CN102398421A - Piezoelectric actuator module and manufacturing method of piezoelectric inkjet head applicable to piezoelectric actuator module - Google Patents
Piezoelectric actuator module and manufacturing method of piezoelectric inkjet head applicable to piezoelectric actuator module Download PDFInfo
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- CN102398421A CN102398421A CN2010102822430A CN201010282243A CN102398421A CN 102398421 A CN102398421 A CN 102398421A CN 2010102822430 A CN2010102822430 A CN 2010102822430A CN 201010282243 A CN201010282243 A CN 201010282243A CN 102398421 A CN102398421 A CN 102398421A
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- actuated module
- piezo chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/10—Finger type piezoelectric elements
Abstract
The invention provides a piezoelectric actuator module and a manufacturing method of a piezoelectric inkjet head applicable to the piezoelectric actuator module. The invention includes the following steps: (a) an upper piezoelectric chip and a lower piezoelectric chip are formed, a first surface of the upper piezoelectric chip and a first surface of the lower piezoelectric chip are respectively provided with a first electrode and a second electrode; (b) the first electrode and the second electrode are jointed with each other through a conductive layer, so the upper piezoelectric chip is assembled with the lower piezoelectric chip correspondingly; (c) a second surface of the upper piezoelectric chip is cut in a manner of equal interval; and (d) a second surface of the lower piezoelectric chip is cut in a staggered manner relative to the second surface of the upper piezoelectric chip, so as to form multiple runners with up-and-down and staggered openings and further form the piezoelectric actuator module.
Description
Technical field
The invention relates to a kind of manufacturing approach of piezoelectric actuated module, refer to a kind of piezoelectric actuated module especially and the manufacturing approach of the piezoelectric ink jet head that is suitable for.
Background technology
Progress along with ink-jet technology; Ink-jet technology no longer just is applied on the traditional prints market, more is applied in the process technique of flat-panel screens and semiconductor industry in recent years, yet; In order to reduce cost and to save the processing procedure time; Seeking new ink-jet technology one after another, by what widely use, is exactly the piezoelectric ink jet technology among this.
General piezoelectric ink jet header structure mainly is made up of nozzle piece, cover plate and piezoelectric actuated module.See also Figure 1A, it is the structural representation for the piezoelectric actuated module of known piezoelectric ink jet head.As shown in the figure; Known piezoelectric actuated module 1 is mainly formed by last piezo chips 10, lower piezoelectric chip 11 and 12 at electrode; Wherein go up piezo chips 10 and lower piezoelectric chip 11 and have an electrode 12 respectively, and between two electrodes 12 of last piezo chips 10 and lower piezoelectric chip 11, have more a conductive layer 13, this conductive layer 13 is to be formed by a conducting resinl; But not as limit, in order to engage two electrodes 12.And known piezoelectric actuated module 1 has more a plurality of runners 14, and these a plurality of runners 14 are to extend downward lower piezoelectric chip 11 from last piezo chips 10, and the opening 140 of these a plurality of runners all is arranged on the piezo chips 10.
In the piezoelectric actuated module 1 shown in Figure 1A; Its manufacturing approach is for processing earlier piezo chips 10 and lower piezoelectric chip 11 respectively; And form electrode 12 on a surface of last piezo chips 10 and lower piezoelectric chip 11, will go up piezo chips 10 through conductive layer 13 more thereafter and lower piezoelectric chip 11 is engaged in together.At last,, go up piezo chips 10 certainly and cut downwards according to certain intervals through a cutting instrument, with the runner 14 that forms a plurality of fixed sizes, and as shown in the figure, the opening 140 of these a plurality of runners 14 all is arranged on the same surface of piezo chips 10.
