CN102762026B - Structure and manufacturing method of transparent conducting circuit - Google Patents
Structure and manufacturing method of transparent conducting circuit Download PDFInfo
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- CN102762026B CN102762026B CN201110106193.5A CN201110106193A CN102762026B CN 102762026 B CN102762026 B CN 102762026B CN 201110106193 A CN201110106193 A CN 201110106193A CN 102762026 B CN102762026 B CN 102762026B
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Abstract
The invention mainly relates to a structure and manufacturing method of a transparent conducting circuit. The transparent conducting circuit comprises a substrate, an ink layer with a conductive polymer liquid absorption characteristic and a conducting layer made of a conducting polymer coating, wherein the ink layer is attached on a region not needed to be conducted on the surface of the substrate, and ink drying and hardening processes are accelerated through heat energy or radiant rays; and the conducting layer is in contact with the ink layer in a whole attachment area larger than that of the ink layer, so that the electric resistance value of the conducting layer in contact with the ink layer attached on the surface of the substrate is increased, the region which is opposite to the conducting layer on the surface of the substrate and is not in contact with the ink layer has conductivity, and furthermore, the required conducting circuit or graph is formed on the substrate. Moreover, the ink layer and the conducting layer in contact with the ink layer are removed by using removing liquid with a polar solution characteristic, comprising water (H2O), ethanol (C2H5OH) and other solutions, on the conducting layer, thus the conductivity and shape of the conducting layer in the special region are changed.
Description
Technical field
The present invention is about a kind of structure of electrically conducting transparent circuit and manufacture method, the electrical impedance value of its contact conductive layer is improved to non-conductive property by the ink layer be attached on surface of bottom material, then there is conductivity relative to the region of transparent ground ink layer not contact conductive layer on the surface, be able to thus form required conducting wire and figure on transparent ground.Moreover the present invention removes liquid with what have a polar solvent characteristic on the electrically conductive further, ink layer and the conductive layer that contacts with ink layer are removed, makes the conductive layer in the region that ground does not contact with ink layer form conducting wire or figure.
Background technology
Due to conducting polymer tool essence conductivity, solution process can be used to produce there is transparent conducting film, compare nesa coating manufactured by general existing metal oxide as ITO (tin indium oxide) film, conducting polymer has the advantages such as lower material cost and manufacturing cost, but the viscosity of the conductive polymer solution of standard because of its solid content can not be too high, otherwise the stability of conductive polymer solution can be reduced, because solution viscosity is low, and be not suitable for for the particular conductivity circuit required for formation and figure.If the formula composition of amendment conductive polymer solution, make to become viscosity higher, then easily sacrifice and reduce its light transmission, conductivity, resistance to water and the characteristic such as weather-proof, therefore related industry to the structure and method using low viscous conductive polymer solution to form transparent conducting wire and figure have in the urgent need to.
The technology that current use conductive polymer solution forms transparent conducting wire and figure comprises radium-shine patterning method, it uses and radium-shinely cuts and make figure, but the cost in fact because using radium-shine equipment is quite high and speed is slow, and does not meet the requirement of industrial volume production.In addition; also electric paste etching method is had; its use the shade material such as (Mask) conducting wire that protectiveness stays and figure; re-use electricity slurry unwanted conductive polymer subregion is removed with etching mode; only leave transparent conducting wire and figure; but the method to make electricity consumption starch equipment cost high slow with etching speed, same and do not meet the requirement of industrial actual volume production.In addition, also ink-jet method is had, use piezoelectric type (Piezo) or hot bubble type (Thermo-bubble) that conductive polymer solution is sprayed on surface of bottom material through ink gun (Print Head) with drops, circuit or the figure of its formation conduction formed by a large amount of ink dots, but the method is except the speed of spray printing is slow and ink gun easily to block etc. except shortcoming, the greater homogeneity of its conducting wire formed or figure, the ink dot planarization of edge line, the problems such as ink dot distribution situation also not easily produce the speed and quality requirements that meet industrial actual volume production.
In addition, company of Dai Nippon Printing (Dai Nippon Printing Co., Ltd.) US Patent No. 7, 749, 684B2 discloses the principle of a use sense photocatalyst and surface differential to form required functional circuit and the method for figure, but the functional circuit using this mode to be formed and the uniformity of figure quite wayward, and because used Forming Theory is to the surface tension of functional coating, liquid viscosity etc. restriction is many, the composition of functional coating and physical property is caused to be restricted, thus the conducting wire meeting industrial requirement and figure is not easily produced.
