CN102573383B - Wind scooper and use the heat abstractor of this wind scooper - Google Patents
Wind scooper and use the heat abstractor of this wind scooper Download PDFInfo
- Publication number
- CN102573383B CN102573383B CN201010580857.7A CN201010580857A CN102573383B CN 102573383 B CN102573383 B CN 102573383B CN 201010580857 A CN201010580857 A CN 201010580857A CN 102573383 B CN102573383 B CN 102573383B
- Authority
- CN
- China
- Prior art keywords
- wind
- wind scooper
- radiator
- wind deflector
- scooper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A kind of heat abstractor, comprise a radiator, and cover is established a wind scooper of this radiator, described wind scooper comprises a wind scooper body and is connected in the wind deflector on this wind scooper body, this wind scooper has an air stream outlet of contiguous radiator and an air flow inlet of contiguous this wind deflector, wherein air flow inlet is for flowing into wind scooper for air-flow, air stream outlet is for flowing out wind scooper for air-flow, one end of this wind deflector is articulated in wind scooper body adjacent gas inflow entrance place, the other end of this wind deflector can be fixed on the diverse location of wind scooper body, to coordinate with the radiator of differing heights or width. the wind deflector arranging in the wind scooper of heat abstractor of the present invention can be fixed on by adjusting the diverse location of wind scooper, and same wind scooper can be matched with the radiator of differing heights or width, has reduced the design cost of whole heat abstractor.
Description
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of wind scooper of heat abstractor.
Background technology
Along with the development of electronic technology, the electronic installation that the electronic component integration degree such as video card are higher is being transportedWhen row, a large amount of heats can be produced, if these heats can not be left effectively, temperature will be directly causedSharply rise, and badly influence the operating efficiency of electronic installation. For this reason, conventionally on electronic installation, pacifyDress heat abstractor dispels the heat.
Common heat abstractor generally comprises the radiator contacting with electronic component heat conduction and is installed on this and falls apartA near fan hot device. In order to promote the utilization rate of fan airstream, also on radiator, install a wind-guiding additionalCover, so that the air-flow that fan was produced is intensively guided to radiator, makes radiator rapidly and air-flow heat exchange.But, for the electronic component of different capacity, the radiator of need to reasonably arrange in pairs or groups differing heights or width,So for the radiator of differing heights or width, need the wind scooper of corresponding design differing heights or widthCome to match with radiator, increased on the whole the design cost of heat abstractor.
Summary of the invention
In view of this, being necessary to provide a kind of in fact can be used in combination with the radiator of differing heights or widthWind scooper and apply the heat abstractor of this wind scooper.
A kind of wind scooper, comprises a wind scooper body and is connected in the wind deflector on this wind scooper body,This wind scooper has an air stream outlet and an air flow inlet, and wherein air flow inlet is for flowing into wind-guiding for air-flowCover, air stream outlet is for flowing out wind scooper for air-flow, and one end of this wind deflector is articulated in wind scooper body neighbourNearly air flow inlet place, the other end of this wind deflector can be fixed on the diverse location of wind scooper body.
A kind of heat abstractor, comprises a radiator and covers a wind scooper of establishing this radiator, described wind-guidingCover and comprise a wind scooper body and be connected in the wind deflector on this wind scooper body, this wind scooper has neighbourOne air flow inlet of one air stream outlet of nearly radiator and contiguous this wind deflector, wherein air flow inlet is for supplyingAir-flow flows into wind scooper, and air stream outlet is for flowing out wind scooper for air-flow, and one end of this wind deflector is articulated inWind scooper body adjacent gas inflow entrance place, the other end of this wind deflector can be fixed on the difference of wind scooper bodyPosition, to coordinate with the radiator of differing heights or width.
Compared with prior art, the wind deflector arranging in the wind scooper of heat abstractor of the present invention can be by adjustingJoint is fixed on the diverse location of wind scooper, make same wind scooper can with the heat radiation of differing heights or widthDevice matches, and has reduced the design cost of whole heat abstractor.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Brief description of the drawings
Fig. 1 is the use state diagram of the heat abstractor of one embodiment of the invention.
Fig. 2 is the exploded view of Fig. 1.
Fig. 3 is the schematic diagram of another form of heat abstractor.
