2nd row of connection pad array, routing district 116b is positioned at the left side of crystal bonding area 116a.In one embodiment, in the 2nd row of connection pad array, routing district 116b can be configured in the right side of crystal bonding area 116a.
Please refer to Fig. 2 and Fig. 3, package structure for LED 100 more comprises lens 150, saturating border 150 covers first light-emitting diode chip for backlight unit 120 and second light-emitting diode chip for backlight unit 130, and the optical axis of second connection pad, 116 pairing second light-emitting diode chip for backlight unit 130 that is arranged in the 1st row of connection pad array and the 2nd row is to being positioned at the optical axis of lens 150.In other words, be arranged in the 2nd row of chip array and the 2nd row and the optical axis of light-emitting diode chip for backlight unit that is positioned at central authorities to being positioned at the optical axis of lens 150, so that package structure for LED 100 has better optical quality.In one embodiment, lens 150 can be the packing colloid that forms by pressing mold processing procedure (molding process).The material of lens 150 can be silicon (silicon).In one embodiment, package structure for LED 100 more comprises phosphor powder layer (phosphor layer) 135, phosphor powder layer 135 is disposed between light-emitting diode chip for backlight unit and the lens 150, to cover first light-emitting diode chip for backlight unit 120 and second light-emitting diode chip for backlight unit 130.Phosphor powder layer 135 can comprise yellow fluorescent powder, red fluorescence powder, green emitting phosphor or be selected from two the combination at least wherein of yellow fluorescent powder, red fluorescence powder and green emitting phosphor.
Fig. 5 is the end view of the package structure for LED of Fig. 2.Fig. 6 is the upward view of the package structure for LED of Fig. 2.Please refer to Fig. 3, Fig. 5 and Fig. 6, package structure for LED 100 more comprises heat conductive pad 160, at least one first electrode 170 (illustrate is two) and at least one second electrode 180 (illustrate is two).Substrate 112 has opposite first 112a and second surface 112b.In one embodiment, first surface 112a and second surface 112b can be respectively end face and bottom surface.Heat conductive pad 160 is disposed at second surface 112b.First electrode 170 is disposed at second surface 112b and the internal circuit by substrate 112, pin inserts (pin through hole) or connector (plug) is electrically connected at first connection pad 114.Second electrode 180 is disposed at second surface 112b and the internal circuit by substrate 112, pin inserts (pin through hole) or connector (plug) is electrically connected at the 3rd connection pad 118.
In the present embodiment, the material of substrate 112 is ceramic or other has the material that is electrically insulated of high-termal conductivity, is electrically connected to first connection pad 160 and second connection pad 170 to avoid heat conductive pad 160, and promotes the radiating efficiency of light-emitting diode 100.By heat conductive pad 160, first electrode 170 and second electrode 180 being disposed in the lump the second surface 112b of substrate 112, can dwindle the volume of package structure for LED 100 and simplify its processing procedure.The formation method of heat conductive pad 160, first electrode 170 and second electrode 180 is for example for electroplating (electroplating), electroless-plating (electroless plating), printing (printing) or other proper method.
Please refer to Fig. 5, package structure for LED 100 is disposed at the lighting device 60 that comprises package structure for LED 100 and pedestal 200 on the pedestal 200 with formation.Heat conductive pad 160 contact pedestals 60 with heat conduction that package structure for LED 100 is produced to pedestal 200.For instance, substrate 112 and heat conductive pad 160 are that (surface-mount technology SMT) is disposed at pedestal 200 by the surface stuck encapsulation.In one embodiment, pedestal 200 can be flexible circuit board (flexible circuit board, FCB) or printed circuit board (PCB) (printed circuit board, PCB).
In the present embodiment, first light-emitting diode chip for backlight unit 120 and second light-emitting diode chip for backlight unit 130 comprise two the combination at least wherein of white light emitting diode chip, blue LED chip, red light-emitting diode chip, green light LED chip or white light emitting diode chip, blue LED chip, red light-emitting diode chip and green light LED chip, so that lighting device 60 is suitable for sending white light or colourama.
