CN102725830A - Real-time monitoring of retaining ring thickness and lifetime - Google Patents
Real-time monitoring of retaining ring thickness and lifetime Download PDFInfo
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- CN102725830A CN102725830A CN2011800074014A CN201180007401A CN102725830A CN 102725830 A CN102725830 A CN 102725830A CN 2011800074014 A CN2011800074014 A CN 2011800074014A CN 201180007401 A CN201180007401 A CN 201180007401A CN 102725830 A CN102725830 A CN 102725830A
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- carrier head
- retainer ring
- base material
- inductor
- grinding
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
Abstract
A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, an apparatus is provided. The apparatus includes a carrier head movable in a travel path between at least one polishing station for polishing a substrate as the substrate is retained in the carrier head, and a transfer station for transferring the substrate to and from the carrier head, the carrier head having a retaining ring, and a sensor disposed in the travel path of the carrier head, the sensor operable to provide a metric indicative of a condition of the retaining ring.
Description
Technical field
Embodiments of the invention are about the grinding system in order to grinding base material (such as semiconductor substrate).More particular it, about the method and apparatus of parts in order to the monitoring grinding system.
Background technology
Cmp (CMP) is the material layer on base material is amassed in a kind of manufacturing that generally is used in the high density IC with planarization or grinding institute Shen a technology.Can provide base material to the grinding stations that is positioned on the grinding system, and base material is fixed in the carrier head, carrier head controllably promotes base material makes base material against the grinding pad that moves.In the presence of polishing fluid, come moving substrate via the contact of the characteristic side that base material is provided and with respect to grinding pad, can effectively utilize CMP.Material is removed from the characteristic side of base material, and wherein the characteristic side of base material contacts with lapped face with the combination of mechanism via chemistry.
Usually, carrier head comprises a retainer ring, and retainer ring is around base material and can promote the fixing of base material in carrier head.Usually, during grinding, one or more surface contact grinding pad of retainer ring.Although retainer ring is suitable for standing the grinding of a plurality of base materials, can experience wear and tear in these surfaces of contact grinding pad, and the periodic replacement retainer ring is necessary.Therefore, the detection of retainer ring is necessary, changes at interval with abrasion Monitoring and decision.
General detection method is consuming time, needs the parts in personnel's entity ground directing station, and need grinding system be shut down.In addition, general method possibly partly dismantle grinding stations and slave station removes carrier head, and this measure meeting makes intrasystem miscellaneous part be exposed to pollution.
So, need a kind of method and apparatus that promotes the monitoring of retainer ring and do not need entity ground to handle retainer ring or grinding system is shut down.
Summary of the invention
The present invention provides a kind of method and apparatus that promotes the monitoring of the retainer ring in the grinding system by and large, with the situation of decision retainer ring and/or the useful life of evaluate fixed ring.In one embodiment, a kind of equipment is provided.This equipment comprises: a carrier head, carrier head can be displaced into when base material is fixed in the carrier head in the travel path between at least one grinding stations that is used for grinding base material; An and transfer station; Transfer station is in order to transmit base material to carrier head and to transmit base material from carrier head; Carrier head has a retainer ring and and is arranged on the inductor in the travel path of carrier head, and inductor can be operated so that the tolerance of the situation that can indicate retainer ring to be provided.
In another embodiment, a kind of transfer station is provided, transfer station is arranged on one and grinds in the module and in order to transmit base material between a base material conveyer and at least one carrier head.Transfer station comprises: a load cup assembly, and the load cup assembly has a main body, and the size of main body can receive at least a portion of a base material and a retainer ring, and retainer ring is couple at least one carrier head; An and inductor; Inductor is arranged on the main body, and inductor can be operated so that the tolerance of the situation that can indicate retainer ring to be provided, and wherein base material comprises one first radius; And inductor is positioned on the main body and the position in one second radius, second radius is greater than first radius.
In another embodiment, provide a kind of in order to monitor at least one surperficial method of a retainer ring, retainer ring is couple to a carrier head.The method may further comprise the steps: carrier head is moved, make the carrier head vicinity be arranged on the transformer device in the grinding module; Transmit energy from transformer device towards retainer ring; Reception is from energy that retainer ring reflected; And based on the energy that receives, a situation of decision retainer ring.
Description of drawings
Therefore, but the mode of understood in detail above-mentioned feature structure of the present invention, i.e. the of the present invention more specific description of preceding text brief overview can be carried out with reference to embodiment, and some of them embodiment illustrates in the accompanying drawings.Yet, it should be noted that accompanying drawing only illustrates exemplary embodiments of the present invention, and therefore do not desire to be regarded as and can constitute restriction, because the present invention can allow other equivalent embodiment to category of the present invention.
Fig. 1 is the plane graph of an embodiment of grinding system.
