CN102323451A - A kind of method and device that detects interconnection solder joint electric migration performance - Google Patents
A kind of method and device that detects interconnection solder joint electric migration performance Download PDFInfo
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- CN102323451A CN102323451A CN201110142828A CN201110142828A CN102323451A CN 102323451 A CN102323451 A CN 102323451A CN 201110142828 A CN201110142828 A CN 201110142828A CN 201110142828 A CN201110142828 A CN 201110142828A CN 102323451 A CN102323451 A CN 102323451A
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Abstract
The present invention relates to a kind of method and device that detects interconnection solder joint electric migration performance; This device comprises base plate; The upper and lower clamping plate that are used for the clamping lead solder-joint; Be used to compress the pressing plate and the power connection at lead-in wire two ends, said upper and lower clamping plate and pressing plate all are fixed on the base plate, and said power connection is electrically connected with pressing plate; This method is meant brazing filler metal alloy and metal lead wire processed docks solder joint, and then loading current, and current density is 10
3-10
5A/cm
2, temperature 75-175 ℃, through detecting the growth change speed of interconnection solder joint changes in resistance or welding point interface IMC, whether superior the electric migration performance of solder joint is thereby qualitative explanation interconnects.The present invention is simple, with low cost, and current-crowding effect and the thermophoresis effect that not only can avoid flip-chip to bring can also be controlled the overall resistance of empirical model through regulating wire length, thereby reach the purpose of regulating weld point temperature.
Description
Technical field
The invention belongs to technical field of electronic encapsulation, relate generally to the method that electronic package reliability detects, particularly the detection method of electronic package interconnections solder joint electric migration performance.
Background technology
At electronic product to today that direction microminiaturized, multifunction develops; The IC packaging density constantly increases; The size of package interconnect solder joint is more and more littler, and current density that solder joint bears and solder joint working temperature sharply raise, and causes the inner ELECTROMIGRATION PHENOMENON that produces of solder joint.ELECTROMIGRATION PHENOMENON be since the high density electron stream continue with solder joint in atom carry out the atomic migration phenomenon that inelastic collision causes.The electromigration meeting causes the interconnect growth and the defectives such as dissolving, grain coarsening of solder joint generation convexity and cavity, interface compound, thereby causes damage of welding spot structure integrality and mechanical property degradation.ELECTROMIGRATION PHENOMENON has become a major challenge of electronic package reliability, is the big obstacle that electronic product continues to advance.
Along with coming into force of the plumbous decrees of a series of taboos such as " electronics and IT products pollution control management ways " of " RoHS " instruction of European Union promulgation and the promulgation of China Ministry of Information Industry; Traditional Sn-Pb solder is withdrawn from the market gradually, and electronic product unleaded become basic development trend.The unleaded development of electronic product makes the research of electronic package interconnections solder joint electric migration performance become complicated more, and Sn-Ag, Sn-Cu, Sn-Ag-Cu brazing filler metal interconnection solder joint and Sn-Zn, Sn-Bi brazing filler metal interconnection solder joint show the electromigration characteristic of fully opposite (the growth differentiation of interface I MC and loading current direction).Especially under present stage various novel electron solders situation about emerging in an endless stream, how to find a kind of simple and effective way detects or the electric migration performance of assessment interconnection solder joint just seems very important.
The way a kind of commonly used of interconnection solder joint electric migration performance research at present is to adopt flip-chip, but flip-chip but has itself unsurmountable defective.Because flip-chip its specific structure and geometric configuration make flip-chip inhomogeneous in solder joint internal current Density Distribution in galvanization, there is current-crowding effect, the big 2-3 order of magnitude of the current density ratio average current density of porch.The uneven distribution of current density is very disadvantageous for research interconnection solder joint electric migration performance.Moreover chip loads after the high electric current, and thermal value is very big.Because the material at interconnection solder joint two ends is different, temperature conductivity and coefficient of heat transfer have very big difference, make interconnection solder joint two ends have thermograde.When thermograde reaches certain value, also can cause the thermophoresis effect, this brings many disturbing factors with regard to the research of giving interconnection solder joint electric migration performance.
Summary of the invention
One of the object of the invention is to detect the difficulty that is run into assessment in order to overcome present electronic package interconnections solder joint electric migration performance; A kind of device that detects the electric migration performance of various interconnection solder joints is provided, and that this device is made is simple, with low cost, be easy to promote.
