CN102455406A - Switching test device for electronic component - Google Patents
Switching test device for electronic component Download PDFInfo
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- CN102455406A CN102455406A CN2010105281484A CN201010528148A CN102455406A CN 102455406 A CN102455406 A CN 102455406A CN 2010105281484 A CN2010105281484 A CN 2010105281484A CN 201010528148 A CN201010528148 A CN 201010528148A CN 102455406 A CN102455406 A CN 102455406A
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- motherboard
- test
- testing apparatus
- electronic component
- processor
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Abstract
The invention discloses a switching test device for an electronic component. The device comprises a box assembly, a plurality of first mainboard assemblies and a processor, wherein the first mainboard assemblies are arranged in the box assembly; each first mainboard assembly comprises a mainboard, a first main socket, a switching plate, a plurality of testing sockets and a center processor; the mainboard is arranged in the box assembly vertically; the first main socket is arranged on the mainboard and is electrically connected with the mainboard; the switching plate is electrically connected with the first main socket and is vertical to the mainboard plate in essence; the testing socket is arranged on the switching plate; the center processor is arranged on the mainboard and is electrically connected with the mainboard; and the processor inserts the plurality of electronic components into the testing sockets along the vertical direction so as to perform a test and pulls out the electronic components after the test is finished. By using the switching test device, more testing capacity can be created in a limited space, and the test cost can be reduced effectively.
Description
Technical field
The present invention relates to a kind of testing apparatus, relate in particular to a kind of switching formula testing apparatus of electronic component.
Background technology
The method of testing of the integrated circuit of traditional memory module all is the testing apparatus through specialty, utilizes artificial mode to carry out test.For example, can integrated circuit be inserted on the special-purpose integrated circuit testing circuit board, utilize the testing circuit board test of starting shooting again, watch test result, according to test result the memory module of testing classified again by the mode of manual work.
Though can come action that integrated circuit is plugged through robotic arm, the integrated circuit testing circuit board must level be put, to let robotic arm can integrated circuit be inserted into the slot on the integrated circuit testing circuit board.Yet the integrated circuit testing circuit board needs modules such as central processing unit, radiating module, display module, so accounted for sizable horizontal zone.If will test to numerous integrated circuit; Then must utilize numerous integrated circuit testing circuit boards, and these integrated circuit testing circuit boards can only level be put, and have occupied sizable space like this; The miniaturization of unfavorable test site, thereby increased testing cost.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of switching formula testing apparatus of electronic component, and reach the purpose of automatic test, save the test space and reduce testing cost.
For reaching above-mentioned purpose, the present invention provides a kind of switching formula testing apparatus of electronic component, and it comprises a box assembly, a plurality of first motherboard assembly and a processor.The first motherboard assembly is arranged in the box assembly.Each first motherboard assembly comprises a motherboard, one first baseplug, a card extender, a plurality of test jack and a central processing unit.Motherboard erectly is arranged in the box assembly.First baseplug is arranged on the motherboard, and is electrically connected to motherboard.Card extender is electrically connected to first baseplug, and in fact perpendicular to motherboard.Test jack is arranged on the card extender.Central processing unit is arranged on the motherboard, and is electrically connected to motherboard.Processor is inserted into a plurality of electronic components in these test jacks testing along a vertical direction respectively, and after test finishes, these electronic components is extracted.
Through above-mentioned switching formula testing apparatus, can under limited space, create more tested productivity, and effectively reduce testing cost.
For letting the foregoing of the present invention can be more obviously understandable, hereinafter is special lifts a preferred embodiment, and cooperates appended graphicly, elaborates as follows.
Description of drawings
Accompanying drawing described herein is used to provide further understanding of the present invention, constitutes the application's a part, does not constitute qualification of the present invention.In the accompanying drawings:
Fig. 1 shows the overall schematic according to the switching formula testing apparatus of first embodiment of the invention;
The partial schematic diagram of the switching formula testing apparatus of Fig. 2 displayed map 1;
The sectional perspective synoptic diagram of the switching formula testing apparatus of Fig. 3 displayed map 1;
Fig. 4 shows the cut-open view according to the location pressing mechanism of second embodiment of the invention;
Fig. 5 shows the partial schematic diagram according to the switching formula testing apparatus of second embodiment of the invention;
Fig. 6 and Fig. 7 show the partial schematic diagram according to the switching formula testing apparatus of second embodiment of the invention;
Fig. 8 shows the annexation according to processor of the present invention, power supply unit and motherboard.
