CN102689495A - Method for shielding galvanized porous plate and device - Google Patents

Method for shielding galvanized porous plate and device Download PDF

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Publication number
CN102689495A
CN102689495A CN2012101720208A CN201210172020A CN102689495A CN 102689495 A CN102689495 A CN 102689495A CN 2012101720208 A CN2012101720208 A CN 2012101720208A CN 201210172020 A CN201210172020 A CN 201210172020A CN 102689495 A CN102689495 A CN 102689495A
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China
Prior art keywords
hole
baffle plate
plate
originals
electroplating
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CN2012101720208A
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Chinese (zh)
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CN102689495B (en
Inventor
姚俊
任红卫
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Chengdu Banknote Printing Co ltd
China Banknote Printing and Minting Group Co Ltd
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CHENGDU BANKNOTE PRINTING Co Ltd
China Banknote Printing and Minting Corp
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Application filed by CHENGDU BANKNOTE PRINTING Co Ltd, China Banknote Printing and Minting Corp filed Critical CHENGDU BANKNOTE PRINTING Co Ltd
Priority to CN201210172020.8A priority Critical patent/CN102689495B/en
Publication of CN102689495A publication Critical patent/CN102689495A/en
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Publication of CN102689495B publication Critical patent/CN102689495B/en
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Abstract

The invention discloses a method for shielding a galvanized porous plate, and a device, wherein nonmetallic materials are adopted as a baffle plate, the baffle plate, except a part corresponding to patterns on the original plate of the porous plate,is left for vacancy, when the porous plate reaches a set thickness through a first time electroplating, the baffle plate is fixed at a part corresponding to the original plate of the porous plate through a sucking disc and then carrying out secondary electroplating, that the pattern part of the porous plate keeps an original thickness is achieved, and an electroplated layer in uniform transition and thickening increasingly is formed at the part out of the pattern. Therefore, under the condition of not influencing the accuracy of printing pattern, the strength of the porous plate is improved by a large margin and the purpose of increasing the printing press run can be achieved.

