CN102456968A - Electric connector combination and manufacturing method for same - Google Patents
Electric connector combination and manufacturing method for same Download PDFInfo
- Publication number
- CN102456968A CN102456968A CN2010105282773A CN201010528277A CN102456968A CN 102456968 A CN102456968 A CN 102456968A CN 2010105282773 A CN2010105282773 A CN 2010105282773A CN 201010528277 A CN201010528277 A CN 201010528277A CN 102456968 A CN102456968 A CN 102456968A
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- Prior art keywords
- accepting hole
- tin
- electric connector
- sidewall
- connector combination
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Abstract
The invention provides an electric connector combination used for connecting a chip module to a circuit board. The electric connector combination comprises an insulating body with a plurality of receiving holes and filling tin balls, wherein the receiving holes penetrate through the upper and lower surfaces of the insulating body respectively, and each receiving hole comprises an upper receiving hole close to the upper surface of the receiving hole and a lower receiving hole slanting downwards from the upper receiving hole and close to the lower surface of the receiving hole; the distance between the upper receiving holes is less than the distance between the lower receiving holes; the filling tin balls are filled in the receiving holes and then melted with heat to form tin columns having an electricity-conducting property; and the upper surfaces of the tin columns are located in the upper receiving holes, and the lower surfaces of the tin columns project out of the lower receiving holes. The electric connector combination disclosed by the invention can be used for connecting a chip module and a circuit board with different distances of electric conductors.
Description
[technical field]
The present invention relates to a kind of electric connector combination, refer to a kind of electric connector combination that chip module is electrically connected to circuit board especially.
[background technology]
United States Patent (USP) is announced No. 7674113 and has been disclosed a kind of electric connector combination; It comprises insulating body; Be provided with some metal tubes in the said insulating body; The tin ball of chip module and the tin ball of circuit board can be contained in the upper/lower terminal of metal tube simultaneously, and electrically connect with metal tube, thereby realize the electric connection between chip module and the circuit board.
But there is following defective at least in above-mentioned electric connector combination; If the spacing between the pad of spacing between the tin ball of chip module or circuit board by before when identical spacing becomes different spacings up and down; Above-mentioned accepting hole can't promptly be accommodated the phenomenon that the tin ball of chip module is connected with the pad of circuit board again simultaneously, and then can have influence on the electric connection between chip module and the circuit board.
Therefore, necessary existing electric connector is made up improved to overcome the aforementioned disadvantages of prior art.
[summary of the invention]
The object of the present invention is to provide a kind of electric connector combination, this electric connector combination can electrically connect with the chip module and the circuit board of different spacing.
The objective of the invention is to realize: a kind of electric connector combination through following technical scheme; Be used to connect chip module to circuit board; It comprises: the insulating body insulating body that is provided with some accepting holes; Said accepting hole runs through the upper and lower surface of insulating body respectively; Said accepting hole comprises near the last accepting hole of accepting hole upper surface and downward-sloping and near the following accepting hole of accepting hole lower surface from last accepting hole, and the said spacing that goes up accepting hole is less than the spacing of accepting hole down, and also is provided with the tin post of combining closely with its sidewall in the accepting hole.
Said tin post is formed by the some filling tin balls that are filled in the accepting hole of heat fused, and said tin post is blended in fully in the accepting hole and combines together with the sidewall of accepting hole, forms conducting medium.The sidewall of said accepting hole is irregular setting; The surface electrical of sidewall is coated with copper plate; The sidewall of said accepting hole comprises vertical shape sidewall that is positioned at upper/lower terminal and the skewed sidewall that connects upper and lower two vertical shape sidewalls; The said accepting hole of going up is provided with proportional spacing, and following accepting hole is provided with proportional spacing, and different with the spacing of last accepting hole.Said chip module is provided with the tin ball, and circuit board comprises pad, and the last accepting hole of said accepting hole is accommodated the tin ball of chip module.Said tin post is provided with and is positioned at the top that accepting hole and its upper surface are the plane, and the tin ball of chip module contacts with the top upper surface of tin post, the tin post also be provided with protrude from down accepting hole and be the protrusion sphere with the contacted bottom of the pad of circuit board.
