CN102306648A - Optical coupler - Google Patents
Optical coupler Download PDFInfo
- Publication number
- CN102306648A CN102306648A CN201110241303A CN201110241303A CN102306648A CN 102306648 A CN102306648 A CN 102306648A CN 201110241303 A CN201110241303 A CN 201110241303A CN 201110241303 A CN201110241303 A CN 201110241303A CN 102306648 A CN102306648 A CN 102306648A
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- Prior art keywords
- lead frame
- end lead
- infrared
- photosensitive
- optical coupler
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 33
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 238000005538 encapsulation Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 abstract description 16
- 238000002347 injection Methods 0.000 abstract description 13
- 239000007924 injection Substances 0.000 abstract description 13
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 230000005693 optoelectronics Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000700608 Sagitta Species 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
The invention relates to a photoelectric element, especially to an optical coupler, which is also known as a photoisolator or an optoelectronic coupler or is called an optocoupler for short. According to the invention, a lead frame of an optical coupler falls into an infrared end lead frame and a photosensitive end lead frame; planes of glass sliding areas of the infrared end lead frame and the photosensitive end lead frame are perpendicular to a plane of the lead frame; infrared light emitting elements are installed on the infrared end lead frame and photosensitive elements are installed on the photosensitive end lead frame; the infrared end lead frame and the photosensitive end lead frame are fixed on a same plane and there is an enough insulation distance between the infrared end lead frame and the photosensitive end lead frame; the photosensitive elements directly face the infrared light emitting elements; outer surfaces of the glass sliding areas of the infrared end lead frame and the photosensitive end lead frame are cladded with transparent colloids, which are in ellipse shapes; and the infrared end lead frame, the photosensitive end lead frame and the transparent colloids are wrapped with a packaging shell tube. According to the invention, the optical coupler not only has good insulation and pressure resistant performances that a reflective optocoupler has, but also has a high photoelectric conversion efficiency that a direct-injection optocoupler has; besides, a CTR value is convenient for control.
Description
Technical field
The present invention relates to the photoelectricity element, especially photoelectrical coupler (opticalcoupler, english abbreviation are OC) is also claimed photoisolator or photoelectrical coupler, or is called for short optocoupler.
Background technology
Optical coupler is to be the device that media comes transmission of electric signals with light, is encapsulated in photophore (infrarede emitting diode chip) and light-receiving device (photosensor chip) in the same shell usually.Photophore emits beam when input adds the signal of telecommunication, and light-receiving device is accepted just to produce photoelectric current after the light, flows out from output, changes thereby realized " electricity-light-".Optocoupler mainly contains two kinds of production methods at present: the one, and reflective, the 2nd, direct-injection type.
Consult shown in Fig. 9 a and Fig. 9 b, reflective is through interior glue, and some transparent adhesive tape and white glues form ellipsoid, and the infrared light reflection that makes infrared chip emission is to the photosensor chip place, thus accomplish electric=light=electric control procedure.This technology mode can be accomplished very high dielectric voltage withstand; But shortcoming is the HFE (current amplification factor of triode) of power, photosensor chip except that infrared chip; Factor affecting CTR values such as interior some glue shape, height (the CTR value is meant the minimum value of current ratio of electric current and the receiving tube of luminous tube) have also been increased; Therefore the CTR value is difficult to accurate control, and can't accomplish very high CTR value and very short time parameter.
Consult shown in Figure 10 a and Figure 10 b; Direct-injection type is that lead frame is divided into two parts; Adorn infrared chip and photosensor chip respectively; And then fixed coupling encapsulates together, and two lead frame planes are parallel, and the slide glass district of infrared end lead frame and the slide glass district of photosensitive end lead frame are aspectant.This mode need not coat white colloid because be direct projection, and CTR is convenient to control, is convenient to accomplish high CTR value.But owing to be aspectant, count the spun gold sagitta in, the thickness of two chips, the thickness of two lead frames has reached or near 1.5mm, the insulation distance of infrared end and photosensitive end receives the restriction of optocoupler height overall, and dielectric voltage withstand can't be accomplished very high; And the required precision to lead frame is very high, and the difficulty that technology realizes is bigger.