Description

A kind of electroplating hole version method and device of blocking
Technical field
The invention belongs to printing, plate-making field, particularly a kind of preparation method that is applicable to flat plating or barrel plating through printing forme, hole version.
Background technology
In the existing porous printing technology, mainly adopt two kinds of methods, a kind of is the silk screen version that forms through braiding warp, latitude net form method, and another kind is to form the method for biting the figure line with laser boring at metal level.These two kinds of method characteristics are that fabrication cycle is long, cost is high.
New hole version preparation method (a kind of method CN101644897 that makes nonwoven metal porous plate used for printing) has advantages such as fabrication cycle is short, cost is low, printing effect is good at present.The principle of its method is that printing down corrosion technology and plating (casting) plate-making technology are combined; To scheme line with the printing down etch and form production with electroplating again behind the master; With the separated China ink layer of electrodeposited coating conduct; Thereby the printing block that replaces traditional braided wires half tone is processed a kind of galvanograph of biting of the figure of having line.But the electroplating hole version of making through said method needs coating thinner, otherwise when electroplating along with the increase of time; The hole of hole version also dwindles thereupon, influences the printing effect of hole version, and it is high in printing, to show as printing figure line precision; But press resistance rate is not high, and service life is shorter.
Summary of the invention
The goal of the invention of patent of the present invention is: the problem to above-mentioned existence, a kind of precision that can guarantee printing figure line is provided, and can improve the electro-plating method of porous printing press resistance rate again by a relatively large margin.
Technical scheme of the present invention is achieved in that
A kind of electroplating hole version method of blocking is characterized in that: may further comprise the steps:
A), to adopt nonmetallic materials be baffle plate, with on the baffle plate, the non-figure line position corresponding with the hole plate originals be blank;
B), the hole plate originals is put into to electroplate in the cylinder body electroplates, when arriving the thickness of coating of setting, take out the hole plate originals, and baffle plate be fixed on the master, leave certain spacing between baffle plate and the hole plate originals;
C), the hole plate originals that will be fixed with baffle plate puts into to electroplate and proceeds in the cylinder body to electroplate, take out after reaching thickness of coating or the electric weight of setting;
D), take off baffle plate and open electrodeposited coating, electrodeposited coating forms printing and uses the electroplating hole version through going up the special cylinder end ring after the cutting edge.
The electroplating hole version method of blocking of the present invention; It is in said step a); According to the position of the last figure line of hole plate originals, design the position at the blank position of engraving on computers, adopt laser engraving machine figure line that baffle plate is corresponding and the cut-out of the position beyond the connecting line and blank.
The electroplating hole version method of blocking of the present invention, it is in said step b), and said baffle plate edge is fixed together through several suckers and plate originals edge, hole, and the spacing between said baffle plate and the hole plate originals is 5~50mm.
The electroplating hole version method of blocking of the present invention; It is in said step c); The coating of hole plate originals figure line corresponding position keeps original thickness under the blocking of baffle plate, the coating at plate originals non-graphic position, hole does not receive blocking of baffle plate, and its coating is thicker than the coating of hole plate originals figure line corresponding position.
The electroplating hole version method of blocking of the present invention is formed the electrodeposited coating of one deck even transition and progressive additive to the non-graphic corresponding position by the picture and text corresponding position on its said hole plate originals.
The electroplating hole version method of blocking of the present invention, it is through the spacing between adjustment retaining version and the hole plate originals, the gradient or flatness when control picture and text position and non-graphic position galvanization coating are excessive.
A kind of device that blocks the electroplating hole version, it comprises the baffle plate with the corresponding connection of hole plate originals, on said baffle plate, the non-figure line position corresponding with the hole plate originals be blank position, leaves a determining deviation between said baffle plate and the hole plate originals.
The device that blocks the electroplating hole version of the present invention is not blocked the position by blank picture and text on its said baffle plate and links together through the connecting line position.
The device that blocks the electroplating hole version of the present invention, the edge of its said baffle plate is provided with some suckers, and said baffle plate edge is fixed together through the edge of several suckers and hole plate originals.