Fig. 2 is the phantom of an embodiment of transfer station, and this transfer station can be used in the grinding system of Fig. 1.
Fig. 3 is the schematic cross sectional views of another embodiment of transfer station, and this transfer station can use with the grinding system of Fig. 1.
Fig. 4 is the schematic cross sectional views of another embodiment of transfer station, and this transfer station can use with the grinding system of Fig. 1.
Fig. 5 A is the partial plan of an embodiment of retainer ring.
Fig. 5 B is the schematic cross sectional views of another embodiment of transfer station, and this transfer station can use with the grinding system of Fig. 1.
Fig. 6 is the schematic cross sectional views of another embodiment of transfer station, and this transfer station can use with the grinding system of Fig. 1.
Fig. 7 is a flow chart, an embodiment of flowchart illustrations method.
For promoting to understand, when possibility, use the components identical symbol to specify these graphic total similar elements.Expection, the element that discloses among embodiment can be advantageously used in other embodiment and not need special detailed description.
Embodiment
The present invention provides the method for supervising and the equipment that can promote the retainer ring in the grinding system by and large, with the wearing and tearing of decision retainer ring and/or the useful life of evaluate fixed ring.Describe (on-tool) supervising device on the instrument, supervising device provides the monitoring of retainer ring on this instrument, and does not need entity ground to handle retainer ring or grinding system is shut down.In addition, come the data of self-monitoring device can be provided to controller and be used to adjust follow-up grinding technics.
Fig. 1 is the plane graph of grinding system 100, and grinding system 100 has the module 105 of grinding and base material conveyer, and grinding system 100 is suitable for electrochemical mechanical polishing and/or cmp.Grind module 105 and comprise the first grinding stations 110A, the second grinding stations 110B and the 3rd grinding stations 110C in the shell 115 that is arranged on controlled environment.Base material conveyer (such as rotating disk 125) moving substrate is between grinding stations 110A, 110B and 110C.Any one planarization carried out of grinding stations 110A, 110B, 110C or grinding technics remove material with the characteristic sidesway from base material, and on the characteristic side, form flat surfaces.Module 105 can be bigger grinding system (such as
ECMP
TM, MIRRA
And REFLEXION GT
TMGrinding system and can buying from the Applied Materials in the holy big Ke Laola city of California, USA is although can use other grinding systems) a part.Other grinding modules (but comprise the grinding pad that uses other types, the net formula pad of band index or they's grinding pad of combinations thereof, and make base material be displaced into they's grinding pad of rotation, linearity or other plane motions with respect to lapped face) also can benefit from embodiment described herein.
In one embodiment, each person of the grinding stations 110A-110C of grinding module 105 is suitable for carrying out general cmp (CMP) technology.Perhaps, the first grinding stations 110A can be through being configured to carry out electrochemical machinery planarization (ECMP) technology, and the second grinding stations 110B and the 3rd grinding stations 110C can carry out CMP technology.In an embodiment of technology; Base material has to be formed on wherein and to be covered and is stamped the characterizing definition of barrier layer; And base material has the electric conducting material that is set at the barrier layer top; Base material can make electric conducting material in the first grinding stations 110A and the second grinding stations 110B, remove with two steps via CMP technology, and barrier layer is handled via the 3rd CMP technology in the 3rd grinding stations 110C, on base material, to form planarized surface.
In one embodiment, system 100 comprises module pedestal 118, and module pedestal 118 supports grinding stations 110A, 110B and 110C, transfer station 120 and rotating disk 125.Each person of grinding stations 110A, 110B and 110C comprises polishing fluid conveying arm 128, and polishing fluid conveying arm 128 is suitable for during grinding technics, polishing fluid being transported to lapped face 175.Several adjusting devices 130 are illustrated as and are couple to module pedestal 118 and removable in direction A, with in order optionally adjusting device 130 to be seated in each person top of grinding stations 110A, 110B and 110C.Transfer station 120 can promote base material 135 to be sent to system 100 and to transmit base material 135 from system 100 via wet type robot 140 substantially.Usually, wet type robot 140 is transmitted in base material 135 between transfer station 120 and the factory interface (not shown), and wherein factory interface can comprise cleaning module, measurement apparatus and one or more base material magazine box.Transfer station 120 comprises first buffered station 145, second buffered station 150, transfer robot 155 and load cup assembly 160.Transfer robot 155 is transmitted in base material between first buffered station 145, second buffered station 150 and the load cup assembly 160.Load cup assembly 160 comprises supervising device 162, and supervising device 162 is couple to controller.