Summary of the invention
Therefore; The present invention is directed to the weak point of these 2 kinds of optocouplers, and propose a kind of improved optical coupler structure, not only possess the good dielectric voltage withstand performance of conventional reflective optocoupler; It is high also to possess simultaneously Japanese direct-injection type optocoupler photoelectric conversion efficiency, the advantage that the CTR value is convenient to control.
The technical scheme that the present invention adopts is:
The lead frame of optical coupler is divided into infrared end lead frame and photosensitive end lead frame; The plane in the slide glass district of infrared end lead frame and photosensitive end lead frame is all vertical with lead frame, and the slide glass district of infrared end lead frame can be plane or cup-shaped, and the slide glass district of photosensitive end lead frame can be plane or cup-shaped; Infrared end lead frame is installed infrared light-emitting component; Photosensitive end lead frame is installed light-sensitive element, and infrared end lead frame and photosensitive end lead frame are fixed in same plane, and leave enough insulation distances; And the light-sensitive element light accepting part then carries out a glue and encapsulation over against the infrared light-emitting component setting.That is, cover the transparent colloid of an elliptical shape outside the slide glass district of infrared end lead frame and photosensitive end lead frame, infrared end lead frame and photosensitive end lead frame outerwrap one encapsulation shell.
Wherein, described infrared end lead frame and photosensitive end lead frame are expert at and are fixed in same plane before a glue and the encapsulation, and leave enough insulation distances, and photosensor chip to remain unchanged over against the state of infrared chip setting be to realize through moulds of industrial equipment.
Further, described light-sensitive element can be photistor, photosensitive Darlington transistor, photosensitive thyristor or photosensitive IC chip.
Optical coupler of the present invention is with the difference of existing reflective optocoupler: structurally; Existing reflective optocoupler is that infrared light-emitting component and light-sensitive element are contained on the same lead frame; Putting transparent colloid then forms the ellipsoid shape and outside transparent colloid, coats the white size body; Two photoelectric cells are in two focuses of spheroid respectively, and the infrared light of infrared light-emitting component emission converges to the light-sensitive element light receiving area through the reflection of white colloid.And the present invention is divided into two parts with lead frame, adorns infrared light-emitting component and light-sensitive element respectively, and then with two parts lead frame through frock be fixed together a transparent colloid and parcel outer package shell.The present invention structurally, infrared light-emitting component and light-sensitive element over against, therefore the infrared light overwhelming majority all can be transmitted into the light-sensitive element light accepting part, on photoelectric conversion efficiency, on response speed, all will be superior to reflective optocoupler greatly.And saved white glues colloid shape and highly to the influence of photoelectric conversion efficiency,, can improve the controllability of CTR value and the shelves rate for photistor output type optocoupler.
Optical coupler of the present invention is with the difference of existing direct-injection type optocoupler: the slide glass district of existing direct-injection type two parts lead frame is parallel with lead frame; After respectively photoelectric cell being installed; Two lead frames are fixed through the coupling of frock; Place, parallel surface opposite transparent colloid and parcel outer package shell have guaranteed that also light-sensitive element is over against infrared light-emitting component simultaneously.And the slide glass district of two parts lead frame is vertical with lead frame among the present invention, and cup-shaped can be made by the slide glass district of two parts lead frame.After respectively photoelectric cell being installed, utilize frock that two parts lead frame is fixed in same plane and light-sensitive element over against infrared light-emitting component (perpendicular to the fixed pan of lead frame) some transparent colloid and parcel outer package shell.The present invention plays the effect of optically focused owing to the design that can do a cup-shaped in the slide glass district of two parts lead frame more, and therefore more Japanese direct-injection type optocoupler can be higher on the infrared light efficiency of transmission; The present invention can be through the adjustment of lead frame; Regulate the insulation distance between two parts; The dielectric voltage withstand value can be accomplished very high, and Japanese direct-injection type optocoupler is owing to receive the restriction of space (optocoupler height overall), and the dielectric voltage withstand value can't be accomplished very high (especially for miniature optocoupler); Japanese direct-injection type is owing to exist the overlapping coupling on the level between two parts lead frame; Therefore to the precision of lead frame; The requirement of technology is all than higher, and two parts lead frame of the present invention only is to place some transparent colloid and parcel outer package shell on the same plane, does not have overlapping coupling each other; Therefore in the lead frame required precision, technology realizes all being lower than Japanese direct-injection type optocoupler on the difficulty.
