CN102762026A - Structure and manufacturing method of transparent conducting circuit - Google Patents

Structure and manufacturing method of transparent conducting circuit Download PDF

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Publication number
CN102762026A
CN102762026A CN2011101061935A CN201110106193A CN102762026A CN 102762026 A CN102762026 A CN 102762026A CN 2011101061935 A CN2011101061935 A CN 2011101061935A CN 201110106193 A CN201110106193 A CN 201110106193A CN 102762026 A CN102762026 A CN 102762026A
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conductive layer
ink lay
ink
manufacturing approach
electrically conducting
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CN2011101061935A
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CN102762026B (en
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杨永树
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Polychem UV/EB International Corp
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Polychem UV/EB International Corp
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Abstract

The invention mainly relates to a structure and manufacturing method of a transparent conducting circuit. The transparent conducting circuit comprises a substrate, an ink layer with a conductive polymer liquid absorption characteristic and a conducting layer made of a conducting polymer coating, wherein the ink layer is attached on a region not needed to be conducted on the surface of the substrate, and ink drying and hardening processes are accelerated through heat energy or radiant rays; and the conducting layer is in contact with the ink layer in a whole attachment area larger than that of the ink layer, so that the electric resistance value of the conducting layer in contact with the ink layer attached on the surface of the substrate is increased, the region which is opposite to the conducting layer on the surface of the substrate and is not in contact with the ink layer has conductivity, and furthermore, the required conducting circuit or graph is formed on the substrate. Moreover, the ink layer and the conducting layer in contact with the ink layer are removed by using removing liquid with a polar solution characteristic, comprising water (H2O), ethanol (C2H5OH) and other solutions, on the conducting layer, thus the conductivity and shape of the conducting layer in the special region are changed.

Description

The structure of electrically conducting transparent circuit and manufacturing approach
Technical field
The structure and the manufacturing approach of the relevant a kind of electrically conducting transparent circuit of the present invention; By being attached to be improved electrical impedance value to the non-conductive property of its contact conductive layer of ink lay on the surface of bottom material; Then do not have conductivity in the zone of contact conductive layer with respect to ink lay on the transparent surface of bottom material, be able on transparent ground, form required conducting wire and figure thus.Moreover the present invention further having the liquid that removes of polar solvent characteristic, removes ink lay and the conductive layer that contacts with ink lay on conductive layer, makes the conductive layer in the zone that does not contact with ink lay on the ground form conducting wire or figure.
Background technology
Because conducting polymer tool essence conductivity; Can use the solution processing procedure to produce and have transparent conducting film; Compare the nesa coating such as ITO (tin indium oxide) film of general existing metal oxide manufacturing; Conducting polymer has advantages such as low material cost and manufacturing cost, but the viscosity of the conductive polymer solution of standard can not be too high because of its solid content, otherwise can reduce the stability of conductive polymer solution; Because of solution viscosity is low, and be not suitable for being used for forming needed particular conductivity circuit and figure.If revising the prescription of conductive polymer solution forms; Making becomes viscosity higher; Then be prone to sacrifice and reduce its light transmission, conductivity, resistance to water and characteristic such as weather-proof, so related industry presses for structure and the method for using low viscous conductive polymer solution to form transparent conducting wire and figure.
The technology of using conductive polymer solution to form transparent conducting wire and figure at present comprises radium-shine patterning method; It uses the radium-shine figure that cuts and make; But in fact slow, and do not meet the requirement that volume production is gone up in industry because of suitable height of cost and the speed of using radium-shine equipment.In addition; The electric paste etching method is also arranged; Conducting wire and figure that it uses shade materials such as (Mask) to come protectiveness to stay re-use the electricity slurry unwanted conductive polymer subregion are removed with etching mode, only stay transparent conducting wire and figure; But the method make electricity consumption slurry equipment cost high slow with etching speed, same and do not meet the requirement that actual volume production is gone up in industry.In addition; Ink-jet method is also arranged; Use piezoelectric type (Piezo) or hot bubble type (Thermo-bubble) that conductive polymer solution is sprayed on surface of bottom material through ink gun (Print Head) with drops; Its circuit or figure that forms conduction is formed by a large amount of ink dots, but the method is except that the speed of spray printing slowly and the shortcoming such as the easy obstruction of ink gun, the quality uniformity of its formed conducting wire or figure; The ink dot planarization of edge line, problems such as ink dot distribution situation also are difficult for producing speed and the quality requirements that meets the last actual volume production of industry.