In one embodiment, rotating disk 125 advances in counter clockwise direction (direction B), carrier head 165A-165D is displaced into grinding stations 110A-110C and transfer station 120 tops in order.During handling, three of these four carrier head 165A-165D have base material and are fixed among the carrier head 165A-165D, and are arranged on grinding stations 110A, 110B, 110C top with at grinding stations 110A, 110B, the last grinding technics of carrying out of 110C.Via base material being displaced between these stations, base material 135 is processed in order, and base material 135 is fixed among the identical carrier head 165A-165D simultaneously.In one example, three carrier head 165A-165C contain base material, and promote the lapped face 175 of base material 135 towards grinding stations 110A, 110B and 110C.During grinding, the carrier head 165A-165C that contains base material is rotated in counter clockwise direction (direction C), and lapped face 175 is rotated in counter clockwise direction (direction D).
When three carrier head (being illustrated as carrier head 165A-165C in this example) are used in station 110A-110C, the contiguous transfer station 120 of carrier head 165D, wherein base material transmission technology takes place at transfer station 120 places.When these three carrier head 165A-165C carried out grinding technics, carrier head 165D can leave unused and reach a period.During the section, carrier head 165D prepares in the circulation that follows, to be used among the grinding stations 110A at this moment.Carrier head 165D can advance along travel path 164, with near transfer station 120.When carrier head 165D position during at transfer station 120 places, carrier head 165D can unload through the base material 135 that grinds and be cleaned, and receives the new base material 135 that does not grind with in order to be used in the grinding technics of grinding stations 110A.In one embodiment, use the supervising device 162 that is arranged in the transfer station 120 to detect carrier head 165D.
Lapped face 175 is removed from the machinery of base material 135 to promote material by roughening.The lapped face 175 of grinding pad can be a polymeric material, and polymeric material can be complete dielectric, during grinding technics, to promote material removing from base material 135.Perhaps, the lapped face 175 of grinding pad can be a partially conductive at least, in electrochemical mechanical polishing (ECMP) technology, to promote the electrochemical dissolution of material from base material.Spendable suitable polymeric material comprises polyurethanes, Merlon, fluorinated polymer, PTFE, PTFA, polyphenylene sulfide (PPS) or combinations thereof, and is used in other grinding-materials that grind substrate surface.In one embodiment, the lapped face 175 of grinding pad comprises that this polymeric material is used in the manufacturing for the grinding pad of grinding semiconductor base material usually such as the polymeric material of the polyurethane material of open aperture or closed pores.In another embodiment, the lapped face 175 of grinding pad can contain fixing abrasion grain.Usually, during grinding, polishing fluid is transported to the lapped face 175 of grinding pad.Polishing fluid can be slurry or fluid electrolyte, depends on employed grinding technics and grinding pad type.
Fig. 2 is the phantom of an embodiment of the transfer station 120 of Fig. 1.As stated, transfer station 120 comprises load cup assembly 160, load cup assembly 160 contiguous first buffered stations 145.First buffered station 145 can be through being configured to the buffered station that inputs or outputs of support base material 135.Transfer robot 155 is transmitted in base material 135 between first buffered station 145 and the load cup assembly 160, and load cup assembly 160 promotes the transmission of base material to carrier head 165D.
In one embodiment, the base material 135 that first buffered station 145 supports through grinding is sent to factory interface to allow wet type robot 140 (Fig. 1) with base material 135, and for follow-up grinding and/or storage.In another embodiment, first buffered station 145 supports the base material 135 that does not grind, and receives base material 135 to allow carrier head 165D, and in order on grinding stations 110A, to grind.In one embodiment, transfer robot 155 is transmitted in base material 135 between first buffered station 145 and the load cup assembly 160 through being configured to, and receives base material 135 to allow carrier head 165D, shown in the dotted line of Fig. 2.
In one embodiment, retainer ring 230 is couple to main body 225 via actuator 232.Actuator 232 is to be controlled by the second variable pressure source 245B.The second variable pressure source 245B provides fluid to actuator 232 or removes fluid from actuator 232, and this measure makes retainer ring 230 to be displaced into Z direction at least with respect to the main body 225 of carrier head 165D.The second variable pressure source 245B is independent of by what motor 210 was provided and moves, and is suitable for providing the Z direction of retainer ring 230 to move.The second variable pressure source 245B can be via applying negative pressure or just being pressed onto actuator 232 and/or retainer ring 230 provides moving of retainer ring 230.On the one hand, during grinding technics, pressure is applied to retainer ring 230 to promote the lapped face 175 (Fig. 1) of retainer ring 230 towards grinding pad (not shown).Each person of the first variable pressure source 245A and the second variable pressure source 245B can be couple to controller, and to promote to grind the execution of prescription (polish recipe), wherein this grinding prescription automatically controls to the pressure in the zone of base material 135 during grinding technics.