See also Figure 1B, it is the illustrative view for known piezoelectric actuated module.As shown in the figure, when piezoelectric actuated module 1 is carried out start, promptly through electrode 12 to produce an electric field; And then make piezo chips 10 and lower piezoelectric chip 11 produce deformation according to different generating positive and negative voltages; As shown in the figure, the generating positive and negative voltage of piezo chips 10 and lower piezoelectric chip 11 is different on because of both sides produces when expanding situation when runner 142, then is arranged at runner 141 and the runner 143 of runner 142 both sides thereby can be squeezed; And then the black liquid (not shown) in runner 141 and the runner 143 is flowed out from a jet orifice (not shown); Otherwise,, thereby black liquid (not shown) is flowed in the runner 142 because of runner 142 is the states that are in expansion; The alternately conversion of generating positive and negative voltage is by this flowed out from different runner 14 and jet orifice (not shown) to control black liquid.
Yet, in known piezoelectric actuated module 1, shown in Figure 1A and Figure 1B; Because a plurality of runners 14 all extend downward 11 formation of lower piezoelectric chip from last piezo chips 10; And the opening 140 of runner 14 all is arranged on the piezo chips 10, and therefore, base portion 110 structures that the lower piezoelectric chip 11 between each runner 14 is set are comparatively fragile; Especially when piezoelectric actuated module 1 is carried out start; Runner 14 can produce the situation of expanding or being extruded, and often more can have influence on the base portion 110 on runner 14 next doors, makes base portion 110 after deformation extruding repeatedly, be prone to produce the situation of breaking; And then have influence on the usefulness of piezoelectric actuated module 1 and the situation that causes piezoelectric ink jet head to occur damaging.
In view of this, how to develop higher, the difficult manufacturing approach that produces piezoelectric actuated module of damaging and the piezoelectric ink jet head that is suitable for thereof of a kind of structural strength, to solve the disappearance of known technology, real is the problem of the correlative technology field person solution that presses at present.
Summary of the invention
The manufacturing approach of the piezoelectric ink jet head that the object of the present invention is to provide a kind of piezoelectric actuated module and be suitable for; It is by means of having the runner that upper and lower opening is crisscross arranged in the piezoelectric actuated module; To solve the fragile structure of known piezoelectric actuated module, be prone to cause piezoelectric ink jet head the disappearance of situation possibly occur damaging.
For reaching above-mentioned purpose; Of the present invention one to implement aspect than broad sense be the manufacturing approach that a kind of piezoelectric actuated module is provided; It is to comprise the following steps: that piezo chips reaches piezo chips in (a) formation one, and first surface of piezo chips and this lower piezoelectric chip is to have one first electrode and one second electrode respectively on this; (b) through a conductive layer this first electrode and this second electrode are bonded with each other, so that should go up piezo chips and the corresponding winding of this lower piezoelectric chip; (c) second surface to piezo chips on this equidistantly cuts; (d) second surface of this lower piezoelectric chip is carried out equidistantly cutting with the second surface that should go up piezo chips the cutting of dislocation, to form the staggered up and down runner of a plurality of openings, to form a piezoelectric actuated module.
For reaching above-mentioned purpose; It is the manufacturing approach that a kind of piezoelectric ink jet head is provided that of the present invention another implemented aspect than broad sense; It is to comprise the following steps: that piezo chips reaches piezo chips in (a) formation one, and first surface of piezo chips and this lower piezoelectric chip is to have one first electrode and one second electrode respectively on this; (b) through a conductive layer this first electrode and this second electrode are bonded with each other, so that should go up piezo chips and the corresponding winding of this lower piezoelectric chip; (c) second surface to piezo chips on this equidistantly cuts; (d) second surface of this lower piezoelectric chip is carried out equidistantly cutting with the second surface that should go up piezo chips the cutting of dislocation, to form the staggered up and down runner of a plurality of openings, to form a piezoelectric actuated module; (e) on this second surface that should go up piezo chips and this lower piezoelectric chip of this piezoelectric actuated module, a upper cover plate and a lower cover are set respectively; (f) in one first side of this piezoelectric actuated module one sealant is set, to seal the end of these a plurality of runners; (g) in one second side of this piezoelectric actuated module one nozzle piece is set, has a plurality of jet orifice on this nozzle piece, it is to be connected with these a plurality of runners.
Description of drawings
Figure 1A: it is the structural representation for the piezoelectric actuated module of known piezoelectric ink jet head.