In addition; Company of Dai Nippon Printing (Dai Nippon Printing Co., U.S. Pat 7,749 Ltd.); The principle that 684B2 discloses a usability photocatalyst and surface tension difference forms the method for needed functional circuit and figure; But use the uniformity of functional circuit that this mode forms and figure quite wayward, and because of the surface tension of employed shaping principle to functional coating, liquid viscosity or the like restriction is many; Cause the composition and the rerum natura of functional coating to be restricted, thereby be difficult for producing conducting wire and the figure that meets the last requirement of industry.
The present invention is directed to above disappearance, the conducting polymer composition that forms electrically conducting transparent circuit and figure is had degree of freedom height, the formed electrically conducting transparent circuit and the figure uniformity and resolution are high, and have the advantage fast of producing.Edge this, the applicant develops " structure of electrically conducting transparent circuit and manufacturing approach ", by the improvement of this electrically conducting transparent substrate structure, can effectively reduce manufacturing cost, prays to make its assembling more convenient, reduces production costs.
Summary of the invention
Main purpose of the present invention is structure and the manufacturing approach that a kind of electrically conducting transparent circuit is provided, to solve the technical problem that exists in the above-mentioned background technology.
It comprises: a ground, has the ink lay of absorption conducting polymer characteristics of liquids and the conductive layer that a conducting polymer coating is constituted; Wherein, This ink lay is attached to this surface of bottom material and forms required circuit or figure, and one of them makes this printing ink add speed and sclerosis by heat energy or radiation; This conductive layer is that big area integral body is coated in this ink lay and the surface that does not cover the ground of this printing ink with more aforementioned ink lay; Then do not have conductivity in the zone of contact conductive layer with respect to ink lay on the surface of bottom material, be able on ground, form required conducting wire or figure thus.
The present invention also provides another kind of structure; Invest this surface of bottom material for earlier aforementioned conductive layer being draped over one's shoulders; Again ink lay is attached to the required non-conductive zone of formation on the conductive layer surface; One of them makes this printing ink add speed and sclerosis by heat energy or radiation again, and the zone that does not contact ink lay with respect to conductive layer on the surface of bottom material then has conductivity, is able on ground, form required conducting wire or figure thus.
Aforementioned structure can be further on conductive layer with one have the polar solvent characteristic the liquid that removes, this removes liquid is a kind of water (H that comprises 2O) and ethanol (C 2H 5OH) etc. polar solvent; Be able to the conductive layer that physical property removes ink lay and contacts with ink lay by this solution; Make the conductive layer area that does not contact on the ground form circuit or figure with conductivity with ink lay; Or make the ink lay that is positioned on this ground by producing the chemical effect with contacting of conductive layer; And then increase substantially the electrical impedance with the ink lay contact conductive layer, the local thus conductivity that changes conductive layer on the ground, the conducting wire or the figure that make the specific region formation of the conductive layer that contact on the ground have conductivity with ink lay.
The present invention's time purpose is the manufacturing approach that a kind of electrically conducting transparent circuit is provided, and its practical implementation step is following:
But a) have absorption conducting polymer characteristics of liquids and solidify one after the ink lay that liquid removes that removes of apparatus polar solvent characteristic be attached to the predetermined zone that need not conduct electricity of a surface of bottom material;
B) with above-mentioned ink lay by heat energy or radiation a kind of mode wherein, ink lay quicken to be solidified;
C) conductive layer that a conducting polymer coating is constituted is coated in the predetermined zone that needs the tool conduction on ink lay surface and the above-mentioned ground, and the curing that makes; And
D) with one have the polar solvent characteristic the liquid that removes, the conductive layer that physical property removes ink lay and contacts with ink lay stays the conductive layer that does not contact with ink lay in surface of bottom material, promptly has a conducting wire of conductivity.
Except aforementioned implementation step, manufacturing approach of the present invention further provides another practical implementation step following:
A) conductive layer that a conducting polymer coating is constituted is coated in a surface of bottom material, and the curing that makes;
B) but the ink lay that liquid removes that removes of an apparatus polar solvent characteristic is attached to the predetermined conductive layer surface that need not conduct electricity, the conductive layer that contacts with ink lay is transformed into do not have the non-conductive zone of conductivity be present in ground on;
C) with aforementioned ink lay, one of them makes it quicken to solidify by heat energy and radiation mode, then has conductivity with respect to the conductive layer area that does not contact ink lay on the surface of bottom material; And
D) with one have the polar solvent characteristic the liquid that removes remove above-mentioned ink lay, the zone that conductive layer touches ink lay forms non-conductive zone, the zone that conductive layer does not contact with ink lay then forms the conducting wire of tool conductivity.