During grinding technics, retainer ring 230 can contact lapped face 175.Retainer ring 230 also can promote the transmission of polishing fluid on lapped face 175, and produces because of contact the heat of the friction that is caused with lapped face 175.During grinding technics, the heat that fluid transmits and produces can have advantage.Make retainer ring 230 wear and tear with contacting of lapped face 175.The wearing and tearing on the surface of retainer ring 230 can influence grinding technics, and retainer ring 230 needs to change the most at last.So the thickness of evaluate fixed ring 230 weares and teares and the replacing interval with decision termly.
In one embodiment, the surface of retainer ring 230 is to be monitored by the supervising device 162 that is arranged in the load cup assembly 160.When carrier head 165D vicinity load cup assembly 160, the surface of retainer ring 230 can be sent to controller by the data of the wearing and tearing of induction and expression retainer ring 230.Controller can be communicated with screen, with to user's display data.Come the situation of the data of self-monitoring device 162, with the useful life and the replacing of decision retainer ring 230 in order to prediction and/or definite retainer ring 230.In one embodiment, data can be indicated the thickness of retainer ring 230.Alternatively or in addition, controller can be can be in technical recipe analysis of data and implement the system controller of correcting measuring with the wearing and tearing of retainer ring 230 in the compensation grinding technics.Therefore, come of useful life and the replacing of the data of self-monitoring device 162 in order to decision retainer ring 230, and can be extraly as the control handle that is used to adjust grinding technics.In addition, in system, capable of usingly come the data of self-monitoring device 162 to be independent of other a plurality of retainer rings on other a plurality of carrier head in the system, adjust the technical recipe of indivedual retainer rings with a plurality of carrier head that contain retainer ring.For example; Although these indivedual retainer rings possibly wear and tear with different rates; Can adjust the technical recipe that is used for a retainer ring on the carrier head, and can be maintained in other a plurality of technical recipes on other a plurality of retainer rings on all the other a plurality of carrier head identical.
Fig. 3 is the schematic cross sectional views of another embodiment of transfer station 120, and transfer station 120 can use with the grinding system 100 of Fig. 1.Transfer station 120 comprises load cup assembly 160, and carrier head 165D is arranged to contiguous load cup assembly 160.In this embodiment, when carrier head 165D was not used to grind on the grinding stations 110A-110C at Fig. 1, load cup assembly 160 was through being configured to as the cleaning station 300 that is suitable for cleaning carrier head 165D.
In one embodiment, load cup assembly 160 comprises main body 305, and main body 305 has the circle of reference cone that is couple to pedestal 309 or encircles 307.Can ring 307 and pedestal 309 be moved with respect to module pedestal 118 via the first actuator 310A.The first actuator 310A can in order to respect to module pedestal 118 mobile agents 305 in linear direction (Z direction) at least.Load cup assembly 160 also comprises carriage 320, and carriage 320 is suitable for support base material 135 (shown in dotted line).Carriage 320 is couple to the second actuator 310B, and the second actuator 310B is suitable for raising and the stayed surface 321 that reduces carriage 320.The second actuator 310B can promote in the Z direction base material 135 is sent to carrier head 165D or transmits base material 135 from carrier head 165D via move stayed surface 321 with respect to main body 305.
In this embodiment, cleaning station 300 comprises supervising device 162, and supervising device 162 comprises the inductor 335 that is couple to controller.Inductor 335 is suitable for measuring the thickness T of retainer ring 230.In one embodiment, inductor 335 is ultrasonic waves inductors.Inductor 335 can be couple to main body 305 or be embedded in main body 305, to transmit and to receive sound wave.Sound wave is sent to controller, so that the tolerance of the thickness T that can indicate retainer ring 230 to be provided.In one embodiment, retainer ring 230 comprises two annulus, such as top 355A and lower part 355B.In one embodiment, it is chemically inert material that top 355A and lower part 355B can contain in CMP technology, such as metal material, ceramic material or plastic material.In one embodiment; Lower part 355B contains plastic cement, for example the PEEK material of polyphenylene sulfide (PPS), polyether-ether-ketone (PEEK), carbon containing, the PEEK material or the composite material that contain
.Top 355A can contain the material firmer or finer and close than lower part 355B.In one embodiment, top 355A contains stainless steel, aluminium, molybdenum or ceramic material.
In an instance of operation, inductor 335 is installed on the active surface 340 of touchdown area 345 of main body 305.Touchdown area 345 can be defined by the zone of ring 307 basal surface, the surface that wherein the lower part 355B of retainer ring 230 herein can contact ring 307.Active surface 340 can be in touchdown area 345 places of positioning and fixing ring 230 and the flush of ring 307.In one embodiment, sound wave is sent to and passes through the lower part 355B of retainer ring 230, and 355A is reflected from top.The signal of warp reflection is sent to controller and is used to determine the thickness T of the lower part 355B of retainer ring 230.Thickness T can be indicated the wearing and tearing of retainer ring 230 along with the change of time.