Main element symbol description
Radiator 10,10a
Wind scooper 20
Circuit board 30
Electronic component 32
Absorber plate 12
Fins group 16
Heat pipe 18
Fin 162
Wind scooper main body 21
Top board 22
Side plate 24
Opening 220
Wind deflector 23
Air flow inlet 25
Air stream outlet 26
Pivoted hole 240
Locating hole 242
Body 232
Pivot 234
Fastening part 236
Salient point 237
Detailed description of the invention
Please refer to Fig. 1 is the use state diagram of the heat abstractor of one embodiment of the invention. In the present embodiment,This heat abstractor is arranged on a circuit board 30, is used for faling apart into the electronic component 32 on this circuit board 30Heat. This heat abstractor comprises a radiator 10 and covers a wind scooper 20 of establishing this radiator 10.
Referring to Fig. 2, this radiator 10 comprises the absorber plate contacting with electronic component 32 heat conduction12, be placed in a fins group 16 and heat conduction connection absorber plate 12 and the fins group 16 of absorber plate 12 topsFour heat pipes 18. Above-mentioned fins group 16 is by stacking the forming of some fins 162, and this fin 162 is by copperMake in metal material. Each fin 162 is spaced, and it is logical that 162 adjacent of fins form some air-flowsRoad (not label).
This wind scooper 20 can adopt the materials such as plastic cement to make, and it comprises a wind scooper body 21 and a wind-guidingPlate 23. This wind scooper body 21 comprises a top board 22 and vertical from the relative both sides outer rim of this top board 22To two side plates 24 of downward-extension. Distance between this two side plate 24 is substantially equal to the width of this radiator 10,This radiator 10 is between two side plates 24. A rectangular aperture 220 is offered in one end of top board 22, described inRadiator 10 is installed in this wind scooper 20 and is positioned at the other end place of this top board 22 away from opening 220, shouldWind deflector 23 is installed on and in this wind scooper body 21, is positioned at this opening 220 places. These wind scooper 20 vicinities are openedOne end of mouth 220 has an air flow inlet 25, and wind scooper 20 has a gas away from one end of opening 220Flow export 26. Two side plates 24 and the junction of this top board 22 of this wind scooper 20 are offered a pair of relativePivoted hole 240, this pivoted hole 240 is between this opening 220 and this air flow inlet 25. This wind scooperFour locating holes 242 are offered, these four locating holes in every side plate 24 contiguous radiator 10 intervals, place of 20242 curved arrangements on side plate 24. The locating hole 242 of this two side plate 24 is from the top down respectively along waterSquare to alignment, form the locating hole 242 of four pairs of corresponding differing heights radiators of difference. This wind deflector 23Comprise the body 232 of the rectangle between two side plates 24, the edge level of these body 232 one end certainlyThe edge-perpendicular of an outward extending pivot 234 and certainly these body 232 other ends is to two holdings of downward-extensionPortion 236. On each fastening part 236, protrude out a circular salient point 237. The body 232 of this wind deflector 23Area be slightly larger than the area of opening 220. The pivot 234 of this wind deflector 23 is articulated in pivoted hole 240,Salient point 237 correspondences of this two fastening part 236 are placed in the uppermost a pair of locating hole 242 of this side plate 24,So that wind deflector 23 is fixed, and make the body 232 of this wind deflector 23 ride against this radiator 10 tops,Blow to radiator 10 with guiding air-flow along wind deflector 23. Be understandable that, can on this fastening part 236Offer a lockhole, pass this fastening part 236 is fixed on this side plate 24 for screw.
As shown in Figure 3, when changing when another highly less radiator 10a, only need along pivot 234 toBackspin transduction aerofoil 23, another that the salient point of fastening part 236 237 is placed in to this side plate 24 is to locationIn hole 242, the body 232 of wind deflector 23 is ridden against on this radiator 10a. Thereby air-flow is downwardBe directed in radiator 10, carry out sufficient heat exchange with radiator 10.
Be understandable that, it is one protruding that wherein side plate 24 bottoms of this wind scooper 20 can be extended to the insideRise, this projection and top board 22 adjacent gas inflow entrance 25 places offer this to pivoted hole 240, above-mentioned locating hole242 compartment of terrains are opened in top board 22 contiguous radiator 10 places of wind scooper 20, the pivot of this wind deflector 23Axle 234 is articulated in pivoted hole 240, and salient point 237 correspondences of this two fastening part 236 are placed in this top board 22A wherein locating hole 242 in, so that wind deflector 23 is fixing, the body 232 of this wind deflector 23 is takenLean against this radiator 10 sidepieces, this wind scooper 20 can match with the radiator of different in width like this.
