CN102324426A - Novel high-power light-emitting diode (LED) package structure - Google Patents
Novel high-power light-emitting diode (LED) package structure Download PDFInfo
- Publication number
- CN102324426A CN102324426A CN201110305503A CN201110305503A CN102324426A CN 102324426 A CN102324426 A CN 102324426A CN 201110305503 A CN201110305503 A CN 201110305503A CN 201110305503 A CN201110305503 A CN 201110305503A CN 102324426 A CN102324426 A CN 102324426A
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- wall
- led chip
- annular body
- light
- fluorescent powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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Abstract
The invention discloses a novel high-power light-emitting diode (LED) package structure, which comprises a base plate, an LED chip fixed on the base plate, and a ring-shaped wall body arranged in a ring shape around the LED chip, wherein a non-light tight piece is arranged on the top part of the ring-shaped wall body; a fluorescent powder film is covered on the non-light tight piece; a non-light tight protective plate is covered on the fluorescent powder film; a fixed cover is sleeved on the ring-shaped wall body to clamp the non-light tight piece, the fluorescent powder film and the non-light tight protective plate; the top part of the fixed cover is provided with a light outlet; and the non-light tight protective plate corresponds to a non-light tight protective plate area in the ring-shaped wall body and is exposed out of the light outlet. Due to the adoption of the fluorescent powder film which replaces a traditional dispensing mode, fluorescent powder is kept away from the LED chip, and is prevented from directly contacting the LED chip, so light decay is reduced; and simultaneously, compared with a traditional dispensing structure, the novel high-power LED package structure has the advantages that: the thickness of the fluorescent powder film is uniform, and the thickness size of the fluorescent powder film can be accurately controlled, so the consistency is high, the excitation efficiency is high, and light spots can be obviously reduced.
Description
[technical field]
The present invention relates to a kind of LED structure, refer in particular to a kind of novel large-power LED encapsulating structure.
[background technology]
White light emitting diode (Lighting Emitting Diode) has the efficient height, and the life-span is long, and reliability is high, environmental protection and energy saving, and plurality of advantages such as applying flexible are the lighting source in the 4th generation by generally approving, have vast potential for future development.The acquisition of white light LEDs at present mainly contains three kinds of approach, and a kind of is on blue chip, to cover yttrium-aluminium-garnet (YAG:Ce3+) fluorescent material, and the blue light that utilizes blue chip to send is not absorbed part and receives the green-yellow light of blue-light excited ejaculation to mix the formation white light with fluorescent material; A kind of is to excite RGB three primary colors fluorescent powder colour mixture to form white light with the ultraviolet LED chip; Also having a kind of is that led chip with RGB sends RGB three primary colors light respectively, again through spacing color mixed formation white light.Comparatively ripe at present, business-like method is above-mentioned first kind of approach, and promptly blue-ray LED+(YAG:Ce3+) fluorescent material obtains white light.
In the preparation technology of large power white light LED, the coating of fluorescent material at present is still some powder mode mainly, after fluorescent material and used silica gel are mixed by a certain percentage, utilizes air pressure control mode point to be coated in around the led chip top reaches.Because there are difference of specific gravity in fluorescent material and used silica gel, this some powder mode can cause fluorescent material above led chip, to reach skewness all around, and led chip top fluorescent material sedimentary facies is to more; And less relatively all around, add that the difference of air pressure control also can cause the inconsistent of whole glue amount, will cause in the batch process like this; The colour temperature of white light LEDs is inconsistent; Discreteness is big, even occurs as hot spot defectives such as yellow circle or blue circle, influences the performance and the illuminating effect of white light LEDs.
As shown in Figure 5; Existing structural manufacturing process is a fixed L ED chip 101 on the microscope carrier 104 in pedestal 105, then fluorescent material 102 is directly evenly covered on the led chip 101, and in the outermost of led chip 101 lens 103 is set; When led chip 101 work; Will produce heat, the fluorescent material 102 that covers on the led chip 101 then can be because of the charing of turning black of being heated, and 102 in the fluorescent material after the charing directly remains on the led chip; Thereby reduced the luminous efficiency of led chip, caused the lifetime of whole element function.
[summary of the invention]
To LED encapsulating structure in the prior art exist bright dipping inhomogeneous, yellow circle is arranged, technological deficiency such as luminous efficiency is low, light decay is big, useful life is short, the object of the present invention is to provide a kind of go out light effect evenly, the LED encapsulating structure of little, the long service life of Wu Huangquan, light extraction efficiency height, light decay.