Figure 1B: it is the illustrative view for known piezoelectric actuated module.
Fig. 2: it is the manufacturing approach flow chart for the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 3 A: it is the decomposition texture sketch map for the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 3 B: it is the combining structure sketch map for the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 3 C: it is to be the structural representation after the last piezo chips cutting of the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 3 D: it is to be the structural representation after the upper and lower piezo chips cutting of the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 4: it is the manufacturing approach flow chart for the piezoelectric ink jet head of the piezoelectric actuated module of using preferred embodiment of the present invention.
Fig. 5: it is the decomposition texture sketch map that is respectively the piezoelectric ink jet head of the piezoelectric actuated module of using preferred embodiment of the present invention.
Fig. 6: it is the combining structure sketch map that is respectively the piezoelectric ink jet head of the piezoelectric actuated module of using preferred embodiment of the present invention.
Fig. 7 A: it is respectively the piezoelectric ink jet head cross-sectional view for the piezoelectric actuated module of using preferred embodiment of the present invention.
Fig. 7 B: it is respectively the illustrative view for the piezoelectric ink jet head of the piezoelectric actuated module of using preferred embodiment of the present invention.
[primary clustering symbol description]
Known piezoelectric actuated module: 1
Last piezo chips: 10,231
Lower piezoelectric chip: 11,232
Base portion: 110,230e, 230f
Electrode: 12
Conductive layer: 13,235
14,141,142,143,230,230a, 230c runner:
Opening: 140,230b, 230d
Piezoelectric ink jet header structure: 2
Upper cover plate: 21
The 3rd surface: 210,220
The 4th surface: 211,221
Go into black hole: 212,222
China ink liquid water conservancy diversion fork road: 213,223
Lower cover: 22
Piezoelectric actuated module: 23
First surface: 231a, 232a
Second surface: 231b, 232b
First electrode: 233
Second electrode: 234
First side: 236
Second side: 237
Nozzle piece: 24
Jet orifice: 240
Sealant: 25
Go into black runner: 26,27
The manufacturing step of piezoelectric actuated module: S30～S34
The manufacturing step of piezoelectric ink jet head: S40～S46
The specific embodiment
Some exemplary embodiments that embody characteristic of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations on different aspects, its neither departing from the scope of the present invention, and explanation wherein and graphic be the usefulness of being used as explanation in itself, but not in order to the restriction the present invention.
Please consult Fig. 2 and Fig. 3 A simultaneously, Fig. 2 is the manufacturing approach flow chart for the piezoelectric actuated module of preferred embodiment of the present invention, and Fig. 3 A then is the decomposition texture sketch map of the piezoelectric actuated module of preferred embodiment of the present invention.Shown in Fig. 3 A, piezoelectric actuated module 23 of the present invention is mainly formed by last piezo chips 231, lower piezoelectric chip 232, first electrode 233, second electrode 234 and 235 of conductive layers.In present embodiment; Shown in the step S30 of Fig. 2, the mode of piezo chips 231 and lower piezoelectric chip 232 is for a piezoelectric is provided earlier in the formation, for example: the lead zirconate titanate piezoelectric material (PZT-5H) of high d31; But not as limit; This piezoelectric through a mould and fluid pressure type machine, is compressed to laminated structure with this piezoelectric, to form piezo chips 231 and lower piezoelectric chip 232 under the effect of suitable pressure.And it is can should go up piezo chips 231 and lower piezoelectric chip 232 through a twin grinder device to grind and be needed thickness, and in some embodiment, the thickness of last piezo chips 231 and lower piezoelectric chip 232 is to be preferable with 500 μ m, but not as limit.