Two of the object of the invention provides the method that detects with said apparatus.
The object of the invention is realized through following technical scheme:
A kind of device that detects interconnection solder joint electric migration performance; Comprise base plate, be used for the upper and lower clamping plate of clamping lead solder-joint, be used to compress the pressing plate and the power connection at lead-in wire two ends; Said upper and lower clamping plate and pressing plate all are fixed on the base plate, and said power connection is electrically connected with pressing plate.
Preferably, said pressing plate is dull and stereotyped, and material is a fine copper.
Preferably, said train wheel bridge is dull and stereotyped, and said lower plate has the V-type groove of clamping lead-in wire usefulness.
Preferably, said upper and lower clamping plate surface all is coated with insulation course, is used for preventing the electric current shunting.
Preferably, this device also comprises the thermopair that is used to measure weld point temperature, and said thermopair is embedded in the interior position near solder joint of lower plate.
Method with said apparatus detection interconnection solder joint electric migration performance comprises the steps:
(1) lead solder-joint to be measured is put into the V-type groove of lower plate, between last lower plate, applied one deck heat conductive silica gel, after train wheel bridge and pressing plate are fixing, the two ends energized of lead solder-joint to be measured;
(2) overall length of size through regulating clamping plate and lead-in wire cooperates the current density 10 that reaches preset with the institute loading current
3-10
5A/cm
2, temperature 75-175 ℃, begin electromigration performance test then.
When the high predetermined temperature of low current density, because the solder joint thermal value is not enough, weld point temperature is lower, can the retained part except that power supply be put into Homothermal Proof Box, and the temperature of chamber is made as predetermined temperature.If when requiring high electric current low temperature, can on train wheel bridge, cooperate with radiator fan by outer radiation fin, the increase rate of heat dispation is to reach predetermined temperature.
Preferably, said electromigration performance test is the change in voltage through on-line monitoring lead solder-joint two ends, obtains the resistance variations of lead solder-joint, the required time of sudden change of resistivity occurs through the record solder joint, records the electromigration lifetime of interconnection solder joint.
Preferably, said electromigration performance test is a growth change of analyzing welding point interface IMC through section, obtains the growth rate of welding point interface IMC, thereby judges the electric migration performance of interconnection solder joint.
Preferably, the preparation method of said lead solder-joint to be measured is: lead solder-joint to be measured adopts the butt joint form, and going between is that metal enamel conductor, diameter are 0.3-1.0mm, and its outside surface has one deck insullac, and insullac can play the effect of resistance weldering in the process of soldering.Enameled wire is cut into before the soldering lead-in wire of certain-length (30-50mm), tens of lead-in wires banded together the end that lead-in wire is used for soldering grind.Utilize low power (* 100) microscopic examination after the grinding, it is smooth and be used for soldering with the lead-in wire of copper lead-in wire axis normal and be connected to choose end face.Get in the V-type groove that ready lead-in wire is placed on brazing jig, wherein one compresses with press strip, and another root is alignd with it, utilize clearance gauge to confirm the joint clearance of brazing after fastening nut compress press strip.Solder to be measured is placed the commissure, add corresponding scaling powder and carry out the soldering connection.Sample after the soldering carefully grinds with sand paper and abrasive pastes butt welding point surface, till the circumference profile alignment that goes between with copper until the solder joint surface is concordant.Adopt the lead solder-joint of method for preparing, its detection has better effect.
It is detection model that the present invention adopts lead-in wire butt joint solder joint, replaces Solder Joint in Flip Chip.This method is simple and reliable, be easy to realize, with low cost; Current-crowding effect and the thermophoresis effect that not only can avoid flip-chip to bring; Can also control the overall resistance of empirical model through regulating wire length, thereby reach the purpose of regulating weld point temperature.Adopt clamping plate as heat sink, can regulate heat dissipation capacity through changing the clamping plate size on the one hand, the control weld point temperature, thereby in a wider context near the actual working state of various interconnection solder joints; Can also control the influence of the thermal stress that produces owing to the metal lead wire thermal deformation through compressing heat sink.