The present invention is directed to above disappearance, the conducting polymer forming electrically conducting transparent circuit and figure formed to have the degree of freedom high, the electrically conducting transparent circuit formed and the figure uniformity and resolution high, and have and produce advantage fast.Edge this, applicant develops " structure of electrically conducting transparent circuit and manufacture method ", and the improvement constructed by this transparent conductive substrate, effectively can reduce manufacturing cost, prays that to make it assemble more convenient, reduces production cost.
Summary of the invention
Main purpose of the present invention for providing a kind of structure and manufacture method of electrically conducting transparent circuit, to solve the technical problem existed in above-mentioned background technology.
It comprises: a ground, has the conductive layer that the ink layer of absorption conducting polymer characteristics of liquids and a conducting polymer coating are formed, wherein, this ink layer is attached to this surface of bottom material and forms required circuit or figure, and by heat energy or radiation one of them that this ink is accelerated is dry with sclerosis; This conductive layer is that large area entirety is coated in this ink layer and the surface of ground not covering this ink with more aforementioned ink layer, then there is conductivity relative to the oil region of layer of ink not contact conductive layer of surface of bottom material, be able to thus on ground, form required conducting wire or figure.
The present invention also provides another kind of structure, this surface of bottom material is invested for first being draped over one's shoulders by aforesaid conductive layer, again ink layer is attached on conductive layer surface and forms required non-conductive region, again by heat energy or radiation one of them that this ink is accelerated is dry with sclerosis, the region not contacting ink layer relative to conductive layer on surface of bottom material then has conductivity, is able to thus on ground, form required conducting wire or figure.
Aforementioned structure can further on the electrically conductive with one there is polar solvent characteristic remove liquid, this removes liquid is that one comprises water (H
2and ethanol (C O)
2h
5etc. OH) polar solvent, the conductive layer that physical property removes ink layer and contact with ink layer is able to by this solution, the conductive layer area that ground does not contact with ink layer is made to form the circuit or figure with conductivity, or the ink layer be positioned on this ground is produced by the contact with conductive layer chemically act on, and then increase substantially the electrical impedance with ink layer contact conductive layer, local changes the conductivity of conductive layer on ground thus, the conducting wire or figure that the specific region of the conductive layer that ground does not contact with ink layer are formed have conductivity.
The present invention's time object is for providing a kind of manufacture method of electrically conducting transparent circuit, and its concrete implementation step is as follows:
A) can the ink layer that liquid removes of removing of apparatus polar solvent characteristic the region that a surface of bottom material makes a reservation for not need to conduct electricity be attached to after there is one absorption conducting polymer characteristics of liquids and solidification;
B) by above-mentioned ink layer by heat energy or radiation a kind of mode wherein, make ink layer accelerate solidification;
C) by the conductive layer that a conducting polymer coating is formed, the predetermined region needing tool to conduct electricity on ink layer surface and above-mentioned ground is coated in, and the solidification made; And
D) there is the liquid that removes of polar solvent characteristic, the conductive layer that physical property removes ink layer and contacts with ink layer by one, leave the conductive layer do not contacted with ink layer in surface of bottom material, namely have a conducting wire of conductivity.
Except aforementioned implementation step, manufacture method of the present invention provides another concrete implementation step as follows further:
A) conductive layer that a conducting polymer coating is formed is coated in a surface of bottom material, and the solidification made;
B) can the ink layer that liquid removed that remove of apparatus polar solvent characteristic be attached to the predetermined conductive layer surface not needing to conduct electricity by one, the conductive layer contacted is transformed into do not have the non-conductive region of conductivity to be present in the upper of ground with ink layer;
C) by aforementioned ink layer, by heat energy and radiation mode, one of them makes it accelerate to solidify, and then has conductivity relative to conductive layer area surface of bottom material not contacting ink layer; And
The liquid that removes d) by one with polar solvent characteristic removes above-mentioned ink layer, and conductive layers make contact forms non-conductive region to the region of ink layer, and the region that conductive layer does not contact with ink layer then forms the conducting wire of tool conductivity.
Aforementioned ink layer being little area compared with conductive layer, by print or visualization way one of them, ink layer is hardened and is attached to predeterminedly not need conductive region.
The electrical impedance value (Resistivity) that the aforementioned ink layer be attached on surface of bottom material is improved its contact conductive layer higher than more than at least 100 times of conductive layer original impedance value to non-conductive property.