Compared with prior art, the wind deflector 23 of the wind scooper 20 interior settings of heat abstractor of the present invention canBe fixed on the diverse location of wind scooper 20 by adjusting, make same wind scooper can with differing heights or wideThe radiator of degree matches, and has reduced the design cost of whole heat abstractor.
Claims (4)
1. a wind scooper, comprises a wind scooper body and is connected in the wind deflector on this wind scooper body,This wind scooper has an air stream outlet and an air flow inlet, and wherein air flow inlet is for flowing into wind-guiding for air-flowCover, air stream outlet, for flowing out wind scooper for air-flow, is characterized in that: one end of this wind deflector is articulated inWind scooper body adjacent gas inflow entrance place, the other end of this wind deflector can be fixed on the difference of wind scooper bodyPosition; Described wind scooper body comprises a top board and from the relative both sides outer rim of this top board to two of downward-extensionSide plate, this two side plate is offered a pair of relative pivoted hole, and this wind deflector comprises between this two side plateOne body, the outward extending pivot in this body one end certainly, the pivot of this wind deflector is articulated in this two side platePivoted hole; Every side plate is offered some locating holes from the top down, and the locating hole of two side plates divides from the top downOther along continuous straight runs alignment, forms some locating holes to the corresponding differing heights of difference, and this wind deflector also wrapsDraw together two fastening parts that extend from this body other end, two fastening part correspondences of this wind deflector are placed in two side platesWherein a pair of locating hole; An opening is offered in one end of described top board, and this wind deflector is installed on this wind scooperIn body, be positioned at this opening part.
2. a heat abstractor, comprises that a radiator and cover establish a wind scooper of this radiator, described in leadFan housing comprises a wind scooper body and is connected in the wind deflector on this wind scooper body, and this wind scooper hasOne air flow inlet of one air stream outlet of contiguous radiator and contiguous this wind deflector, wherein air flow inlet is used forFlow into wind scooper for air-flow, air stream outlet, for flowing out wind scooper for air-flow, is characterized in that: this wind-guidingOne end of plate is articulated in wind scooper body adjacent gas inflow entrance place, and the other end of this wind deflector can be fixed on and leadThe diverse location of fan housing body, to coordinate with the radiator of differing heights or width; Described wind scooper bodyComprise a top board and two side plates from the relative both sides outer rim of this top board to downward-extension, this radiator is positioned at thisBetween two side plates, this two side plate is offered a pair of relative pivoted hole, and this wind deflector comprises and is positioned at this two side plateBetween a body, the outward extending pivot in this body one end certainly, the pivot of this wind deflector is articulated in thisThe pivoted hole of two side plates, the body of this wind deflector rides against on this radiator; The contiguous radiator of every side platePlace offers some locating holes from the top down, and the locating hole of two side plates is along continuous straight runs alignment respectively from the top down,Form somely to the locating holes of corresponding differing heights respectively, this wind deflector also comprises from this body other end and prolongingTwo fastening parts of stretching, two fastening part correspondences of this wind deflector be placed in this wind scooper two side plates wherein oneTo locating hole; An opening is offered in one end of described top board, and this wind deflector is installed on position in this wind scooper bodyIn this opening part, described radiator is installed on and in this wind scooper, is positioned at the other end place of this top board away from opening.
3. heat abstractor as claimed in claim 2, is characterized in that: described locating hole is on side plateArc shooting.