The object of the invention can also be realized through another kind of technical scheme: a kind of manufacturing approach of electric connector combination; Step is following: a. provides an insulating body; It comprises matrix and is formed at the some accepting holes on the matrix; The sidewall of accepting hole is irregular setting, and accepting hole comprises near the last accepting hole of body upper surface and downward-sloping and near the following accepting hole of matrix lower surface from last accepting hole; B. the electroplating surface copper plate of said sidewall; C. some diameters are bigger filling tin ball is contained in the following accepting hole of accepting hole, and the filling tin ball that some diameters are little places accepting hole from the opening of last accepting hole; D. heat is heated the filling tin ball that is arranged in accepting hole and is melted back formation tin post.
The adjacent spacing of last accepting hole of the accepting hole of said matrix is different with the adjacent spacing of following accepting hole, and the size in the following accepting hole is greater than the size of last accepting hole.Said accepting hole is provided with sidewall, and the sidewall of said accepting hole comprises vertical shape sidewall that is positioned at upper/lower terminal and the skewed sidewall that connects upper and lower two vertical shape sidewalls.Said chip module is provided with the tin ball, and circuit board comprises pad, and the last accepting hole of said accepting hole is accommodated the tin ball of chip module.Said tin post is provided with and is positioned at the top that accepting hole and its upper surface are the plane, and the tin ball of chip module also contacts with the top upper surface of tin post, the tin post also be provided with protrude from down accepting hole and be the protrusion sphere with the contacted bottom of the pad of circuit board.
Compared to prior art, electric connector combination of the present invention has following beneficial effect: the electric connector combination can electrically connect with the chip module and the circuit board of different spacing.
[description of drawings]
Fig. 1 is the three-dimensional combination figure of electric connector combination of the present invention.
Fig. 2 is the three-dimensional exploded view of electric connector combination of the present invention.
Fig. 3 is along the cross-sectional schematic of the A-A line among Fig. 1.
The cross-sectional schematic that Fig. 4 is connected with chip module for electric connector combination of the present invention.
[embodiment]
See also Fig. 1 and shown in Figure 4, electric connector of the present invention combination 100 is electrically connected to circuit board 4 with chip module 2, and it comprises insulating body 1 and is contained in the filling tin ball 3 in the insulating body 1.
See also shown in Figure 2ly, said chip module 2 roughly is platy structure, and its bottom array is provided with some tin balls 20.Said insulating body 1 comprises matrix 10 and is positioned at matrix 10 outer wall 13 all around.Wherein, Said matrix 10 middle parts are provided with some accepting holes 11; Said accepting hole 11 runs through the upper and lower surface of insulating body 1 respectively; Comprise that the part near insulating body 1 upper surface is defined as accepting hole 110, be defined as down accepting hole 111 near the part of insulating body 1 lower surface, the said accepting hole 110 of going up connects with following accepting hole 111 each other.Said outer wall 13 comprises the convex extension part 12 that upwards protrudes out, and said convex extension part 12 can be positioned chip module 2 in the insulating body 1.
Please specifically consult Fig. 3 and shown in Figure 4, the sidewall 112 of accepting hole 11 is irregular setting, and the surface electrical of sidewall 112 is coated with copper plate 113.The sidewall 112 of said accepting hole 11 comprises vertical shape sidewall 112 that is positioned at upper/lower terminal and the skewed sidewall 112 that connects upper and lower two vertical shape sidewalls 112.Last accepting hole 110 is provided with proportional spacing; Accepting hole 111 under the also downward-sloping laterally formation of last accepting hole 110; Said accepting hole 111 down is provided with proportional spacing, and said spacing and the spacing between the following accepting hole 111 that goes up between the accepting hole 110 need form through the design and the calculating manufacturing of precision.The spacing of following accepting hole 111 is different with the spacing of last accepting hole 110, and following accepting hole 111 adjacent spacings are greater than last accepting hole 110 adjacent spacings, and the diameter in the following accepting hole 111 is greater than the diameter of last accepting hole 110.The tin ball 20 that can accommodate the less chip module of spacing 2 in the last accepting hole 110 of said accepting hole 11 is in wherein.The last accepting hole 110 that can set out accepting hole 11 through accurate design and calculating again according to the arrangement mode between the pad 40 of arrange density and circuit board 4 between the tin ball 20 of chip module 2 and the spacing of accepting hole 111 down.