In order to reach above-mentioned technical purpose; The technical scheme that the present invention taked is a kind of novel large-power LED encapsulating structure; The led chip and the ring that comprise substrate, be fixed on the substrate are located at led chip annular body of wall on every side, and the top of said annular body of wall is equipped with light transmission piece, is coated with fluorescent powder film on the said light transmission piece; Cover the printing opacity baffle on the said fluorescent powder film; One fixed cap is nested with on annular body of wall light transmission piece, fluorescent powder film and printing opacity baffle is clamped, and the top of said fixed cap is provided with light-emitting window, and the inner printing opacity baffle zone of the corresponding annular body of wall of said printing opacity baffle exposes to said light-emitting window.
The present invention adopts fluorescent powder film to replace traditional phosphor dot glue mode, makes fluorescent material away from led chip, has avoided fluorescent material directly to contact led chip, has reduced light decay, has prolonged the useful life of LED lamp; Simultaneously with respect to traditional some plastic structure; The thickness that the present invention adopts fluorescent powder film evenly and can accurately control its gauge; The efficient that is stimulated is high, and photochromic uniformity high conformity can avoid occurring the perhaps phenomenon of blue circle of yellow circle fully; Make the whole hot spot uniformity obtain remarkable improvement, and improved light extraction efficiency.
Preferably, the arranged outside of said annular body of wall has external screw thread, and the inboard of said fixed cap is provided with the internal thread that is complementary with said external screw thread, and said fixed cap is fixed on the annular body of wall through being threaded.
Preferably, said annular body of wall is embedded on the substrate.
Preferably, the bottom of said annular body of wall is provided with a plurality of location-plates, and corresponding a plurality of location-plates are provided with the holddown groove that a plurality of and said location-plate is complementary on the said substrate, and said location-plate is embedded in the holddown groove annular body of wall is fixed on the substrate.
Preferably, be provided with the sealing and fixing colloid in the said holddown groove, said location-plate is embedded in the holddown groove fastening through the sealing of sealing and fixing colloid.
Preferably, the substrate surface in the said annular body of wall and the inner surface of annular body of wall are provided with reflector layer.
Preferably, said reflector layer is reflective sheeting or reflecting coating.
Preferably, said led chip is many group led chip groups, and the adjacent mutual dislocation of respectively organizing between the led chip group is arranged.
Preferably, the surface of said printing opacity baffle is a rough surface.
Preferably, said led chip is a blue-light LED chip, and said fluorescent powder film is the yellow fluorescent powder film.
[description of drawings]
Shown in Figure 1 for the structural representation of substrate of the present invention;
Structural representation for the present invention's annular body of wall shown in Figure 2;
Shown in Figure 3 is STRUCTURE DECOMPOSITION sketch map of the present invention;
Shown in Figure 4 is internal structure sketch map of the present invention;
Fig. 5 is the prior art constructions sketch map.
[embodiment]
For further detailed elaboration technical scheme of the present invention, be elaborated below in conjunction with accompanying drawing.
Like Fig. 1, Fig. 2, Fig. 3, shown in Figure 4; The invention discloses a kind of novel large-power LED encapsulating structure; It is characterized in that: the led chip 11 and the ring that comprise substrate 1, are fixed on the substrate 1 are located at led chip 11 annular body of wall 2 on every side; The top of said annular body of wall 2 is equipped with light transmission piece 30; Be coated with fluorescent powder film 3 on the said light transmission piece 30, cover a printing opacity baffle 4, one fixed caps on the said fluorescent powder film 3 and be nested with 5 and on annular body of wall 2, light transmission piece 30, fluorescent powder film 3 and printing opacity baffle 4 clamped; The top of said fixed cap 5 is provided with light-emitting window 51, and said printing opacity baffle 4 corresponding annular bodies of wall 2 inner printing opacity baffle zones expose to said light-emitting window 51.
The present invention adopts fluorescent powder film to replace traditional phosphor dot glue mode, makes fluorescent material away from led chip, has avoided fluorescent material directly to contact led chip, has reduced light decay, has prolonged the useful life of LED lamp; While is with respect to the structure of the heap shape fluorescent coating of conventional point glue formation; The thickness that the present invention adopts fluorescent powder film evenly and can accurately control its gauge; The efficient that is stimulated is high, and photochromic uniformity high conformity can avoid occurring the perhaps phenomenon of blue circle of yellow circle fully; Make the whole hot spot uniformity obtain remarkable improvement, and improved light extraction efficiency.