The present invention does not limit the quantity of first light-emitting diode chip for backlight unit 120 and second light-emitting diode chip for backlight unit 130.Fig. 7 is the vertical view of the package structure for LED of another embodiment of the present invention.Fig. 8 is the vertical view of the LED package of Fig. 7 with substrate.Please refer to Fig. 7 and Fig. 8, the package structure for LED 300 of present embodiment comprises LED package substrate 310, a plurality of first light-emitting diode chip for backlight unit 320, a plurality of second light-emitting diode chip for backlight unit 330 and many bonding wires 340.LED package comprises substrate 312, first connection pad 314, a plurality of second connection pad 316 and one the 3rd connection pad 318 with substrate 310.In one embodiment, substrate 312 has end face, and first connection pad 314 is disposed at the left area of the end face of substrate 312.The 3rd connection pad 118 is disposed at the zone, the right of the end face of substrate 312.Second connection pad 316 is disposed at the zone line of the end face of substrate 312.Second connection pad 316 is disposed between first connection pad 314 and the 3rd connection pad 318.In another embodiment, connection pad can be conductive electrode.In other embodiments, bonding wire can be electric wire.Substrate can be base plate (submount), carries seat (carrier) or circuit board.
Each first light-emitting diode chip for backlight unit 320 is by bonding wire 340 routings or be electrically connected to second connection pad 316 of the correspondence of the 1st row that is arranged in the connection pad array.Be arranged in each capable second connection pad, 316 pairing second light-emitting diode chip for backlight unit 330 of the n-1 of connection pad array by bonding wire 340 routings or be electrically connected to the 3rd connection pad 318.Second connection pad, 316 pairing second light-emitting diode chip for backlight unit 330 that are arranged in the capable and j row of the i of connection pad array are by bonding wire 340 routings or be electrically connected to second connection pad 316 of the capable and j row of the i+1 that is arranged in the connection pad array.The scope of described i and j is decided to be 1≤i≤n-2 and 1≤j≤n.
Under configuration mode as package structure for LED 300, even first light-emitting diode chip for backlight unit 320 and second light-emitting diode chip for backlight unit 330 are rectilinear (illustrating to rectilinear), being arranged in second light-emitting diode chip for backlight unit 330 of same row of chip array and corresponding first light-emitting diode chip for backlight unit 320 can be by bonding wire 340 and connection pad series connection, to reduce the required drive current of package structure for LED 300.First light-emitting diode chip for backlight unit 320 electrically connects in the mode of connecting with second light-emitting diode chip for backlight unit 330.In addition, therefore the length of bonding wire 340 can shorten to avoid bonding wire 340 fractures, to stay and cross first light-emitting diode chip for backlight unit 320 and second light-emitting diode chip for backlight unit, 330 tops, to promote the reliability and the optical quality of package structure for LED 300.In one embodiment, LED package is used for load level formula (horizontal type) light-emitting diode chip for backlight unit with substrate 310.Described horizontal light-emitting diode chip for backlight unit comprises two electrodes that are positioned at its same surface.
Specifically, each second connection pad 316 have for the second corresponding light-emitting diode chip for backlight unit 330 carry out solid crystalline substance crystal bonding area 316a (being illustrated in Fig. 8), carry out the routing district 316b of routing and the groove 316c between crystal bonding area 316a and routing district 316b for corresponding bonding wire 340.By form groove 316c between crystal bonding area 316a and routing district 316b, the sealing that can avoid being used for each second light-emitting diode chip for backlight unit 330 is overflow glue to corresponding routing district 316b, so that each routing district 316b positively is electrically connected at corresponding bonding wire 340.
Be arranged between the crystal bonding area 316b of the crystal bonding area 316b of second connection pad 316 of the routing district 316b of second connection pad 316 of the capable and j row of the i+1 of connection pad array and j row capable and second connection pad 316 that j is listed as capable, wherein 1≤i≤n-2 and 1≤j≤n with the i that is arranged in the connection pad array at the i+1 that is arranged in the connection pad array.The crystal bonding area 316a of second connection pad 316 of the 1st row that is arranged in the connection pad array is between the routing district 316b of the 1st row that are arranged in the connection pad array and the 2nd second connection pad 316 that is listed as that is arranged in the connection pad array.The crystal bonding area 316a of second connection pad 316 of n row that is arranged in the connection pad array is between second connection pad 316 that the routing district 316b of the n row that are arranged in the connection pad array and the n-1 that is arranged in the connection pad array are listed as.By this, can really make each bonding wire 340 can not cross first light-emitting diode chip for backlight unit 320 and second light-emitting diode chip for backlight unit, 330 tops.