To sum up, optical coupler of the present invention not only possesses the good dielectric voltage withstand performance of reflective optocoupler, and it is high also to possess direct-injection type optocoupler photoelectric conversion efficiency simultaneously, the advantage that the CTR value is convenient to control.
Description of drawings
Fig. 1 is the structural representation of photosensitive end lead frame.
Fig. 2 is the structural representation of infrared end lead frame.
Fig. 3 is that a pair of photosensitive end lead frame and infrared end lead frame fixed-site concern sketch map.
Fig. 4 is the upward view of the photosensitive end lead frame among Fig. 3.
Fig. 5 is the vertical view of the infrared end lead frame among Fig. 3.
Fig. 6 is the sketch map that a pair of photosensitive end lead frame and infrared end lead frame are installed photoelectric cell.
Fig. 7 is the sketch map of a pair of photosensitive end lead frame and infrared end lead frame point transparent colloid and parcel outer package shell.
Fig. 8 is the left view of Fig. 7.
Fig. 9 a is the structural representation of existing reflective optocoupler.
The existing reflective optocoupler encapsulation back of Fig. 9 b is along the cutaway view of A-A.
Figure 10 a is the structural representation of existing direct-injection type optocoupler.
The existing direct-injection type optocoupler encapsulation back of Figure 10 b is along the cutaway view of A-A.
Embodiment
Combine accompanying drawing and embodiment that the present invention is further specified at present.Although the slide glass district of the slide glass district of infrared end lead frame and photosensitive end lead frame all can be cup-shaped or plane in the claim of the present invention; But following instance is a cup-shaped with the slide glass district of infrared end lead frame only, and the slide glass district of photosensitive end lead frame is that the plane describes.
Consult illustrated in figures 1 and 2; The lead frame of optical coupler is divided into infrared end lead frame 2 and photosensitive end lead frame 1; An infrared end lead frame of row or a photosensitive end lead frame formed in a plurality of infrared end lead frame unit or photosensitive end lead frame unit, after encapsulation manufacturing is accomplished, carries out being separated into the independent entry device towards the lead frame pin again.
For the convenience of explaining, following embodiment only explains with a pair of photosensitive end lead frame and infrared end lead frame.
Consult Fig. 3, shown in Figure 4, the plane in the slide glass district 11 of photosensitive end lead frame 1 is all vertical with the plane of its pin 12, and the slide glass district 11 of photosensitive end lead frame 1 is the plane.Consult Fig. 3, shown in Figure 5, the plane in the slide glass district 21 of infrared end lead frame 2 is all vertical with the plane of its pin 22, and the slide glass district 21 of infrared end lead frame 2 is structures of cup-shaped.
Consult shown in Figure 6ly, at photosensitive end lead frame and infrared end lead frame photoelectric cell is installed respectively again, light-sensitive elements 3 are installed, infrared light-emitting components 4 are installed in the slide glass district 21 of infrared end lead frame 2 in the slide glass district 11 of photosensitive end lead frame 1.Described light-sensitive element 3 can be photistor, photosensitive Darlington transistor, photosensitive thyristor or photosensitive IC chip.Described infrared light-emitting component 4 can be the infrared LED chip.