Fig. 4 is the schematic cross sectional views of another embodiment of transfer station 120, and transfer station 120 can use with the grinding system 100 of Fig. 1.In this embodiment, load cup assembly 160 is through being configured to be similar to embodiment shown in Figure 3 in fact as cleaning station 400.For the sake of brevity, with the element of the transfer station 120 that no longer repeats to be similar to Fig. 3 transfer station 120.
In this embodiment, supervising device 162 comprises inductor 335, and inductor 335 is vortex flow inductor and the thickness T that is suitable for measuring lower part 355B.In this embodiment, the active surface 340 of the contact surface 405 meeting contact rings 307 of lower part 355B.In other embodiments, can, retainer ring 230 utilize inductor 335 when being separated by with ring 307.On the one hand, be suitable for the displacement between the contact surface 405 of top 355A that inductor 335 as the vortex flow inductor can be used to measure active surface 340 and retainer ring 230.Displacement is corresponding to the change of the thickness of the lower part 355B of retainer ring 230 at least.When the lower part of retainer ring 230 355B contact active surface 340, or be retained when being separated by a constant distance as lower part 355B, can determine displacement with active surface 340.
Fig. 5 A is the partial plan of an embodiment with retainer ring 230 of one or more groove 500.Each one or more groove 500 is formed in the retainer ring 230, and the position is at the desired depth place between the bottom 505 of the contact surface 405 of retainer ring 230 and groove 500.Each groove 500 that is arranged on the retainer ring 230 can be in order to promote to grind via during grinding technics, increasing sending of polishing fluid.
Fig. 5 B is the schematic cross sectional views of another embodiment of transfer station 120, and this transfer station 120 can use with grinding system 100 and the retainer ring shown in Fig. 5 A 230 of Fig. 1.Retainer ring 230 comprises one or more groove 500, these grooves 500 have the depth D that defines by contact surface 405 and bottom 505 '.The depth D of groove 500 ' change corresponding to the change of the thickness of retainer ring 230.In one embodiment, inductor 335 can be couple to ring 307 or be embedded in ring 307.Inductor 335 can be optical sensor, vortex flow inductor, ultrasonic waves inductor or other suitable induction installations.In one embodiment, inductor 335 is ultrasonic waves inductors, and the ultrasonic waves inductor is through being configured to transmit and receive the sound wave (being depicted as signal 510) that strikes contact surface 405.Sound wave be sent to controller with provide the depth D that can indicate groove 500 ' and thereby can indicate the tolerance of the thickness of retainer ring 230, no matter retainer ring 230 is to respond to dry type or wet type all can.Therefore, the degree of depth of measured groove 500 can determine wearing and tearing between contact surface 405 and the bottom 505, and does not need the entity between other parts of retainer ring 230 and load cup assembly 160 to contact.The rotary speed that can be scheduled to is carrier head 165D rotation, with the induction of a plurality of positions that retainer ring 230 is provided.Therefore, can monitor a plurality of grooves 500.Perhaps, carrier head 165D can not move, to allow the induction of single groove 500.In another embodiment, controlled air column capable of using or liquid column come around the interface between signal 510 and control retainer ring 230 and the inductor 335.For example, bubbler capable of using (not shown) forms cylindric air column, and this cylindric air column is around the path of signal 510.
In one embodiment, the position of supervising device 162 is the outsides that are positioned at the zone of base material 135, with any unfavorable induction of the part of avoiding non-interested base material 135 or carrier head 165.For example, in the situation of circular base material, base material 135 comprises first radius R
1In one embodiment, for the base material of 200mm diameter, first radius R
1The radius that comprises about 100mm.In another embodiment, for the base material of 300mm diameter, first radius R
1The radius that comprises about 150mm.In one embodiment, supervising device 162 is positioned at second radius R
2The place, second radius R
2Be greater than first radius R
1Or be positioned at first radius R
1The outside.For the 200mm base material, second radius R
2Can be separated by greater than about 100mm with center line C ', such as about 105mm to about 120mm.In another example, for the 300mm base material, second radius R
2Can be separated by greater than about 150mm with center line C ', such as about 155mm to about 170mm.Center line C ' can be the heart among geometric shape center and/or the carrier head 165D of load cup assembly 160.Therefore, any unfavorable induction of the part of non-interested base material 135 or carrier head 165D can be avoided in the location of supervising device 162.
Fig. 6 is the schematic cross sectional views of another embodiment of transfer station 120, and this transfer station 120 can use with the grinding system 100 of Fig. 1.In this embodiment, load cup assembly 160 is similar to Fig. 3, Fig. 4 and embodiment shown in Figure 5.For the sake of brevity, with the element of the transfer station 120 that no longer repeats to be similar to Fig. 3-Fig. 5 transfer station 120.In one embodiment, retainer ring 230 comprises one or more groove 500, and is similar to the embodiment of the retainer ring 230 of Fig. 5.