Aforesaid conductive high-molecular coating contains a kind of internal (intrinsic) conducting polymer, at least comprise one of them conducting polymer of " poly-(3; fen of 4-vinyl dioxy base plug " Poly (3,4-ethylenedioxythiophene) (PEDOT), Pyrrols.
Aforementioned remove liquid be a kind of there is polar solvent characteristic remove liquid, its conductive layer being removed ink layer and contact with ink layer, and make conductive base increase evenness thus, reduce integral thickness simultaneously.
Aforementioned there is polar solvent characteristic remove the conductive layer that liquid also can remove aforementioned ink layer institute overlay area further.
The aforementioned liquid that removes with polar solvent characteristic is a kind of at dissolving and the solution that can not reduce the conductivity being in contact with it conductive layer after divesting ink layer.
The structure of aforementioned transparent conducting wire and manufacture method, wherein this ink layer must use a kind of radiation hardening type ink, comprises UV constrictive type ink layer, and it makes ink accelerate dry and sclerosis by irradiation with radiation; This radiation comprises one of them of ultraviolet, visible ray and electron beam.
Aforesaid conductive substrate structure and manufacture method, wherein the generation type of this ink layer comprises visualization way, lithographic printing or screen painting, and hardens with heat energy or irradiation with radiation that one of them makes ink layer harden; And this radiation comprises ultraviolet, visible ray and electron beam one of them; This heat energy comprise hot blast or infrared ray one of them.
The structure of aforementioned transparent conducting wire and manufacture method, wherein this ground comprises transparent PET (PETG, polyethylene terephthalate), PC (Merlon Polycarbonate), PEN (PEN), PI (Polyimide polyimides), acryl, COC (cyclic olefine copolymer Cyclic Olefin Copolymer), coating or glass one of them.
Aforementioned transparent conduction substrate structure and manufacture method, wherein, this ink layer contains fluorescer (fluorescence material), brightener (optical brighter) and colorant one of them.
The structure of aforementioned transparent conducting wire and manufacture method, wherein this conductive layer contains surfactant and at least one binding agent (binder), and this surfactant is further containing UV absorbent or light stabilizer wherein at least one; This binding agent (binder) further containing PU, polyester, acryl, one of them.
The structure of aforesaid electrically conducting transparent circuit and manufacture method, wherein, the conducting polymer of this conductive layer is poly (3,4-ethylenedioxythiophene) during " poly-(3; fen of 4-vinyl dioxy base plug " (PEDOT), include at least one polymeric acid (polyacid) further, as PSS (polystyenesulfonate); This electroconductive polymer layer includes silane and couplant wherein at least one further; And the electrical impedance value (Resistivity) of conductive layer on the surface of transparent ground is lower than 2,000ohm/square; The penetrance of the visible ray (380nm-800nm) of conductive layer is more than 65%.
The structure of aforementioned transparent conducting wire and manufacture method, wherein this conductive layer is that use comprises line rod method (Wire Bar Method), roller rubbing method (Roller Coatng Method), slit examination rubbing method (SlotDie Coating), screen printing (Screen Printing), method of spin coating (Spin Coating Method), stitch thin rubbing method (Knife Over Coating " Gap Coating "), spraying process (Spray) wherein a kind of mode formed.
The structure of aforementioned transparent conducting wire and manufacture method, it manufactures does not need to use tradition complicated, the chemical method for etching (Chemical Etch Method) of tool contaminative, also quicker than using the radium-shine forming process of high equipment cost and electric paste etching method to form the mode of the circuit of conduction and figure, compared to the circuit of mode and the mode of figure of the surface tension difference using photocatalyst to be formed, also there is high-quality reliability, and compared to using the mode of ink-jet, the present invention also has fast, high evenness and high-quality.The present invention particularly can use low viscous functional coating, as low viscosity aqueous conducting polymer coating, form the electrically conducting transparent circuit and figure that become more meticulous, can be used to replace the transparent conductive oxide film of cost intensive and the manufactures of etching such as traditional tin indium oxide (ITO).
The present invention is able to form required conducting wire and figure on transparent ground.Moreover, the present invention removes liquid with what have a polar solvent characteristic on the electrically conductive further, ink layer and the conductive layer that contacts with ink layer are removed, makes the conductive layer in the region that ground does not contact with ink layer form conducting wire or figure, reach useful technique effect.
Below further illustrate the specific embodiment of the present invention.
