CN102485423A - Grinding and polishing device and grinding and polishing method thereof - Google Patents
Grinding and polishing device and grinding and polishing method thereof Download PDFInfo
- Publication number
- CN102485423A CN102485423A CN2010105909741A CN201010590974A CN102485423A CN 102485423 A CN102485423 A CN 102485423A CN 2010105909741 A CN2010105909741 A CN 2010105909741A CN 201010590974 A CN201010590974 A CN 201010590974A CN 102485423 A CN102485423 A CN 102485423A
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- Prior art keywords
- polishing
- cutter
- grinding
- lapping liquid
- workpiece
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- 238000005498 polishing Methods 0.000 title claims abstract description 135
- 238000000227 grinding Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 39
- 238000003801 milling Methods 0.000 claims abstract description 14
- 239000012530 fluid Substances 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 57
- 238000003754 machining Methods 0.000 claims description 17
- 238000006073 displacement reaction Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 230000003116 impacting effect Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001962 electrophoresis Methods 0.000 description 3
- 229910001651 emery Inorganic materials 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000001652 electrophoretic deposition Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A grinding and polishing device and a grinding and polishing method thereof mainly comprise a polishing cutter, a pressure pump and grinding fluid with abrasive particles; the polishing cutter is internally provided with a flow channel, the peripheral side of the polishing cutter is provided with at least one slotted hole communicated with the flow channel, the pressure pump is communicated with the flow channel of the polishing cutter through a pipeline so as to convey grinding fluid with abrasive particles, the slotted hole of the polishing cutter outputs the grinding fluid, the polishing cutter can be arranged on an automatic driving device in a matching way so that the surfaces of the polishing cutter and a workpiece can be relatively displaced along a preset processing path, the slotted hole of the polishing cutter outputs the grinding fluid, the abrasive particles of the grinding fluid are uniformly impacted and extruded on the surface of the workpiece, and the surface of the workpiece is automatically ground and polished; therefore, the milling and grinding of the workpiece can be carried out in an integrated operation mode, and the purposes of greatly improving the grinding and polishing quality and the processing efficiency are achieved.
Description
Technical field
The present invention relates to a kind of mode that can one-stop operation and carry out the Milling Process and the grinding and polishing of workpiece, with polishing grinding equipment and the abrasive polishing method thereof that significantly promotes grinding and polishing quality and working (machining) efficiency.
Background technology
Industries such as photoelectricity, semiconductor, mould use the surface accuracy requirement of part (as milling, cut processed workpiece) all to improve day by day for it now, and therefore, the precise fine processing of carrying out grinding and polishing in surface of the work has been the main flow process technology that develops at present.
The grinding and polishing processing of surface of the work; Mechanical system surperficial capable of using for general rule is carried out grinding and polishing, carries out the grinding and polishing operation but must be dependent on manual work for complex-shaped surface (like groove surfaces), yet; The grinding and polishing mode that this is artificial; Except operating personnel must have skillful technology, its working (machining) efficiency more was difficult to promote, and the quality of grinding and polishing can't satisfy the surface accuracy requirement that improves day by day.
The processing method of other in the streets existing a kind of electrochemical milling polishing, with replacement traditional mechanical and artificial grinding and polishing mode, and the grinding and polishing quality of lifting surface of the work, to satisfy the surface accuracy requirement that improves day by day; This electrochemical milling finishing method places workpiece and working electrode the electrophoresis solution of the trickle abrasive particle of tool; After imposing voltage; Promptly utilize the mode of electrophoretic deposition, make abrasive particle absorption be deposited on working electrode surface, so that working electrode surface generates the emery wheel of the trickle abrasive particle of tool; Do relative motion with the emery wheel of this working electrode surface and the workpiece in the electrophoresis solution again, to carry out the grinding and polishing processing of surface of the work; Yet this electrochemical grinding and polishing mode still has following scarce fraud on using:
If when the surface configuration of workpiece was complicated, after imposing voltage, the distribution of its electric field was wayward, with the uneven problem of surface grinding polishing that causes workpiece.
It must be provided with like the tank of electrophoresis solution and drive working electrode and workpiece is made the specialized apparatus such as drive unit of relative motion; General workpiece is after carrying out Milling Process on the automatic tools machine; Again workpiece is moved to and carry out grinding and polishing on this special equipment; And go up quite trouble, and then influence working (machining) efficiency in operation.
In view of this; The inventor then is engaged in the research and development and the making experience of relevant industries with it for many years; The problem further investigation that faces to present, through the research of long-term endeavour with study, grind eventually and create a kind of grinding and polishing device and abrasive polishing method thereof; And to improve the scarce fraud of prior art, this is design aim of the present invention.
