CN102677135A - Electroplating production device and method for high-precision circuit board with complete metal wrapped edge - Google Patents
Electroplating production device and method for high-precision circuit board with complete metal wrapped edge Download PDFInfo
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- CN102677135A CN102677135A CN2011100644537A CN201110064453A CN102677135A CN 102677135 A CN102677135 A CN 102677135A CN 2011100644537 A CN2011100644537 A CN 2011100644537A CN 201110064453 A CN201110064453 A CN 201110064453A CN 102677135 A CN102677135 A CN 102677135A
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Abstract
The invention discloses an electroplating production device and a method for a high-precision circuit board with a complete metal wrapped edge. An insulation hole in the circuit board is used as a positioning insulation hole, and a screw is fixed in the insulation hole; the screws in all circuit boards are connected with a conductive copper plate by a first copper wire and a conductive clip; the screws in all the circuit boards are connected in series by a second copper wire arranged between two optical substrates; when the two ends of a pinch roller are connected with a power supply, the circuit boards form a conductive path through the pinch roller, a first conductive clamp plate, a conductive beam, a second conductive clamp plate, the conductive copper plate and the conductive clip, so that the electroplating treatment to the circuit boards is realized. Compared with the prior art, a connecting position is not needed to be arranged on the side edge of the circuit board, the insulation hole of the circuit board is directly used as the positioning hole for fixing the screw, a large number of circuit boards are connected in series through the copper wire, the large-scale production of circuit boards with complete metal wrapped edges is realized, and the production efficiency is greatly improved.
Description
Technical field:
The invention belongs to PCB manufacturing technology field, what be specifically related to is the Electroplating Production device and method on the complete limit covered with gold leaf of a kind of high-accuracy wiring board.
Background technology:
Printed substrate (Printed Circuit Board) is called for short PCB, claims printed board again, is one of vitals of electronic product.Electronic product with the printed circuit board manufacturing has safety height, high conformity, physical strength is high, in light weight, volume is little, be easy to advantages such as stdn.Every kind of electronics almost arrives computingmachine, signal equipment, electronic radar system greatly to accutron, counter for a short time, as long as there are electronic devices and components, the electric interconnection between them will use printed substrate.
Along with the fast development of high-accuracy electronic machine, the manufacturing of pcb board to be had higher requirement, the pcb board that in precise electronic product, uses usually need carry out limit covered with gold leaf to be handled, to satisfy the user demand of high-accuracy electronic machine.
Yet according to the different request for utilizations of electronic machine, it is also corresponding different that pcb board is carried out limit covered with gold leaf processing, usually PCB limit covered with gold leaf mainly is divided into: part limit covered with gold leaf and complete limit covered with gold leaf.Part limit covered with gold leaf is exactly that at pcb board four lateral one of them or several side are carried out gold filled and handled; It at first is that design is connected between plate and plate; Then with the empty also turmeric of the disconnected bit position gong between plate and plate limit covered with gold leaf; It is disconnected to connect the position gong afterwards, final molding, and it is covered with gold leaf to accomplish part; And complete limit covered with gold leaf is if adopt aforesaid way, to connect the position in the design of pcb board side on the complete limit covered with gold leaf, four sides of pcb board; Be provided with the place that connects the position at side so and just can't carry out the gold filled processing; So can not adopt the mode on part limit covered with gold leaf to produce, way is with the processing covered with gold leaf fully of a pcb board usually, another piece is being carried out the gold filled processing then; It can't realize producing in enormous quantities, and production efficiency is very low.
Summary of the invention:
Existingly in high-accuracy pcb board being carried out complete limit covered with gold leaf treating processes at present can't produce in enormous quantities for solving, inefficient problem, the present invention proposes the Electroplating Production device and method on the complete limit covered with gold leaf of a kind of high-accuracy wiring board.