Please consult Fig. 2 and Fig. 3 A again; Shown in step S31; After form going up piezo chips 231 and lower piezoelectric chip 232, promptly on the first surface 231a of last piezo chips 231 and lower piezoelectric chip 232 and 232a, form first electrode 233 and second electrode 234 respectively subsequently.In some embodiment, form in the processing procedure of first electrode 233 and second electrode 234, more comprise formation one temporary electrode earlier; But not as limit, this practice is for earlier with an electrode material, for example: one-pack type high temperature silver palladium glue; But not as limit, be coated with on the first surface 231a and 232a that invests piezo chips 231 and lower piezoelectric chip 232, pass through high-temperature firing thereafter again; For example: 600 ℃ high temperature, and send in the high-temperature insulation silicone oil groove, and impose voltage; For example: the voltage of 3V/ μ m, carrying out 10 minutes polarization, and then go up in the first surface 231a of last piezo chips 231 and lower piezoelectric chip 232 and 232a and to form a temporary electrode (not shown); Then, again this temporary electrode is removed with the mode of grinding.Then; Lift the technology removed (lift off) with another electrode material with metal again; For example: Jin Ge (Au/Cr) material; But, be formed on the first surface 231a and 232a of piezo chips 231 and lower piezoelectric chip 232 with the mode of vapor deposition, by this to form first electrode 233 and second electrode 234 not as limit.
In other embodiment, can cut instrument through one again, for example: the wafer cutter, but not as limit, the last piezo chips 231 and the lower piezoelectric chip 232 that will have first electrode 233 and second electrode 234 are cut into required specific dimensions.And this size is to be preferable with 7mm * 20mm * 0.5mm, but not as limit, and it is to make situation and appoint and execute variation according to actual executing.After last piezo chips 231 and lower piezoelectric chip 232 have been cut into specific dimensions; Then shown in step S32; Can will be arranged at the first surface 231a of piezo chips 231 and lower piezoelectric chip 232 and first electrode 233 and second electrode 234 of 232a is bonded with each other through conductive layer 235; And in some embodiment, be this conductive layer 235 and first electrode 233 and second electrode 234 to be bonded with each other, but not as limit through a screen printing technology; By this so that go up piezo chips 231 and lower piezoelectric chip 232 can corresponding winding, and form the combining structure of the upper and lower piezo chips 231,232 shown in Fig. 3 B.And in present embodiment, conductive layer 235 is to can be a conducting resinl, but not as limit.
Please consult Fig. 2 and Fig. 3 C simultaneously; Fig. 3 C is for the structural representation after the last piezo chips cutting of the piezoelectric actuated module of preferred embodiment of the present invention, and is as shown in Figure 2, after completion is carried out the step of corresponding winding with upper and lower piezo chips 231,232; Thereafter then shown in step S33; Through a cutting instrument, for example: the wafer cutter, but not as limit; Second surface 231b to last piezo chips 231 cuts; And its cutting mode is for carrying out the equidistant cutting of the fixed width and the degree of depth with specific range, and then forms a plurality of runner 230a that extend downward lower piezoelectric chip 232 from last piezo chips 231, and the opening 230b of these a plurality of runner 230a is arranged on the second surface 231b of piezo chips 231.
Then; Then for another example shown in the step S34 of Fig. 2; The combining structure of upper and lower piezo chips 231,232 is overturn; And the second surface 232b of lower piezoelectric chip 232 carried out equidistantly cutting with the second surface 231b of last piezo chips 231 cutting second time of dislocation, its cutting tool and cutting mode are all similar with aforementioned embodiments, so repeat no more.After cutting for the second time, then can form a plurality of runner 230c that extend to piezo chips 23 from lower piezoelectric chip 232, and the opening 230d of these a plurality of runner 230c is arranged on the second surface 232b of lower piezoelectric chip 232.Thus; Through this secondary cut, then can make piezoelectric actuated module 23 have a plurality of opening 230b shown in Fig. 3 D, the runner 230 that 230d is crisscross arranged up and down, and since opening 230b, the 230d of runner 230 be crisscross arranged respectively last in second surface 231b, the 232b of last piezo chips 231 and lower piezoelectric chip 232; But not be arranged on the same piezo chips; Thereby for each runner 230, its both sides all have the column structure that is enough to support, so has stronger structural strength.And because the intensity of this structure is higher; Make to design and to shorten the distance between each runner 230; This shows; It is high except structural strength that this has the piezoelectric actuated module 23 of staggered up and down runner 230, can avoid producing the situation of breaking man-hour in adding, and more can save the material cost of making piezoelectric actuated module 23.