Aforementioned ink lay to be being little area than conductive layer, by printing or visualization way one of them, make the ink lay sclerosis and be attached to the predetermined conductive region that do not need.
The aforementioned ink lay that is attached on the surface of bottom material be improved the electrical impedance value (Resistivity) of its contact conductive layer be higher than conductive layer original impedance value more than at least 100 times to non-conductive property.
Aforementioned conducting polymer coating contains a kind of internal (intrinsic) conducting polymer, comprise at least " gather (3, the fen of 4-vinyl dioxy base plug " Poly (3,4-ethylenedioxythiophene) one of them conducting polymer of (PEDOT), Pyrrols.
The aforementioned liquid that removes is a kind of liquid that removes with polar solvent characteristic, and it is able to the conductive layer that removes ink lay and contact with ink lay, and makes conductive base increase evenness thus, reduces integral thickness simultaneously.
The aforementioned conductive layer that liquid also can further remove aforementioned ink lay institute overlay area that removes with polar solvent characteristic.
The aforementioned liquid that removes with polar solvent characteristic is a kind of solution that can not reduce the conductivity that is in contact with it conductive layer in dissolving and after divesting ink lay.
The structure of aforementioned electrically conducting transparent circuit and manufacturing approach, wherein this ink lay must use a kind of radiation hardening type printing ink, comprises UV constrictive type ink lay, and it makes printing ink add speed and sclerosis by irradiation with radiation; This radiation comprises one of them of ultraviolet ray, visible light and electron beam.
Aforementioned conductive base structure and manufacturing approach, wherein the generation type of this ink lay comprises visualization way, lithographic printing or screen painting, and one of them makes the ink lay sclerosis with heat energy or irradiation with radiation sclerosis; And this radiation comprises ultraviolet ray, visible light and electron beam one of them; This heat energy comprise hot blast or infrared ray one of them.
The structure of aforementioned electrically conducting transparent circuit and manufacturing approach; Wherein this ground comprises transparent PET (PETG; Polyethylene terephthalate), PC (Merlon Polycarbonate), PEN (PEN), PI (Polyimide polyimides), acryl, COC (cyclic olefine copolymer Cyclic Olefin Copolymer), coating or glass one of them.
Aforementioned electrically conducting transparent substrate structure and manufacturing approach, wherein, this ink lay contains fluorescer (fluorescence material), brightener (optical brighter) and colorant one of them.
The structure of aforementioned electrically conducting transparent circuit and manufacturing approach, wherein this conductive layer contains interface activating agent and at least a binding agent (binder), and this interface activating agent further contains the UV absorbent or light stabilizer is wherein at least a; This binding agent (binder) further contain PU, polyester, acryl, one of them.
The structure of aforesaid electrically conducting transparent circuit and manufacturing approach; Wherein, The conducting polymer of this conductive layer is that (3,4-ethylenedioxythiophene) " gather (3, the fen of 4-vinyl dioxy base plug " is (PEDOT) time for poly; Further include at least a polymeric acid (polyacid), like PSS (polystyenesulfonate); This electroconductive polymer layer further includes silane and couplant is wherein at least a; And the electrical impedance value (Resistivity) of the lip-deep conductive layer of transparent ground is lower than 2,000ohm/square; The penetrance of the visible light of conductive layer (380nm-800nm) is more than 65%.
The structure of aforementioned electrically conducting transparent circuit and manufacturing approach; Wherein this conductive layer comprises line rod method (Wire Bar Method), roller rubbing method (Roller Coatng Method), slit examination rubbing method (Slot Die Coating), screen printing (Screen Printing) for using; Method of spin coating (Spin Coating Method), stitch thin rubbing method (Knife Over Coating " Gap Coating "), spraying process (Spray) wherein a kind of mode form.
The structure of aforementioned electrically conducting transparent circuit and manufacturing approach; It is made and need not use tradition complicated; The chemical method for etching of tool contaminative (Chemical Etch Method); Also quick than using radium-shine forming process of high equipment cost and electric paste etching method to form the mode of circuit and figure of conduction, compared to the circuit of the mode of the formed surface tension difference of use photocatalyst and the mode of figure, also have high-quality reliability; And compared to the mode of using ink-jet, the present invention also has fast, high evenness and high-quality.The present invention particularly can use low viscous functional coating; Like low viscosity aqueous conducting polymer coating; Form the electrically conducting transparent circuit and the figure that become more meticulous, can be used to replace traditional tin indium oxide costs such as (ITO) expensive transparent conductive oxide film and etched manufacture.
