CN102233594A

CN102233594A - Cutter

Info

Publication number: CN102233594A
Application number: CN201010172558XA
Authority: CN
Inventors: 黄俊钦; 朱青松; 黄明玉
Original assignee: Advanced Semiconductor Engineering Inc
Current assignee: Advanced Semiconductor Engineering Inc
Priority date: 2010-05-07
Filing date: 2010-05-07
Publication date: 2011-11-09
Anticipated expiration: 2030-05-07
Also published as: CN102233594B

Abstract

The invention provides a cutter which is suitable for cutting work-pieces put on a photo-curing glue layer. The cutter comprises a main body, a cutting layer and light radiation material, wherein the cutting layer is configured on the surface of the main body and used for cutting the work-pieces; the light radiation material is arranged in the cutting layer or between the cutting layer and the main body and used for releasing light when the cutting layer cuts the work-pieces, so that the photo-curing glue layer close to a cutting path is cured by the light. The cutter provided by the invention can be used for lowering probability of reduction of cutting ability because viscous substances are adhered on the surface of the cutter.

Description

Cutter

Technical field

The present invention relates to a kind of cutter, and particularly relate to a kind of cutter that is placed in the workpiece on the photocuring glue-line that is suitable for cutting.

Background technology

In known tube core bonding process, the tube core after the cutting utilizes the epoxy resin cement to be fixedly arranged on the base plate for packaging.Yet along with die thickness and base plate for packaging are more and more thinner, the epoxy resin cement is replaced by diaphragm type sticker (adhesive film).The diaphragm type cement has frivolous uniform characteristic, can improve shortcoming such as the contingent tube core inclination of institute and the glue that overflows in the known tube core bonding process.

Particularly, shape and the size adhesion coating identical with wafer can be pasted on the back side of wafer, wherein wafer is milled in advance and has expection thickness, and afterwards, adhesion coating can together be cut with wafer.

When adhesion coating and wafer together were cut, the chip that produces from adhesion coating was built-up in cutter easily, and the smear metal meeting is attached to the adhesion coating surface, therefore causes follow-up chip to fit not exclusively.

Summary of the invention

The invention provides a kind of cutter, can reduce that tool surface attaches stickum and the probability that causes cutting power to descend.

The present invention proposes a kind of cutter, is suitable for cutting the workpiece that is placed on the photocuring glue-line.Cutter comprises main body, cutting lay and light emission material.Cutting lay is disposed at body surfaces, in order to cut workpiece.The light emission material configuration is in cutting lay or be disposed between cutting lay and the main body, in order to discharge light when the cutting lay cut workpiece, to solidify the photocuring glue-line of contiguous cutting path by light.

In an embodiment of the present invention, above-mentioned light emission material sends ultraviolet light.

In an embodiment of the present invention, above-mentioned light emission material comprises zinc-oxide nano coating.

In an embodiment of the present invention, above-mentioned light emission material comprises gold or platinum in addition.

In an embodiment of the present invention, above-mentioned light emission material configuration is between main body and cutting lay.

In an embodiment of the present invention, above-mentioned cutting lay comprises diamond grains.

In an embodiment of the present invention, above-mentioned main body is discoid, and light emission material and cutting lay are disposed on the circumference of disk-shaped main body.

In an embodiment of the present invention, above-mentioned light emission is material doped in this cutting lay.

Based on above-mentioned, cutter of the present invention disposes the light emission material, and when the cutting lay of cutter cut being placed in workpiece on the optic-solidified adhesive layer, the photocuring glue-line of contiguous cutting path can be solidified by the light that the light emission material radiates.Thus, the stickum that can reduce the photocuring glue-line is built-up in the probability of cutter, to keep the cutting power of cutter.

For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. is described in detail below.

Description of drawings

Fig. 1 is the schematic diagram of the cutter of the embodiment of the invention.

Fig. 2 A is the partial schematic diagram of the cutter cut workpiece of Fig. 1.