Summary of the invention
The objective of the invention is to: a kind of grinding and polishing device and abrasive polishing method thereof are provided, solve the existing in prior technology problem.
For realizing above-mentioned purpose, the technical scheme that the present invention adopts is:
A kind of grinding and polishing device is characterized in that, includes:
The polishing cutter is placed on the driving arrangement, and its inside is provided with runner, and offers the slotted eye that at least one communicates with this runner in all sides; And
Force (forcing) pump is communicated in the runner of polishing cutter, has the lapping liquid of abrasive particle for pressurized delivered, and by the slotted eye output lapping liquid of polishing cutter, with the surface of the abrasive particle impact extruded workpiece of lapping liquid.
Wherein, be periphery on all sides of this polishing cutter to offer and make a plurality of slotted eyes that linearity is arranged.
Wherein, offer a plurality of slotted eyes of making helical arrangement on all sides of this polishing cutter.
Wherein, This driving arrangement is provided with and supplies clamping polishing cutter and main shaft that can driven in rotation; Should rotate by the polishing cutter for driving, and make the surface of this polishing cutter and workpiece do relative displacement along preset machining path, this main shaft is provided with the passage that can be communicated with the runner of polishing cutter in inside.
Wherein, the lapping liquid of this force (forcing) pump is with water liquid or with fluid mixing abrasive particle.
Wherein, the abrasive particle of this lapping liquid is the alumina particulate that is coated with rubber.
For realizing above-mentioned purpose, the technical scheme that the present invention adopts is:
A kind of abrasive polishing method is characterized in that, includes:
To polish the cutter collocation and be placed on the driving arrangement, this polishing cutter inside is provided with runner, and offers at least one slotted eye that communicates with this runner in all sides;
Start force (forcing) pump and carry out the lapping liquid that pressurized delivered has abrasive particle, and export lapping liquid by the slotted eye of polishing cutter; And
Make the surface of polishing cutter and workpiece do relative displacement along preset machining path, and with the surface of the uniform impact extruded workpiece of the abrasive particle of lapping liquid.
Wherein, make the surface of polishing cutter and workpiece when preset machining path is done relative displacement, and driving the rotation of polishing cutter.
Wherein, will polish after cutter collocation is placed on the driving arrangement, and carry out before pressurized delivered has the lapping liquid of abrasive particle starting force (forcing) pump, this workpiece carries out Milling Process earlier on driving arrangement.
Wherein, Force (forcing) pump carries out pressurized delivered and is the aqueous lapping liquid of water; And at the lapping liquid of the slotted eye output high pressure of polishing cutter, make the abrasive particle of lapping liquid impact the surface of workpiece uniformly, and on the open surface of complicated shape, carry out grinding and polishing with the mode of impacting with high pressure.
Wherein, force (forcing) pump carries out pressurized delivered and is thick lapping liquid, and exports lapping liquid at the slotted eye of polishing cutter, makes the abrasive particle of lapping liquid push the hole surface of workpiece uniformly, and in cap holes, carries out grinding and polishing with the mode of low pressure extruding.
Compared with prior art, the beneficial effect that has of the present invention is:
1. the present invention provides a kind of grinding and polishing device, and it consists predominantly of the lapping liquid of polishing cutter, force (forcing) pump and tool abrasive particle; This polishing cutter is provided with runner in inside; And offer at least one slotted eye that communicates with this runner in all sides, this force (forcing) pump is somebody's turn to do the runner that polishes cutter with pipeline connection, for the lapping liquid of carrying the tool abrasive particle; And by slotted eye output lapping liquid of this polishing cutter; Can this polishing cutter collocation be placed on the automatic driving device in addition,, and export lapping liquid by the slotted eye of this polishing cutter so that relative displacement can be done along preset machining path in the surface of this polishing cutter and workpiece; Make the surface of the uniform impact extruded workpiece of abrasive particle of this lapping liquid, and carry out the grinding and polishing of automation in the surface of workpiece; So, mode that can one-stop operation is carried out the Milling Process and the grinding and polishing of workpiece, and then reaches the practical purpose that significantly promotes grinding and polishing quality and working (machining) efficiency.