It is baffle plate that the present invention adopts nonmetallic materials; Position beyond the last figure line of baffle plate corresponding aperture plate originals is blank; When the hole version arrives the thickness that is provided with through electroplating for the first time; With sucker the corresponding site that baffle plate is fixed on the hole plate originals is carried out second time electroplating again, realize that domain line position, hole keeps original thickness, and the position formation one deck beyond the figure line is excessively even and the electrodeposited coating of progressive additive; Thereby under the situation that does not influence printing figure line precision, improve the intensity of hole version by a relatively large margin and reach the purpose that promotes the printing press resistance rate.This electroplating hole version technical problem in service life that but method workout cost is low, fabrication cycle is fast and printability is good.
Beneficial effect of the present invention:
1, will scheme lamina and be controlled at thin plane, and make the electroplating hole version of accurate figure line not influence diminishing of aperture because of thickness of coating;
2, effectively improve the service life and the printing press resistance rate of electroplating hole version;
3, the fixed position of master can reused and be positioned to the retaining version, guarantees the hole version uniformity of making;
4, for a kind of method of making nonwoven metal porous plate used for printing new technical support is provided.
Description of drawings
Fig. 1 is the structural representation of baffle plate among the present invention.
Fig. 2 is the structural representation of mesopore plate originals of the present invention.
Fig. 3 is the structural representation after baffle plate and hole plate originals are fixed.
Fig. 4 is the sketch map of galley when printing that adopts the present invention to make.
Mark among the figure: 1 is baffle plate, and 2 for the figure line blocks the position, and 3 is the connecting line position, and 4 is the edge of baffle plate, and 5 is the hole plate originals, and 6 is sucker, and 7 is the printing ink scraping blade, and 8 is the blank position on the baffle plate.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is done detailed explanation.
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Like Fig. 1, shown in 2 and 3, a kind of electroplating hole version method of blocking may further comprise the steps:
A), according to the position of hole plate originals 5 last figure lines; Design the position at the blank position of engraving on computers; Adopting nonmetallic materials such as acrylic is baffle plate 1; Adopt laser engraving machine with on the baffle plate, the non-figure line position corresponding with the hole plate originals, promptly scheming line, to block position 2 also blank with the position cut-out beyond the connecting line position 3;
B), hole plate originals 5 is put into to electroplate in the cylinder body electroplates; When arriving the thickness of coating of setting; Take out hole plate originals 5, and said baffle plate 1 edge 4 is fixed together with plate originals edge, hole through several suckers 6, leave certain spacing between baffle plate 1 and the hole plate originals 5; Said spacing is 5~50mm, and the big I of spacing is adjusted as required;
The hole plate originals 5 that c), will be fixed with baffle plate 1 is put into to electroplate and is proceeded in the cylinder body to electroplate; The coating of hole plate originals 5 figure line corresponding positions keeps original thickness under the blocking of baffle plate 1; The coating at hole plate originals 5 non-graphic positions does not receive blocking of baffle plate 1; Its coating is thicker than the coating of hole plate originals figure line corresponding position, behind thickness of coating that reaches setting or electric weight, takes out;
D), take off baffle plate 1 and open electrodeposited coating, electrodeposited coating forms printing and uses the electroplating hole version through going up the special cylinder end ring after the cutting edge.
Wherein, After the process step c); Form the electrodeposited coating of one deck even transition and progressive additive on the said hole plate originals 5 to the non-graphic corresponding position by the picture and text corresponding position; Through the spacing between adjustment retaining version and the hole plate originals, can control picture and text position and the non-graphic position galvanization coating gradient or the flatness when excessive.
This method is on a kind of basis of method of making nonwoven metal porous plate used for printing; Solve meticulous figure line electroplating hole version; Order is several 180~240, because of thinner thickness causes the lower problem of press resistance rate, under the situation that does not influence printing figure line precision; Realize the different and even excessive coating hole version of thickness, thereby improve electroplating hole version press resistance rate by a relatively large margin.
As shown in Figure 4, during printing, printing ink scraping blade 7 contacts with non-figure line position, guarantees that the figure line does not come to harm.Negative area is convenient to store more printing ink, and under the effect of scraping blade pressure, printed matter China ink layer is more even, full.Show the hole version that adopts said method to make, the precision of figure line in the time of not only porous printing can being kept, and the printing press resistance rate of raising electroplating hole version that can be by a relatively large margin through printing experiment.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within the protection domain of invention.