Consult Fig. 7 and shown in Figure 8; Infrared end lead frame 2 is fixed in same plane with photosensitive end lead frame 1; And leave enough insulation distances, guarantee that promptly the slide glass district 11 of photosensitive end lead frame 1 and the slide glass district 21 of infrared end lead frame 2 have an insulation distance, and the slide glass district 21 of the slide glass district 11 of photosensitive end lead frame 1 and infrared end lead frame 2 is right opposite settings; Thereby realize that light-sensitive element 3 is provided with over against infrared light-emitting component 4; Then put transparent colloid and parcel outer package shell again, i.e. the transparent colloid 5 of null ellipse shape, and they all are encapsulated in inside with encapsulating shell 6.In order to guarantee that described infrared end lead frame 2 and photosensitive end lead frame 1 are fixed in same plane before a transparent colloid and parcel outer package shell; And leave enough insulation distances; And light-sensitive element remains unchanged over against the state of infrared light-emitting component setting; Realize through moulds of industrial equipment in the operation, infrared end lead frame 2 and the corresponding lead frame groove that photosensitive end lead frame 1 is positioned over moulds of industrial equipment are got final product.About the structure of the moulds of industrial equipment of anchor leg framework, be those skilled in the art's technological means on top of, launch explanation no longer in detail for the moulds of industrial equipment structure.Like this, the fixing stability and the consistency that can improve infrared end lead frame 2 and photosensitive end lead frame 1 stationary state through moulds of industrial equipment than manual operation, improves and makes efficient.
Like this; When electric current passes through the infrared light-emitting component 4 of optical coupler of the present invention; Infrared light-emitting component 4 emission infrared lights; Through the focussing force of the cup-like structure in the slide glass district 21 of infrared end lead frame 2, infrared light converge to basically over against the plane in slide glass district 11 of photosensitive end lead frame 1 on the light accepting part of light-sensitive element 3, make light-sensitive element 3 get into operating states.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; But the those skilled in the art should be understood that; In the spirit and scope of the present invention that do not break away from appended claims and limited; Can make various variations to the present invention in form with on the details, be protection scope of the present invention.
Claims (5)
1. optical coupler, it is characterized in that: the lead frame of optical coupler is divided into infrared end lead frame and photosensitive end lead frame, and the plane in the slide glass district of infrared end lead frame and photosensitive end lead frame is all vertical with lead frame; Infrared light-emitting component is installed in the slide glass district of infrared end lead frame, and light-sensitive element is installed in the slide glass district of photosensitive end lead frame; Infrared end lead frame and photosensitive end lead frame are fixed in same plane, and leave enough insulation distances, and light-sensitive element then carries out a glue and encapsulation over against infrared chip setting.
2. optical coupler according to claim 1 is characterized in that: the slide glass district of described infrared end lead frame can be cup-shaped or plane.
3. optical coupler according to claim 1 is characterized in that: the slide glass district of described photosensitive end lead frame can be cup-shaped or plane.
4. according to claim 1 or 2 or 3 described optical couplers, it is characterized in that: described light-sensitive element can be photistor, photosensitive Darlington transistor, photosensitive thyristor or photosensitive IC chip.