In addition, be different from the crystal bonding area 316a of second connection pad 316 that the 2nd row that are positioned at the connection pad array are listed as to n-1 and the relative position of routing district 316b owing to be positioned at the relative position of crystal bonding area 316a and routing district 316b of second connection pad 316 of the 1st row of connection pad array and n row, therefore the routing district 316b that is arranged in each second connection pad 316 of the 1st row of connection pad array and n row can be between two light-emitting diode chip for backlight unit, and the 2nd row that are arranged in the connection pad array to the routing district 316b of each second connection pad 316 of n-1 row can be between two light-emitting diode chip for backlight unit.By this, first light-emitting diode chip for backlight unit 320 and second light-emitting diode chip for backlight unit 330 are concentrated on the middle section of substrate 312, and can dwindle the scope of the fluorescent material coating that package structure for LED 300 is carried out, to save manufacturing cost.In the 1st row of connection pad array, routing district 316b is positioned at the upside of crystal bonding area 316a.In the n of connection pad array row, routing district 316b is positioned at the downside of crystal bonding area 316a.In the 2nd row of connection pad array were listed as to n-1, routing district 316b was positioned at the left side of crystal bonding area 316a.In one embodiment, in the 2nd row of connection pad array were listed as to n-1, routing district 316b can be configured in the right side of crystal bonding area 316a.
Please refer to Fig. 7, package structure for LED 300 more comprises lens 350, saturating border 350 covers first light-emitting diode chip for backlight unit 320 and second light-emitting diode chip for backlight unit 330, and the optical axis of second connection pad, 316 pairing second light-emitting diode chip for backlight unit 330 that is arranged in (n-1)/2 row of connection pad array and (n+1)/2 row is to being positioned at the optical axis of lens 350.In other words, be arranged in (n-1)/2 row of chip array and (n+1)/2 row and the optical axis of light-emitting diode chip for backlight unit that is positioned at central authorities to being positioned at the optical axis of lens 350, so that package structure for LED 300 has better optical quality.In one embodiment, lens 350 can be the packing colloid that forms by pressing mold processing procedure (molding process).The material of lens 350 can be silicon (silicon).In one embodiment, package structure for LED 300 more comprises phosphor powder layer (phosphor layer), and phosphor powder layer is disposed between light-emitting diode chip for backlight unit and the lens, to cover first light-emitting diode chip for backlight unit 320 and second light-emitting diode chip for backlight unit 330.Phosphor powder layer can comprise yellow fluorescent powder, red fluorescence powder, green emitting phosphor or be selected from two the combination at least wherein of yellow fluorescent powder, red fluorescence powder and green emitting phosphor.
Package structure for LED 300 more comprises heat conductive pad, at least one first electrode and at least one second electrode.Substrate 312 has opposite first and second surface.In one embodiment, first surface and second surface can be respectively end face and bottom surface.Heat conductive pad is disposed at second surface.First electrode is disposed at second surface and the internal circuit by substrate 312, pin inserts (pin through hole) or connector (plug) is electrically connected at first connection pad 314.Second electrode is disposed at second surface and the internal circuit by substrate 312, pin inserts (pin through hole) or connector (plug) is electrically connected at the 3rd connection pad 318.
In the present embodiment, the material of substrate 312 is ceramic or other has the material that is electrically insulated of high-termal conductivity, is electrically connected to first connection pad and second connection pad to avoid heat conductive pad, and promotes the radiating efficiency of light-emitting diode 300.By heat conductive pad, first electrode and second electrode being disposed in the lump the second surface of substrate 312, can dwindle the volume of package structure for LED 300 and simplify its processing procedure.The formation method of heat conductive pad, first electrode and second electrode is for example for electroplating (electroplating), electroless-plating (electroless plating), printing (printing) or other proper method.
The package structure for LED 300 configurable lighting devices that on pedestal, comprise package structure for LED and pedestal with formation.Heat conductive pad contact pedestal with heat conduction that package structure for LED 300 is produced to pedestal.For instance, substrate 312 and heat conductive pad are that (surface-mount technology SMT) is disposed at pedestal by the surface stuck encapsulation.In one embodiment, pedestal can be flexible circuit board (flexible circuit board, FCB) or printed circuit board (PCB) (printed circuit board, PCB).