Claims (9)

1. one kind blocks electroplating hole version method, it is characterized in that: may further comprise the steps:
A), to adopt nonmetallic materials be baffle plate, with on the baffle plate, the non-figure line position corresponding with the hole plate originals be blank;
B), the hole plate originals is put into to electroplate in the cylinder body electroplates, when arriving the thickness of coating of setting, take out the hole plate originals, and baffle plate be fixed on the master, leave certain spacing between baffle plate and the hole plate originals;
C), the hole plate originals that will be fixed with baffle plate puts into to electroplate and proceeds in the cylinder body to electroplate, take out after reaching thickness of coating or the electric weight of setting;
D), take off baffle plate and open electrodeposited coating, electrodeposited coating forms printing and uses the electroplating hole version through going up the special cylinder end ring after the cutting edge.
2. the electroplating hole version method of blocking according to claim 1; It is characterized in that: in said step a); Position according to the last figure line of hole plate originals; Design the position at the blank position of engraving on computers, adopt laser engraving machine figure line that baffle plate is corresponding and the cut-out of the position beyond the connecting line and blank.
3. the electroplating hole version method of blocking according to claim 2; It is characterized in that: in said step b); Said baffle plate edge is fixed together through several suckers and plate originals edge, hole, and the spacing between said baffle plate and the hole plate originals is 5~50mm.
4. according to claim 1, the 2 or 3 described electroplating hole version methods of blocking; It is characterized in that: in said step c); The coating of hole plate originals figure line corresponding position keeps original thickness under the blocking of baffle plate; The coating at plate originals non-graphic position, hole does not receive blocking of baffle plate, and its coating is thicker than the coating of hole plate originals figure line corresponding position.
5. the electroplating hole version method of blocking according to claim 4 is characterized in that: the electrodeposited coating that is formed one deck even transition and progressive additive on the plate originals of said hole by the picture and text corresponding position to the non-graphic corresponding position.
6. the electroplating hole version method of blocking according to claim 5 is characterized in that: through the spacing between adjustment retaining version and the hole plate originals, the gradient or flatness when control picture and text position and non-graphic position galvanization coating are excessive.
7. device that blocks the electroplating hole version; It is characterized in that: comprise baffle plate (1) with the corresponding connection of hole plate originals (5);, with hole plate originals (5) corresponding non-figure line position last at said baffle plate (1) is blank position (8), leaves a determining deviation between said baffle plate (1) and the hole plate originals (5).
8. the device that blocks the electroplating hole version according to claim 7 is characterized in that: do not blocked position (2) by blank picture and text on the said baffle plate (1) and link together through connecting line position (3).
9. according to claim 7 or the 8 described devices that block the electroplating hole version; It is characterized in that: the edge (4) of said baffle plate (1) is provided with some suckers (6), and said baffle plate (1) edge (4) is fixed together through the edge of several suckers (6) with hole plate originals (5).
CN201210172020.8A 2012-05-30 2012-05-30 Method for shielding galvanized porous plate and device Active CN102689495B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104476905A (en) * 2014-12-10 2015-04-01 成都印钞有限公司 Three dimensional shielding rack for electrotyping porous printing plate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB255736A (en) * 1926-01-25 1926-07-29 Wmf Wuerttemberg Metallwaren Improvements in electro plating baths for simultaneously obtaining metallic depositsof various thicknesses
US4481881A (en) * 1979-05-30 1984-11-13 Tdk Electronics Co., Ltd. Hot melt screen printing machine
JPH0640179A (en) * 1992-07-27 1994-02-15 Noritake Co Ltd Printing plate
CN1090122A (en) * 1993-01-19 1994-07-27 江苏曙光光学电子仪器厂 The compound half tone facture of metal forming and silk screen
CN101644897A (en) * 2009-09-02 2010-02-10 中国印钞造币总公司 Method for manufacturing nonwoven metal porous plate used for printing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB255736A (en) * 1926-01-25 1926-07-29 Wmf Wuerttemberg Metallwaren Improvements in electro plating baths for simultaneously obtaining metallic depositsof various thicknesses
US4481881A (en) * 1979-05-30 1984-11-13 Tdk Electronics Co., Ltd. Hot melt screen printing machine
JPH0640179A (en) * 1992-07-27 1994-02-15 Noritake Co Ltd Printing plate
CN1090122A (en) * 1993-01-19 1994-07-27 江苏曙光光学电子仪器厂 The compound half tone facture of metal forming and silk screen
CN101644897A (en) * 2009-09-02 2010-02-10 中国印钞造币总公司 Method for manufacturing nonwoven metal porous plate used for printing

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
叶洪勋: "抗电镀印料的应用", 《丝网印刷》, no. 6, 31 December 1998 (1998-12-31) *
徐桐: "金属丝网的织造及其强度计算", 《金属制品》, no. 1, 28 February 1985 (1985-02-28) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104476905A (en) * 2014-12-10 2015-04-01 成都印钞有限公司 Three dimensional shielding rack for electrotyping porous printing plate
CN104476905B (en) * 2014-12-10 2016-05-04 成都印钞有限公司 A kind of electroforming hole version 3 D stereo blocks frame

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Address after: 611130 No. 189, Golden Road, Wenjiang District, Sichuan, Chengdu

Patentee after: CHENGDU BANKNOTE PRINTING Co.,Ltd.

Patentee after: China Banknote Printing and Minting Group Co.,Ltd.

Address before: 611130 No. 189, Golden Road, Wenjiang District, Sichuan, Chengdu

Patentee before: CHENGDU BANKNOTE PRINTING Co.,Ltd.

Patentee before: CHINA BANKNOTE PRINTING AND MINTING Corp.

CP01 Change in the name or title of a patent holder