CN102403305A - USB (universal serial bus) device structure - Google Patents
USB (universal serial bus) device structure Download PDFInfo
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- CN102403305A CN102403305A CN2010102835695A CN201010283569A CN102403305A CN 102403305 A CN102403305 A CN 102403305A CN 2010102835695 A CN2010102835695 A CN 2010102835695A CN 201010283569 A CN201010283569 A CN 201010283569A CN 102403305 A CN102403305 A CN 102403305A
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- potted element
- substrate
- electronic component
- apparatus structure
- adhesive body
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Abstract
The invention relates to a USB (universal serial bus) device structure, which comprises a first packaging component (10) and at least one second packaging component (20). The first packaging component (10) includes at least one electronic component (12) which is attached to a substrate (11) and sealed in a first sealing glue body (15), each second packaging component (20) includes at least one electronic component (22) which is attached to a substrate (21) and sealed in a second sealing glue body (25), each second packaging component (20) can be completely and partially sealed by the corresponding first sealing glue body (15), a plurality of metal contacts (13) are arranged on the inner surface (111) of the substrate (11) of the first packaging component (10), a plurality of metal contacts (23) are arranged on the outer surface (212) of the substrate (21) of each second packaging component (20), and the metal contacts (13) of the first packaging component (10) electrically contact with the metal contacts (23) of the second packaging components (20). By the aid of the USB device structure, yield of products can be increased, client delivery term can be shortened, and manufacturing cost and material cost are reduced.
Description
Technical field
The present invention relates to a kind of USB apparatus structure, be meant especially a kind of difference in functionality or the chip that differs greatly to be divided into the USB apparatus structure that different package assemblings are made.
Background technology
Along with the arriving of cybertimes, impel speeding up that information shares, also quickened Information technology and popularized and progressive step.Like all lives of consumer extensively and profoundly such as electronic computer (computer), communication (Communications) and consumer electronics (Consumer-Electronics) products.
Wherein with storage device; Like carry-on dish, hard disk or other is main device with the flash memory, owing to have light, thin, short, little characteristic, possesses mobility highly; And its storage volume has increased to the Tbyte level capacity; And still have the trend that continues to increase, therefore on the purposes that information is shared, receive consumer's favor day by day.
With regard to storage device, difference in functionality or the big chip component of difference be arranged on have been become inevitablely in the substrate, and these variety classes chip components being interconnected each other is to be electrically connected through this substrate, and this substrate can use multilager base plate in addition.
Yet, in manufacture process, if during the poor electrical contact of a certain functional chip element, for example when the gold thread overstocked shortcoming of breasting the tape (wire-sweeping) and revealing gold thread that has easily that distributes.The then as easy as rolling off a log electrical characteristic of entire product that causes is undesired, and causes product to check and accept failure in detection-phase.
From the position that manufactures a product, the disqualification rate of product improves, then possibly need to postpone the client the term of delivery, increase the consuming time of manufacture process, the probability that need supplant other product of production line is very big, thereby causes the increase of manufacturing cost.In addition, utilize, therefore also caused the waste of material, improve Material Cost relatively because the product after the encapsulation can't take out normal electronic component reprocessing separately.
Summary of the invention
To the problems referred to above, main purpose of the present invention is to provide a kind of USB apparatus structure, and it can improve qualification rate, shortening delivery to customer time limit, the reduction manufacturing cost of product and reduce Material Cost.
For achieving the above object, a kind of USB apparatus structure provided by the present invention is characterized in that comprising: one first potted element 10, comprise at least one electronic component 12, and said electronic component 12 is attached on the substrate 11 and is sealed in one first adhesive body 15; At least one second potted element 20, wherein said second potted element 20 comprises at least one electronic component 22, and said electronic component 22 is attached on the substrate 21 and is sealed in one second adhesive body 25; Said second potted element 20 of wherein said first adhesive body, 15 sealings, and said second adhesive body 25 can be by encapsulation or part are packaged in said first adhesive body 15 fully; One inner surface 111 of the said substrate 11 of said first potted element 10 is provided with a plurality of hard contacts 13; One outer surface 212 of the said substrate 21 of said second potted element 20 is provided with a plurality of hard contacts 23, and the hard contact 13 of wherein said first potted element 10 electrically contacts with the hard contact 23 of said second potted element 20.
In the technical scheme of the invention described above, the electronic component 12 of said first potted element 10 is arranged at inner surface 111 or an outer surface 112 or its combination of said substrate 11.
The electronic component 12 of said first potted element 10 is at least one control element or at least one passive device.
The substrate 11 of said first potted element 10 is provided with a plurality of hard contacts 14 at its outer surface 112, and each said hard contact 14 is for being compatible with at least a data transmission interface in the advanced supplementary technology of universal serial bus, mini universal serial bus, micro universal serial bus or sequence.