Accompanying drawing explanation
Fig. 1 is first embodiment of the invention D structure schematic diagram;
Fig. 2 is the present invention second schematic diagram embodiment D structure schematic diagram;
Fig. 3 is first embodiment of the invention cross-sectional configuration schematic diagram;
Fig. 4 is the present invention second schematic diagram embodiment cross-sectional configuration schematic diagram;
Fig. 5 is the present invention the 3rd schematic diagram embodiment cross-sectional configuration schematic diagram;
Fig. 6 is the present invention the 4th schematic diagram embodiment cross-sectional configuration schematic diagram;
Fig. 7 is manufacture method of the present invention (one) embodiment flow chart;
Fig. 8 is the further manufacture method of the present invention (two) embodiment flow chart.
Description of reference numerals
Ground-10; Circuit-11; Ink layer-20; Conductive layer-30; Non-conductive area-301; Remove liquid-40.
Embodiment
As shown in Figure 1,3, be first embodiment of the invention, mainly comprise ground 10, ink layer 20 and a conductive layer 30 formed, wherein, this ground 10 comprise PET, PC, PEN, PI, acryl, coating, COC or glass one of them.This ink layer 20 has absorption conducting polymer characteristics of liquids, and it is for being included water (H after a kind of solidification
2o), ethanol (C
2h
5etc. OH) at interior polar organic solvent dissolve or the ink of Peng Run (swell), this ink layer 20 and conductive layer 30 can contain fluorescer (fluorescencematerial) further, fluorescent whitening agent (optical brighter) and colorant one of them strengthen optical characteristics and identification.It is attached to the circuit 11 needed for the surperficial formation of this ground 10, i.e. the predetermined region that need conduct electricity.This ink layer 20 is one have the soluble transparent ink layer 20 of polar solvent, its generation type comprise lithographic printing, screen painting one of them; And it is dry with sclerosis this ink layer 20 can be made to accelerate by heat energy H (comprising hot blast or infrared ray) or radiation L, makes it be attached to transparent ground 10 surface, wherein, this radiation L comprises one of them of ultraviolet, visible ray and electron beam.
This conductive layer 30 is substantially compared with ink layer 20 to be the large overall region being coated in this ink layer 20 surface and conducting electricity with the predetermined needs not adhering to this ink layer 20 of area, the conducting polymer coating that this conductive layer 30 has contains a kind of internal conducting polymer, at least comprise " poly-(3; the fen of 4-vinyl dioxy base plug " Poly (3,4-ethylenedioxythiophene) (PEDOT) and Pyrrols (pyrroles); The electrical impedance value (Resistivity) being improved its contact conductive layer 301 by the aforementioned ink layer 20 be attached on ground 10 surface higher than more than at least 100 times of conductive layer 30 original impedance value to non-conductive property.
The present embodiment will containing poly (3, 4-ethylenedioxythiophene) " poly-(3, the fen of 4-vinyl dioxy base plug " conductive polymer solution that forms of the conductive organic polymer of (PEDOT) is in line rod (WireBar) mode, the slit examination rubbing method mode such as (Slot Die Coating) is uniformly coated on the ink layer on above-mentioned part or whole surface of bottom material and ground, after 120C x10min. drying, four pin types (Four-Pin Method) impedance instrument is used to record the conductive polymer conducting layer (the beneath conductive layer without ink) in PET film, its original impedance (Resistivity) is 210 Ω/square (2.1x10
2Ω/square), deduct the light transmittance 93-94% of the script ground of transparent ground, the visible ray penetrance of conductive layer is 91-93%.
Because the region beyond the conducting wire 11 of required tool conductivity is formed ink coverage rate in ground 10 surface by ink layer 20, then there is conductivity relative to the region of ground 10 ink layer 20 not contact conductive layer 30 on the surface, be able to thus on ground 10, form required conducting wire 11.
As 2, shown in 4 figure, for second embodiment of the invention, with the first embodiment difference be in the present embodiment be first by aforesaid conductive layer 30 substantially being that large area entirety is draped over one's shoulders and invested this ground 10 surface compared with ink layer 20, again ink layer 20 is attached to conductive layer 30 surface, ink layer 20 is made to improve the electrical impedance of the conductive layer 301 contacted, and other conductive layer 30 regions that surface does not cover ink layer 20 form required circuit 11, and make one of them kind of ink layer 30 accelerate drying by heat energy H or radiation L, reaction or sclerosis, and the electrical impedance value (Resistivity) improving its contact conductive layer 301 higher than more than at least 100 times of conductive layer 30 original impedance value to non-conductive property.The conducting polymer coating that this conductive layer 30 is formed is formed containing one of them conductive organic polymer of " poly-(3; fen of 4-vinyl dioxy base plug " Poly (3,4-ethylenedioxythiophene) (PEDOT) and Pyrrols; The electrical impedance value (Resistivity) being improved institute's contact conductive layer 30 under it by the aforementioned ink layer 20 be attached on ground 10 surface higher than more than at least 100 times of conductive layer 30 original impedance value to non-conductive property.