The arranged outside of annular body of wall 2 according to the invention has external screw thread 25, and the inboard of said fixed cap 5 is provided with the internal thread 51 that is complementary with said external screw thread 25, and said fixed cap 5 is fixed on through being threaded on the annular body of wall 2.In practical application, if find photochromic inconsistent phenomenon, also can fixed cap 5 reverse rotations be unloaded, change fluorescent powder film 3 again; As the phenomenon of dead lamp or stroboscopic appears, can fixed cap 5 be unloaded inspection line fault or change led chip 11 equally.
Certainly in order further to make it more firm, the later stage can be played the glue of a circle sealing at the bottom margin of fixed cap 5, to reach good sealing effectiveness.
Annular body of wall 2 of the present invention is embedded on the substrate 1; The mode of inlaying can adopt following structure; Can be provided with 4 location- plates 21,22,23,24 in the bottom of annular body of wall 2; Corresponding 4 location-plates are provided with holddown groove 12a, 12b, 12c, the 12d that a plurality of and said location- plate 21,22,23,24 is complementary on the said substrate 1, and said location- plate 21,22,23,24 is embedded in holddown groove 12a, 12b, 12c, the 12d annular body of wall 2 is fixed on the substrate.In order to make annular body of wall 2 more firm; Can preset part sealing and fixing colloid (not shown) in said holddown groove 12a, 12b, 12c, the 12d, said location- plate 21,22,23,24 is embedded in holddown groove 12a, 12b, 12c, the 12d fastening through the sealing of sealing and fixing colloid.
In order to make light farthest obtain utilizing, the substrate surface of the present invention in annular body of wall 2 is provided with reflector layer 6, is provided with reflector layer 7 at the inner surface of annular body of wall 2.This reflector layer 6 and reflector layer 7 are reflective sheeting or reflecting coating.
Led chip 11 according to the invention is many group led chip groups; As shown in Figure 1; Led chip 11 of the present invention is four groups of led chip group 11a, 11b, 11c, 11d; The adjacent mutual dislocation of respectively organizing between the led chip group is arranged, and the mode that described dislocation is arranged is meant between the led chip of adjacent led chip group that the gap of corresponding its vertical distribution is provided with separately, and such mode can let the distance maximization between the led chip; The heat of led chip let the thermal source of led chip in limited space, scatter as much as possible, so that can make full use of substrate 1 quick heat radiating.Substrate 1 of the present invention is provided with anodal wire welding area 13a and negative pole wire welding area 13b, and is provided with fixing hole 14a, 14b in the position at diagonal angle.
In order to reduce total reflection, the surface of printing opacity baffle 4 of the present invention is set to rough surface, to improve the light extraction efficiency.
Led chip 11 of the present invention can be a blue-light LED chip, and said fluorescent powder film 3 is the yellow fluorescent powder film, and this moment, blue chip excited the yellow fluorescent powder film can send white light.
The above only with convenient explanation the present invention, in not breaking away from creation spirit category of the present invention, knows this technological any simple modification and distortion that personnel did, still belongs to protection range of the present invention.
Claims (10)
1. novel large-power LED encapsulating structure; It is characterized in that: the led chip and the ring that comprise substrate, are fixed on the substrate are located at led chip annular body of wall on every side; The top of said annular body of wall is equipped with light transmission piece; Be coated with fluorescent powder film on the said light transmission piece, cover the printing opacity baffle on the said fluorescent powder film, a fixed cap is nested with on annular body of wall light transmission piece, fluorescent powder film and printing opacity baffle is clamped; The top of said fixed cap is provided with light-emitting window, and the inner printing opacity baffle zone of the corresponding annular body of wall of said printing opacity baffle exposes to said light-emitting window.
2. a kind of novel large-power LED encapsulating structure according to claim 1; It is characterized in that: the arranged outside of said annular body of wall has external screw thread; The inboard of said fixed cap is provided with the internal thread that is complementary with said external screw thread, and said fixed cap is fixed on the annular body of wall through being threaded.
3. a kind of novel large-power LED encapsulating structure according to claim 2 is characterized in that: said annular body of wall is embedded on the substrate.
4. a kind of novel large-power LED encapsulating structure according to claim 3; It is characterized in that: the bottom of said annular body of wall is provided with a plurality of location-plates; Corresponding a plurality of location-plates are provided with the holddown groove that a plurality of and said location-plate is complementary on the said substrate, and said location-plate is embedded in the holddown groove annular body of wall is fixed on the substrate.
5. a kind of novel large-power LED encapsulating structure according to claim 4 is characterized in that: be provided with the sealing and fixing colloid in the said holddown groove, said location-plate is embedded in the holddown groove fastening through the sealing of sealing and fixing colloid.
