CN102373407A - Coating processing method - Google Patents
Coating processing method Download PDFInfo
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- CN102373407A CN102373407A CN2010102589830A CN201010258983A CN102373407A CN 102373407 A CN102373407 A CN 102373407A CN 2010102589830 A CN2010102589830 A CN 2010102589830A CN 201010258983 A CN201010258983 A CN 201010258983A CN 102373407 A CN102373407 A CN 102373407A
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- pattern
- plated film
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Abstract
The invention discloses a coating processing method. The method comprises the following steps of: providing a workpiece, wherein the workpiece is provided with a first surface on which patterns are to be processed; depositing a coating on the first surface by adopting a physical vapor deposition method; providing a mask, wherein the shape of the mask is as same as that of the patterns to be formed, and the mask magnetically attracts the workpiece; adsorbing the mask to the first surface to shield a predetermined area of the coated first surface; removing the coating beyond the predetermined area of the first surface by using magnetic grinding; and removing the mask to obtain the patterns on the first surface of the workpiece.
Description
Technical field
The present invention relates to the plated film working method, relate in particular to the method for the surface formation predetermined pattern after thin film deposition.
Background technology
Traditional coating technique field is covered outside normally with predetermined area of the pattern to form method of patterning in workpiece surface processing, and directly this predetermined area of the pattern is carried out plated film.So, have certain thickness owing to hide the shade of non-area of the pattern, therefore after to the area of the pattern plated film, so the thickness of shade causes the partial reaction particulate to adhere to, thereby causes the uneven thickness of the clear and whole pattern of the blur margin of pattern.Blur margin is clear under powerful microscope, show edge fog, that is, the pattern precision is too low, especially when surface shape to be plated is complicated, the more difficult patterns of high precision that forms.The pattern thickness inequality can cause that then the physical properties of pattern is bad, for example hardness and fastness to rubbing variation.
Summary of the invention
In view of this, provide a kind of high precision plated film working method real for necessary.
A kind of plated film working method, it may further comprise the steps: a workpiece is provided, and this workpiece has the first surface of a formation pattern to be processed; Adopt physical vaporous deposition that this first surface is deposited a rete; One shade is provided, and the shape of this shade is identical with the shape of pattern to be formed, but this shade is inhaled with this workpiece magnetic mutually; This shade is adsorbed in this first surface and covers the prospective region of this first surface of plated film; Utilize magnetic grinding to remove the rete outside this prospective region of this first surface; Remove this shade and obtain this pattern with first surface in this workpiece.
With respect to prior art; The plated film working method that the present invention adopts is on the basis of physical vapor deposition coating film, to adopt shade to cover area of the pattern; And non-area of the pattern carried out magnetic grinding, thus the pattern edge that is taken place when avoiding directly to the area of the pattern plated film is unintelligible, the defective that produces halation, and; Owing to adopt magnetic grinding to grind accurately, thereby further improve the sharpness at the edge of pattern to the zone outside the edge of pattern.Because earlier to the equal deposit film in the surface at pattern place, thus the homogeneity of thicknesses of layers can be guaranteed to greatest extent, thus the physical properties of pattern is preferable.
Description of drawings
Fig. 1 be the plating that provides of the embodiment of the invention the schematic perspective view of workpiece of film.
Fig. 2 be the plating that is adsorbed with shade that provides of the embodiment of the invention the schematic perspective view of workpiece of film.
Fig. 3 be the rete of non-area of the pattern has been ground, has removed after, manifest the schematic perspective view of the workpiece of this pattern.
The main element nomenclature
Shade 30
Embodiment
To combine accompanying drawing that the present invention is done further explain below.
See also Fig. 1, the plated film working method that the embodiment of the invention provides may further comprise the steps at least:
At first, a workpiece 10 is provided, this workpiece 10 has a first surface 101.This workpiece 10 is by being processed by the metal or alloy that magnetic attracts, and particularly, this workpiece 10 can be made of metal, like iron, nickel; Or process stainless steel for example by the alloy that contains metal.
Secondly, (Physical Vapor Deposition is PVD) to this first surface 101 depositions one rete 20 to adopt physical vaporous deposition.Physical vaporous deposition is to carry out thin film deposition with physical mechanism and do not relate to the process technique of chemical reaction, pollutes low.Physical vaporous deposition generally comprises vacuum evaporation, sputter vapor deposition and ion vapor deposition.Present embodiment adopts single cavity to carry out reaction formula magnetron sputtering embrane method, also can adopt alternate manner.
In the present embodiment, this rete 20 is the metal single layer film, and it is gorgeous from full to have height metal texture, color.In other embodiments, this rete can comprise multilayer film.