See also Fig. 4, it is the manufacturing approach flow chart for the piezoelectric ink jet head of the piezoelectric actuated module of using preferred embodiment of the present invention.As shown in Figure 4, piezoelectric ink jet head of the present invention passes through earlier like the described step of step S40～S44 when making, to process a piezoelectric actuated module 23, because step, material and required instrument etc. in this processing procedure are all identical with previous embodiment, so repeat no more.After forming piezoelectric actuated module 23; Then can be of step S45; In the last piezo chips 231 of piezoelectric actuated module 23 and the last upper cover plate 21 and the lower cover 22 (as shown in Figure 5) of being provided with respectively of second surface 231b, 232b of lower piezoelectric chip 232, in some embodiment, when last piezo chips 231 and lower piezoelectric chip 232 will engage with upper cover plate 21 and lower cover 22; Also can be through a conducting resinl (not shown) with it joint; But, thus, then can lead to upper cover plate 21 and lower cover 22 respectively by means of first electrode 233 and second electrode 234 that this conducting resinl (not shown) will be gone up piezo chips 231 and lower piezoelectric chip 232 not as limit.
Please consult Fig. 4 Fig. 5 simultaneously; After upper cover plate 21 and lower cover 22 and piezoelectric actuated module 23 corresponding assemblings; Then can be of step S46, at 236 places, first side of piezoelectric actuated module sealant 25 is set, when sealing layer 25 correspondence are arranged at first side 236; Then can runner 230 ends on the piezoelectric actuated module 23 be sealed, and then prevent black liquid seepage.In some embodiment, sealant 25 is to can be a fluid sealant, for example: and silica gel, but not as limit.Then, shown in the step S47, nozzle piece 24 (as shown in Figure 5) is set for another example in 237 places, second side of piezoelectric actuated module 23; And on nozzle piece 24, having a plurality of jet orifice 240, when nozzle piece 24 will be with piezoelectric actuated module 23 corresponding windings, is with the winding corresponding to a plurality of runners on the piezoelectric actuated module 23 of a plurality of jet orifice 240; In present embodiment; Be to stick together medium through one, for example: structure glue, but not as limit; With nozzle piece 24 corresponding gluings on piezoelectric actuated module 23, by this to form the combining structure of piezoelectric ink jet head as shown in Figure 6.
Please consult Fig. 5 and Fig. 6 simultaneously, it is decomposition texture sketch map and the combining structure sketch map that is respectively the piezoelectric ink jet head of the piezoelectric actuated module of using preferred embodiment of the present invention.As shown in the figure, piezoelectric ink jet head 2 of the present invention mainly is made up of upper cover plate 21, lower cover 22, piezoelectric actuated module 23, nozzle piece 24 and 25 of sealants.Wherein, Upper cover plate 21 and lower cover 22 be correspond respectively to piezoelectric actuated module 23 last piezo chips 231 second surface 231b and lower piezoelectric chip 232 second surface 232b and be provided with; And upper cover plate 21 and lower cover 22 have the 210,220 and the 4th surface 211,221, the 3rd surface respectively; And on the 3rd surface 210,220, have respectively, on the 4th surface 211,221, then have black liquid water conservancy diversion fork road 213,223 respectively into black hole 212,222.One end of going into black hole 212 and 222 be respectively with go into black runner 26,27 and be connected, the other end then is connected with black liquid water conservancy diversion fork road 213,223.When piezoelectric ink jet head 2 will spray black liquid; Be black liquid to be imported in the upper and lower cover plate 21,22 by going into black runner 26,27; Flow to black liquid water conservancy diversion fork road 213,223 by the black hole 212,222 of going into of upper and lower cover plate 21,22, by black liquid water conservancy diversion fork road 213,223 black liquid is guided in the runner 230 on the piezoelectric actuated module 23 equably again, and carry over runner 230 and flow to jet orifice 240; Through the actuating of piezoelectric actuated module 23, spray by specific jet orifice 240 again to control black liquid.