4. heat abstractor as claimed in claim 2, is characterized in that: each pivoted hole is positioned at correspondingThe junction of side plate and top board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010580857.7A CN102573383B (en) | 2010-12-09 | 2010-12-09 | Wind scooper and use the heat abstractor of this wind scooper |
| US12/981,426 US20120145363A1 (en) | 2010-12-09 | 2010-12-29 | Fan duct and heat dissipation device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010580857.7A CN102573383B (en) | 2010-12-09 | 2010-12-09 | Wind scooper and use the heat abstractor of this wind scooper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102573383A CN102573383A (en) | 2012-07-11 |
| CN102573383B true CN102573383B (en) | 2016-05-25 |
Family
ID=46198133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010580857.7A Expired - Fee Related CN102573383B (en) | 2010-12-09 | 2010-12-09 | Wind scooper and use the heat abstractor of this wind scooper |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120145363A1 (en) |
| CN (1) | CN102573383B (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958322A (en) * | 2011-08-25 | 2013-03-06 | 鸿富锦精密工业（深圳）有限公司 | Air director |
| CN103366833A (en) * | 2012-03-28 | 2013-10-23 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation device combination |
| CN103809711B (en) * | 2012-11-12 | 2017-07-14 | 英业达科技有限公司 | Electronic installation |
| CN103857256B (en) * | 2012-11-28 | 2016-08-10 | 国家电网公司 | Wind scooper and there is the electronic installation of this wind scooper |
| CN104122953A (en) * | 2013-04-24 | 2014-10-29 | 鸿富锦精密工业（深圳）有限公司 | Chassis |
| JP1513564S (en) * | 2014-06-18 | 2016-12-05 | ||
| JP1513565S (en) * | 2014-06-18 | 2016-12-05 | ||
| JP6407214B2 (en) * | 2016-08-02 | 2018-10-17 | 株式会社ソニー・インタラクティブエンタテインメント | Electronics |
| CN106502340B (en) * | 2016-11-02 | 2019-06-28 | 英业达科技有限公司 | Server |
| USD907184S1 (en) * | 2017-11-28 | 2021-01-05 | Gree Electric Appliances, Inc. Of Zhuhai | Air conditioning apparatus |
| CN109960380B (en) * | 2017-12-22 | 2022-10-04 | 富联精密电子(天津)有限公司 | Wind scooper, case adopting wind scooper and electronic device |
| US10372176B2 (en) * | 2018-01-03 | 2019-08-06 | Dell Products, Lp | Information handling system with a common air duct for multiple air flow guiding configurations |
| CN108563310A (en) * | 2018-04-23 | 2018-09-21 | 郑州云海信息技术有限公司 | A kind of wind scooper for supporting half long half high high power consumption add-on card heat dissipation |
| CN109357326B (en) * | 2018-09-14 | 2020-09-11 | 青岛海信日立空调系统有限公司 | Wind scooper and electric box |
| CN110506824A (en) * | 2019-09-26 | 2019-11-29 | 江苏科技大学 | A kind of cotton candy machine based on electromagnetic heating |
| US11510344B2 (en) * | 2019-09-30 | 2022-11-22 | TechnoGuard Inc. | Computer server cabinet portable louver system |
| CN111447799A (en) * | 2020-04-29 | 2020-07-24 | 水氪(北京)科技发展有限公司 | Heat dissipation system for food purifier |
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| US6005770A (en) * | 1997-11-12 | 1999-12-21 | Dell U.S.A., L.P. | Computer and a system and method for cooling the interior of the computer |
| US6155920A (en) * | 1998-12-18 | 2000-12-05 | Lite-On Enclosure Inc. | Air ducts structure of a radiating fan |
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| US7643292B1 (en) * | 2008-12-23 | 2010-01-05 | Chenbro Micom Co., Ltd. | Adjustable air director |
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| US5963424A (en) * | 1995-11-07 | 1999-10-05 | Sun Microsystems, Inc. | Pulsar desk top system that will produce 500 watts of heat |
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| JP2005158045A (en) * | 2003-11-20 | 2005-06-16 | First Internatl Computer Inc | Structure of air guide cover and method for manufacturing the same |
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-
2010
- 2010-12-09 CN CN201010580857.7A patent/CN102573383B/en not_active Expired - Fee Related
- 2010-12-29 US US12/981,426 patent/US20120145363A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6005770A (en) * | 1997-11-12 | 1999-12-21 | Dell U.S.A., L.P. | Computer and a system and method for cooling the interior of the computer |
| US6155920A (en) * | 1998-12-18 | 2000-12-05 | Lite-On Enclosure Inc. | Air ducts structure of a radiating fan |
| US7262964B1 (en) * | 2005-04-27 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Airflow control baffle |
| CN201115221Y (en) * | 2007-08-21 | 2008-09-10 | 英业达股份有限公司 | Wind guide cover |
| US7643292B1 (en) * | 2008-12-23 | 2010-01-05 | Chenbro Micom Co., Ltd. | Adjustable air director |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120145363A1 (en) | 2012-06-14 |
| CN102573383A (en) | 2012-07-11 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20151029 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160525 Termination date: 20161209 |
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| CF01 | Termination of patent right due to non-payment of annual fee |