5. optical coupler according to claim 1; It is characterized in that: described infrared end lead frame and photosensitive end lead frame be expert at a glue with the encapsulation before be fixed in same plane; And leave enough insulation distances, and photosensor chip to remain unchanged over against the state of infrared chip setting be to realize through moulds of industrial equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110241303 CN102306648B (en) | 2011-08-22 | 2011-08-22 | Optical coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110241303 CN102306648B (en) | 2011-08-22 | 2011-08-22 | Optical coupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102306648A true CN102306648A (en) | 2012-01-04 |
| CN102306648B CN102306648B (en) | 2013-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110241303 Active CN102306648B (en) | 2011-08-22 | 2011-08-22 | Optical coupler |
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| Country | Link |
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| CN (1) | CN102306648B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730456A (en) * | 2014-01-07 | 2014-04-16 | 苏州承源光电科技有限公司 | High-pressure-resistant photoelectric coupler |
| CN107370484A (en) * | 2017-06-26 | 2017-11-21 | 西安微电子技术研究所 | A kind of Infra red photo electric device transfer ratio adjusting method |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN109301028A (en) * | 2018-09-20 | 2019-02-01 | 西安微电子技术研究所 | A kind of one-time formed plastic packaging photoelectrical coupler production method |
| CN112397495A (en) * | 2020-11-18 | 2021-02-23 | 珠海市大鹏电子科技有限公司 | High-sensitivity miniaturized photoelectric coupler and high-sensitivity processing method thereof |
| CN114141760A (en) * | 2022-01-06 | 2022-03-04 | 北京华芯微半导体有限公司 | Soft package photoelectric coupler method and soft package photoelectric coupler |
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| US6270712B1 (en) * | 1998-02-09 | 2001-08-07 | Sharp Kabushiki Kaisha | Molding die and marking method for semiconductor devices |
| US20030138219A1 (en) * | 2000-11-03 | 2003-07-24 | O'toole Michael M. | Optoelectric module for multi-fiber arrays |
| CN101582420A (en) * | 2009-06-26 | 2009-11-18 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with built-in reflective cup |
| CN201549509U (en) * | 2009-06-26 | 2010-08-11 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with internal reflective cup |
-
2011
- 2011-08-22 CN CN 201110241303 patent/CN102306648B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6270712B1 (en) * | 1998-02-09 | 2001-08-07 | Sharp Kabushiki Kaisha | Molding die and marking method for semiconductor devices |
| US20030138219A1 (en) * | 2000-11-03 | 2003-07-24 | O'toole Michael M. | Optoelectric module for multi-fiber arrays |
| CN101582420A (en) * | 2009-06-26 | 2009-11-18 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with built-in reflective cup |
| CN201549509U (en) * | 2009-06-26 | 2010-08-11 | 哈尔滨海格科技发展有限责任公司 | Focusing infrared receiver with internal reflective cup |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730456A (en) * | 2014-01-07 | 2014-04-16 | 苏州承源光电科技有限公司 | High-pressure-resistant photoelectric coupler |
| CN103730456B (en) * | 2014-01-07 | 2017-02-08 | 苏州承源光电科技有限公司 | High-pressure-resistant photoelectric coupler |
| CN107370484A (en) * | 2017-06-26 | 2017-11-21 | 西安微电子技术研究所 | A kind of Infra red photo electric device transfer ratio adjusting method |
| CN107370484B (en) * | 2017-06-26 | 2020-06-09 | 西安微电子技术研究所 | Transmission ratio adjusting method for infrared photoelectric coupler |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN109301028A (en) * | 2018-09-20 | 2019-02-01 | 西安微电子技术研究所 | A kind of one-time formed plastic packaging photoelectrical coupler production method |
| CN112397495A (en) * | 2020-11-18 | 2021-02-23 | 珠海市大鹏电子科技有限公司 | High-sensitivity miniaturized photoelectric coupler and high-sensitivity processing method thereof |
| CN112397495B (en) * | 2020-11-18 | 2023-11-07 | 珠海市大鹏电子科技有限公司 | High-sensitivity miniaturized photoelectric coupler and high-sensitivity processing method thereof |
| CN114141760A (en) * | 2022-01-06 | 2022-03-04 | 北京华芯微半导体有限公司 | Soft package photoelectric coupler method and soft package photoelectric coupler |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102306648B (en) | 2013-05-15 |
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Address after: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee after: XIAMEN HUALIAN ELECTRONICS Corp.,Ltd. Address before: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee before: XIAMEN HUALIAN ELECTRONICS Co.,Ltd. |
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Effective date of registration: 20231109 Address after: Room 208-93, Hengye Building, No. 100 Xiangxing Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Patentee after: Xiamen Hualian Semiconductor Technology Co.,Ltd. Address before: 361000 Hualian electronic building, torch hi tech Industrial Development Zone, Fujian, Xiamen Patentee before: XIAMEN HUALIAN ELECTRONICS Corp.,Ltd. |