2. the present invention provides a kind of abrasive polishing method; It will polish cutter collocation and be placed on one and can be on the automation driving arrangement of toolroom machine; Can do relative displacement along preset machining path for the surface that drives this polishing cutter and workpiece, and carry the lapping liquid of tool abrasive particle, and export lapping liquid by the slotted eye of this polishing cutter with force (forcing) pump; Make the surface of the uniform impact extruded workpiece of abrasive particle of this lapping liquid; With the grinding and polishing that carries out automation in the surface of workpiece, and mode that can one-stop operation is carried out the Milling Process and the grinding and polishing of workpiece, and then reaches the practical purpose that significantly promotes grinding and polishing quality and working (machining) efficiency.
Description of drawings
Fig. 1 is the schematic appearance that the present invention polishes cutter;
Fig. 2 is a configuration diagram of the present invention;
Fig. 3 is the schematic appearance of another polishing cutter of the present invention;
Fig. 4 is the action sketch map of the present invention in the open surface grinding and polishing;
Fig. 5 is the enlarged diagram of the present invention in the open surface grinding and polishing;
Fig. 6 is the action sketch map of the present invention in the cap holes grinding and polishing;
Fig. 7 is the enlarged diagram of the present invention in the cap holes grinding and polishing.
Description of reference numerals: 10-polishes cutter; 10A-polishes cutter; The 101-runner; The 102-slotted eye; The 102A-slotted eye; The 20-force (forcing) pump; The 201-pipeline; The 30-lapping liquid; The 31-abrasive particle; The 40-driving arrangement; The 41-main shaft; The 411-passage; The 50-workpiece; The 501-surface; The 60-workpiece; The 601-hole.
The specific embodiment
For the present invention is done understanding further, lift a preferred embodiment now, and cooperate graphic detailed description as back:
See also Fig. 1, shown in Figure 2, grinding and polishing device of the present invention, it consists predominantly of the lapping liquid 30 of polishing cutter 10, force (forcing) pump 20 and tool abrasive particle 31; The inside of this polishing cutter 10 is provided with runner 101, and offers at least one slotted eye 102 that communicates with this runner 101 in all sides; In present embodiment, be periphery on all sides of this polishing cutter 10 to offer and make a plurality of slotted eyes 102 that linearity is arranged; This polishing cutter 10 can be arranged in pairs or groups on the driving arrangement 40 that is placed on an automation; In the present embodiment; This driving arrangement 40 is one can carry out the toolroom machine of Milling Process; But it is provided with the main shaft 41 that supplies clamping polishing cutter 10 and driven in rotation, and in the inside of this main shaft 41 and be provided with the passage 411 that can be communicated with the runner 101 of polishing cutter 10, and can be placed on the main shaft 41 of driving arrangement 40 polishing cutter 10; Should rotate by polishing cutter 10 for driving, and make this polishing cutter 10 and the surface of workpiece do three relative displacement along preset machining path; This force (forcing) pump 20 supplies the lapping liquid 30 of pressurized delivered tool abrasive particle 31; Should and be communicated to the passage 411 of main shaft 41 with pipeline 201; Lapping liquid 30 can be carried via the passage 411 of this pipeline 201, main shaft 41 and the runner 101 of polishing cutter 10; And in slotted eye 102 output of polishing cutter 10, and then with the surface of the abrasive particle 31 impact extruded workpiece of this lapping liquid 30; In present embodiment, it can water liquid or fluid mixing abrasive particle 31, to form the aqueous or thick lapping liquid 30 of water; The material of this abrasive particle 31 may be selected to be aluminium oxide (Al
2O
3), carborundum (SiC) or chromium oxide (Cr
2O
3), this abrasive particle 31 can be the alumina particulate that is coated with rubber in addition.
The present invention is on other are used, and a plurality of slotted eyes of this polishing cutter can be done the arrangement of various types; See also shown in Figure 3ly, the slotted eye 102A of this polishing cutter 10A offers the slotted eye 102A that makes helical arrangement in all side ring cloth, so that the abrasive particle of lapping liquid impact extruded surface of the work more uniformly.
