CN102548236A - Combined tray for surface brown oxidation of copper blocks and manufacturing method thereof - Google Patents
Combined tray for surface brown oxidation of copper blocks and manufacturing method thereof Download PDFInfo
- Publication number
- CN102548236A CN102548236A CN2011104448827A CN201110444882A CN102548236A CN 102548236 A CN102548236 A CN 102548236A CN 2011104448827 A CN2011104448827 A CN 2011104448827A CN 201110444882 A CN201110444882 A CN 201110444882A CN 102548236 A CN102548236 A CN 102548236A
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- hole
- chassis
- cover plate
- copper billet
- blind groove
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Abstract
The invention relates to a combined tray for surface brown oxidation of copper blocks, which comprises a bottom disc and a cover plate. The bottom disc is provided with blind grooves which are used for holding and carrying the copper blocks with surfaces to be subjected to brown oxidation treatment, the bottom disc and the cover plate are provided with first through holes and second through holes corresponding to the blind grooves, and the cover plate is detachably covered on the bottom disc so as to prevent the copper blocks arranged in the blind grooves from falling off. The combined tray for surface brown oxidation of the copper blocks is capable of realizing treatment of surface brown oxidation of small-sized copper blocks and is convenient in operation and fine durability. The invention further discloses a manufacturing method of the combined tray for surface brown oxidation of the copper blocks.
Description
Technical field
The present invention relates to printed circuit board (pcb) and make the auxiliary equipment field, relate in particular to a kind of brown oxidation usefulness in copper billet surface combination pallet and preparation method thereof in the copper billet pcb board that buries.
Background technology
Bury the copper billet pcb board and be meant the pcb board of in local location, individual layers, imbedding copper billet, be embedded in the copper billet surface and need carry out the processing of brown oxidation or black oxidation usually, to improve the bond strength of copper billet and prepreg.Mostly brown oxidation production line in the existing PCB manufacture process is horizontal line roller rumble transmission design, for the less copper billet of size (size is smaller or equal to 40mm * 60mm), if directly carry out brown oxidation, very easily clamp, fall cylinder, even can not carry out brown oxidation.Therefore, the existing small size copper billet surface of imbedding adopts black oxidation to handle usually, but there is following shortcoming in copper billet surface black oxidation processes: 1, adopt the black oxidation Hanging Basket vertically to soak, oxidation treatment time is longer, and production efficiency is low, and production cost is high; 2, the copper billet handled of black oxidation combines reliability lower with prepreg, is prone to the defective that copper billet separates with prepreg during pb-free solder, reduce built-in or in bury the copper billet pcb board dependability and electric property.
Summary of the invention
Therefore, the object of the present invention is to provide the brown oxidation in a kind of copper billet surface, can realize the brown oxidation processes in small size copper billet surface with combination pallet and preparation method thereof, easy to operate and durability good.
Another purpose of the present invention is to provide the manufacture method of a kind of brown oxidation in above-mentioned copper billet surface with the combination pallet.
For realizing above-mentioned purpose; The present invention provides the brown oxidation in a kind of copper billet surface with the combination pallet; Comprise chassis and cover plate; Said chassis is provided with blind groove in order to hold and to carry the copper billet of treating surperficial brown oxidation, and the corresponding said blind groove of said chassis and cover plate is respectively equipped with first through hole and second through hole, and said cover plate covers separably and is located on the chassis to prevent that the copper billet that is contained in the blind groove from dropping.
Said chassis and cover plate are located through pin and are combined.
Said pin is located at the edge on chassis, and corresponding pin is provided with location hole on the said cover plate, and the location hole through cover plate is inserted in pin and cover plate and chassis are positioned and combines.
Said cover plate and chassis are processed by the light central layer.
The quantity of said blind groove is a plurality of, and rectangular array arrangement.
The first set through hole of corresponding blind groove comprises a large-size through hole that is positioned at blind groove centre and is distributed in said large-size through hole several reduced size through holes on every side on the said chassis, and the size of said large-size through hole is less than the size of treating the copper billet of surperficial brown oxidation in the blind groove.
Said blind groove and large-size through hole are all rectangular, and said reduced size through hole is rounded.The second set through hole of corresponding blind groove is the strip through hole on the said cover plate, and the width of said second through hole is less than the size of blind groove at this Width, and less than treating the size of the copper billet of surperficial brown oxidation at this Width in the blind groove.