In this embodiment, supervising device 162 comprises inductor 335, and inductor 335 is ultrasonic waves inductors, although can use optical sensor, vortex flow inductor or other suitable induction installations.In one embodiment, when retainer ring 230 is arranged in sight line (line-of-sight) or the visual field (the field of view) of inductor 335, can use inductor 335.In other embodiments, when retainer ring 230 is at least partially disposed in the load cup assembly 160, can use inductor 335.On the one hand, inductor 335 comprises tubular conduit 600, and tubular conduit 600 is arranged to proximity sensing device 335.Tubular conduit 600 is couple to fluid supply machine 605, and the fluid of fluid supply machine 605 conveying such as deionized waters is with the signal path around inductor 335.Fluid is used to remove not controlled air, and wherein this not controlled air possibly influence the signal of self-inductor 335.In one embodiment, the contact surface 405 of retainer ring 230 active surface 340 of contact ring 307 directly.In another embodiment, tubular conduit 600 is couple to actuator 610, and actuator 610 tolerable tubular conduits 600 extend and withdrawal with respect to the active surface 340 of ring 307.When carrier head 165D does not have contact ring 307, can tubular conduit 600 be activated the position of the contact surface 405 of the contiguous retainer ring 230 that (shown in dotted line) arrive towards contact surface 405.Tubular conduit 600 can comprise at least a portion of inductor 335, and at least a portion of inductor 335 and tubular conduit 600 move towards the contact surface 405 of retainer ring 230 together.When not needing inductor 335, actuator 610 also can be with tubular conduit 600 withdrawals.
Fig. 7 is a flow chart, an embodiment of flowchart illustrations method 700.705, the carrier head 165D that will have retainer ring 230 moves and makes the contiguous supervising device 162 of carrier head 165D.In one embodiment, supervising device 162 is arranged on the load cup assembly 160 that grinds in the module 105.In other embodiments, supervising device 162 can be close to transfer station 120 or be arranged in contiguous transfer station 120 carrier head 165D travel path or be positioned on other positions of grinding module 105.Supervising device 162 comprises inductor 335, and energy is transmitted (shown in 710) from inductor 335.Energy can be ultrasonic waves, light wave or magnetic field or magnetic signal.715, the energy that reflects from retainer ring 230 is received by inductor 335.The energy that is reflected can be from the inner surface or the outer surface on the surface of retainer ring 230.720, based on the energy that is received, the situation of decision retainer ring.The signal that is reflected can be provided to controller, can indicate the tolerance of the situation (the for example thickness of the part of retainer ring 230 or retainer ring 230, or the degree of depth of the groove 500 of the retainer ring 230 that can be associated with the thickness of retainer ring 230) of retainer ring 230 with acquisition.Data capable of using is with the replacing interval of decision retainer ring 230 and/or the adjustment of the parameter in the follow-up grinding technics.
Embodiment described herein provides the method and apparatus in order to the surface appearance of monitoring retainer ring 230, and wherein this retainer ring 230 is arranged on the carrier head (such as carrier head 165A-165D described herein) in the grinding stations.Supervising device 162 is described as and can be installed in (on-tool) on the instrument, and can respond to retainer ring 230 situations between a plurality of grinding circulations in one embodiment.Can be via the user with as the predetermined space of the part of conventional monitoring or can be based on user's hobby with selected interval, and set the induction of retainer ring 230.Come the data of self-monitoring device 162 to be provided to controller, its middle controller can be used with the useful life of the wearing and tearing of monitoring retainer ring 230, decision retainer ring 230 and/or the replacing interval of decision retainer ring 230.On the one hand, come the data of self-monitoring device 162 and to promote the replacing of retainer ring 230 when available useful life stops in order to the useful life of prediction retainer ring 230.In another aspect, come the data of self-monitoring device 162 can in order to the prediction useful life and promote to change easily at interval (if retainer ring 230 is not worn fully).
The embodiment of supervising device 162 described herein can minimize or remove with the manipulations of physical of carrier head 165A-165D and retainer ring 230 and/or with the Mechanical Contact of carrier head 165A-165D and retainer ring 230.For example, the mechanical measuring device such as clamp need contact with retainer ring 230.During measuring, can damage retainer ring 230 with contacting of mechanical measuring device, this measure then can damage lapped face 175 during handling.Can in instrument, measure, and need grinding system not shut down.In addition, need retainer ring 230 is fully not dry to measure.Supervising device 162 is installed on the instrument, so that environment is comprised in the shell 115 (Fig. 1) of controlled environment.Therefore, supervising device 162 described herein provides the monitoring of retainer ring 230, handles or contacts carrier head 165A-165D and/or destroy the environment that grinds module 105 and can damage potentially hardly.The method and equipment also can be removed consuming time and the coarse vision-based detection of possibility or minimize.In addition, can production capacity be maximized, this is because grinding system need not shut down for the measurement of carrying out retainer ring 230 and/or observation.