Please consult Fig. 2 in the lump, then, a shade 30 is provided, the shape of this shade 30 is identical with the shape of pattern to be formed, and the shaded areas of 30 pairs of these first surfaces 101 of this shade just in time is the shape of pattern.This shade can be inhaled with this workpiece magnetic mutually.For example, this shade 30 has stronger magnetic, and this workpiece 10 is by being processed by the metal or alloy that magnetic attracts.This shade 30 is adsorbed in this first surface 101 and covers the prospective region of this first surface of plated film.Because but this shade 30 inhales with these workpiece 10 magnetic mutually, can be in flow so this shade can adsorb, be fixed on this first surface 101 quickly and easily the shift position, thereby guarantee the precision of pattern to greatest extent.Pattern can be various marks such as literal, figure, numeral, letter, and in the present embodiment, this pattern is circular.
Then, this first surface 101 that is coated with rete 20 is carried out magnetic grinding to remove the rete 20 outside this prospective region.
Magnetic grinding is to utilize the action of a magnetic field to carry out attrition process, and it mainly comprises the unsteady grinding of magnetic and utilizes magnetic abrasive to carry out magnetic grinding.The present invention adopts the latter.Specifically, earlier this workpiece 10 is put into the magnetic field that is formed by two magnetic poles, in this workpiece 10 and polar gap, put into magnetic abrasive.Under the effect of magnetic field force, abrasive material forms a softness and has certain inflexible " magnetic abrasive brush " along magneticline of force direction proper alignment.When this workpiece 10 rotates in magnetic field and does axial vibration, thereby this workpiece 10 is realized the attrition process to rete 20 with magnetic abrasive generation relative movement.Magnetic grinding change magneticstrength capable of using is controlled grinding pressure since have between magnetic pole and the workpiece surface machining gap (1~4mm), therefore can carry out flexible grinding through magnetic abrasive, especially be fit to compromise face and free form surface are ground.
Please consult Fig. 3 in the lump, then, remove this shade 30, the pattern 40 that is formed on this first surface 101 promptly appears.The controllable thickness of this pattern 40 is in 2 microns, and among Fig. 3, the thickness of pattern 40 is increased so that know display pattern 40 and other regional difference in thickness.
Carry out after the magnetic grinding, remove before this shade 30, can polish this first surface 101.It is instrument that polishing can be adopted buff; Buff adopts that material is even and fine to be processed through the timber of skimming treatment or special fine felt; Its movement locus is evenly thick netted, and the surfaceness after the polishing is very low, does not observe any surface imperfection at the microscopically that amplifies 40 times.Can adopt electropolishing in addition.
Remove after this shade 30, also can modify the edge of this pattern 40.
The plated film working method that present embodiment provided is on the basis of physical vapor deposition coating film, to adopt shade to cover area of the pattern; And non-area of the pattern carried out magnetic grinding; Thereby the pattern edge that is taken place when avoiding directly to the area of the pattern plated film is unintelligible, the defective of generation halation; And, owing to adopt magnetic grinding to grind accurately to the zone outside the edge of pattern, thus the sharpness at the edge of pattern further improved.Because earlier to the equal deposit film in the surface at pattern place, thus the homogeneity of thicknesses of layers can be guaranteed to greatest extent, thus the physical properties of pattern is preferable.
It is understandable that; But satisfying shade 30 attracts each other with workpiece 10 magnetic; Not necessarily require shade 30 or workpiece 10 itself just to have than ferromagnetism; This shade 30 or workpiece 10 can magnetic attract each other after for example being magnetized under the externally-applied magnetic field effect under certain condition, and the magnetic of this workpiece 10 or shade 30 need not to keep after this externally-applied magnetic field is cancelled.
It is understandable that those skilled in the art also can do other variation in spirit of the present invention, all should be included within the present invention's scope required for protection.
Claims (8)
1. plated film working method, it may further comprise the steps:
A workpiece is provided, and this workpiece has the first surface of a formation pattern to be processed;
Adopt physical vaporous deposition that this first surface is deposited a rete; One shade is provided, and the shape of this shade is identical with the shape of pattern to be formed, but this shade is inhaled with this workpiece magnetic mutually;
This shade is adsorbed in this first surface and covers the prospective region of this first surface of plated film;
Utilize magnetic grinding to remove the rete outside this prospective region of this first surface;
Remove this shade and obtain this pattern with first surface in this workpiece.
2. plated film working method as claimed in claim 1 is characterized in that: this first surface is carried out removing before this shade after the magnetic grinding, this first surface is polished.
3. plated film working method as claimed in claim 1 is characterized in that: remove after this shade, the edge of this pattern is modified.
4. plated film working method as claimed in claim 1 is characterized in that: this workpiece is by being processed by the metal or alloy that magnetic attracts, and this shade is processed by magneticsubstance.