For realizing above-mentioned purpose, the present invention mainly adopts following technical scheme:
The Electroplating Production device on the complete limit covered with gold leaf of a kind of high-accuracy wiring board; Comprise and fly crust (1), conduction crossbeam (9), conductive copper plate (7) and wiring board (5); Be fixed with screw (11) on the said wiring board (5); Said flying is connected through the first conduction clamping plate (2) between crust (1) and conduction crossbeam (9), passes through second between conduction crossbeam (9) and the conductive copper plate (7) and conducts electricity clamping plate (3) connection, and said conductive copper plate (7) is provided with a plurality of conductive clips (10); Said conductive clip (10) is connected with screw (11) on the wiring board (5) through first copper cash (12); Said conductive copper plate (7) both sides respectively are provided with a photopolymer substrate (4), are connected with second copper cash (13) between the said photopolymer substrate (4), and said second copper cash (13) is connected with screw (11) on the wiring board (5).
Wherein said crust (1) two ends that fly are provided with power connector end (8).
Also be provided with Teflon line (6) between the wherein said photopolymer substrate (4), said wiring board (5) is fixing through this Teflon line (6).
Wherein said wiring board (5) is provided with a location insulated hole (14), and said screw (11) is fixed in this location insulated hole (14).
In addition, the present invention also provides the Electroplating Production method on the complete limit covered with gold leaf of a kind of high-accuracy wiring board, and it comprises step:
A, hole in the circuit board, institute's boring is divided into via and non-conduction hole, choose the location insulated hole that one of them non-conduction hole is used as retaining screw, and make the little 0.1mm in aperture, finished product hole of its aperture ratio customer requirements according to customer requirements;
B, above-mentioned wiring board is carried out the gong sheet metal forming, then above-mentioned wiring board is put into heavy copper liquid and sink the copper processing, making wiring board face, plate side and via hole wall deposit thickness is the copper layer of 0.2～0.5um;
C, in the insulated hole of above-mentioned location set screw;
D, wiring board is serially connected on first copper cash that is connected with conductive clip through above-mentioned screw; And screw is connected with second copper cash between the photopolymer substrate; Then wiring board is put into electroplate liquid and carry out panel plating, make wiring board face, plate side and via hole wall copper layer thickness reach 5～6um;
E: the wiring board that will pass through the panel plating processing takes off from first copper cash, second copper cash, and from the insulated hole of wiring board location, takes out screw;
F, above-mentioned wiring board is carried out circuit make, on the wiring board face, form line pattern;
G, screw is fixed in the insulated hole of wiring board location once more;
H, wiring board is serially connected on first copper cash that is connected with conductive clip through screw once more; And screw is connected with second copper cash between the photopolymer substrate; And wiring board is put into electroplate liquid carry out graphic plating, wiring board face, plate side and via hole wall copper layer are thickeied once more;
I, will pass through the wiring board that graphic plating handles and take off, and from the insulated hole of wiring board location, take out screw from first copper cash, second copper cash;
J, wiring board is hindered weldering, on circuit that need not weld on the wiring board face and substrate, apply one deck printing ink;
K, the location insulated hole on the wiring board plate is carried out secondary drilling, make the diameter of this location insulated hole identical with the aperture, finished product hole of customer requirements;
L, above-mentioned wiring board is carried out turmeric handle, make the welding position and side formation nickel-gold layer of wiring board plate face.
Wherein step D specifically comprises:
Wiring board is serially connected on first copper cash that is connected with conductive clip through above-mentioned screw; And screw is connected with second copper cash between the photopolymer substrate; And wiring board is clamped through the Teflon line; Then wiring board is put into electroplate liquid and carry out panel plating, make wiring board face, plate side and via hole wall copper layer thickness reach 5～6um.
Wherein step F specifically comprises:
Above-mentioned wiring board is pasted dry film, exposure, development, etch process processing, remove the copper layer of wiring board plate face logicalnot circuit part, on wiring board plate face, form line pattern.
Wherein step H specifically comprises:
Wiring board is serially connected on first copper cash that is connected with conductive clip through screw once more; And screw is connected with second copper cash between the photopolymer substrate; And wiring board is clamped through the Teflon line; Then wiring board is put into electroplate liquid and carry out graphic plating, wiring board face, plate side and via hole wall copper layer are thickeied once more.