In addition, retainer ring 230 wearing and tearing data can be used as the controlled variable during the grinding technics.For example,, can adjust one or more abrasive parameters if retainer ring 230 comprises the wearing and tearing that groove 500 and groove 500 have shown scheduled volume, any to compensate for grinding inhomogeneity retainer ring 230 thickness effects.In one example, can adjust abrasive parameters (such as rotary speed and the downward force of carrier head 165A-165D), with wearing and tearing that solve retainer ring 230 and the grinding effect of imitating the retainer ring 230 that does not almost have wearing and tearing.On the one hand, can the rotary speed of carrier head 165A-165D be quickened, with the transmission that promotes polishing fluid and on lapped face 175, produce heat, this essence equals almost not have the effect of the retainer ring 230 that weares and teares.
In another example, during the useful life of retainer ring 230, retainer ring 230 wearing and tearing data capable of using minimize heterogeneity in the wafer.Can the automation process control system utilize retainer ring 230 wearing and tearing data, wherein this automation process control system is couple to capsule chamber 235A and the 235B in the multizone carrier head (such as carrier head 165D shown in Figure 2).In addition, the automation process control system can be communicated with the actuator 232 on the carrier head 165D shown in Figure 2.On the one hand, in response to the change of the thickness of retainer ring 230, the variable pressure that is applied to exterior domain (capsule chamber 235A) and/or retainer ring 230 by actuator 232.Can immediately carry out being applied to the pressure of base material and/or being applied to the change of the pressure of retainer ring 230 based on the thickness data of retainer ring 230 by capsule chamber 235A and 235B.Therefore, can control removing speed, removing profile and/or topology of polished base material via controlling abrasive parameters based on the wearing and tearing of retainer ring 230.In addition, owing to can adjust the abrasive parameters of each carrier head 165A-165D, can the variation of carrier head to carrier head be reduced to minimum.
Embodiment described herein provides the method and apparatus of the monitoring that can promote the retainer ring in the grinding system, with the situation of decision retainer ring and/or the useful life of evaluate fixed ring.In one embodiment, a kind of equipment is provided.This equipment comprises: a carrier head, carrier head can be displaced into when base material is fixed in the carrier head in the travel path between at least one grinding stations that is used for grinding base material; And a transfer station, transfer station is in order to transmitting base material to carrier head and to transmit base material from carrier head, and carrier head has retainer ring and is arranged on the inductor in the travel path of carrier head, and inductor can be operated so that the tolerance of the situation that can indicate retainer ring to be provided.
In another embodiment, a kind of transfer station is provided, transfer station is arranged on and grinds in the module and in order to transmit base material between base material conveyer and at least one carrier head.Transfer station comprises: a load cup assembly, and the load cup assembly has main body, and the size of main body can receive at least a portion of base material and retainer ring, and retainer ring is couple at least one carrier head; And an inductor, inductor is arranged on the main body, and inductor can be operated so that the tolerance of the situation that can indicate retainer ring to be provided, and wherein base material comprises first radius, and inductor is positioned on the main body and is positioned at second radius, and second radius is greater than first radius.
Although aforementioned content is to embodiments of the invention, can dream up other and further embodiment of the present invention under the basic categories of the present invention not breaking away from.
Claims (15)
1. equipment, this equipment comprises:
One carrier head, this carrier head can be displaced into when a base material is fixed in this carrier head in the travel path between at least one grinding stations that is used for grinding this base material; And
One transfer station; This transfer station is in order to transmit this base material to this carrier head and to transmit this base material from this carrier head; This carrier head has a retainer ring and is arranged on the inductor in this travel path of this carrier head, and this inductor can be operated so that a tolerance of the situation that can indicate this retainer ring to be provided.
2. equipment as claimed in claim 1, wherein this inductor is a ultrasonic waves inductor.
3. equipment as claimed in claim 1, wherein this inductor is a vortex flow inductor.
4. equipment as claimed in claim 1, wherein this inductor is an optical sensor.
5. equipment as claimed in claim 4, wherein this inductor comprises several waveguides, and these waveguides are arranged in the main body of this transfer station, and these waveguides are positioned to aim at constantly with this main body of this transfer station light is pointed to this retainer ring when this retainer ring.
6. equipment as claimed in claim 4, wherein this inductor comprises a conveyer and receiver.