In the present embodiment, first light-emitting diode chip for backlight unit 320 and second light-emitting diode chip for backlight unit 330 comprise two the combination at least wherein of white light emitting diode chip, blue LED chip, red light-emitting diode chip, green light LED chip or white light emitting diode chip, blue LED chip, red light-emitting diode chip and green light LED chip, so that lighting device is suitable for sending white light or colourama.
In one embodiment, above-mentioned package structure for LED more can be applied on automobile-used illumination, TV and the products such as display backlight module, room lighting, outdoor lighting and billboards.
In one embodiment, except n is capable, be arranged in the light-emitting diode chip for backlight unit of the 2nd row to the n-1 row, the light-emitting diode chip for backlight unit routing on the left side is to the routing district, left side in small electrode zone, the small electrode zone has the right side crystal bonding area, and the light-emitting diode chip for backlight unit on right side is solid brilliant in the right side crystal bonding area.Channel shaped is formed between the routing district, left side and right side crystal bonding area in small electrode zone.
In one embodiment, except n was capable, at the light-emitting diode chip for backlight unit that is arranged in the 1st row, the light-emitting diode chip for backlight unit routing on the left side was to the upside routing district in small electrode zone, the small electrode zone has the downside crystal bonding area, and the light-emitting diode chip for backlight unit on right side is solid brilliant in the downside crystal bonding area.Channel shaped is formed between the upside routing district and downside crystal bonding area in small electrode zone.
In one embodiment, except n was capable, at the light-emitting diode chip for backlight unit that is arranged in the n row, the light-emitting diode chip for backlight unit routing on the left side was to the downside routing district in small electrode zone, the small electrode zone has the upside crystal bonding area, and the light-emitting diode chip for backlight unit on right side is solid brilliant in the upside crystal bonding area.Channel shaped is formed between the downside routing district and upside crystal bonding area in small electrode zone.
In sum, package structure for LED of the present invention has a plurality of second connection pads, and second connection pad is arranged in array and between the first and the 3rd connection pad.Even first and second light-emitting diode chip for backlight unit is rectilinear, second light-emitting diode chip for backlight unit and the first corresponding light-emitting diode chip for backlight unit that are arranged in the same row of array can be connected by bonding wire, to reduce the required drive current of package structure for LED.In addition, therefore the length of bonding wire can shorten to avoid the bonding wire fracture, to stay and cross the light-emitting diode chip for backlight unit top, to promote the reliability and the optical quality of package structure for LED.In addition, by forming groove between crystal bonding area and routing district, the sealing that can avoid being used for each second light-emitting diode chip for backlight unit is overflow glue to corresponding routing district, so that each routing district positively is electrically connected at corresponding bonding wire.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the invention; when doing a little change and retouching, so protection scope of the present invention is worked as with being as the criterion that claim was defined.
Claims (11)
1. package structure for LED comprises:
One LED package substrate comprises:
One substrate;
One first connection pad is disposed in this substrate;
A plurality of second connection pads are disposed in this substrate and are arranged in the array of a n * (n-1), and wherein n is a positive integer, and this first connection pad arranged in proximity is in those second connection pads of the 1st row of this array; And
One the 3rd connection pad, be disposed in this substrate and arranged in proximity in those capable second connection pads of the n-1 of this array, wherein those second connection pads are disposed between this first connection pad and this second connection pad;
Gu a plurality of first light-emitting diode chip for backlight unit are brilliant in this first connection pad and respectively to being positioned at those second connection pads of the 1st row that is arranged in this array;
A plurality of second light-emitting diode chip for backlight unit, solid respectively brilliant in those second connection pads; And
A plurality of bonding wires, respectively this first light-emitting diode chip for backlight unit is by second connection pad of a bonding wire routing to this correspondence of the 1st row that is arranged in this array, capable pairing this second light-emitting diode chip for backlight unit of respectively this second connection pad of n-1 that is arranged in this array passes through a bonding wire routing to the 3rd connection pad, and the i that is arranged in this array is capable and pairing this second light-emitting diode chip for backlight unit of this second connection pad of j row is capable to the i+1 that is arranged in this array by a bonding wire routing and this second connection pad of j row, wherein 1≤i≤n-2 and 1≤j≤n.