Drawing reference numeral:
DV: vertical direction
1: testing apparatus
10: box assembly
10 ': additional box assembly
12: base
14: loam cake
16: temperature control module
17: well heater
18: the space
20: the first motherboard assemblies
21: motherboard
22: the first baseplugs
23: the second baseplugs
24: card extender
26: test jack
28: central processing unit
29A: radiator fan
29B: display card
30: processor
31: pipe-hanging hook
32: robotic arm
40: power supply unit
50: test preceding working area
51: test preceding storage area
55: rough sort district, test back
56: disaggregated classification district, test back
60: the second motherboard assemblies
70: the location pressing mechanism
71: the first location structures
72: the second location structures
73: briquetting
74: pressing mechanism
75: the second pipe-hanging hooks
80: board
90: oil hydraulic cylinder
95: the oil hydraulic cylinder pipe-hanging hook
100: electronic component
Embodiment
For making the object of the invention, technical scheme and advantage clearer, the embodiment of the invention is explained further details below in conjunction with accompanying drawing.At this, illustrative examples of the present invention and explanation thereof are used to explain the present invention, but not as to qualification of the present invention.
Fig. 1 shows the overall schematic according to the switching formula testing apparatus of first embodiment of the invention.The partial schematic diagram of the switching formula testing apparatus of Fig. 2 displayed map 1.The sectional perspective synoptic diagram of the switching formula testing apparatus of Fig. 3 displayed map 1.
To shown in Figure 3, the switching formula testing apparatus 1 of the electronic component of present embodiment comprises a box assembly 10, a plurality of first motherboard assembly 20 and a processor (Handler) 30 like Fig. 1.Certainly, the switching formula testing apparatus 1 of electronic component also can more comprise a plurality of additional box assemblies 10 '.Additional box assembly 10 ' function class be similar to box assembly 10, can increase the production capacity of test like this.Below only do explanation with the internal structure of single box assembly 10.
The first motherboard assembly 20 is arranged in the box assembly 10.Each first motherboard assembly 20 comprises a motherboard 21, one first baseplug 22, a card extender 24, a test jack 26 and a central processing unit 28.Motherboard 21 is the motherboard from each label that can buy on the market for example, and it erectly is arranged in the box assembly 10.Thus, can buy the particular host plate according to client's needs and carry out the test of integrated circuit, also can use special motherboard to test certainly.First baseplug 22 is arranged on the motherboard 21, and is electrically connected to motherboard 21.Card extender 24 is electrically connected to first baseplug 22, and in fact perpendicular to motherboard 21.Test jack 26 is arranged on the card extender 24.Central processing unit 28 is arranged on the motherboard 21, and is electrically connected to motherboard 21.
In addition, aforementioned testing apparatus 1 can more comprise the preceding storage area in the preceding working area of a test 50, a test 51, rough sort district, a test back 55 and disaggregated classification district, a test back 56.Processor 30 is tested electronic component 100 and is inserted into the test jack 26 after take out in preceding working area 50 from these.Processor 30 moves to rough sort district, test back 55 according to these electronic components 100 that a plurality of test results (being normal or undesired for example) finish test respectively.These electronic components 100 can leave the preceding storage area 51 of test earlier in before test, and can be stored disaggregated classification district 56 after test after the test.
It should be noted that to provide another processor (not shown) so that these electronic components 100 are moved to the preceding working area 50 of test from testing preceding storage area 51, or moves to disaggregated classification district, test back 56 from testing rough sort district, back 55.Certainly, also can carry out aforementioned activities by processor 30.