Description of drawings
Fig. 1 pick-up unit general structure synoptic diagram;
Fig. 2 Sample chuck synoptic diagram;
Fig. 3 lower plate and sample assembling synoptic diagram.
Embodiment
Below in conjunction with specific embodiment the present invention is done further concrete detailed description the in detail, but embodiment of the present invention is not limited thereto.
Embodiment 1
A kind of device that detects interconnection solder joint electric migration performance; Comprise base plate 3, be used for the upper and lower clamping plate 11,12 of clamping lead solder-joint, be used to compress the last lower platen 5,6 of lead-in wire left end; Compress the last lower platen 13,14 of lead-in wire right-hand member; Thermopair 10 and power connection 4, said upward lower plate 11,12 and pressing plate all are fixed on the base plate 3, and said power connection 4 is electrically connected with pressing plate.Said pressing plate is dull and stereotyped, and material is a fine copper.Said train wheel bridge is dull and stereotyped, and said lower plate has the V-type groove of clamping lead-in wire usefulness.The outside surface of said upper and lower clamping plate all is coated with insulation course.Said thermopair is embedded in the interior position near solder joint of lower plate, is used to measure weld point temperature.
It is fine copper, the nickel enameled wire of 0.4mm that the present invention adopts diameter respectively, and brazing filler metal alloy is Sn-3.5Ag, processes Cu/Sn-3.5Ag/Cu and Ni/Sn-3.5Ag/Ni lead-in wire butt joint solder joint.The enameled wire outside surface has one deck insullac, and insullac can play the effect of resistance weldering in brazing process.Before the soldering enameled wire is cut out the long lead-in wire of 40mm, then tens of lead-in wires are banded together the lead-in wire brazed end is ground.Utilize low power (* 100) microscopic examination after the grinding, it is smooth and be connected with the soldering that is used for of copper lead-in wire axis normal to choose section.As shown in Figure 2, get in the V-type groove that ready lead-in wire is placed on brazing jig 17, wherein lead-in wire 91 usefulness first press strip 16 compresses, and another root lead-in wire 93 is alignd with it, utilize clearance gauge to confirm the joint clearance of brazing after fastening nut compress second press strip 18.Solder 92 to be measured is placed the commissure, add corresponding scaling powder and carry out the soldering connection.Sample after the soldering carefully grinds with sand paper and abrasive pastes butt welding point surface, till the circumference profile alignment of solder joint outside surface and copper lead-in wire is concordant, and the lead solder-joint to be measured 9 of system thus.
Above-mentioned ready lead solder-joint 9 is put into the V-type groove of lower plate 11, apply one deck heat conductive silica gel between the last lower plate, lead solder-joint 9 is pushed down, be fixed in again on the base plate 3 with train wheel bridge 12.Wipe the insullac of lead terminal then off, clamp lead terminal with the last lower platen 5,6 in left side and the last lower platen 13,14 on right side respectively, be fixed to again on the base plate 3.Insert constant current source 1 through power connection 4, slowly be adjusted to required electric current.After treating temperature stabilization, measure weld point temperature by pre-buried thermopair 10.Regulating lead-in wire overall length and clamping plate size then, is 5.16 * 10 to reach loading current density
4A/cm
2, 150 ℃ of predetermined temperatures.
Detect the solder joint resistance variations through shunt voltage table 2 in the experimentation, record needed time of sudden change of resistivity, the electromigration lifetime of measurement interconnection solder joint.The result finds that Cu/Sn-3.5Ag/Cu and Ni/Sn-3.5Ag/Ni interconnection solder joint the required time of sudden change of resistivity occurs and is respectively 49h and 45h, explain that under the situation of high current density, high temperature bond pad surface plating Ni can not improve the electric migration performance of the solder joint that interconnects.
Embodiment 2
The difference of present embodiment and embodiment 1 is:
1) adopting diameter is the enameled wire of 0.3mm, and brazing filler metal alloy is Sn-3.8Ag-0.7Cu, processes Ni/Sn-3.8Ag-0.7Cu/Au lead-in wire butt joint solder joint.
2) loading current density is 1 * 10
5A/cm
2, the retained part (except that power supply, voltage table) of experimental provision is put into Homothermal Proof Box, temperature is controlled at 170 ℃.