The present embodiment will containing poly (3, 4-ethylene dioxythiophene) " poly-(3, the fen of 4-vinyl dioxy base plug " conductive polymer solution that forms of the conductive organic polymer of (PEDOT) is uniformly coated on above-mentioned part or whole perspex surface of bottom material in modes such as line rod (WireBar) mode or slits examination rubbing method (Slot Die Coating), the impedance (Resistivity) using four pin types (Four-Pin Method) impedance instrument to record the electroconductive polymer layer on PC film is 220 Ω/square, and the electrical impedance value of the conductive layer 301 contacted with ink layer 20 increases considerably about 1,000,000 times, to about 5x10
9Ω/square.
Then keep original conductivity relative to ground 10 region, conducting wire 11 that conductive layer 30 does not contact ink layer 20 on the surface, be able to thus on ground 10, form required conducting wire 11.Region beyond required conducting wire 11 is formed ink coverage rate by the surface being coated in conductive layer 30 due to ink layer 20, then maintain conductivity relative to the 1l region, conducting wire of ink layer 20 not contact conductive layer 30, be able to thus on ground 10, form required conducting wire 11.
As shown in Figure 5, for third embodiment of the invention, with being in aforementioned ink layer 20 in the present embodiment in the predetermined region not needing to conduct electricity of previous embodiment difference, this ground 10 surface is formed at local adhering mode, and make it solidify by heat energy H or radiation L, this conductive layer 30 is coated in this ink layer 20 surface and predetermined circuit 11 region needing to conduct electricity again, and makes conductive layer 30 and ink layer 20 accelerate Drying and curing by heat energy H or radiation L.
The present embodiment will containing poly (3, 4-ethylenedioxythiophene) " poly-(3, the fen of 4-vinyl dioxy base plug " conductive polymer solution that forms of the conductive organic polymer of (PEDOT) is in line rod (WireBar) mode, the ink layer surface on above-mentioned part or whole perspex surface of bottom material and perspex ground is uniformly coated in the slit examination rubbing method mode such as (Slot Die Coating), if after 120Cx10min. drying, four pin types (Four-Pin Method) impedance instrument is used to record the conductive polymer conducting layer (the beneath conductive layer without ink) in PET film, its original impedance (Resistivity) is 210 Ω/square (2.1x10
2Ω/square), deduct the light transmittance 93-94% of the script ground of transparent ground, the visible ray penetrance of conductive layer is 91-93%.
The non-conductive area 301 that the present embodiment conductive layer 30 and its part conductive layer 30 of contacting with ink layer 20 of surface are formed can give physical property remove to remove liquid 40 further, and this removes liquid 40 for one and comprises water (H
2and ethanol (C O)
2h
5etc. OH) polar solvent, can be removed ink layer 20 and non-conductive area 301 simultaneously; The region that ground 10 surface oil layer of ink 20 does not cover conductive layer 30 is recessed, and this conductive layer 30 entirety drapes over one's shoulders the surface investing ink layer 20 and predetermined circuit 11 region that need conduct electricity, and therefore conductive layer 30 is able to be filled by this sunk area further.When removing after ink layer 20 and conductive layer 30 remove by liquid 40 simultaneously, ground 10 surface is made not form circuit 11 with the conductive layer 30 of ink layer 20 contact area.In addition, through removing after liquid 40 removes, this conducting wire 11 relative to ground 10 in standing shape.
As shown in Figure 6, for fourth embodiment of the invention, its by aforesaid conductive layer 30 substantially being that large area entirety is draped over one's shoulders and invested this ground 10 surface compared with ink layer 20, again ink layer 20 is made a reservation for not need in the region surface of conduction at conductive layer 30, ink layer 20 is formed on the surface in conductive layer 30 with local adhering mode, and by the wherein at least one mode of heat energy H or radiation L, ink layer 30 is made to accelerate drying, reaction or sclerosis, and increase substantially more than 100 times of at least more former resistance value of electrical impedance of the part conductive layer 301 contacted under ink layer 20 to nonconducting degree.