Fig. 2 B is the partial side view of the cutter of Fig. 2 A along visual angle A.

Fig. 3 A to Fig. 3 C is the making flow chart of the cutter of Fig. 1.

Fig. 4 A is the schematic diagram of the cutter of another embodiment of the present invention.

Fig. 4 B is the schematic diagram of the cutter cut workpiece of Fig. 4 A.

Fig. 5 A to Fig. 5 B is the making flow chart of the cutter of Fig. 4.

Description of reference numerals

50: photocurable layers

60: workpiece

70: bearing part

100,200: cutter

110,210: main body

120,220: cutting lay

140: the light emission material

230: the light emission material

A: visual angle

D: direction

L, L ': light

P: cutting path

The specific embodiment

Fig. 1 is the schematic diagram of the cutter of the embodiment of the invention.Please refer to Fig. 1, the cutter 100 of present embodiment comprises main body 110, cutting lay 120, light emission material 140.Cutting lay 120 is disposed at main body 110 surfaces, is placed in workpiece 60 on the photocuring glue-line 50 in order to cutting.Light emission material 140 is disposed between main body 110 and the cutting lay 120, and light emission material 140 for example comprises nano-deposit.In certain embodiments, nano-deposit can comprise gold or platinum in addition, improves the efficient of nano-deposit emitting ultraviolet light thus.Photocuring glue-line 50 for example is to be disposed on the bearing part 70 (for example being the adhesive tape (blue tape) that is positioned on the steel framework (not being shown among the figure)), and workpiece 60 for example is a wafer to be cut.In the present embodiment, the material of photocuring glue-line 50 for example is epoxy resin or other photo-curing materials.

The main body 110 of present embodiment for example is discoid, and light emission material 140 and cutting lay 120 are disposed on the circumference of disk-shaped main body 110.In addition, cutting lay 120 for example is made up of diamond grains, however the present invention not as limit, cutting lay 120 also can be made up of other suitable material in other embodiments.

Fig. 2 A is the partial schematic diagram of the cutter cut workpiece of Fig. 1.Fig. 2 B is the partial side view of the cutter of Fig. 2 A along visual angle A.Please refer to Fig. 2 A and Fig. 2 B, cutter 100 can cut with 120 pairs of workpiece 60 of mat cutting lay along direction D fast rotational.When workpiece 60 was cut to state shown in Fig. 2 B by cutter 100 and makes cutter 100 near photocuring glue-line 50, the light L that light emission material 140 is discharged can solidify the photocuring glue-line 50 of contiguous cutting path P.Thus, the stickum that can reduce photocuring glue-line 50 is built-up in the probability of the cutting lay 120 of cutter 100 in cutting process, to keep the cutting power of cutter 100.

Material character that it should be noted that intensity, wavelength and the photocuring glue-line 50 of the light that the state of cure of photocuring glue-line 50 and solidification range are discharged on light emission material 140 is decided.Therefore, visual demand is selected suitable photocuring glue-line 50 and light emission material 140, and the light that photocuring glue-line 50 is discharged by light emission material 140 has suitable state of cure and solidification range when shining.

Specifically, the light emission material 140 included nano-deposits of present embodiment for example are Nano-class zinc oxide (ZnO) coating, its fermi level (Fermi level) is between the 60meV, and its bandwidth (energy bandgap) is about between the 3.3eV, therefore can radiate ultraviolet light under room temperature environment, for example be the photocuring glue-line 50 of ultraviolet light polymerization glue-line in order to solidify.

Below pass through the preparation method of the cutter of Fig. 3 A to Fig. 3 C key diagram 1.