7. equipment as claimed in claim 1, wherein this transfer station comprises one or more nozzle, and these nozzles are communicated with a water source fluid.
8. equipment as claimed in claim 2, wherein this transfer station comprises a main body, and the shape of this main body can be held a fluid.
9. equipment as claimed in claim 7, wherein this base material comprises one first radius, and this inductor is positioned at one second radius, this second radius is greater than this first radius.
10. one kind in order to monitor at least one surperficial method of a retainer ring, and this retainer ring is couple to a carrier head, and the method includes the steps of:
This carrier head is moved, make this carrier head vicinity be arranged on the transformer device in the grinding module;
Transmit energy from this transformer device towards this retainer ring;
Reception is from energy that this retainer ring reflected; And
Based on the energy of this reception, determine a situation of this retainer ring.
11. method as claimed in claim 10, wherein this transmission is a sound wave with the energy that receives.
12. method as claimed in claim 10, wherein this transmission is an optical signalling with the energy that receives.
13. method as claimed in claim 10, wherein this transmission is a magnetic field with the energy that receives.
14. method as claimed in claim 10, wherein this energy transmits and receives via a liquid.
15. method as claimed in claim 10, this method further comprises following steps:
This carrier head is moved, make this carrier head vicinity be arranged on the load cup assembly in this grinding module, this transformer device is arranged in the main body of this load cup assembly.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/843,793 | 2010-07-26 | ||
| US12/843,793 US20120021671A1 (en) | 2010-07-26 | 2010-07-26 | Real-time monitoring of retaining ring thickness and lifetime |
| PCT/US2011/036731 WO2012018425A2 (en) | 2010-07-26 | 2011-05-17 | Real-time monitoring of retaining ring thickness and lifetime |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102725830A true CN102725830A (en) | 2012-10-10 |
| CN102725830B CN102725830B (en) | 2016-03-16 |
Family
ID=45494015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180007401.4A Active CN102725830B (en) | 2010-07-26 | 2011-05-17 | The thickness of retainer ring and the immediately monitoring method and apparatus of useful life |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120021671A1 (en) |
| JP (1) | JP2013532588A (en) |
| KR (1) | KR101754855B1 (en) |
| CN (1) | CN102725830B (en) |
| TW (1) | TWI530359B (en) |
| WO (1) | WO2012018425A2 (en) |
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| CN113001394A (en) * | 2019-12-20 | 2021-06-22 | 株式会社荏原制作所 | Substrate processing apparatus, substrate processing method, and substrate polishing method |
| US11705354B2 (en) | 2020-07-10 | 2023-07-18 | Applied Materials, Inc. | Substrate handling systems |
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| TWI381904B (en) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
| WO2013112764A1 (en) * | 2012-01-25 | 2013-08-01 | Applied Materials, Inc. | Retaining ring monitoring and control of pressure |
| US9067295B2 (en) * | 2012-07-25 | 2015-06-30 | Applied Materials, Inc. | Monitoring retaining ring thickness and pressure control |
| US9242338B2 (en) * | 2013-10-22 | 2016-01-26 | Globalfoundries Singapore Pte. Ltd. | CMP head structure |
| US9227294B2 (en) * | 2013-12-31 | 2016-01-05 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and method for chemical mechanical polishing |
| JP2015188955A (en) | 2014-03-27 | 2015-11-02 | 株式会社荏原製作所 | Polishing device |
| TWI658899B (en) * | 2014-03-31 | 2019-05-11 | 日商荏原製作所股份有限公司 | Polishing apparatus and polishing method |
| JP6344950B2 (en) * | 2014-03-31 | 2018-06-20 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| EP3473309A1 (en) * | 2015-01-09 | 2019-04-24 | Ironburg Inventions | Controller for a games console |
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| JP6577385B2 (en) * | 2016-02-12 | 2019-09-18 | 株式会社荏原製作所 | Substrate holding module, substrate processing apparatus, and substrate processing method |
| CN108716899B (en) * | 2018-06-27 | 2020-04-10 | 山东天厚石油科技有限责任公司 | Non-contact ultrasonic thickness gauge with high detection precision |
| US20220184771A1 (en) * | 2020-12-14 | 2022-06-16 | Applied Materials, Inc. | Polishing system apparatus and methods for defect reduction at a substrate edge |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20120021671A1 (en) | 2012-01-26 |
| CN102725830B (en) | 2016-03-16 |
| KR20130088738A (en) | 2013-08-08 |
| TW201204509A (en) | 2012-02-01 |
| KR101754855B1 (en) | 2017-07-06 |
| WO2012018425A3 (en) | 2012-05-18 |
| JP2013532588A (en) | 2013-08-19 |
| TWI530359B (en) | 2016-04-21 |
| WO2012018425A2 (en) | 2012-02-09 |
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