Please consult Fig. 7 A, B simultaneously, its be respectively for the piezoelectric ink jet head cross-sectional view of the piezoelectric actuated module of using preferred embodiment of the present invention with and illustrative view.Shown in Fig. 7 A; The opening 230b of the runner 230a of wherein piezoelectric actuated module 23 is for being arranged on the piezo chips 231, and runner 230a is that the runner 230c that is arranged at lower piezoelectric chip 232 with opening 230d is crisscross arranged, therefore; As shown in the figure; Each runner 230 is the base portion 230e of piezo chips 231 on it is positioned at no matter, or is positioned at the base portion 230f place of lower piezoelectric chip 232, all can obtain good supporting.Thus; When first electrode 233 on the upper and lower piezo chips 231 and 232 of piezoelectric ink jet head 2 and second electrode, 234 generations, one electric field; Be to make to produce different positive and negative magnitudes of voltage on the side wall of runner 230 both sides; By means of this different positive and negative magnitude of voltage, then can and then make runner 230 produce different deformation.For instance, shown in Fig. 7 B, when the left and right sides of the runner 230c that is arranged at central authorities is to have a positive and negative magnitude of voltage respectively; Thereby impel runner 230c to produce deformation and expand; And be expressed to the runner 230a of its both sides, because the opposite side of runner 230a is to be earth terminal, this ground connection is distolateral not to produce deformation; A side that is adjacent to expansionary channel 230c then is squeezed, so runner 230a can impel black liquid wherein to spray from the terminal jet orifice 240 of runner 230a because of the deformation of this extruding.As for the runner 230c that produces expansion deformation,, can impel black liquid to flow among the runner 230c from black liquid water conservancy diversion fork road 223 (as shown in Figure 5) then because of the attraction of expansion deformation.This shows; Piezoelectric ink jet head 2 is can be through the electric field change of piezoelectric actuated module 23; And then make a plurality of runners 230 produce deformation or constant, to control outside the black liquid ejection jet orifice 240 or to insert among the passage 230, to accomplish the ink-jet operation of piezoelectric ink jet head 2.
In sum; The manufacturing approach of piezoelectric actuated module of the present invention and the piezoelectric ink jet head that is suitable for thereof mainly is by means of the equidistant cutting of carrying out upper and lower secondary dislocation in piezoelectric actuated module; To form the runner that a plurality of upper and lower openings are crisscross arranged; So can strengthen the structural strength of piezoelectric actuated module, and, make runner more can reduce the distance between the runner on designing because its support structure power is higher; And then can reduce the volume of piezoelectric actuated module and required material, escapable cost and structure are comparatively firm, advantage such as be difficult for breaking to have.Because above-mentioned advantage is to be known technology person can't be obtained, so the manufacturing approach of piezoelectric actuated module of the present invention and the piezoelectric ink jet head that is suitable for thereof has industrial value.
The present invention must be by haveing the knack of that this technological personage Ren Shi craftsman thinks and be to modify as all, right neither take off such as attach claim desire Protector.
Claims (12)
1. the manufacturing approach of a piezoelectric actuated module, it is to comprise the following steps:
(a) piezo chips reaches piezo chips in the formation one, and first surface of piezo chips and this lower piezoelectric chip is to have one first electrode and one second electrode respectively on this;
(b) through a conductive layer this first electrode and this second electrode are bonded with each other, so that should go up piezo chips and the corresponding winding of this lower piezoelectric chip;
(c) second surface to piezo chips on this equidistantly cuts;
(d) second surface of this lower piezoelectric chip is carried out equidistantly cutting with this second surface that should go up piezo chips the cutting of dislocation, to form the staggered up and down runner of a plurality of openings, to form a piezoelectric actuated module.
2. the manufacturing approach of piezoelectric actuated module as claimed in claim 1 wherein should go up piezo chips and this lower piezoelectric chip is made by a lead zirconate titanate piezoelectric material.
3. the manufacturing approach of piezoelectric actuated module as claimed in claim 1, wherein in step (a), this first electrode and this second electrode are mode this first surfaces of vapor deposition piezo chips and this lower piezoelectric chip on this respectively that lifts the technology of removing with metal.