3) detect the solder joint resistance variations through the shunt voltage table, find that sudden change appears in energising 95h resistance, its electromigration lifetime is four times of Sn-38Pb solder under the same case.
Embodiment 3
The difference of present embodiment and embodiment 1 is:
1) adopting diameter is the fine copper enameled wire of 0.5mm, and brazing filler metal alloy is Sn-58Bi, processes Cu/Sn-58Bi/Cu lead-in wire butt joint solder joint.
2) loading current density is 2 * 10
4A/cm
2,, can experimental temperature be controlled at 125 ℃ through adjustable clamp board size and lead-in wire overall length.
3) detect the solder joint resistance variations through the shunt voltage table, find that sudden change appears in energising 150h resistance, its electromigration lifetime is three times of Sn-Pb solder under the same case.
Embodiment 4
The difference of present embodiment and embodiment 1 is:
1) adopting diameter is the fine copper enameled wire of 0.6mm, and brazing filler metal alloy is Sn-3.0Ag-0.5Cu, processes Cu/Sn-3.0Ag-0.5Cu/Cu lead-in wire butt joint solder joint.
2) loading current density is 1.78 * 10
4A/cm
2, through adjustable clamp board size and lead-in wire overall length, can be with the experimental temperature regulation and control at 100 ℃.
3) being set the load time respectively is 30h, 60h, 120h, 200h, and through the growth change of section analysis welding point interface IMC, the growth rate that obtains welding point interface IMC is 9.2 * 10
-6μ m/s, the growth rate of its interface I MC is 0.6 times of Sn-9Zn solder under the same terms.Explanation is under such condition, and the electric migration performance of Sn-3.0Ag-0.5Cu interconnection solder joint is superior to Sn-9Zn interconnection solder joint.
Embodiment 5
The difference of present embodiment and embodiment 1 is:
1) adopting diameter is the fine copper enameled wire of 1.0mm, and brazing filler metal alloy is Sn-3.0Ag-0.5Cu, processes Cu/Sn-3.0Ag-0.5Cu/Cu lead-in wire butt joint solder joint.
2) current density is 6.82 * 10
3A/cm
2,, experimental temperature is controlled at 75 ℃ through adjustable clamp board size and lead-in wire overall length and heat radiator and radiator fan.
3) detect the solder joint resistance variations through the shunt voltage table, find that sudden change appears in energising 3547h resistance, its electromigration lifetime is the twice of Sn-58Bi solder under the same case.
The foregoing description is a preferred implementation of the present invention; But embodiment of the present invention is not restricted to the described embodiments; Other any do not deviate from change, the modification done under spirit of the present invention and the principle, substitutes, combination, simplify; All should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (9)
1. device that detects interconnection solder joint electric migration performance; It is characterized in that; This device comprises base plate, is used for the upper and lower clamping plate of clamping lead solder-joint, is used to compress the pressing plate and the power connection at lead-in wire two ends; Said upper and lower clamping plate and pressing plate all are fixed on the base plate, and said power connection is electrically connected with pressing plate.
2. device according to claim 1 is characterized in that, said pressing plate is dull and stereotyped, and material is a fine copper.
3. device according to claim 1 and 2 is characterized in that, said train wheel bridge is dull and stereotyped, and said lower plate has the V-type groove of clamping lead-in wire usefulness.
4. device according to claim 3 is characterized in that, said upper and lower clamping plate surface all is coated with insulation course.
5. device according to claim 4 is characterized in that this device also comprises the thermopair that is used to measure weld point temperature, and said thermopair is embedded in the interior position near solder joint of lower plate.
6. the method with the said device detection of claim 1～5 interconnection solder joint electric migration performance is characterized in that, comprises the steps:
(1) lead solder-joint to be measured is put into the V-type groove of lower plate, between last lower plate, applied one deck heat conductive silica gel, after train wheel bridge and pressing plate are fixing, the two ends energized of lead solder-joint to be measured;
(2) overall length of size through regulating clamping plate and lead-in wire cooperates the current density 10 that reaches preset with the institute loading current
3-10
5A/cm
2, temperature 75-175 ℃, begin electromigration performance test then.
7. method according to claim 6; It is characterized in that said electromigration performance test is the change in voltage through on-line monitoring lead solder-joint two ends, obtain the resistance variations of lead solder-joint; The required time of sudden change of resistivity occurs through the record solder joint, record the electromigration lifetime of interconnection solder joint.