6. according to each described a kind of novel large-power LED encapsulating structure of claim 1 to 5, it is characterized in that: the substrate surface in the said annular body of wall and the inner surface of annular body of wall are provided with reflector layer.
7. a kind of novel large-power LED encapsulating structure according to claim 6 is characterized in that: said reflector layer is reflective sheeting or reflecting coating.
8. a kind of novel large-power LED encapsulating structure according to claim 7 is characterized in that: said led chip is many group led chip groups, and the adjacent mutual dislocation of respectively organizing between the led chip group is arranged.
9. a kind of novel large-power LED encapsulating structure according to claim 8 is characterized in that: the surface of said printing opacity baffle is a rough surface.
10. a kind of novel large-power LED encapsulating structure according to claim 9 is characterized in that: said led chip is a blue-light LED chip, and said fluorescent powder film is the yellow fluorescent powder film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110305503A CN102324426A (en) | 2011-09-30 | 2011-09-30 | Novel high-power light-emitting diode (LED) package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110305503A CN102324426A (en) | 2011-09-30 | 2011-09-30 | Novel high-power light-emitting diode (LED) package structure |
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| Publication Number | Publication Date |
|---|---|
| CN102324426A true CN102324426A (en) | 2012-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110305503A Pending CN102324426A (en) | 2011-09-30 | 2011-09-30 | Novel high-power light-emitting diode (LED) package structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103872034A (en) * | 2014-03-21 | 2014-06-18 | 长春希达电子技术有限公司 | Total-angle light emitting LED light source based on light transmission substrate and packaging method of total-angle light emitting LED light source |
Citations (9)
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|---|---|---|---|---|
| US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| CN1373523A (en) * | 2002-01-11 | 2002-10-09 | 北京大学 | High-brightness nitride LED generating white light and its preparing process |
| CN2667289Y (en) * | 2003-11-24 | 2004-12-29 | 赖政章 | Multi-colour light variable hand electric torch |
| CN1759487A (en) * | 2002-12-06 | 2006-04-12 | 克立公司 | LED package die having a small footprint |
| JP2007059371A (en) * | 2005-07-25 | 2007-03-08 | Matsushita Electric Works Ltd | Luminaire using led |
| CN101226975A (en) * | 2007-01-19 | 2008-07-23 | 研晶光电股份有限公司 | High-power light emitting diode chip packaging structure and method for manufacturing the same |
| CN101660678A (en) * | 2009-09-09 | 2010-03-03 | 史杰 | Method for packaging white LED light source module |
| CN201838620U (en) * | 2010-08-12 | 2011-05-18 | 红蝶科技(深圳)有限公司 | High-efficiency monochromatic light source packaging structure with excitation cavity and projection optical engine |
| CN202259427U (en) * | 2011-09-30 | 2012-05-30 | 深圳市灏天光电有限公司 | Novel high-power LED (light emitting diode) encapsulating structure |
-
2011
- 2011-09-30 CN CN201110305503A patent/CN102324426A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| CN1373523A (en) * | 2002-01-11 | 2002-10-09 | 北京大学 | High-brightness nitride LED generating white light and its preparing process |
| CN1759487A (en) * | 2002-12-06 | 2006-04-12 | 克立公司 | LED package die having a small footprint |
| CN2667289Y (en) * | 2003-11-24 | 2004-12-29 | 赖政章 | Multi-colour light variable hand electric torch |
| JP2007059371A (en) * | 2005-07-25 | 2007-03-08 | Matsushita Electric Works Ltd | Luminaire using led |
| CN101226975A (en) * | 2007-01-19 | 2008-07-23 | 研晶光电股份有限公司 | High-power light emitting diode chip packaging structure and method for manufacturing the same |
| CN101660678A (en) * | 2009-09-09 | 2010-03-03 | 史杰 | Method for packaging white LED light source module |
| CN201838620U (en) * | 2010-08-12 | 2011-05-18 | 红蝶科技(深圳)有限公司 | High-efficiency monochromatic light source packaging structure with excitation cavity and projection optical engine |
| CN202259427U (en) * | 2011-09-30 | 2012-05-30 | 深圳市灏天光电有限公司 | Novel high-power LED (light emitting diode) encapsulating structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103872034A (en) * | 2014-03-21 | 2014-06-18 | 长春希达电子技术有限公司 | Total-angle light emitting LED light source based on light transmission substrate and packaging method of total-angle light emitting LED light source |
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Application publication date: 20120118 |