The electronic component 22 of said second potted element 20 is arranged at inner surface 211 or outer surface 212 or its combination of said substrate 21.
The electronic component 22 of said second potted element 20 is at least one control element or at least one memory chip.
Said first adhesive body 15 forms for adopting pressing mold or some glue mode.
Said second adhesive body 25 forms for adopting pressing mold or some glue mode.
The composition of said first adhesive body 15 comprises epoxy resin, curing agent, catalyst, antiblaze and filler.
Said epoxy resin is bisphenol-A system, novolac epoxy resin Novolac epoxy, cyclic aliphatic epoxy resin or epoxidation butadiene.
Adopt technique scheme; The present invention can encapsulate two kinds of tool difference in functionalitys or the big chip component of difference at least in batches; After a potted element after the encapsulation to be confirmed (like the present invention's second potted element) electrical characteristic is normal; With another potted element (like the present invention's first potted element) electric connection, therefore have the effects such as qualification rate, shortening delivery to customer time limit, reduction manufacturing cost and reduction Material Cost that improve product again.
Description of drawings
Fig. 1 is the schematic perspective view of first and second enforcement kenel of the present invention;
Fig. 2 is the profile that the present invention first implements kenel;
Fig. 3 is the profile that the present invention second implements kenel;
Fig. 4 is the profile that the present invention the 3rd implements kenel;
Fig. 5 is the profile that the present invention the 4th implements kenel.
Embodiment
Lift following examples at present and combine accompanying drawing that structure of the present invention and effect are elaborated.
Like Fig. 1, shown in Figure 2; For the present invention first implements a kind of USB apparatus structure that kenel provided; It comprises one first potted element 10 and at least one second potted element 20, and this enforcement kenel describes with one first potted element 10 and one second potted element 20.First potted element 10 can be chip on board (Chip-On-Board; COB) encapsulated type; Wherein first potted element 10 comprises at least one electronic component 12, and it is attached on the substrate 11, particularly; Substrate 11 has an inner surface 111 and an outer surface 112; Wherein electronic component 12 is arranged at the inner surface 111 of substrate 11, and bonding wire that electronic component 12 routings capable of using form or chip bonding or surface mount technology are electrically connected to substrate 11 (among the figure not formula), and electronic component 12 can be at least one control element or at least one passive device.
Second potted element 20 is installed on first potted element 10, and in addition, the inner surface 111 of first potted element, 10 substrates 11 can be provided with a plurality of hard contacts 13, and it is used to electrically contact second potted element 20.
In addition; The outer surface 112 of first potted element, 10 substrates 11 also can be provided with a plurality of hard contacts 14; It can be at least a data transmission interface that is compatible to the advanced supplementary technology of universal serial bus (USB), mini universal serial bus (Mini USB), micro universal serial bus (Micro USB) or sequence (e-SATA), and this enforcement kenel has the universal serial bus of being compatible with (USB) connector as explanation with hard contact 14.In addition, substrate 11 is generally a kind of multilayer board of high density double-side conduction, and inside is formed with circuit (among the figure not formula), can be used as electrical passing interface, so that each hard contact 14 is electrically connected with electronic component 12 through substrate 11.The present invention can electrically contact with an electronic computer (computer) through the data transmission interface of each hard contact 14.
Second potted element 20 comprises at least one electronic component 22; It is attached on the substrate 21; Substrate 21 comprises an inner surface 211 and an outer surface 212; Wherein electronic component 22 can be arranged on the inner surface 211 of substrate 21, and bonding wire or chip bonding technology that electronic component 22 routings capable of using form are electrically connected to substrate 21 (not shown), and electronic component 22 can be at least one control element or at least one memory chip.In addition, the outer surface 212 of substrate 21 also can be provided with a plurality of hard contacts 23, and it is used to electrically contact first potted element 10.Particularly, substrate 21 is generally a kind of multilayer board of high density double-side conduction, and inside is formed with the circuit (not shown), can be used as electrical passing interface, so that each hard contact 23 is electrically connected on electronic component 22 through substrate 21.Execution mode is preferably, and the electronic component 22 of second potted element 20 can be made the reliable and stable degree of time spent to guarantee electronic component 22 by 25 sealings of one second adhesive body.