The present invention is able on transparent ground, form required conducting wire and figure.Moreover; The present invention on conductive layer further to have the liquid that removes of polar solvent characteristic; Ink lay and the conductive layer that contacts with ink lay are removed, make the conductive layer in the zone that does not contact on the ground form conducting wire or figure, reached beneficial technical effects with ink lay.
Below further specify embodiment of the present invention.
Description of drawings
Fig. 1 is a first embodiment of the invention D structure sketch map;
Fig. 2 is the present invention's second sketch map embodiment D structure sketch map;
Fig. 3 is a first embodiment of the invention cross-sectional configuration sketch map;
Fig. 4 is the present invention's second sketch map embodiment cross-sectional configuration sketch map;
Fig. 5 is the present invention's the 3rd sketch map embodiment cross-sectional configuration sketch map;
Fig. 6 is the present invention's the 4th sketch map embodiment cross-sectional configuration sketch map;
Fig. 7 is manufacturing approach of the present invention () embodiment flow chart;
Fig. 8 is the further manufacturing approach of the present invention (a two) embodiment flow chart.
Description of reference numerals
Ground-10; Circuit-11; Ink lay-20; Conductive layer-30; Non-conductive area-301; Remove liquid-40.
Embodiment
Like Fig. 1, shown in 3, be first embodiment of the invention, mainly comprise a ground 10, an ink lay 20 and 30 compositions of a conductive layer, wherein, this ground 10 comprise PET, PC, PEN, PI, acryl, coating, COC or glass one of them.This ink lay 20 has absorption conducting polymer characteristics of liquids, and it can be comprised water (H after a kind of curing 2O), ethanol (C 2H 5OH) etc. dissolve or the printing ink of Peng Run (swell) at interior polar organic solvent; This ink lay 20 can further contain fluorescer (fluorescencematerial) with conductive layer 30, and one of them strengthens optical characteristics and identification fluorescent whitening agent (optical brighter) and colorant.It is attached to these ground 10 surfaces and forms required circuit 11, the promptly predetermined zone that needs conduction.This ink lay 20 is one to have the soluble transparent ink layer 20 of polar solvent, its generation type comprise lithographic printing, screen painting one of them; And can make this ink lay 20 add speed and sclerosis by heat energy H (comprising hot blast or infrared ray) or radiation L, and make it be attached to transparent ground 10 surfaces, wherein, this radiation L comprises one of them of ultraviolet ray, visible light and electron beam.
This conductive layer 30 is basically to be coated in these ink lay 20 surfaces and not adhere to the zone of the predetermined needs conduction of this ink lay 20 for big area integral body than ink lay 20; The conducting polymer coating that this conductive layer 30 is had contains a kind of internal conducting polymer; Comprise at least " gather (3; the fen of 4-vinyl dioxy base plug " and Poly (3,4-ethylenedioxythiophene) (PEDOT) and Pyrrols (pyrroles); By aforementioned be attached to ground 10 lip-deep ink laies 20 be improved the electrical impedance value (Resistivity) of its contact conductive layer 301 be higher than conductive layer 30 original impedance values more than at least 100 times to non-conductive property.
Present embodiment will contain poly (3; 4-ethylenedioxythiophene) conductive polymer solution formed of " gather (3; fen of 4-vinyl dioxy base plug " conductive organic polymer (PEDOT) is with line rod (Wire Bar) mode; Slit examination rubbing method modes such as (Slot Die Coating) is uniformly coated on above-mentioned part or the whole surface of bottom material and the ink lay on the ground; After 120C x10min. drying, use four pin types (Four-Pin Method) impedance appearance to record the conducting polymer conductive layer (conductive layer of beneath no printing ink) on the PET film, its original impedance (Resistivity) is 210 Ω/square (2.1x10 2Ω/square), deduct the light transmittance 93-94% of the script ground of transparent ground, the visible light penetrance of conductive layer is 91-93%.
Because ink lay 20 forms the printing ink coverage rate in ground 10 surfaces with the zone beyond the conducting wire 11 of required tool conductivity; Go up ink lay 20 with respect to ground 10 surfaces and then do not have conductivity in the zone of contact conductive layer 30, be able on ground 10, form required conducting wire 11 thus.