For realizing above-mentioned purpose, the present invention also provides the manufacture method of the brown oxidation in a kind of copper billet surface with the combination pallet, comprises the steps:
Step 1: chassis base material and cover plate base material are provided;
Step 2: make the chassis, comprise the steps: step 2.1, the edge of base material bores location hole on the chassis; Step 2.2 is milled the large-size through hole on the base material of chassis; Step 2.3, on the base material of chassis in the blind groove of the peripheral milling of large-size through hole; Step 2.4 is bored the reduced size through hole in the bottom of blind groove; Step 2.5 is squeezed into pin in the location hole on chassis, make the chassis;
Step 3: make cover plate, comprise the steps: step 3.1, the corresponding ground auger location hole of location hole on correspondence chassis, the edge of cover plate substrate; Step 3.2, on the cover board the blind groove on corresponding chassis is made second through hole, makes cover plate.
Said blind groove and large-size through hole are all rectangular; Said reduced size through hole is rounded; The second set through hole of corresponding blind groove is the strip through hole on the said cover plate; The width of said second through hole is less than the size of blind groove at this Width, and less than treating the size of the copper billet of surperficial brown oxidation at this Width in the blind groove.
Said chassis base material and cover plate substrate adopt the light central layer to make.
Beneficial effect of the present invention: the brown oxidation in copper billet of the present invention surface is with the combination pallet; Through being set, blind groove holds and carries the copper billet of treating surperficial brown oxidation on the chassis; And on the chassis loam cake is established cover plate; (size is less than the brown oxidation processes on the copper billet of 40mm * 60mm) surface, and is easy to operate and durability good can to realize small size; Simultaneously on cover plate and chassis, through hole is set; Help brown oxidation liquid medicine and fully contact the copper billet surface; Improve the oxidation effectiveness on copper billet surface, thereby improve the bond strength of copper billet and prepreg, prevent that effectively copper billet from separating with prepreg; Guarantee built-in or in bury copper billet pcb board reliability and reach pb-free solder (260 ℃ of maximum temperatures) requirement, improve built-in or in bury the copper billet pcb board dependability and electric property.
For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effects obvious.
In the accompanying drawing,
Fig. 1 is the plane assembling sketch map of the brown oxidation in copper billet of the present invention surface with one preferred embodiment of combination pallet;
Fig. 2 is the decomposing schematic representation of the brown oxidation in copper billet shown in Figure 1 surface with the combination pallet;
Fig. 3 is the cutaway view of Fig. 2 along the A-A line.
Embodiment
To shown in Figure 3, be the preferred embodiment of the brown oxidation in copper billet of the present invention surface like Fig. 1 with the combination pallet.
For realizing above-mentioned purpose; The present invention provides the brown oxidation in a kind of copper billet surface with the combination pallet; Comprise chassis 10 and cover plate 20; Said chassis 10 is provided with blind groove 11 in order to hold and to carry the copper billet of treating surperficial brown oxidation, and said chassis 10 and cover plate 20 corresponding said blind grooves 11 are respectively equipped with first through hole 12 and second through hole 21, and said cover plate 20 covers separably and is located on the chassis 10 to prevent that the copper billet that is contained in the blind groove 11 from dropping.
Said chassis 10 is passed through pin 30 location and is combined with cover plate 20.
Said pin 30 is located at the edge on chassis 10, and corresponding pin 30 is provided with location hole 22 on the said cover plate 20, and the location hole 22 through cover plate 20 is inserted in pin 30 pairs of cover plates 20 and positions with chassis 10 and combine.Said chassis 10 is provided with location hole 13, and said pin 30 is inserted in the location hole 13.
Said cover plate 20 and chassis 10 are processed by the light central layer, and said smooth central layer is meant the central layer of the no copper in surface.
The quantity of said blind groove 11 is looked concrete operating position and is decided, and can be one or several, and in the present embodiment, the quantity of said blind groove 11 is 6, and rectangular array arrangement.
The corresponding blind groove 11 first set through holes 12 comprise a large-size through hole 121 that is positioned at blind groove 11 centres and are distributed in said large-size through hole 121 several reduced size through holes 122 on every side on the said chassis 10, and the size of said large-size through hole 121 is less than the size of treating the copper billet of surperficial brown oxidation in the blind groove 11.
Said blind groove 11 and large-size through hole 121 are all rectangular, and said reduced size through hole 122 is rounded.The corresponding blind groove 11 second set through holes 21 are the strip through hole on the said cover plate 20, and the width of said second through hole 21 is less than the size of blind groove 11 at this Width, and less than treating the size of the copper billet of surperficial brown oxidation at this Width in the blind groove 11.Said second through hole 21 also can be several manholes that are evenly distributed.