Accepting hole 11 domestic demands of matrix 10 are placed and are filled tin ball 3; Its manufacturing approach is following: the filling tin ball 3 that some diameters are bigger is contained in the following accepting hole 111 of accepting hole 11 through corresponding tool; The filling tin ball 3 that then some diameters is diminished gradually places accepting hole 11 respectively from the opening of last accepting hole 110; After passing through heat again; The filling tin ball 3 that is arranged in accepting hole 11 is heated and melts the back and form tin post 30, and said tin post 30 is blended in fully in the accepting hole 11 and combines together with the sidewall 112 of accepting hole 11, thereby forms conducting medium.The top that is arranged in the tin post 30 of accepting hole 11 is positioned at accepting hole 110 its upper surfaces and roughly is the plane; The tin ball 20 of chip module 2 is contained in the last accepting hole 110 of accepting hole 11 and with the upper surface of tin post 30 and contacts, and the bottom of tin post 30 protrudes from down accepting hole 111 and roughly is protrudes sphere to contact with the pad 40 of circuit board 4.
The tin ball 20 that the accepting hole 11 of the insulating body 1 of electric connector of the present invention combination 100 can be accommodated the higher chip module of the density of arranging 2 simultaneously according to different demands is in last accepting hole 110; And the pad 40 of comparatively lax circuit board 4 and following accepting hole 111 interior tin posts 30 are in contact with one another, can connect the electronic component of different spacing simultaneously.Some filling tin balls 3 are directly inserted the tin post 30 that has conduction property in the accepting hole 11 and with its thawing back formation; Substitute existing conducting terminal with tin post 30 and have the high advantage of reliability of connection, and then improve the connection reliability that electric connector combination 100 electrically connects chip module 2 and circuit board 4.
Claims (10)
1. electric connector combination; Be used to connect chip module to circuit board; It comprises: the insulating body insulating body that is provided with some accepting holes; Said accepting hole runs through the upper and lower surface of insulating body respectively; It is characterized in that: said accepting hole comprises near the last accepting hole of accepting hole upper surface and downward-sloping and near the following accepting hole of accepting hole lower surface from last accepting hole, and the said spacing that goes up accepting hole is less than the spacing of accepting hole down, and also is provided with the tin post of combining closely with its sidewall in the accepting hole.
2. electric connector combination as claimed in claim 1; It is characterized in that: said tin post is formed by the some filling tin balls that are filled in the accepting hole of heat fused; Said tin post is blended in fully in the accepting hole and combines together with the sidewall of accepting hole, forms conducting medium.
3. electric connector combination as claimed in claim 2; It is characterized in that: the sidewall of said accepting hole is irregular setting; The surface electrical of sidewall is coated with copper plate, and the sidewall of said accepting hole comprises vertical shape sidewall that is positioned at upper/lower terminal and the skewed sidewall that connects upper and lower two vertical shape sidewalls, and the said accepting hole of going up is provided with proportional spacing; Following accepting hole is provided with proportional spacing, and different with the spacing of last accepting hole.
4. electric connector combination as claimed in claim 3, it is characterized in that: said chip module is provided with the tin ball, and circuit board comprises pad, and the last accepting hole of said accepting hole is accommodated the tin ball of chip module.
5. electric connector combination as claimed in claim 4; It is characterized in that: said tin post is provided with and is positioned at the top that accepting hole and its upper surface are the plane; The tin ball of chip module contacts with the top upper surface of tin post, the tin post also be provided with protrude from down accepting hole and be the protrusion sphere with the contacted bottom of the pad of circuit board.
6. the manufacturing approach of electric connector combination; It is characterized in that: it may further comprise the steps: a. provides an insulating body; It comprises matrix and is formed at the some accepting holes on the matrix; The sidewall of accepting hole is irregular setting, and accepting hole comprises near the last accepting hole of body upper surface and downward-sloping and near the following accepting hole of matrix lower surface from last accepting hole; B. the electroplating surface copper plate of said sidewall; C. some diameters are bigger filling tin ball is contained in the following accepting hole of accepting hole, and the filling tin ball that some diameters are little places accepting hole from the opening of last accepting hole; D. heat is heated the filling tin ball that is arranged in accepting hole and is melted back formation tin post.