Shown in 2,4 figure; Be second embodiment of the invention; With being in present embodiment of the first embodiment difference for earlier aforementioned conductive layer 30 being invested this ground 10 surfaces to drape over one's shoulders for big area integral body than ink lay 20 basically; Again ink lay 20 is attached to conductive layer 30 surfaces; Make ink lay 20 improve the electrical impedance of the conductive layer 301 that is contacted; And the surface does not cover other conductive layers 30 zones of ink lay 20 and forms required circuit 11, and one of them is planted and adds speed, reaction or sclerosis to make ink lay 30 by heat energy H or radiation L, and the electrical impedance value (Resistivity) that improves its contact conductive layer 301 be higher than conductive layer 30 original impedance values more than at least 100 times to non-conductive property.(3,4-ethylenedioxythiophene) form by one of them conductive organic polymer of (PEDOT) and Pyrrols in order to contain " gather (3, the fen of 4-vinyl dioxy base plug " Poly for the conducting polymer coating that this conductive layer 30 is constituted; By aforementioned be attached to ground 10 lip-deep ink laies 20 be improved the electrical impedance value (Resistivity) of institute's contact conductive layer 30 under it be higher than conductive layer 30 original impedance values more than at least 100 times to non-conductive property.
Present embodiment will contain poly (3; 4-ethylene dioxythiophene) conductive polymer solution formed of " gather (3; fen of 4-vinyl dioxy base plug " conductive organic polymer (PEDOT) is uniformly coated on above-mentioned part or whole perspex surface of bottom material with line rod (Wire Bar) mode or slit examination rubbing method modes such as (Slot Die Coating); The impedance (Resistivity) of using four pin types (Four-Pin Method) impedance appearance to record the electroconductive polymer layer on the PC film is 220 Ω/square; And the electrical impedance value of the conductive layer 301 that is contacted with ink lay 20 increases considerably about 1,000,000 times, to about 5x10 9Ω/square.
11 zones, conducting wire that do not contact ink lay 20 with respect to ground 10 surperficial upward conductive layers 30 then keep original conductivity, are able on ground 10, form required conducting wire 11 thus.Because ink lay 20 is coated in the surface of conductive layer 30 zone beyond the required conducting wire 11 is formed the printing ink coverage rate; Then do not maintain conductivity in the 1l zone, conducting wire of contact conductive layer 30 with respect to ink lay 20, be able on ground 10, form required conducting wire 11 thus.
As shown in Figure 5; Be third embodiment of the invention; With being in present embodiment aforementioned ink lay 20 of previous embodiment difference, being formed at this ground 10 surfaces with local adhering mode, and making its curing by heat energy H or radiation L in the predetermined zone that need not conduct electricity; This conductive layer 30 is coated in this ink lay 20 surfaces and predetermined circuit 11 zones that need conduction again, and makes conductive layer 30 and ink lay 20 add speed and curing by heat energy H or radiation L.
Present embodiment will contain poly (3; 4-ethylenedioxythiophene) conductive polymer solution formed of " gather (3; fen of 4-vinyl dioxy base plug " conductive organic polymer (PEDOT) is with line rod (WireBar) mode; Be uniformly coated on above-mentioned part or whole perspex surface of bottom material and surfaces of the ink lay on the perspex ground with slit examination rubbing method modes such as (Slot Die Coating); If with after the 120Cx10min. drying; Use four pin types (Four-Pin Method) impedance appearance to record the conducting polymer conductive layer (conductive layer of beneath no printing ink) on the PET film, its original impedance (Resistivity) is 210 Ω/square (2.1x10 2Ω/square), deduct the light transmittance 93-94% of the script ground of transparent ground, the visible light penetrance of conductive layer is 91-93%.
Present embodiment conductive layer 30 with and the part conductive layer 30 formed non-conductive areas 301 that contact with ink lay 20, surface can be further give physical property and remove to remove liquid 40, this removes liquid 40 is a kind of water (H that comprises 2O) and ethanol (C 2H 5OH) etc. polar solvent can remove ink lay 20 and non-conductive area 301 simultaneously; The zone that ground 10 surface ink layers 20 do not cover conductive layer 30 is recess, and these conductive layer 30 integral body are draped over one's shoulders the surface that invests ink lay 20 and predetermined circuit 11 zones that need conduct electricity, so conductive layer 30 is able to further this sunk area filled.After removing liquid 40 ink lay 20 and conductive layer 30 removed simultaneously, so that ground 10 surfaces do not form circuits 11 with the conductive layer 30 of ink lay 20 contact areas.In addition, after removing liquid 40 and removing, this conducting wire 11 is standing shape with respect to ground 10.