See also Fig. 4, shown in Figure 5; The present invention applies to the abrasive polishing method of open surface; It at first, is placed on these polishing cutter 10 collocation on the main shaft 41 of driving arrangement 40 after Milling Process goes out to be the surface 501 of bending arc shape in carrying out on the workpiece 50 with driving arrangement 40; And begin to start force (forcing) pump 20 and carry out pressurized delivered and be the aqueous lapping liquid of water 30; This lapping liquid 30 promptly is communicated with conveying via the passage 411 of this pipeline 201, main shaft 41 and the runner 101 of polishing cutter 10, and in the lapping liquid 30 of the slotted eye that polishes cutter 10 102 output high pressure, this driving arrangement 40 and driving main shaft 41 rotations; And make polishing cutter 10 along with main shaft 41 rotations; Simultaneously, this driving arrangement 40 begins to drive polishing cutter 10 and does relative displacement in the surface 501 of workpiece 50 along preset machining path, and exports the lapping liquid 30 of high pressure with the slotted eye 102 of this polishing cutter; Make the abrasive particle 31 of lapping liquid 30 impact the surface 501 of workpiece 50 uniformly, and on the open surface of complicated shape, carry out grinding and polishing with the mode of impacting with high pressure; So, mode that can one-stop operation is carried out the Milling Process and the grinding and polishing of workpiece 50, and then reaches the practical purpose that significantly promotes grinding and polishing quality and working (machining) efficiency.
See also Fig. 6, shown in Figure 7; The present invention applies to the abrasive polishing method of cap holes in addition; Its with driving arrangement 40 in carrying out on the workpiece 60 after Milling Process goes out blind bore hole 601; At first, 10 collocation of this polishing cutter are placed on the main shaft 41 of driving arrangement 40, and begin to start force (forcing) pump 20 and carry out pressurized delivered and be thick lapping liquid 30; This lapping liquid 30 promptly is communicated with conveying via the passage 411 of this pipeline 201, main shaft 41 and the runner 101 of polishing cutter 10; And, driving 10 rotations of polishing cutters with this driving arrangement 40 in the lapping liquid 30 of the slotted eye that polishes cutter 10 102 output low pressure, other drives this polishing cutter 10 and stretches in the hole 601 of workpiece 60 along the machining path of presetting; Make the abrasive particle 31 of lapping liquid 30 push hole 601 surfaces of workpiece 60 uniformly, and in cap holes, carry out grinding and polishing with the mode of low pressure extruding.
More than explanation is just illustrative for the purpose of the present invention; And nonrestrictive, those of ordinary skills understand, under the situation of spirit that does not break away from claim and limited and scope; Can make many modifications, variation or equivalence, but all will fall within protection scope of the present invention.
Claims (11)
1. a grinding and polishing device is characterized in that, includes:
The polishing cutter is placed on the driving arrangement, and its inside is provided with runner, and offers the slotted eye that at least one communicates with this runner in all sides; And
Force (forcing) pump is communicated in the runner of polishing cutter, has the lapping liquid of abrasive particle for pressurized delivered, and by the slotted eye output lapping liquid of polishing cutter, with the surface of the abrasive particle impact extruded workpiece of lapping liquid.
2. grinding and polishing device according to claim 1 is characterized in that: be periphery on all sides of this polishing cutter to offer and make a plurality of slotted eyes that linearity is arranged.
3. grinding and polishing device according to claim 1 is characterized in that: offer a plurality of slotted eyes of making helical arrangement on all sides of this polishing cutter.
4. grinding and polishing device according to claim 1; It is characterized in that: this driving arrangement is provided with and supplies clamping polishing cutter and main shaft that can driven in rotation; Should rotate by the polishing cutter for driving; And making the surface of this polishing cutter and workpiece do relative displacement along preset machining path, this main shaft is provided with the passage that can be communicated with the runner of polishing cutter in inside.
5. grinding and polishing device according to claim 1 is characterized in that: the lapping liquid of this force (forcing) pump is with water liquid or with fluid mixing abrasive particle.
6. grinding and polishing device according to claim 1 is characterized in that: the abrasive particle of this lapping liquid is the alumina particulate that is coated with rubber.
7. an abrasive polishing method is characterized in that, includes:
To polish the cutter collocation and be placed on the driving arrangement, this polishing cutter inside is provided with runner, and offers at least one slotted eye that communicates with this runner in all sides;
Start force (forcing) pump and carry out the lapping liquid that pressurized delivered has abrasive particle, and export lapping liquid by the slotted eye of polishing cutter; And
Make the surface of polishing cutter and workpiece do relative displacement along preset machining path, and with the surface of the uniform impact extruded workpiece of the abrasive particle of lapping liquid.
8. abrasive polishing method according to claim 7 is characterized in that: make the surface of polishing cutter and workpiece when preset machining path is done relative displacement, and driving the rotation of polishing cutter.
9. abrasive polishing method according to claim 7; It is characterized in that: will polish after cutter collocation is placed on the driving arrangement; And carry out before pressurized delivered has the lapping liquid of abrasive particle starting force (forcing) pump, this workpiece carries out Milling Process earlier on driving arrangement.