The present invention is through choose an insulated hole as the location insulated hole in the circuit board; And in this insulated hole fixing screw; Then the screw on all wiring boards is connected with conductive copper plate through first copper cash, conductive clip; And second copper cash through being arranged between two photopolymer substrates is together in series the screw on all wiring boards; When flying to cling to two ends and be connected, can make wiring board form conductive path, from realizing electroplating processes to wiring board through flying crust, the first conduction clamping plate, conduction crossbeam, the second conduction clamping plate, conductive copper plate, conductive clip with power supply.Compared with prior art; The present invention need not at the wiring board side connection position to be set; Directly pass through the pilot hole of the insulated hole of wiring board itself as set screw; And through copper cash a large amount of circuit spots are serially connected, have realized the production in enormous quantities on the complete limit covered with gold leaf of wiring board, improved production efficiency greatly.
Description of drawings:
Fig. 1 is the structural representation of the Electroplating Production device on the complete limit covered with gold leaf of the high-accuracy wiring board of the present invention.
Fig. 2 is the local enlarged diagram in A place among Fig. 1.
The structural representation that Fig. 3 connects through first copper cash, second copper cash for wiring board of the present invention.
Fig. 4 is a process flow sheet of the present invention.
Identifier declaration among the figure: fly to cling to 1, the first conduction clamping plate 2, the second conduction clamping plate 3, photopolymer substrate 4, wiring board 5, Teflon line 6, conductive copper plate 7, power connector end 8, conduction crossbeam 9, conductive clip 10, screw 11, first copper cash 12, second copper cash 13, location insulated hole 14.
Embodiment:
Core concept of the present invention is: needs are carried out choose on the wiring board on limit covered with gold leaf an insulated hole as the location insulated hole; And in this insulated hole fixing screw; Then the screw on all wiring boards is connected with conductive copper plate through first copper cash, conductive clip, and the screw on all wiring boards is together in series, when flying to cling to two ends and be connected with power supply through second copper cash that is arranged between two photopolymer substrates; Can make all wiring board energising conductings, carry out electroplating processes.
For setting forth thought of the present invention and purpose, will combine accompanying drawing and specific embodiment that the present invention is done further detailed description below.
See also Fig. 1, Fig. 2, shown in Figure 3; The invention provides the Electroplating Production device on the complete limit covered with gold leaf of a kind of high-accuracy wiring board, comprise fly to cling to 1, conduction crossbeam 9, conductive copper plate 7 and wiring board 5, fly to cling to 1, conduction crossbeam 9 is the stainless steel conductor; And fly to cling to 1, conduction crossbeam 9, conductive copper plate 7 threes be on the same horizontal plane; Wherein flying to cling to 1 two ends is power connector end 8, is connected with external power source, fly to cling to 1 with conduction crossbeam 9 between conduct electricity clamping plate 2 through first and be connected; Connect through the second conduction clamping plate 3 between conduction crossbeam 9 and the conductive copper plate 7; The second conduction clamping plate, 3 two ends respectively are equipped with a photopolymer substrate 4, and side then is equipped with a plurality of conductive clips 10, these conductive clips 10 and 3 conductings of the second conduction clamping plate.
The second conduction clamping plate, 3 two ends respectively are equipped with a photopolymer substrate 4; These two photopolymer substrates 4 are provided with second copper cash 13 and Teflon line 6; Screw 11 on the above-mentioned wiring board 5 all is serially connected on second copper cash 13; Form conducting, and grip, rock to prevent that wiring board 5 from producing in moving process through Teflon line 6.
Through the conduction that flies to cling to 1, conduction crossbeam 9, conductive copper plate 7, conductive clip 10, first copper cash 12, screw 11, second copper cash 13 can be realized wiring board 5, accomplish its electroplating activity in electroplate liquid.
More than be explanation, will combine the Electroplating Production method on 4 pairs of complete limits covered with gold leaf of the high-accuracy wiring board of the present invention of accompanying drawing to do further description below the Electroplating Production device on the complete limit covered with gold leaf of the high-accuracy wiring board of the present invention.