As shown in Figure 6; Be fourth embodiment of the invention; It invests this ground 10 surfaces to drape over one's shoulders for big area integral body than ink lay 20 basically with aforementioned conductive layer 30; Again with ink lay 20 on the predetermined region surface that need not conduct electricity of conductive layer 30, go up in conductive layer 30 surfaces with local adhering mode and to form ink laies 20, and by the wherein at least a mode of heat energy H or radiation L; Make ink lay 30 add speed, reaction or sclerosis, and increase substantially the part conductive layers 301 that contacted under the ink lay 20 the more former at least resistance value of electrical impedance more than 100 times to nonconducting degree.
Present embodiment will be if will contain poly (3; 4-ethylenedioxythiophene) conductive polymer solution formed of " gather (3; fen of 4-vinyl dioxy base plug " conductive organic polymer (PEDOT) is uniformly coated on transparent PC film surface with line rod (Wire Bar) mode, slit examination rubbing method modes such as (Slot Die Coating); Use the dry above-mentioned conductive polymer solution of 120Cx10min.; Make at transparent PC film surface and form conductive layer, the impedance (Resistivity) of using four pin types (Four-Pin Method) impedance appearance to record the electroconductive polymer layer on the PC film surface is 2.20 Ω x10 2Ω/square.
Present embodiment ink lay 20 further with one have a polar solvent characteristic remove liquid 40, this removes liquid 40 and is a kind of for example water (H that comprises 2O), ethanol (C 2H 5OH) isopolarity solution or contain the solution of the mixed liquor of this polar solvent; Be able to ink lay 20 is removed by this solution; Be positioned on this transparent ground 10 electrical impedance with the ink lay 20 beneath conductive layers 301 that contacted because the zone that contact with conductive layer 30 of this ink lay 20 produces chemical action and increases substantially it, so the zone that the conductive layer 30 on the ground 10 is not contacted with ink lay 20 forms required circuit 11.
Present embodiment ink lay 20 contacts with conductive layer 30 and when removing liquid 40 ink lay 20 is removed; The conductive layer 30 that contacts with ink lay 20 be transformed into do not have the non-conductive area 301 of conductivity be present in ground 10 on; Part conductive layer 30 zones with respect to not touching ink lay 20 then have conductivity, are able on ground 10, form required conducting wire 11 thus.In addition, via after removing liquid 40 and removing, this conducting wire 11 generally is flat condition with respect to ground 10 integral body.
In addition, the aforementioned conductive layer that liquid also can further remove aforementioned ink lay institute overlay area that removes with polar solvent characteristic.
Please,, comprise the following steps: for manufacturing approach embodiment of the present invention () flow chart with reference to shown in Figure 7
But a) have absorption conducting polymer characteristics of liquids and solidify one after apparatus polar solvent characteristic remove that liquid removes ink lay 20, by printing or a kind of mode wherein of developing, be attached to the predetermined zone that need not conduct electricity on a ground 10 surfaces;
B) with above-mentioned ink lay 20 by heat energy H or one of them irradiation of radiation L, make ink lay 20 quicken to solidify;
C) conductive layer 30 that a conducting polymer coating is constituted; Basically be coated in ink lay 20 and the surface of required conducting wire 11 and the dry solidification that makes with more aforementioned ink lay 20 for big area, this conducting polymer coating is for containing a kind of internal (intrinsic) conducting polymer; Be attached to ground 10 lip-deep ink laies 20 be improved its surperficial institute contact conductive layer 301 electrical impedance values (Resistivity) be higher than conductive layer 30 original impedance values more than at least 100 times to non-conductive property; The zone that this conductive layer 30 does not contact with ink lay 20 then has conductivity, forms conducting wire 11; And
D) with one have the polar solvent characteristic the conductive layer 301 that liquid 40 physical properties remove ink lay 20 and contact with ink lay 20 that removes, stay the conductive layer 30 that does not contact in these ground 10 surfaces with ink lay 20, promptly have a conducting wire 11 of conductivity.