10. abrasive polishing method according to claim 9; It is characterized in that: force (forcing) pump carries out pressurized delivered and is the aqueous lapping liquid of water; And at the lapping liquid of the slotted eye output high pressure of polishing cutter; Make the abrasive particle of lapping liquid impact the surface of workpiece uniformly, and on the open surface of complicated shape, carry out grinding and polishing with the mode of impacting with high pressure.
11. abrasive polishing method according to claim 9; It is characterized in that: force (forcing) pump carries out pressurized delivered and is thick lapping liquid; And export lapping liquid at the slotted eye of polishing cutter; Make the abrasive particle of lapping liquid push the hole surface of workpiece uniformly, and in cap holes, carry out grinding and polishing with the mode of low pressure extruding.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099141771 | 2010-12-01 | ||
| TW099141771A TW201223698A (en) | 2010-12-01 | 2010-12-01 | A grinding and polishing device and grinding and polishing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102485423A true CN102485423A (en) | 2012-06-06 |
Family
ID=46151016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105909741A Pending CN102485423A (en) | 2010-12-01 | 2010-12-16 | Grinding and polishing device and grinding and polishing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102485423A (en) |
| TW (1) | TW201223698A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104842256A (en) * | 2015-04-30 | 2015-08-19 | 哈尔滨工业大学 | Flexible joint thin neck abrasive flow lapping and polishing method |
| CN104842257A (en) * | 2015-04-30 | 2015-08-19 | 哈尔滨工业大学 | Flexible joint thin neck abrasive flow lapping and polishing device |
| CN105817990A (en) * | 2016-03-30 | 2016-08-03 | 张家界绿源文化发展有限责任公司 | Turtle proluta sculpture hollowed part polishing device and method thereof |
| CN112437712A (en) * | 2018-06-01 | 2021-03-02 | 巴斯夫欧洲公司 | Water erosion grinding method for assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6227955B1 (en) * | 1999-04-20 | 2001-05-08 | Micron Technology, Inc. | Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| CN1727116A (en) * | 2004-11-10 | 2006-02-01 | 中国科学院长春光学精密机械与物理研究所 | A kind of numerical control polishing is with contactless hydrojet bistrique |
| JP2008006540A (en) * | 2006-06-29 | 2008-01-17 | Disco Abrasive Syst Ltd | Polishing method |
| CN101186020A (en) * | 2006-11-22 | 2008-05-28 | 昭和电工株式会社 | Polishing apparatus, polishing brush and manufacturing method of disk-shaped substrate |
| CN101484982A (en) * | 2006-07-04 | 2009-07-15 | 日立化成工业株式会社 | Polishing liquid for CMP |
-
2010
- 2010-12-01 TW TW099141771A patent/TW201223698A/en unknown
- 2010-12-16 CN CN2010105909741A patent/CN102485423A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6227955B1 (en) * | 1999-04-20 | 2001-05-08 | Micron Technology, Inc. | Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| CN1727116A (en) * | 2004-11-10 | 2006-02-01 | 中国科学院长春光学精密机械与物理研究所 | A kind of numerical control polishing is with contactless hydrojet bistrique |
| JP2008006540A (en) * | 2006-06-29 | 2008-01-17 | Disco Abrasive Syst Ltd | Polishing method |
| CN101484982A (en) * | 2006-07-04 | 2009-07-15 | 日立化成工业株式会社 | Polishing liquid for CMP |
| CN101186020A (en) * | 2006-11-22 | 2008-05-28 | 昭和电工株式会社 | Polishing apparatus, polishing brush and manufacturing method of disk-shaped substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104842256A (en) * | 2015-04-30 | 2015-08-19 | 哈尔滨工业大学 | Flexible joint thin neck abrasive flow lapping and polishing method |
| CN104842257A (en) * | 2015-04-30 | 2015-08-19 | 哈尔滨工业大学 | Flexible joint thin neck abrasive flow lapping and polishing device |
| CN105817990A (en) * | 2016-03-30 | 2016-08-03 | 张家界绿源文化发展有限责任公司 | Turtle proluta sculpture hollowed part polishing device and method thereof |
| CN112437712A (en) * | 2018-06-01 | 2021-03-02 | 巴斯夫欧洲公司 | Water erosion grinding method for assembly |
| CN112437712B (en) * | 2018-06-01 | 2022-11-29 | 巴斯夫欧洲公司 | Water erosion grinding method for assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI438059B (en) | 2014-05-21 |
| TW201223698A (en) | 2012-06-16 |
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Application publication date: 20120606 |