See also shown in Figure 4ly, the present invention also provides the Electroplating Production method on the complete limit covered with gold leaf of a kind of high-accuracy wiring board, and it specifically may further comprise the steps:
Boring
Hole in the circuit board according to customer requirements, institute's boring is divided into via and non-conduction hole, choose the location insulated hole that one of them non-conduction hole is used as retaining screw, and make the little 0.1mm in aperture, finished product hole of its aperture ratio customer requirements; Formed hole, back all is the same owing to holing in the circuit board according to customer requirements; All be non-via, and through after the heavy copper processing, customer requirement is that its hole wall of via just can be deposited copper; Form via; And the hole wall in all the other holes promptly forms non-conduction hole not by heavy copper, and what choose here is a conduct location insulated hole in the non-via.
The gong plate sinks copper
Above-mentioned wiring board is carried out the gong sheet metal forming; Then above-mentioned wiring board is put into heavy copper liquid and sink the copper processing; Making wiring board face, plate side and via hole wall deposit thickness is the copper layer of 0.2～0.5um, and can in its hole, not form the copper layer for non-conduction Kong Ze.
It is under the reductive agent effect, bivalent cupric ion to be reduced into copper that the heavy copper is here handled.Because reduction efficiency is very low under the catalyst-free condition; And the copper atom that generates is difficult for directed set, can be suspended in the solution, need carry out activation treatment in the therefore heavy copper process; Can make PCB surface generate the layer of metal catalytic film; Thereby improve the reduction rate of cupric ion, the copper atom orientation is adhered to, so that be the copper layer of 0.2～0.5um at the hole wall deposit thickness of plate face, plate side and the via of wiring board.
Panel plating
Before wiring board is carried out panel plating; Will be in the location insulated hole on each wiring board set screw; Through above-mentioned screw wiring board is serially connected on first copper cash that is connected with conductive clip then, screw is connected with second copper cash between the photopolymer substrate, and the Teflon line between the photopolymer substrate is clamped wiring board; Then wiring board is put into electroplate liquid and carry out panel plating, make the hole wall copper layer thickness of wiring board face, plate side and via reach 5～6um.
Because formed copper layer thickness is 0.2～0.5um when sinking copper, oxidized easily and corrosion is when carrying out graphic plating; Can not play the favorable conductive effect; Therefore need carry out panel plating to it, make copper layer thickness reach 5～6um, excellent conducting performance during with the assurance graphic plating.
Circuit is made
Through after the panel plating; Wiring board is taken off from first copper cash, second copper cash; And from the insulated hole of wiring board location, take out screw; Then above-mentioned wiring board is pasted art breading such as dry film, exposure, development, etching, remove the copper layer of wiring board plate face logicalnot circuit part, on the wiring board face, form line pattern.
Graphic plating
Set screw once more in the location insulated hole of the wiring board after making through circuit; Wiring board is serially connected on first copper cash that is connected with conductive clip through screw; And screw is connected with second copper cash between the photopolymer substrate, and the Teflon line between the photopolymer substrate is clamped wiring board, then wiring board is put into the capable graphic plating of electroplate liquid; Wiring board face, plate side and via hole wall copper layer are thickeied once more, made the thickness of copper layer reach the thickness of customer requirement.
Resistance weldering, character are handled
Before hindering weldering, character processing; The wiring board of handling through graphic plating takes off from first copper cash, second copper cash; And from the insulated hole of wiring board location, take out screw; On circuit that need not weld on the wiring board face and substrate, apply one deck printing ink then, produce the bridge joint short circuit when preventing to weld, nonvolatil electric circumstance and anti-chemical coating are provided simultaneously; Then stamp manufacturer's printed words such as Logo, production cycle afterwards in the correct position of PCB surface.
Secondary drilling
Location insulated hole on the wiring board plate is carried out secondary drilling, makes the diameter of this location insulated hole identical with the aperture, finished product hole of customer requirements.