In addition, each first motherboard assembly 20 can more comprise one second baseplug 23, a radiator fan 29A and a display card 29B.Second baseplug 23 is arranged on the motherboard 21, and is electrically connected to motherboard 21.Certainly, can utilize another card extender to be connected to second baseplug 23, to carry out the test of more electronic component 100.Radiator fan 29A is arranged on the central processing unit 28.Display card 29B is arranged on the motherboard 21.The user can be connected to display card 29B to let the tester observe test status and result with the display screen (not shown).Yet display card 29B is not to be necessary element, because the data of all test processs can and be handled by processor 30 monitoring.
Fig. 4 shows the cut-open view according to the location pressing mechanism of second embodiment of the invention.As shown in Figure 4, the testing apparatus of present embodiment is similar to first embodiment, and difference is that testing apparatus more comprises a location pressing mechanism 70, is arranged on the card extender 24, comes localized electron part 100 and electronic component 100 is pressed into to test jack 26.Location pressing mechanism 70 can be different from processor 30, can also combine with processor 30.Location pressing mechanism 70 comprises one first location structure 71, one second location structure 72, a briquetting 73, a pressing mechanism 74 and one second pipe-hanging hook 75.First location structure 71 is arranged in the test jack 26 with aiming at.Second location structure 72 is arranged on first location structure 71, in order to localized electron part 100 with aiming at.Briquetting 73 is pressed into electronic component 100 to test jack 26.Pressing mechanism 74 is a spring for example, in order to force in briquetting 73.Pressing mechanism 74 is installed on second pipe-hanging hook 75 movably.
Fig. 5 shows the partial schematic diagram according to the switching formula testing apparatus of second embodiment of the invention.As shown in Figure 5, present embodiment is similar to first embodiment, and difference is box assembly 10 and additional box assembly 10 ' be provided with in the board 80, and box assembly 10 and these additional box assemblies 10 ' can be drawn out of board 80 so that keep in repair.
Fig. 6 and Fig. 7 show the partial schematic diagram according to the switching formula testing apparatus of second embodiment of the invention.Like Fig. 6 and shown in Figure 7, the box assembly 10 of the testing apparatus of present embodiment comprises a base 12, a loam cake 14 and a temperature control module 16.These first motherboard assemblies 20 are fixed in the base 12.Loam cake 14 can be moved with covering base 12 and these first motherboard assemblies 20.Temperature control module 16 is arranged in loam cake 14 and the base 12 formed spaces 18, controls the temperature in space 18.In an example, temperature control module 16 comprises a well heater 17.In another example, temperature control module can the air inclusion generator, in order to provide in gas to the space 18 with the control temperature.After processor 30 had been planted electronic component 100, processor 30 was removed, then the oil hydraulic cylinder 90 on the oil hydraulic cylinder pipe-hanging hook 95 with loam cake 14 down push away with base 12 closures, and then can carry out the test of some specified temp according to client's needs.
Fig. 8 shows the annexation according to processor of the present invention, power supply unit and motherboard.As shown in Figure 8; Testing apparatus of the present invention can more comprise a power supply unit 40; Be electrically connected to processor 30; Processor 30 is electrically connected to motherboard 21, and processor 30 is being inserted into electronic component 100 in the test jack 26 back turn-on power supply 40 and motherboard 21 testing, and finishes back deenergization supply 40 and motherboard 21 to remove motherboard 21 in test.Therefore, all test processs can be carried out or monitored by processor 30, and tester's demand number can significantly reduce.
Below specify testing process.At first, processor 30 is inserted into the test jack 26 from testing preceding working area 50 extracting electronic components 100, then with motherboard 21 energisings (start); Whether the signal that reads motherboard 21 is normal; If note abnormalities, then to motherboard 21 outages (shutdown), the electronic component 100 that more renews is tested.If the signal of motherboard 21 is normal, then repeat said procedure, to continue that other motherboards 21 in the box assembly 10 are inserted electronic component 100.The time of mainboard starting test is very long usually, is 1500 seconds to 3000 seconds or longer for example.So processor 30 can continue to utilize other additional box assemblies 10 ' motherboard 21 carry out the test of other electronic components 100, be the repetition above-mentioned steps equally.By the time behind all box assemblies 10 ' all stuck with electronic component 100; Judge whether the test duration arrives; Then continue if not to wait for; If then read the signal of each motherboard 21, whether normal with the test result of judging electronic component 100, and according to test result electronic component 100 is extracted and to be delivered to rough sort district, test back 55.In addition, can electronic component 100 be carried to disaggregated classification district, test back 56 from testing rough sort district, back 55 through another processor.