For the qualification rate that improves product, shorten the delivery to customer time limit, reduce manufacturing cost and reduce Material Cost, therefore will at least two kinds have difference in functionality or the big chip component of difference encapsulates in batches, to reach the object of the invention.Therefore; With this enforcement kenel; After the electrical characteristic of confirming second potted element 20 is normal, a plurality of hard contacts 23 of second potted element, 20 substrates, 21 outer surfaces 212 are electrically contacted with a plurality of hard contacts 13 of first potted element, 10 substrates, 11 inner surfaces 111.Execution mode is preferably; Substrate 11 inner surfaces 111 at first potted element 10 form one first adhesive body 15; In it is sealed in the electronic component 12 of first potted element 10 and second potted element 20; And second adhesive body 25 can encapsulate fully or part is packaged in first adhesive body 15, to form a complete integrated circuit modules.In this enforcement kenel; First adhesive body 15 and second adhesive body 25 can adopt pressing mold (molding) mode to form; Main component comprises but is not limited to epoxy resin (Epoxy), curing agent (hardener), catalyst (Catalyst), antiblaze (Flame retardant) and filler (Filler) etc., and wherein epoxy resin can be but is not limited to bisphenol-A system (Bisphenol-A), novolac epoxy resin (Novolac epoxy), cyclic aliphatic epoxy resin (Cyclicaliphatic), epoxidation butadiene etc.; Also can adopt a glue (glob) mode to form, main component comprises but is not limited to epoxy resin and catalyst etc.
After a plurality of hard contacts 14 of substrate 11 outer surfaces 112 of first potted element 10 were plugged in electronic computer, the present invention can carry out digital content delivery, reception and actions such as newly-increased deletion or modification with this electronic computer.
Fig. 1, Fig. 3 implement the sketch map of kenel for the present invention second; Because Fig. 1 is a schematic perspective view of the present invention; And first and second stereogram of implementing kenel all can use same graphic describing, so Fig. 1 can implement the schematic perspective view of kenel simultaneously as first, second.
Wherein, implement a kind of USB apparatus structure of having explained among kenel and Fig. 1, Fig. 2 in the present invention first, in Fig. 1 and Fig. 3 with identical symbology or omit no longer narration.Implement like Fig. 1, Fig. 3, the difference that the present invention second implements the kenel and the first enforcement kenel is that the electronic component 22 of second potted element 20 can be arranged on the inner surface 211 and the outer surface 212 of substrate 21.In addition, electronic component 22 also can only be arranged at the inner surface 211 (first implement kenel) of substrate 21 or only be arranged at the outer surface 212 (not being shown among the figure) of substrate 21.
Fig. 1, Fig. 4 implement the sketch map of kenel for the present invention the 3rd; Because Fig. 1 is a schematic perspective view of the present invention; And first, second and third implement kenel stereogram all can use same graphic describing, so Fig. 1 can be simultaneously as first, second and third implement kenel schematic perspective view.
Wherein, implement a kind of USB apparatus structure of having explained among kenel and Fig. 1, Fig. 2 first, in Fig. 1 and Fig. 4 with identical symbology or omit no longer narration.Like Fig. 1 and shown in Figure 4, the difference that the 3rd enforcement kenel of the present invention and first is implemented kenel is that the electronic component 12 of first potted element 10 can be arranged on the inner surface 111 and the outer surface 112 of substrate 11.In addition, electronic component 12 also can only be arranged on the inner surface 111 (first implement kenel) of substrate 11 or only be arranged at the outer surface 112 (not being shown among the figure) of substrate 11.
Fig. 1, Fig. 5 implement the sketch map of kenel for the present invention the 4th; Because Fig. 1 is a schematic perspective view of the present invention; And the first, second, third and the 4th implement kenel stereogram all can use same graphic describing, so Fig. 1 can be simultaneously as the first, second, third and the 4th implement kenel schematic perspective view.
Wherein, implement a kind of USB apparatus structure of having explained among kenel and Fig. 1, Fig. 3 second, in Fig. 1 and Fig. 5 with identical symbology or omit no longer narration.Like Fig. 1 and shown in Figure 5, the difference that the 4th enforcement kenel of the present invention and second is implemented kenel is that the electronic component 12 of first potted element 10 can be arranged on the inner surface 111 and the outer surface 112 of substrate 11.In addition, electronic component 12 also can only be arranged on the inner surface 111 (first implement kenel) of substrate 11 or only be arranged at the outer surface 112 (not being shown among the figure) of substrate 11.
Therefore; Implementing kenel by the present invention first to fourth can know; The electronic component 12 of first potted element 10 is positioned at inner surface 111 or outer surface 112 or its combination of substrate 11; And the electronic component 22 of second potted element 20 is positioned at inner surface 211 or outer surface 212 or its combination of substrate 21, is the consideration of circuit arrangement or overall architecture to be planned at the beginning of design with this product.Therefore, the present invention should not limit to scope of patent protection of the present invention with the electronic component arrangements position of first potted element or second potted element.
In sum; The present invention encapsulates two kinds of tool difference in functionalitys or the big chip component of difference at least in batches; After a potted element after the encapsulation to be confirmed (like the present invention's second potted element) electrical characteristic is normal; Electrically connect with another potted element (like the present invention's first potted element) again, make the present invention have the effects such as qualification rate, shortening delivery to customer time limit, reduction manufacturing cost and reduction Material Cost of raising product.