7. the manufacturing approach of electric connector combination as claimed in claim 6, it is characterized in that: the adjacent spacing of last accepting hole of the accepting hole of said matrix is different with the adjacent spacing of following accepting hole, and the size in the following accepting hole is greater than the size of last accepting hole.
8. the manufacturing approach of electric connector combination as claimed in claim 7, it is characterized in that: the sidewall of said accepting hole comprises vertical shape sidewall that is positioned at upper/lower terminal and the skewed sidewall that connects upper and lower two vertical shape sidewalls.
9. the manufacturing approach of electric connector combination as claimed in claim 8, it is characterized in that: said chip module is provided with the tin ball, and circuit board comprises pad, and the last accepting hole of said accepting hole is accommodated the tin ball of chip module.
10. the manufacturing approach of electric connector combination as claimed in claim 9; It is characterized in that: said tin post is provided with and is positioned at the top that accepting hole and its upper surface are the plane; The tin ball of chip module also contacts with the top upper surface of tin post, the tin post also be provided with protrude from down accepting hole and be the protrusion sphere with the contacted bottom of the pad of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010528277.3A CN102456968B (en) | 2010-11-01 | 2010-11-01 | Electric connector combination and manufacturing method for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010528277.3A CN102456968B (en) | 2010-11-01 | 2010-11-01 | Electric connector combination and manufacturing method for same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102456968A true CN102456968A (en) | 2012-05-16 |
| CN102456968B CN102456968B (en) | 2015-07-08 |
Family
ID=46039812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010528277.3A Expired - Fee Related CN102456968B (en) | 2010-11-01 | 2010-11-01 | Electric connector combination and manufacturing method for same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102456968B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789158A (en) * | 2016-03-30 | 2016-07-20 | 华天科技（西安）有限公司 | POP packaging part with no need for plastic-sealed body opening and manufacturing technology for POP packaging part |
| US10084252B1 (en) | 2017-07-24 | 2018-09-25 | Lotes Co., Ltd | Electrical connector |
| CN111525290A (en) * | 2020-04-30 | 2020-08-11 | 番禺得意精密电子工业有限公司 | Substrate and method for manufacturing substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4641426A (en) * | 1985-06-21 | 1987-02-10 | Associated Enterprises, Inc. | Surface mount compatible connector system with mechanical integrity |
| US6087597A (en) * | 1994-07-22 | 2000-07-11 | Nec Corporation | Connecting member and a connecting method with ball and tapered via |
| CN201332147Y (en) * | 2008-12-08 | 2009-10-21 | 番禺得意精密电子工业有限公司 | Electric connector |
| US7674113B2 (en) * | 2007-08-17 | 2010-03-09 | Centipede Systems, Inc. | Miniature electrical ball and tube socket assembly with self-capturing multiple-contact-point coupling |
-
2010
- 2010-11-01 CN CN201010528277.3A patent/CN102456968B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4641426A (en) * | 1985-06-21 | 1987-02-10 | Associated Enterprises, Inc. | Surface mount compatible connector system with mechanical integrity |
| US6087597A (en) * | 1994-07-22 | 2000-07-11 | Nec Corporation | Connecting member and a connecting method with ball and tapered via |
| US7674113B2 (en) * | 2007-08-17 | 2010-03-09 | Centipede Systems, Inc. | Miniature electrical ball and tube socket assembly with self-capturing multiple-contact-point coupling |
| CN201332147Y (en) * | 2008-12-08 | 2009-10-21 | 番禺得意精密电子工业有限公司 | Electric connector |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789158A (en) * | 2016-03-30 | 2016-07-20 | 华天科技（西安）有限公司 | POP packaging part with no need for plastic-sealed body opening and manufacturing technology for POP packaging part |
| US10084252B1 (en) | 2017-07-24 | 2018-09-25 | Lotes Co., Ltd | Electrical connector |
| CN111525290A (en) * | 2020-04-30 | 2020-08-11 | 番禺得意精密电子工业有限公司 | Substrate and method for manufacturing substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102456968B (en) | 2015-07-08 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20161101 |
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| CF01 | Termination of patent right due to non-payment of annual fee |