Through above-mentioned switching formula testing apparatus; Because the effect of card extender 24; Make processor 30 can electronic component 100 be inserted in the test jack 26 along vertical direction, and the horizontal-extending of card extender 24 is small-sized, so the spacing between the vertical type motherboard 21 can effectively be dwindled.Therefore, can under limited space, create more tested productivity, and effectively reduce testing cost.
The specific embodiment that in the detailed description of preferred embodiment, is proposed is only in order to convenient explanation technology contents of the present invention; But not with narrow sense of the present invention be limited to the foregoing description; In the situation that does not exceed spirit of the present invention and claim scope; The many variations of being done is implemented, and all belongs to scope of the present invention.
Claims (11)
1. the switching formula testing apparatus of an electronic component is characterized in that, described switching formula testing apparatus comprises:
One box assembly;
A plurality of first motherboard assemblies are arranged in the said box assembly, and each said first motherboard assembly comprises:
One motherboard erectly is arranged in the said box assembly;
One first baseplug is arranged on the said motherboard, and is electrically connected to said motherboard;
One card extender is electrically connected to said first baseplug, and perpendicular to said motherboard;
A plurality of test jacks are arranged on the said card extender; And
One central processing unit is arranged on the said motherboard, and is electrically connected to said motherboard; And
One processor is inserted into a plurality of electronic components in described a plurality of test jack testing along a vertical direction respectively, and after test finishes, described a plurality of electronic components is extracted.
2. testing apparatus as claimed in claim 1 is characterized in that, described switching formula testing apparatus more comprises:
One power supply unit; Be electrically connected to said processor; Said processor is electrically connected to said motherboard; Said processor is being inserted into said electronic component in the said test jack back said power supply unit of conducting and said motherboard testing, and breaks off said power supply unit and said motherboard to remove said motherboard in the test back that finishes.
3. testing apparatus as claimed in claim 1 is characterized in that, described switching formula testing apparatus more comprises:
Rough sort district, one test back, described a plurality of electronic components that said processor finishes test respectively according to a plurality of test results move to rough sort district, said test back.
4. testing apparatus as claimed in claim 1 is characterized in that, described switching formula testing apparatus more comprises:
The preceding working area of one test, said processor is inserted into said electronic component the said test jack after take out in the preceding working area of said test.
5. testing apparatus as claimed in claim 1 is characterized in that, said box assembly comprises:
One base, described a plurality of first motherboard assemblies are fixed in the said base;
One loam cake, it can be moved to cover said base and described a plurality of first motherboard assembly; And
One temperature control module is arranged in the formed space of said loam cake and said base, controls the temperature in said space.
6. testing apparatus as claimed in claim 5 is characterized in that said temperature control module comprises a well heater.
7. testing apparatus as claimed in claim 1 is characterized in that said processor once grasps a plurality of of described electronic component.
8. testing apparatus as claimed in claim 1 is characterized in that, each said first motherboard assembly more comprises:
One radiator fan is arranged on the said central processing unit; And
One display card is arranged on the said motherboard.
9. testing apparatus as claimed in claim 1; It is characterized in that; Described switching formula testing apparatus more comprises a plurality of additional box assemblies; Said box assembly and described a plurality of additional box assembly are provided with in the board, and said box assembly and described a plurality of additional box assembly can be drawn out of said board so that keep in repair.
10. testing apparatus as claimed in claim 1 is characterized in that, described switching formula testing apparatus more comprises:
One location pressing mechanism is provided with on the said card extender, locatees said electronic component and said electronic component is pressed into to said test jack.