The brown oxidation in copper billet surface is with the method for using of combination pallet: the copper billet that will treat brown oxidation is put in the blind groove 11 on chassis 10 of brown oxide compound pallet, places a copper billet in each blind groove 11, wounds, wipes flower to prevent copper billet; Cover plate 20 Gai Zaiyi of combination pallet are put on the chassis 10 of copper billet, and the location hole 22 of cover plate 20 is inserted on the pin 30 on chassis 10, and cover plate 20 just forms the combination pallet with chassis 10 like this; The combination pallet that to put into copper billet at last is put in the brown production line, can carry out brown to copper billet.
The brown oxidation in above-mentioned copper billet surface is with the combination pallet; Through being set, blind groove holds and carries the copper billet of treating surperficial brown oxidation on the chassis; And on the chassis loam cake is established cover plate, (size is less than the brown oxidation processes on the copper billet of 40mm * 60mm) surface, and is easy to operate and durability good can to realize small size; Simultaneously on cover plate and chassis, through hole is set; Help brown oxidation liquid medicine and fully contact the copper billet surface; Improve the oxidation effectiveness on copper billet surface, thereby improve the bond strength of copper billet and prepreg, prevent that effectively copper billet from separating with prepreg; Guarantee built-in or in bury copper billet pcb board reliability and reach pb-free solder (260 ℃ of maximum temperatures) requirement, improve built-in or in bury the copper billet pcb board dependability and electric property.
The brown oxidation in copper billet of the present invention surface comprises the steps: with the manufacture method of combination pallet
Step 1: chassis base material and cover plate base material are provided;
Step 2: make the chassis, comprise the steps: step 2.1, the edge of base material bores location hole on the chassis; Step 2.2 is milled the large-size through hole on the base material of chassis; Step 2.3, on the base material of chassis in the blind groove of the peripheral milling of large-size through hole; Step 2.4 is bored the reduced size through hole in the bottom of blind groove; Step 2.5 is squeezed into pin in the location hole on chassis, make the chassis;
Step 3: make cover plate, comprise the steps: step 3.1, the corresponding ground auger location hole of location hole on correspondence chassis, the edge of cover plate substrate; Step 3.2, on the cover board the blind groove on corresponding chassis is made second through hole, makes cover plate.
In the manufacture method of the brown oxidation in above-mentioned copper billet surface with the combination pallet; Said blind groove and large-size through hole are all rectangular; Said reduced size through hole is rounded; The second set through hole of corresponding blind groove is the strip through hole on the said cover plate, and the width of said second through hole is less than the size of blind groove at this Width, and less than treating the size of the copper billet of surperficial brown oxidation at this Width in the blind groove.
In the manufacture method of the brown oxidation in above-mentioned copper billet surface with the combination pallet, said chassis base material and cover plate substrate adopt the light central layer to make, and be easy to make and cost is low.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (10)
1. the brown oxidation in copper billet surface is with the combination pallet; It is characterized in that; Comprise chassis and cover plate; Said chassis is provided with blind groove in order to hold and to carry the copper billet of treating surperficial brown oxidation, and the corresponding said blind groove of said chassis and cover plate is respectively equipped with first through hole and second through hole, and said cover plate covers separably and is located on the chassis to prevent that the copper billet that is contained in the blind groove from dropping.
2. the brown oxidation in copper billet as claimed in claim 1 surface is characterized in that with the combination pallet said chassis and cover plate pass through the pin location and combine.
3. the brown oxidation in copper billet as claimed in claim 2 surface is with the combination pallet; It is characterized in that; Said pin is located at the edge on chassis, and corresponding pin is provided with location hole on the said cover plate, and the location hole through cover plate is inserted in pin and cover plate and chassis are positioned and combines.
4. the brown oxidation in copper billet as claimed in claim 1 surface is characterized in that with the combination pallet said cover plate and chassis are processed by the light central layer.
5. the brown oxidation in copper billet as claimed in claim 1 surface is characterized in that with the combination pallet quantity of said blind groove is a plurality of, and rectangular array arrangement.
6. the brown oxidation in copper billet as claimed in claim 1 surface is with the combination pallet; It is characterized in that; The first set through hole of corresponding blind groove comprises a large-size through hole that is positioned at blind groove centre and is distributed in said large-size through hole several reduced size through holes on every side on the said chassis, and the size of said large-size through hole is less than the size of treating the copper billet of surperficial brown oxidation in the blind groove.
7. the brown oxidation in copper billet as claimed in claim 6 surface is characterized in that with the combination pallet said blind groove and large-size through hole are all rectangular, and said reduced size through hole is rounded.The second set through hole of corresponding blind groove is the strip through hole on the said cover plate, and the width of said second through hole is less than the size of blind groove at this Width, and less than treating the size of the copper billet of surperficial brown oxidation at this Width in the blind groove.