Turmeric
Above-mentioned wiring board is carried out turmeric handle, make the welding position of wiring board plate face and side form nickel-gold layer, reach the complete limit covered with gold leaf of wiring board.
More than be that Electroplating Production device and method to the complete limit covered with gold leaf of high-accuracy wiring board provided by the present invention has carried out detailed introduction; Used concrete example among this paper structural principle of the present invention and embodiment are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (8)
1. the Electroplating Production device on the complete limit covered with gold leaf of high-accuracy wiring board; It is characterized in that comprising and fly to cling to (1), conduction crossbeam (9), conductive copper plate (7) and wiring board (5); Be fixed with screw (11) on the said wiring board (5); Said flying is connected through the first conduction clamping plate (2) between crust (1) and conduction crossbeam (9), passes through second between conduction crossbeam (9) and the conductive copper plate (7) and conducts electricity clamping plate (3) connection, and said conductive copper plate (7) is provided with a plurality of conductive clips (10); Said conductive clip (10) is connected with screw (11) on the wiring board (5) through first copper cash (12); Said conductive copper plate (7) both sides respectively are provided with a photopolymer substrate (4), are connected with second copper cash (13) between the said photopolymer substrate (4), and said second copper cash (13) is connected with screw (11) on the wiring board (5).
2. the Electroplating Production device on the complete limit covered with gold leaf of high-accuracy wiring board according to claim 1 is characterized in that said crust (1) two ends that fly are provided with power connector end (8).
3. the Electroplating Production device on the complete limit covered with gold leaf of high-accuracy wiring board according to claim 1 is characterized in that also being provided with between the said photopolymer substrate (4) Teflon line (6), and said wiring board (5) is fixing through this Teflon line (6).
4. the Electroplating Production device on the complete limit covered with gold leaf of high-accuracy wiring board according to claim 1 is characterized in that said wiring board (5) is provided with a location insulated hole (14), and said screw (11) is fixed in this location insulated hole (14).
5. the Electroplating Production method on the complete limit covered with gold leaf of high-accuracy wiring board is characterized in that comprising step:
A, hole in the circuit board, institute's boring is divided into via and non-conduction hole, choose the location insulated hole that one of them non-conduction hole is used as retaining screw, and make the little 0.1mm in aperture, finished product hole of its aperture ratio customer requirements according to customer requirements;
B, above-mentioned wiring board is carried out the gong sheet metal forming, then above-mentioned wiring board is put into heavy copper liquid and sink the copper processing, making wiring board face, plate side and via hole wall deposit thickness is the copper layer of 0.2～0.5um;
C, in the insulated hole of above-mentioned location set screw;
D, wiring board is serially connected on first copper cash that is connected with conductive clip through above-mentioned screw; And screw is connected with second copper cash between the photopolymer substrate; Then wiring board is put into electroplate liquid and carry out panel plating, make wiring board face, plate side and via hole wall copper layer thickness reach 5～6um;
E: the wiring board that will pass through the panel plating processing takes off from first copper cash, second copper cash, and from the insulated hole of wiring board location, takes out screw;
F, above-mentioned wiring board is carried out circuit make, on the wiring board face, form line pattern;
G, screw is fixed in the insulated hole of wiring board location once more;
H, wiring board is serially connected on first copper cash that is connected with conductive clip through screw once more; And screw is connected with second copper cash between the photopolymer substrate; And wiring board is put into electroplate liquid carry out graphic plating, wiring board face, plate side and via hole wall copper layer are thickeied once more;
I, will pass through the wiring board that graphic plating handles and take off, and from the insulated hole of wiring board location, take out screw from first copper cash, second copper cash;
J, wiring board is hindered weldering, on circuit that need not weld on the wiring board face and substrate, apply one deck printing ink;
K, the location insulated hole on the wiring board plate is carried out secondary drilling, make the diameter of this location insulated hole identical with the aperture, finished product hole of customer requirements;
L, above-mentioned wiring board is carried out turmeric handle, make the welding position and side formation nickel-gold layer of wiring board plate face, reach the complete limit covered with gold leaf of wiring board.