Please,, comprise the following steps: for the further embodiment of manufacturing approach of the present invention (two) flow graph with reference to shown in Figure 8
A) dry solidification that the conductive layer 30 that a conducting polymer coating is constituted is coated in a ground 10 surfaces and makes, this conducting polymer coating is for containing a kind of internal (intrinsic) conducting polymer;
B) can be with one by the ink lay 20 that polar solvent dissolved; Basically with more aforementioned conductive layer 30 for little area is attached to predetermined conductive layer 30 surfaces that need not conduct electricity by printing or one of them the mode of developing, the conductive layer commentaries on classics 30 that contact with ink lay 20 is become do not have the non-conductive area 301 of conductivity be present in ground 10 on;
C) with the ink lay 20 of aforementioned formation conducting wire 11; By heat energy or radiation a kind of mode wherein; Make ink lay 20 add speed, reaction or sclerosis; And improve its partly conductive layer 301 electrical impedance values (Resistivity) of contacting be higher than conductive layer 30 the original impedance value more than at least 100 times to non-conductive property, the part that contact with ink lay 20 with respect to conductive layer on the surface of bottom material 30 then forms the conducting wire 11 of being scheduled to tool conductivity; And
D) with one have the polar solvent characteristic the liquid 40 that removes remove liquid and remove above-mentioned ink lay 20; The zone that conductive layer 30 touches ink lay 20 forms non-conductive regional 301; With respect to ground 10 lip-deep non-conductive areas 301, the zone that this conductive layer 30 does not contact with ink lay 20 then forms the conducting wire 11 of tool conductivity; Make simultaneously conductive layer 30 surfaces increase evenness thus, reduce the thickness of whole clearing electricity conductive construction simultaneously.
The liquid 40 that removes that aforementioned each embodiment mentions is a kind of solution that can not reduce the conductivity that is in contact with it conductive layer 30 in dissolving and after divesting ink lay 20.
The manufacturing approach embodiment of aforementioned electrically conducting transparent circuit (one) and (two), wherein this conductive layer contains interface activating agent and at least a binding agent (binder), and this interface activating agent further contains the UV absorbent or light stabilizer is wherein at least one. plant; This binding agent (binder) further contains PU, polyester, acryl, at least wherein a kind of.The conducting polymer of this conductive layer be poly (3,4-ethylenedioxythiophene) " gather (3, the fen of 4-vinyl dioxy base plug " further include at least a polymeric acid (polyacid), like PSS (polystyenesulfonate) (PEDOT) time.; This electroconductive polymer layer further includes silane silane and couplant is wherein at least a; And the electrical impedance value (Resistivity) of the lip-deep conductive layer of transparent ground is lower than 2,000ohm/square; The penetrance of the visible light of conductive layer (380nm-800nm) is more than 65%.This conductive layer comprises line bar mode (Wire Bar Method), roller rubbing method (Roller Coatng Method), slit examination rubbing method (Slot Die Coating), method of spin coating (Spin Coating Method) for using, stitch thin rubbing method (Knife Over Coating " Gap Coating "), spraying process (Spray) wherein a kind of mode form.
The present invention's's " structure of electrically conducting transparent circuit and manufacturing approach " application comprises nesa coating (Transparent Conductive Film, " TCF "), LCD (LCD) at least; Heat-protecting glass, contact panel (Touch Panel), film resistor (Thin Film Resistor); Membrane transistor (Thin Film Transistor); Luminous original paper (Light-Emitting Device), solar cell (Solar Cell), flexible electronic (Printed Electronics).
The above description of this invention is illustrative, and nonrestrictive, and those skilled in the art is understood, and the spirit and the interior of scope that limit in claim can carry out many modifications, variation or equivalence to it, but they all will fall in protection scope of the present invention.

Claims (18)

1. the structure of an electrically conducting transparent circuit is characterized in that, comprises:
One ground;
One has the transparent ink layer of absorption conducting polymer characteristics of liquids, is attached to the predetermined zone that need not conduct electricity of this surface of bottom material, and one of them makes this printing ink quicken curing by heat energy and radiation;
The conductive layer that one conducting polymer coating is constituted is coated in the predetermined zone that needs tool conductivity of this ink lay and the surface of bottom material that does not cover this printing ink, and this conducting polymer coating contains a kind of internal conducting polymer; By the aforementioned ink lay that is attached on the surface of bottom material be improved its contact conductive layer electrical impedance value be higher than conductive layer original impedance value more than at least 100 times to non-conductive property; The zone that does not touch ink lay with respect to conductive layer on the surface of bottom material then has conductivity, on ground, forms required conducting wire thus.
2. the structure of an electrically conducting transparent circuit is characterized in that, comprises:
One ground;
The conductive layer that one conducting polymer coating is constituted invests this surface of bottom material, and this conducting polymer coating contains a kind of internal conducting polymer;
One has the soluble transparent ink layer of polar solvent; Be attached to the predetermined zone that need not conduct electricity on the conductive layer surface; And make printing ink add speed and curing by heat energy or radiation a kind of mode at least wherein; And the electrical impedance value that improves ink lay institute contact conductive layer is higher than the extremely non-conductive more than at least 100 times of conductive layer original impedance value; The conductive layer that is covered by ink lay is transformed into do not have the non-conductive area of conductivity, the zone that does not contact ink lay with respect to conductive layer on the surface of bottom material then has conductivity, is able on ground, form required conducting wire thus.