11. testing apparatus as claimed in claim 10 is characterized in that, said location pressing mechanism comprises:
One first location structure is arranged in the said test jack with aiming at;
One second location structure is arranged on said first location structure with aiming at, locatees said electronic component;
One briquetting is pressed into said electronic component to said test jack;
One pressing mechanism forces in said briquetting; And
One second pipe-hanging hook, said pressing mechanism are installed on said second pipe-hanging hook movably.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010528148.4A CN102455406B (en) | 2010-11-01 | 2010-11-01 | Switching test device for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010528148.4A CN102455406B (en) | 2010-11-01 | 2010-11-01 | Switching test device for electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102455406A true CN102455406A (en) | 2012-05-16 |
| CN102455406B CN102455406B (en) | 2014-11-05 |
Family
ID=46038817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010528148.4A Expired - Fee Related CN102455406B (en) | 2010-11-01 | 2010-11-01 | Switching test device for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102455406B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109031009A (en) * | 2018-08-17 | 2018-12-18 | 深圳市金邦科技发展有限公司 | Using the memory body mould group intelligent checking system of robotic arm |
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| US6357023B1 (en) * | 1998-04-08 | 2002-03-12 | Kingston Technology Co. | Connector assembly for testing memory modules from the solder-side of a PC motherboard with forced hot air |
| CN1479873A (en) * | 2000-12-07 | 2004-03-03 | ��ʽ���簮������� | Socket for electronic component test and electronic component test apparatus using the socket |
| US20040078698A1 (en) * | 2000-09-13 | 2004-04-22 | Kingston Technology Corp. | Robotic Memory-Module Tester Using Adapter Cards for Vertically Mounting PC Motherboards |
| CN2845101Y (en) * | 2005-10-12 | 2006-12-06 | 资重兴 | Memorizer test device and use the memory test machine of this memorizer test device |
| CN101794624A (en) * | 2009-02-01 | 2010-08-04 | 金士顿科技（上海）有限公司 | Failure diagnosis of serial addressing memory module of personable computer mainboard |
| CN201876524U (en) * | 2010-11-01 | 2011-06-22 | 维瀚科技有限公司 | Adapting-type testing equipment for electronic part |
| CN102456416A (en) * | 2010-10-28 | 2012-05-16 | 维瀚科技有限公司 | Vertical test equipment for electronic assemblies |
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2010
- 2010-11-01 CN CN201010528148.4A patent/CN102455406B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6357023B1 (en) * | 1998-04-08 | 2002-03-12 | Kingston Technology Co. | Connector assembly for testing memory modules from the solder-side of a PC motherboard with forced hot air |
| US20040078698A1 (en) * | 2000-09-13 | 2004-04-22 | Kingston Technology Corp. | Robotic Memory-Module Tester Using Adapter Cards for Vertically Mounting PC Motherboards |
| CN1479873A (en) * | 2000-12-07 | 2004-03-03 | ��ʽ���簮������� | Socket for electronic component test and electronic component test apparatus using the socket |
| CN2845101Y (en) * | 2005-10-12 | 2006-12-06 | 资重兴 | Memorizer test device and use the memory test machine of this memorizer test device |
| CN101794624A (en) * | 2009-02-01 | 2010-08-04 | 金士顿科技（上海）有限公司 | Failure diagnosis of serial addressing memory module of personable computer mainboard |
| CN102456416A (en) * | 2010-10-28 | 2012-05-16 | 维瀚科技有限公司 | Vertical test equipment for electronic assemblies |
| CN201876524U (en) * | 2010-11-01 | 2011-06-22 | 维瀚科技有限公司 | Adapting-type testing equipment for electronic part |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109031009A (en) * | 2018-08-17 | 2018-12-18 | 深圳市金邦科技发展有限公司 | Using the memory body mould group intelligent checking system of robotic arm |
| CN109031009B (en) * | 2018-08-17 | 2020-12-29 | 深圳市金邦科技发展有限公司 | Intelligent detection system of memory module using robot |
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| Publication number | Publication date |
|---|---|
| CN102455406B (en) | 2014-11-05 |
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Granted publication date: 20141105 Termination date: 20151101 |
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