Yet; Disclosed first to fourth of specification of the present invention implemented kenel and is merely preferable enforcement kenel of the present invention; Can not be used for limiting the present invention; Those skilled in the art is not breaking away within spirit of the present invention and description, claims or the accompanying drawing scope, and the various changes that the foregoing description is carried out must be included in the scope of patent protection of the present invention with modification.
Claims (10)
1. USB apparatus structure is characterized in that comprising:
One first potted element (10) comprises at least one electronic component (12), and said electronic component (12) is attached to a substrate (11) and goes up and be sealed in one first adhesive body (15);
At least one second potted element (20), wherein said second potted element (20) comprises at least one electronic component (22), and said electronic component (22) is attached to a substrate (21) and goes up and be sealed in one second adhesive body (25); Wherein said first adhesive body (15) sealing said second potted element (20), and said second adhesive body (25) can be by encapsulation or part are packaged in said first adhesive body (15) fully; One inner surface (111) of the said substrate (11) of said first potted element (10) is provided with a plurality of hard contacts (13); One outer surface (212) of the said substrate (21) of said second potted element (20) is provided with a plurality of hard contacts (23), and the hard contact (13) of wherein said first potted element (10) electrically contacts with the hard contact (23) of said second potted element (20).
2. a kind of USB apparatus structure as claimed in claim 1 is characterized in that: the electronic component (12) of said first potted element (10) is arranged at inner surface (111) or an outer surface (112) or its combination of said substrate (11).
3. a kind of USB apparatus structure as claimed in claim 1 is characterized in that: the electronic component (12) of said first potted element (10) is at least one control element or at least one passive device.
4. a kind of USB apparatus structure as claimed in claim 2; It is characterized in that: the substrate (11) of said first potted element (10) is provided with a plurality of hard contacts (14) at its outer surface (112), and each said hard contact (14) is for being compatible with at least a data transmission interface in the advanced supplementary technology of universal serial bus, mini universal serial bus, micro universal serial bus or sequence.
5. a kind of USB apparatus structure as claimed in claim 1 is characterized in that: the electronic component (22) of said second potted element (20) is arranged at inner surface (211) or outer surface (212) or its combination of said substrate (21).
6. a kind of USB apparatus structure as claimed in claim 1 is characterized in that: the electronic component (22) of said second potted element (20) is at least one control element or at least one memory chip.
7. a kind of USB apparatus structure as claimed in claim 1 is characterized in that: said first adhesive body (15) forms for adopting pressing mold or some glue mode.
8. a kind of USB apparatus structure as claimed in claim 1 is characterized in that: said second adhesive body (25) forms for adopting pressing mold or some glue mode.
9. a kind of USB apparatus structure as claimed in claim 1 is characterized in that: the composition of said first adhesive body (15) comprises epoxy resin, curing agent, catalyst, antiblaze and filler.
10. a kind of USB apparatus structure as claimed in claim 9 is characterized in that: said epoxy resin is bisphenol-A system, novolac epoxy resin, cyclic aliphatic epoxy resin or epoxidation butadiene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102835695A CN102403305A (en) | 2010-09-13 | 2010-09-13 | USB (universal serial bus) device structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102835695A CN102403305A (en) | 2010-09-13 | 2010-09-13 | USB (universal serial bus) device structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102403305A true CN102403305A (en) | 2012-04-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102835695A Pending CN102403305A (en) | 2010-09-13 | 2010-09-13 | USB (universal serial bus) device structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102403305A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5617297A (en) * | 1995-09-25 | 1997-04-01 | National Semiconductor Corporation | Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards |
| CN1468177A (en) * | 2000-10-02 | 2004-01-14 | ���µ�����ҵ��ʽ���� | Card type recording medium and production method therefor |
| US7269004B1 (en) * | 2005-04-21 | 2007-09-11 | Super Talent Electronics, Inc. | Low-profile USB device |
| US20100220966A1 (en) * | 2009-02-27 | 2010-09-02 | Kevin Wallace Bennett | Reliability Multimode Optical Fiber |
-
2010
- 2010-09-13 CN CN2010102835695A patent/CN102403305A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5617297A (en) * | 1995-09-25 | 1997-04-01 | National Semiconductor Corporation | Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards |
| CN1468177A (en) * | 2000-10-02 | 2004-01-14 | ���µ�����ҵ��ʽ���� | Card type recording medium and production method therefor |
| US7269004B1 (en) * | 2005-04-21 | 2007-09-11 | Super Talent Electronics, Inc. | Low-profile USB device |
| US20100220966A1 (en) * | 2009-02-27 | 2010-09-02 | Kevin Wallace Bennett | Reliability Multimode Optical Fiber |
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Application publication date: 20120404 |