2. package structure for LED as claimed in claim 1, it is characterized in that, the 2nd row that are arranged in this array to respectively this second connection pad of n-1 row has one first crystal bonding area that carries out solid crystalline substance for second light-emitting diode chip for backlight unit of this correspondence, carry out the one first routing district and one first groove between this first crystal bonding area and this first routing district of routing for this corresponding bonding wire, this first routing district that wherein is arranged in this second connection pad of the capable and j row of the i+1 of this array be positioned at the capable and j row of the i+1 that is arranged in this array this second connection pad this first crystal bonding area and be arranged between this first crystal bonding area of capable and this second connection pad that j is listed as of the i of this array;
Respectively this second connection pad that wherein is arranged in the 1st row of this array have second light-emitting diode chip for backlight unit for this correspondence carry out solid crystalline substance one second crystal bonding area, carry out one second routing district of routing and one second groove between this second crystal bonding area and this second routing district for this corresponding bonding wire, wherein those second crystal bonding areas are in those second routing districts and be arranged between the 2nd those second connection pads that are listed as of this array; And
Respectively this second connection pad that wherein is arranged in the n row of this array have for second light-emitting diode chip for backlight unit of this correspondence carry out solid crystalline substance one the 3rd crystal bonding area, carry out one the 3rd routing district of routing and one the 3rd groove between the 3rd crystal bonding area and the 3rd routing district for this corresponding bonding wire, wherein those the 3rd crystal bonding areas are in those the 3rd routing districts and be arranged between those second connection pads that the n-1 of this array is listed as.
3. package structure for LED as claimed in claim 1, it is characterized in that, more comprise lens, cover those first light-emitting diode chip for backlight unit and those second light-emitting diode chip for backlight unit, wherein n is an odd number, and an optical axis of pairing this second light-emitting diode chip for backlight unit of this second connection pad that is arranged in (n-1)/2 row of this array and (n+1)/2 row is to being positioned at an optical axis of these lens.
4. package structure for LED as claimed in claim 1 is characterized in that, more comprises a phosphor powder layer, covers those first light-emitting diode chip for backlight unit and those second light-emitting diode chip for backlight unit.
5. package structure for LED as claimed in claim 1, it is characterized in that, this substrate has a relative first surface and a second surface, this first connection pad, those second connection pads and the 3rd connection pad are disposed at this first surface of this substrate, and wherein this package structure for LED more comprises:
One heat conductive pad is disposed at this second surface;
At least one first electrode is disposed at this second surface and is electrically connected at this first connection pad; And
At least one second electrode is disposed at this second surface and is electrically connected at the 3rd connection pad.
6. lighting device comprises:
One pedestal; And
One package structure for LED comprises:
One LED package substrate comprises:
One substrate is disposed on this pedestal;
One first connection pad is disposed in this substrate;
A plurality of second connection pads are disposed in this substrate and are arranged in the array of a n * (n-1), and wherein n is a positive integer, and this first connection pad arranged in proximity is in those second connection pads of the 1st row of this array; And
One the 3rd connection pad, be disposed in this substrate and arranged in proximity in those capable second connection pads of the n-1 of this array, wherein those second connection pads are disposed between this first connection pad and this second connection pad;
Gu a plurality of first light-emitting diode chip for backlight unit are brilliant in this first connection pad and respectively to being positioned at those second connection pads of the 1st row that is arranged in this array
A plurality of second light-emitting diode chip for backlight unit, solid respectively brilliant in those second connection pads; And
A plurality of bonding wires, respectively this first light-emitting diode chip for backlight unit is by second connection pad of a bonding wire routing to this correspondence of the 1st row that is arranged in this array, capable pairing this second light-emitting diode chip for backlight unit of respectively this second connection pad of n-1 that is arranged in this array passes through a bonding wire routing to the 3rd connection pad, and the i that is arranged in this array is capable and pairing this second light-emitting diode chip for backlight unit of this second connection pad of j row is capable to the i+1 that is arranged in this array by a bonding wire routing and this second connection pad of j row, wherein 1≤i≤n-2 and 1≤j≤n.