5. plated film working method as claimed in claim 4 is characterized in that: the material of this workpiece is a stainless steel.
6. plated film working method as claimed in claim 1 is characterized in that: this rete is a metallic diaphragm.
7. plated film working method as claimed in claim 1 is characterized in that: this rete is a unitary film.
8. plated film working method as claimed in claim 1 is characterized in that: this rete comprises multilayer film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010102589830A CN102373407A (en) | 2010-08-20 | 2010-08-20 | Coating processing method |
Applications Claiming Priority (1)
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CN2010102589830A CN102373407A (en) | 2010-08-20 | 2010-08-20 | Coating processing method |
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CN102373407A true CN102373407A (en) | 2012-03-14 |
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CN2010102589830A Pending CN102373407A (en) | 2010-08-20 | 2010-08-20 | Coating processing method |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103478092A (en) * | 2012-06-15 | 2014-01-01 | 苏州市京伦陶瓷有限公司 | Method for machining two-transverse-plane ceramic ring of fishing tool |
CN104513969A (en) * | 2013-09-27 | 2015-04-15 | 群创光电股份有限公司 | Structure with diamond-like carbon, fingerprint identifier and production method of fingerprint identifier |
CN108048795A (en) * | 2017-12-27 | 2018-05-18 | 西安文理学院 | A kind of machinery part surface coating process |
CN114875354A (en) * | 2022-05-05 | 2022-08-09 | 常州市方正型钢有限公司 | High-strength seamless deformed steel and processing technology thereof |
CN116623127A (en) * | 2023-05-31 | 2023-08-22 | 北京创思镀膜有限公司 | Optical film preparation method and fixture for pyramid prism |
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TW505706B (en) * | 1995-09-13 | 2002-10-11 | Samsung Electronics Co Ltd | Method of forming minute pattern in metal workpiece |
US20040142625A1 (en) * | 2002-10-28 | 2004-07-22 | Finisar Corporation | In situ adaptive masks |
US20050088785A1 (en) * | 2003-03-14 | 2005-04-28 | Delphi Technologies, Inc. | Microactuator having a ferromagnetic substrate |
CN1621555A (en) * | 2003-04-10 | 2005-06-01 | 株式会社半导体能源研究所 | Mask and container and manufacturing apparatus |
US20060148386A1 (en) * | 2003-07-15 | 2006-07-06 | Hoya Corporation | Method and device for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk |
CN1894803A (en) * | 2003-12-19 | 2007-01-10 | 株式会社半导体能源研究所 | Semiconductor apparatus and method for manufacturing the same |
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2010
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Patent Citations (6)
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TW505706B (en) * | 1995-09-13 | 2002-10-11 | Samsung Electronics Co Ltd | Method of forming minute pattern in metal workpiece |
US20040142625A1 (en) * | 2002-10-28 | 2004-07-22 | Finisar Corporation | In situ adaptive masks |
US20050088785A1 (en) * | 2003-03-14 | 2005-04-28 | Delphi Technologies, Inc. | Microactuator having a ferromagnetic substrate |
CN1621555A (en) * | 2003-04-10 | 2005-06-01 | 株式会社半导体能源研究所 | Mask and container and manufacturing apparatus |
US20060148386A1 (en) * | 2003-07-15 | 2006-07-06 | Hoya Corporation | Method and device for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103478092A (en) * | 2012-06-15 | 2014-01-01 | 苏州市京伦陶瓷有限公司 | Method for machining two-transverse-plane ceramic ring of fishing tool |
CN104513969A (en) * | 2013-09-27 | 2015-04-15 | 群创光电股份有限公司 | Structure with diamond-like carbon, fingerprint identifier and production method of fingerprint identifier |
CN104513969B (en) * | 2013-09-27 | 2017-06-06 | 群创光电股份有限公司 | Structure, fingerprint identifier and its manufacture method with quasi cobalt carbon diaphragm |
CN108048795A (en) * | 2017-12-27 | 2018-05-18 | 西安文理学院 | A kind of machinery part surface coating process |
CN114875354A (en) * | 2022-05-05 | 2022-08-09 | 常州市方正型钢有限公司 | High-strength seamless deformed steel and processing technology thereof |
CN114875354B (en) * | 2022-05-05 | 2023-09-05 | 常州市方正型钢有限公司 | High-strength seamless deformed steel and processing technology thereof |
CN116623127A (en) * | 2023-05-31 | 2023-08-22 | 北京创思镀膜有限公司 | Optical film preparation method and fixture for pyramid prism |
CN116623127B (en) * | 2023-05-31 | 2024-02-09 | 北京创思镀膜有限公司 | Optical film preparation method and fixture for pyramid prism |
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Application publication date: 20120314 |