8. the brown oxidation in copper billet surface is characterized in that with the manufacture method that makes up pallet, comprises the steps:
Step 1: chassis base material and cover plate base material are provided;
Step 2: make the chassis, comprise the steps: step 2.1, the edge of base material bores location hole on the chassis; Step 2.2 is milled the large-size through hole on the base material of chassis; Step 2.3, on the base material of chassis in the blind groove of the peripheral milling of large-size through hole; Step 2.4 is bored the reduced size through hole in the bottom of blind groove; Step 2.5 is squeezed into pin in the location hole on chassis, make the chassis;
Step 3: make cover plate, comprise the steps: step 3.1, the corresponding ground auger location hole of location hole on correspondence chassis, the edge of cover plate substrate; Step 3.2, on the cover board the blind groove on corresponding chassis is made second through hole, makes cover plate.
9. the brown oxidation in copper billet as claimed in claim 8 surface is with the manufacture method of combination pallet; It is characterized in that; Said blind groove and large-size through hole are all rectangular, and said reduced size through hole is rounded, and the second set through hole of corresponding blind groove is the strip through hole on the said cover plate; The width of said second through hole is less than the size of blind groove at this Width, and less than treating the size of the copper billet of surperficial brown oxidation at this Width in the blind groove.
10. the brown oxidation in copper billet as claimed in claim 8 surface is characterized in that with the manufacture method of combination pallet said chassis base material and cover plate substrate adopt the light central layer to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104448827A CN102548236A (en) | 2011-12-26 | 2011-12-26 | Combined tray for surface brown oxidation of copper blocks and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104448827A CN102548236A (en) | 2011-12-26 | 2011-12-26 | Combined tray for surface brown oxidation of copper blocks and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102548236A true CN102548236A (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104448827A Pending CN102548236A (en) | 2011-12-26 | 2011-12-26 | Combined tray for surface brown oxidation of copper blocks and manufacturing method thereof |
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| CN (1) | CN102548236A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883556A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Copper block oxide method |
| CN105307399A (en) * | 2015-10-23 | 2016-02-03 | 深圳市强达电路有限公司 | Processing method for small, thin and pure ceramic circuit board |
| CN106550544A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of manufacture method of small size ceramics pcb board |
| TWI742947B (en) * | 2020-12-02 | 2021-10-11 | 健鼎科技股份有限公司 | Copper block browning metohd |
| TWI755180B (en) * | 2020-12-02 | 2022-02-11 | 健鼎科技股份有限公司 | Copper block browning fixture and manufacturing method thereof |
| CN114521068A (en) * | 2020-11-19 | 2022-05-20 | 健鼎（无锡）电子有限公司 | Copper block browning method |
| CN114521069A (en) * | 2020-11-19 | 2022-05-20 | 健鼎（无锡）电子有限公司 | Copper block browning jig and manufacturing method thereof |
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| US5605719A (en) * | 1995-03-03 | 1997-02-25 | Rockwell International Corporation | Method of transporting and applying a surface treatment liquid using gas bubbles |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883556A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Copper block oxide method |
| CN105307399A (en) * | 2015-10-23 | 2016-02-03 | 深圳市强达电路有限公司 | Processing method for small, thin and pure ceramic circuit board |
| CN105307399B (en) * | 2015-10-23 | 2017-11-28 | 深圳市强达电路有限公司 | A kind of processing method of small size, thin pure ceramic circuit-board |
| CN106550544A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of manufacture method of small size ceramics pcb board |
| CN114521068A (en) * | 2020-11-19 | 2022-05-20 | 健鼎（无锡）电子有限公司 | Copper block browning method |
| CN114521069A (en) * | 2020-11-19 | 2022-05-20 | 健鼎（无锡）电子有限公司 | Copper block browning jig and manufacturing method thereof |
| CN114521068B (en) * | 2020-11-19 | 2024-01-30 | 健鼎（无锡）电子有限公司 | Method for browning copper block |
| CN114521069B (en) * | 2020-11-19 | 2024-02-23 | 健鼎（无锡）电子有限公司 | Copper block browning jig and manufacturing method thereof |
| TWI742947B (en) * | 2020-12-02 | 2021-10-11 | 健鼎科技股份有限公司 | Copper block browning metohd |
| TWI755180B (en) * | 2020-12-02 | 2022-02-11 | 健鼎科技股份有限公司 | Copper block browning fixture and manufacturing method thereof |
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Application publication date: 20120704 |