7. lighting device as claimed in claim 6, it is characterized in that, the 2nd row that are arranged in this array to respectively this second connection pad of n-1 row has one first crystal bonding area that carries out solid crystalline substance for second light-emitting diode chip for backlight unit of this correspondence, carry out the one first routing district and one first groove between this first crystal bonding area and this first routing district of routing for this corresponding bonding wire, this first routing district that wherein is arranged in this second connection pad of the capable and j row of the i+1 of this array be positioned at the capable and j row of the i+1 that is arranged in this array this second connection pad this first crystal bonding area and be arranged between this first crystal bonding area of capable and this second connection pad that j is listed as of the i of this array;
Respectively this second connection pad that wherein is arranged in the 1st row of this array have second light-emitting diode chip for backlight unit for this correspondence carry out solid crystalline substance one second crystal bonding area, carry out one second routing district of routing and one second groove between this second crystal bonding area and this second routing district for this corresponding bonding wire, wherein those second crystal bonding areas are in those second routing districts and be arranged between the 2nd those second connection pads that are listed as of this array; And
Respectively this second connection pad that wherein is arranged in the n row of this array have for second light-emitting diode chip for backlight unit of this correspondence carry out solid crystalline substance one the 3rd crystal bonding area, carry out one the 3rd routing district of routing and one the 3rd groove between the 3rd crystal bonding area and the 3rd routing district for this corresponding bonding wire, wherein those the 3rd crystal bonding areas are in those the 3rd routing districts and be arranged between those second connection pads that the n-1 of this array is listed as.
8. lighting device as claimed in claim 6, it is characterized in that, this package structure for LED more comprises lens, cover those first light-emitting diode chip for backlight unit and those second light-emitting diode chip for backlight unit, wherein n is an odd number, and an optical axis of pairing this second light-emitting diode chip for backlight unit of this second connection pad that is arranged in (n-1)/2 row of this array and (n+1)/2 row is to being positioned at an optical axis of these lens.
9. lighting device as claimed in claim 6 is characterized in that this package structure for LED more comprises a phosphor powder layer, covers those first light-emitting diode chip for backlight unit and those second light-emitting diode chip for backlight unit.
10. lighting device as claimed in claim 6, it is characterized in that, this substrate has a relative first surface and a second surface, and this first connection pad, those second connection pads and the 3rd connection pad are disposed at this first surface of this substrate, and wherein this package structure for LED more comprises:
One heat conductive pad is disposed at this second surface and contacts this pedestal;
One first electrode is disposed at this second surface and is electrically connected at this first connection pad; And
One second electrode is disposed at this second surface and is electrically connected at the 3rd connection pad.
11. a LED package substrate comprises:
One substrate;
One first connection pad is disposed in this substrate;
A plurality of second connection pads are disposed in this substrate and are arranged in the array of a n * (n-1), and wherein n is a positive integer, and this first connection pad arranged in proximity is in those second connection pads of the 1st row of this array; And
One the 3rd connection pad, be disposed in this substrate and arranged in proximity in those capable second connection pads of the n-1 of this array, wherein those second connection pads are between this first connection pad and the 3rd connection pad;
The 2nd row that wherein are arranged in this array to respectively this second connection pad of n-1 row has one first crystal bonding area, one first routing district and one first groove between this first crystal bonding area and this first routing district, this first routing district that wherein is arranged in this second connection pad of the capable and j row of the i+1 of this array be positioned at the capable and j row of the i+1 that is arranged in this array this second connection pad this first crystal bonding area and be arranged between this first crystal bonding area of capable and this second connection pad that j is listed as of the i of this array;
Respectively this second connection pad that wherein is arranged in the 1st row of this array has one second crystal bonding area, one second routing district and one second groove between this second crystal bonding area and this second routing district, and wherein those second crystal bonding areas are in those second routing districts and be arranged between the 2nd those second connection pads that are listed as of this array;
Respectively this second connection pad that wherein is arranged in the n row of this array has one the 3rd crystal bonding area, one the 3rd routing district and one the 3rd groove between the 3rd crystal bonding area and the 3rd routing district, and wherein those the 3rd crystal bonding areas are in those the 3rd routing districts and be arranged between those second connection pads that the n-1 of this array is listed as.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| US32230910P | 2010-04-09 | 2010-04-09 | |
| US61/322,309 | 2010-04-09 | ||
| US13/078,933 | 2011-04-02 | ||
| US13/078,933 US8492777B2 (en) | 2010-04-09 | 2011-04-02 | Light emitting diode package, lighting device and light emitting diode package substrate |
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| CN102214776A true CN102214776A (en) | 2011-10-12 |
| CN102214776B CN102214776B (en) | 2013-05-01 |
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| CN2011100931245A Expired - Fee Related CN102214776B (en) | 2010-04-09 | 2011-04-08 | Light emitting diode package, lighting device and light emitting diode package substrate |
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