3. the manufacturing approach of an electrically conducting transparent circuit is characterized in that, comprises:
But a) have absorption conducting polymer characteristics of liquids and solidify one after the ink lay that liquid removes that removes of apparatus polar solvent characteristic be attached to the predetermined zone that need not conduct electricity of a surface of bottom material;
B) with above-mentioned ink lay by heat energy or radiation a kind of mode wherein, ink lay quicken to be solidified;
C) conductive layer that a conducting polymer coating is constituted is coated in the predetermined zone that needs the tool conduction on ink lay surface and the above-mentioned ground, and the curing that makes, and this conducting polymer coating contains a kind of internal conducting polymer; And
D) with one have the polar solvent characteristic the liquid that removes, the conductive layer that physical property removes ink lay and contacts with ink lay stays the conductive layer that does not contact with ink lay in surface of bottom material, promptly has a conducting wire of conductivity.
4. the manufacturing approach of an electrically conducting transparent circuit is characterized in that, comprises:
A) conductive layer that a conducting polymer coating is constituted is coated in a surface of bottom material, and the curing that makes, and this conducting polymer coating contains a kind of internal conducting polymer;
B) but the ink lay that liquid removes that removes of an apparatus polar solvent characteristic is attached to the predetermined conductive layer surface that need not conduct electricity, the conductive layer that contacts with ink lay is transformed into do not have the non-conductive zone of conductivity be present in ground on;
C) with aforementioned ink lay; Make it quicken to solidify by heat energy and wherein a kind of at least mode of radiation; And make the electrical impedance value of ink lay raising institute contact conductive layer be higher than the extremely non-conductive more than 100 times of conductive layer original electrical resistance value at least, then have conductivity with respect to the conductive layer area that does not contact ink lay on the surface of bottom material; And
D) with one have the polar solvent characteristic the liquid that removes remove above-mentioned ink lay, the zone that conductive layer touches ink lay forms non-conductive zone, the zone that conductive layer does not contact with ink lay then forms the conducting wire of tool conductivity.
5. the manufacturing approach of electrically conducting transparent circuit as claimed in claim 4 and figure is characterized in that, this removes liquid and removes ink lay and the conductive layer that contacts with ink lay simultaneously.
6. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit, it is characterized in that this internal conducting polymer comprises at least and gather 3, one of them conducting polymer of the fen of 4-vinyl dioxy base plug, pyrroles.
7. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit, it is characterized in that this ink lay is a kind of radiation hardening type printing ink, and this radiation comprises ultraviolet ray, visible light and electron beam one of them.
8. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit, it is characterized in that the formation of this ink lay is with mode of printing or visualization way.
9. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit, it is characterized in that, this heat energy comprise hot blast and infrared ray one of them.
10. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit; It is characterized in that, this ground comprise transparent PETG, Merlon, PEN, polyimides, cyclic olefine copolymer, acryl, coating and glass one of them.
11. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit, it is characterized in that, this ink lay and conductive layer wherein contain one of at least fluorescer, brightener and colorant one of them.
12. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit, it is characterized in that this conductive layer contains the interface activating agent, this interface activating agent further contains the UV absorbent and light stabilizer is wherein at least a.
13. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit, it is characterized in that this conductive layer contains binding agent, this binding agent contain PU, polyester and acryl one of them.
14., it is characterized in that the conducting polymer of this conductive layer during the fen of 4-vinyl dioxy base plug, further includes at least a polymeric acid for gathering 3 like claim 1 to 4 wherein each described electrically conducting transparent circuit configurations and manufacturing approach.
15. like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit; It is characterized in that; This conductive layer uses line rod method, roller rubbing method, slit examination rubbing method, method of spin coating, stitch thin rubbing method and spraying process wherein a kind of mode form.
16., it is characterized in that the original electrical resistance value of the lip-deep conductive layer of this ground is lower than 2,000ohm/square like claim 1 to 4 wherein each described electrically conducting transparent circuit configurations and manufacturing approach.
17., it is characterized in that this conductive layer further includes couplant like claim 1 to the 4 wherein structure and the manufacturing approach of each described electrically conducting transparent circuit.
18., it is characterized in that the visible light penetrance of this conductive layer is more than 65% like claim 1 to 4 wherein each described electrically conducting transparent circuit configurations and manufacturing approach.
CN201110106193.5A 2011-04-27 2011-04-27 Structure and manufacturing method of transparent conducting circuit Expired - Fee Related CN102762026B (en)

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