6. the Electroplating Production method on the complete limit covered with gold leaf of high-accuracy wiring board according to claim 5 is characterized in that step D specifically comprises:
Wiring board is serially connected on first copper cash that is connected with conductive clip through above-mentioned screw; And screw is connected with second copper cash between the photopolymer substrate; And wiring board is clamped through the Teflon line; Then wiring board is put into electroplate liquid and carry out panel plating, make wiring board face, plate side and via hole wall copper layer thickness reach 5～6um.
7. the Electroplating Production method on the complete limit covered with gold leaf of high-accuracy wiring board according to claim 5 is characterized in that step F specifically comprises:
Above-mentioned wiring board is pasted dry film, exposure, development, etch process processing, remove the copper layer of wiring board plate face logicalnot circuit part, on wiring board plate face, form line pattern.
8. the Electroplating Production method on the complete limit covered with gold leaf of high-accuracy wiring board according to claim 5 is characterized in that step H specifically comprises:
Wiring board is serially connected on first copper cash that is connected with conductive clip through screw once more; And screw is connected with second copper cash between the photopolymer substrate; And wiring board is clamped through the Teflon line; Then wiring board is put into electroplate liquid and carry out graphic plating, wiring board face, plate side and via hole wall copper layer are thickeied once more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110064453.7A CN102677135B (en) | 2011-03-17 | 2011-03-17 | Electroplating production device and method for high-precision circuit board with complete metal wrapped edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110064453.7A CN102677135B (en) | 2011-03-17 | 2011-03-17 | Electroplating production device and method for high-precision circuit board with complete metal wrapped edge |
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| CN102677135A true CN102677135A (en) | 2012-09-19 |
| CN102677135B CN102677135B (en) | 2014-09-03 |
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| CN201110064453.7A Active CN102677135B (en) | 2011-03-17 | 2011-03-17 | Electroplating production device and method for high-precision circuit board with complete metal wrapped edge |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
| CN105696061A (en) * | 2016-04-12 | 2016-06-22 | 合肥长源液压股份有限公司 | Electroplating clamp for barrel-shaped workpiece |
| CN105792533A (en) * | 2014-12-19 | 2016-07-20 | 深南电路有限公司 | Manufacturing method of PCB and PCB |
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| KR20100025892A (en) * | 2008-08-28 | 2010-03-10 | 김원영 | A jig device for multistage plated of printed circuit boards |
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| US6632343B1 (en) * | 2000-08-30 | 2003-10-14 | Micron Technology, Inc. | Method and apparatus for electrolytic plating of surface metals |
| JP2003293195A (en) * | 2002-04-09 | 2003-10-15 | Canon Inc | Tool for plating printed-circuit board and plating method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105792533A (en) * | 2014-12-19 | 2016-07-20 | 深南电路有限公司 | Manufacturing method of PCB and PCB |
| CN105792533B (en) * | 2014-12-19 | 2018-11-02 | 深南电路有限公司 | A kind of production method and PCB of PCB |
| CN105007683A (en) * | 2015-07-03 | 2015-10-28 | 深圳市景旺电子股份有限公司 | Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization |
| CN105007683B (en) * | 2015-07-03 | 2018-04-03 | 深圳市景旺电子股份有限公司 | A kind of method of no glass cloth ceramics frequency PCB plate edges of boards metallization |
| CN105696061A (en) * | 2016-04-12 | 2016-06-22 | 合肥长源液压股份有限公司 | Electroplating clamp for barrel-shaped workpiece |
| CN105696061B (en) * | 2016-04-12 | 2018-09-21 | 合肥长源液压股份有限公司 | A kind of cylindrical workpiece electroplating clamp |
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| Publication number | Publication date |
|---|---|
| CN102677135B (en) | 2014-09-03 |
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Inventor after: Li Changsheng Inventor after: He Chun Inventor before: He Chun |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: HE CHUN TO: LI CHANGSHENG HE CHUN |
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| GR01 | Patent grant |