8. method according to claim 6 is characterized in that, said electromigration performance test is a growth change of analyzing welding point interface IMC through section, obtains the growth rate of welding point interface IMC, thereby judges the electric migration performance of interconnection solder joint.
9. method according to claim 6; It is characterized in that the preparation method of said lead solder-joint to be measured is: adopt open joint, going between is metal enamel conductor; Diameter is 0.3-1.0mm, before the soldering lead-in wire brazed end need polish to section smooth and with the lead-in wire axis normal; Outside face to lead solder-joint after the soldering grinds, till the circumference profile line flush of solder joint outside surface and copper lead-in wire.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102768332A (en) * | 2012-06-28 | 2012-11-07 | 工业和信息化部电子第五研究所 | Real-time online monitoring system of electromigration warning circuit |
| CN103884928A (en) * | 2012-12-21 | 2014-06-25 | 中国科学院金属研究所 | Microelectronic product reliability test platform under force electrothermal multi-field coupling effect |
| CN103962680A (en) * | 2014-04-13 | 2014-08-06 | 北京工业大学 | Soldered joint electromigration experiment device |
| CN105606647A (en) * | 2016-03-23 | 2016-05-25 | 华南理工大学 | Device and method for detecting thermal migration performance of interconnected welding spots |
| CN106680694A (en) * | 2017-01-19 | 2017-05-17 | 重庆科技学院 | Experimental device of micro linear solder joints electromigration |
| CN107063891A (en) * | 2017-04-10 | 2017-08-18 | 河南科技大学 | It is a kind of to be used for the device and method of electromigration under thermoelectricity Composite Field |
| CN107097012A (en) * | 2017-05-05 | 2017-08-29 | 北京工业大学 | A kind of crystal grain is orientated consistent banjo fixing butt jointing electro-migration testing method |
| CN108646159A (en) * | 2018-03-14 | 2018-10-12 | 北京工业大学 | A kind of miniature solder joint coupled thermomechanics test method |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768332A (en) * | 2012-06-28 | 2012-11-07 | 工业和信息化部电子第五研究所 | Real-time online monitoring system of electromigration warning circuit |
| CN103884928A (en) * | 2012-12-21 | 2014-06-25 | 中国科学院金属研究所 | Microelectronic product reliability test platform under force electrothermal multi-field coupling effect |
| CN103962680A (en) * | 2014-04-13 | 2014-08-06 | 北京工业大学 | Soldered joint electromigration experiment device |
| CN103962680B (en) * | 2014-04-13 | 2016-01-13 | 北京工业大学 | Soldered fitting electromigration experimental provision and building method |
| CN105606647B (en) * | 2016-03-23 | 2018-06-22 | 华南理工大学 | A kind of apparatus and method for detecting interconnection solder joint thermal mobility energy |
| CN105606647A (en) * | 2016-03-23 | 2016-05-25 | 华南理工大学 | Device and method for detecting thermal migration performance of interconnected welding spots |
| CN106680694A (en) * | 2017-01-19 | 2017-05-17 | 重庆科技学院 | Experimental device of micro linear solder joints electromigration |
| CN107063891A (en) * | 2017-04-10 | 2017-08-18 | 河南科技大学 | It is a kind of to be used for the device and method of electromigration under thermoelectricity Composite Field |
| CN107063891B (en) * | 2017-04-10 | 2023-04-11 | 河南科技大学 | Device and method for electromigration in thermoelectric composite field |
| CN107097012A (en) * | 2017-05-05 | 2017-08-29 | 北京工业大学 | A kind of crystal grain is orientated consistent banjo fixing butt jointing electro-migration testing method |
| CN107097012B (en) * | 2017-05-05 | 2019-05-24 | 北京工业大学 | A kind of consistent banjo fixing butt jointing electro-migration testing method of crystal grain orientation |
| CN108646159A (en) * | 2018-03-14 | 2018-10-12 | 北京工业大学 | A kind of miniature solder joint coupled thermomechanics test method |
| CN108646159B (en) * | 2018-03-14 | 2020-06-16 | 北京工业大学 | Micro welding spot thermoelectric coupling test method |
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Application publication date: 20120118 |