4. the manufacturing approach of piezoelectric actuated module as claimed in claim 3, wherein this first electrode and this second electrode are made by a gold medal chromium material.
5. the manufacturing approach of piezoelectric actuated module as claimed in claim 1; Wherein in step (b); Be this conductive layer and this first electrode and this second electrode to be bonded with each other, so that should go up piezo chips and the corresponding joint of this lower piezoelectric chip through a screen printing technology.
6. the manufacturing approach of piezoelectric actuated module as claimed in claim 5, wherein this conductive layer is to be a conducting resinl.
7. the manufacturing approach of piezoelectric actuated module as claimed in claim 1 in step (c) and (d), is respectively this second surface of piezo chips on this and this lower piezoelectric chip to be carried out cutting in regular turn through wafer cutter wherein.
8. the manufacturing approach of a piezoelectric ink jet head, it is to comprise the following steps:
(a) piezo chips reaches piezo chips in the formation one, and first surface of piezo chips and this lower piezoelectric chip is to have one first electrode and one second electrode respectively on this;
(b) through a conductive layer this first electrode and this second electrode are bonded with each other, so that should go up piezo chips and the corresponding winding of this lower piezoelectric chip;
(c) second surface to piezo chips on this equidistantly cuts;
(d) second surface of this lower piezoelectric chip is carried out equidistantly cutting with the second surface that should go up piezo chips the cutting of dislocation, to form the staggered up and down runner of a plurality of openings, to form a piezoelectric actuated module;
(e) on this second surface that should go up piezo chips and this lower piezoelectric chip of this piezoelectric actuated module, a upper cover plate and a lower cover are set respectively;
(f) in one first side of this piezoelectric actuated module one sealant is set, with the end of these a plurality of runners of sealing;
(g) in one second side of this piezoelectric actuated module one nozzle piece is set, has a plurality of jet orifice on this nozzle piece, it is to be connected with these a plurality of runners.
9. the manufacturing approach of piezoelectric ink jet head as claimed in claim 8, wherein in step (e), this upper cover plate and this lower cover are to be connected through the piezoelectric actuated module of a conducting resinl and this.
10. the manufacturing approach of piezoelectric ink jet head as claimed in claim 8; Wherein this upper cover plate and lower cover are to be respectively equipped with black liquid water conservancy diversion fork road on the corresponding respectively surface that is connected in this piezoelectric actuated module; This China ink liquid water conservancy diversion fork road is communicated with one and goes into black hole, is provided with black liquid and is guided in this piezoelectric actuated module runner.
11. the manufacturing approach of piezoelectric ink jet head as claimed in claim 8, wherein in step (f), the sealing layer is a silica gel material.
12. the manufacturing approach of piezoelectric ink jet head as claimed in claim 8, wherein in step (g), this nozzle piece is the corresponding winding of structure glue of sticking together medium through with piezoelectric actuated module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010282243.0A CN102398421B (en) | 2010-09-09 | 2010-09-09 | Piezoelectric actuator module and manufacturing method of piezoelectric inkjet head applicable to piezoelectric actuator module |
| US13/218,917 US8388115B2 (en) | 2010-09-09 | 2011-08-26 | Piezoelectric inkjet head structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010282243.0A CN102398421B (en) | 2010-09-09 | 2010-09-09 | Piezoelectric actuator module and manufacturing method of piezoelectric inkjet head applicable to piezoelectric actuator module |
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| CN102398421A true CN102398421A (en) | 2012-04-04 |
| CN102398421B CN102398421B (en) | 2014-05-21 |
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| CN1474750A (en) * | 2000-09-26 | 2004-02-11 | Droplet deposition apparatus | |
| CN1445090A (en) * | 2002-03-18 | 2003-10-01 | 精工爱普生株式会社 | Piezoelectric actuator, liquid spray nozzle containing it, piezoelectric element and its making method |
| CN101503025A (en) * | 2008-02-08 | 2009-08-12 | 精工爱普生株式会社 | Liquid ejecting head and liquid ejecting apparatus |
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