Fig. 3 A to Fig. 3 C is the making flow chart of the cutter of Fig. 1.Please refer to Fig. 3 A, at first, provide discoid main body 110.Then, please refer to Fig. 3 B, as light emission material 140, for example see through electrochemical deposition (electrochemical deposition) technology at main body 110 surface coating zinc-oxide nano coating.In certain embodiments, gold or platinum can be deposited on main body 110 surfaces simultaneously and form gold-zinc oxide or platinum-zinc-oxide nano coating, in order to improve the ultraviolet light emission efficiency.Afterwards, please refer to Fig. 3 C, at main body 110 surface configuration cutting lays 120, make light emission material 140 between main body 110 and cutting lay 120, and finish the making of cutter 100.Referring to the thesis for the doctorate " with the characteristic research of electrochemical process depositing zinc oxide " of Du Huaifu, it incorporates this case into as a reference at this.

Fig. 4 A is the schematic diagram of the cutter of another embodiment of the present invention.Fig. 4 B is the schematic diagram of the cutter cut workpiece of Fig. 4 A.Please refer to Fig. 4 A and Fig. 4 B, compared to Fig. 1 light emission material 140 is disposed between main body 110 and the cutting lay 120, the light emission material 230 of the cutter 200 of present embodiment is to be doped in the cutting lay 220.When 220 pairs of workpiece 60 of the cutting lay that is disposed at main body 210 surfaces cut, but light emission material 230 ray L ' are to solidify the photocuring glue-line 50 of contiguous Cutting Road, and the stickum that reduces photocuring glue-line 50 is built-up in the probability of cutting lay 220 in cutting process, to keep the cutting power of cutter 200.Below pass through the preparation method of the cutter of Fig. 5 A to Fig. 5 C key diagram 4.

Fig. 5 A to Fig. 5 B is the making flow chart of the cutter of Fig. 4.Please refer to Fig. 5 A, at first, provide discoid main body 210.Then, please refer to Fig. 5 B, on the circumference of disk-shaped main body 210, form cutting lay 220, and when forming cutting lay 220, doping light emission material 230 in cutting lay 220.Wherein, light emission material 230 is doped in the method for cutting lay 220, for example, see through electrochemical deposition (electrochemical deposition) technology light emission material 230 (for example zinc-oxide nano coating) is coated between the cutting particle for when the cutting particle that will constitute cutting lay 220 is coated main body 210 surfaces.Described cutting particle for example is a diamond grains.

In sum, cutter of the present invention disposes the light emission material, and when the cutting lay of cutter cut being placed in workpiece on the optic-solidified adhesive layer, the photocuring glue-line of contiguous cutting path can be solidified by the light that the light emission material radiates.Thus, the stickum that can reduce the photocuring glue-line is built-up in the probability of cutter, to keep the cutting power of cutter.In addition, can mix gold or platinum in the nano-deposit of light emission material, to improve the beamy efficient of light emission material.

Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; those of ordinary skill in the technical field under any; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention defines and is as the criterion when looking appended claim.

Claims

1. a cutter is suitable for cutting the workpiece that is placed on the photocuring glue-line, and this cutter comprises:

Main body;

Cutting lay is disposed at this body surfaces, in order to cut this workpiece; And

The light emission material is disposed in this cutting lay or is disposed between this cutting lay and this main body, in order to discharge light when this cutting lay cuts this workpiece, to solidify this photocuring glue-line of vicinity cutting path by this light.

2. cutter as claimed in claim 1, wherein this light emission material sends ultraviolet light.

3. cutter as claimed in claim 1, wherein this light emission material comprises zinc-oxide nano coating.

4. cutter as claimed in claim 3, wherein this light emission material comprises gold or platinum in addition.

5. cutter as claimed in claim 1, wherein this light emission material configuration is between this main body and this cutting lay.

6. cutter as claimed in claim 1, wherein this cutting lay comprises diamond grains.

7. cutter as claimed in claim 1, wherein this main body is discoid, and this light emission material and this cutting lay are disposed on the circumference of this disk-shaped main body.

8. cutter as claimed in claim 7, wherein this light emission is material doped in this cutting lay.