If the present embodiment will containing poly (3, 4-ethylenedioxythiophene) " poly-(3, the fen of 4-vinyl dioxy base plug " conductive polymer solution that forms of the conductive organic polymer of (PEDOT) is in line rod (WireBar) mode, the modes such as slit examination rubbing method (Slot Die Coating) are uniformly coated on transparent PC film surface, use the dry above-mentioned conductive polymer solution of 120Cx10min., make to form conductive layer at transparent PC film surface, the impedance (Resistivity) using four pin types (Four-Pin Method) impedance instrument to record the electroconductive polymer layer on PC film surface is 2.20 Ω x10
2Ω/square.
The present embodiment ink layer 20 further with one there is polar solvent characteristic remove liquid 40, this removes liquid 40 for one and comprises such as water (H
2o), ethanol (C
2h
5oH) solution of isopolarity solution or the mixed liquor containing this polar solvent, be able to ink layer 20 to remove by this solution, the region contacted with conductive layer 30 due to this ink layer 20 produces chemical action and increases substantially it and is positioned at electrical impedance with the conductive layer 301 contacted under ink layer 20 on this transparent ground 10, and the region therefore making the conductive layer 30 on ground 10 not contact with ink layer 20 forms required circuit 11.
The present embodiment ink layer 20 contact with conductive layer 30 and by remove liquid 40 ink layer 20 is removed time, the conductive layer 30 contacted with ink layer 20 is transformed into does not have a non-conductive area 301 of conductivity and is present in the upper of ground 10, then there is conductivity relative to part conductive layer 30 region not touching ink layer 20, be able to thus on ground 10, form required conducting wire 11.In addition, via removing after liquid 40 removes, this conducting wire 11 is overall relative to ground 10 general in flat condition.
In addition, aforementioned there is polar solvent characteristic remove the conductive layer that liquid also can remove aforementioned ink layer institute overlay area further.
Please refer to shown in Fig. 7, be manufacture method embodiment () flow chart of the present invention, comprise the following steps:
A) after there is one absorption conducting polymer characteristics of liquids and solidification can apparatus polar solvent characteristic remove that liquid removed ink layer 20, by a kind of mode wherein of printing or develop, be attached to the predetermined region not needing to conduct electricity on ground 10 surface;
B) by above-mentioned ink layer 20, by heat energy H or radiation L, one of them irradiates, and makes ink layer 20 accelerate solidification;
C) by conductive layer 30 that a conducting polymer coating is formed, substantially be that large area is coated in the surface of ink layer 20 and required conducting wire 11 and the dry solidification made with more aforementioned ink layer 20, this conducting polymer coating is for containing a kind of internal (intrinsic) conducting polymer; The ink layer 20 be attached on ground 10 surface is improved its surperficial institute's contact conductive layer 301 electrical impedance value (Resistivity) higher than more than at least 100 times of conductive layer 30 original impedance value to non-conductive property, the region that this conductive layer 30 does not contact with ink layer 20 then has conductivity, forms conducting wire 11; And
What d) have polar solvent characteristic by one removes the conductive layer 301 that liquid 40 physical property removes ink layer 20 and contact with ink layer 20, leaves in this ground 10 surface the conductive layer 30 do not contacted with ink layer 20, namely has a conducting wire 11 of conductivity.
Please refer to shown in Fig. 8, be the further embodiment of manufacture method of the present invention (two) flow graph, comprise the following steps:
A) conductive layer 30 that a conducting polymer coating is formed is coated in ground 10 surface and the dry solidification made, this conducting polymer coating is for containing a kind of internal (intrinsic) conducting polymer;
B) by one can the ink layer 20 that dissolves by polar solvent, substantially to be little area compared with aforesaid conductive layer 30 by print or one of them the mode of developing is attached to predetermined conductive layer 30 surface not needing to conduct electricity, make the conductive layer contacted with ink layer 20 turn 30 and become and do not have a non-conductive area 301 of conductivity and be present in the upper of ground 10;
C) by the ink layer 20 of aforementioned formation conducting wire 11, by heat energy or radiation a kind of mode wherein, ink layer 20 is made to accelerate drying, reaction or sclerosis, and improve its contact part conductive layer 301 electrical impedance value (Resistivity) higher than at least 100 times more than of original impedance value of conductive layer 30 extremely non-conductive property, the part do not contacted with ink layer 20 relative to conductive layer on surface of bottom material 30 then forms the conducting wire 11 of predetermined tool conductivity; And
The liquid 40 that removes d) by one with polar solvent characteristic removes liquid and removes above-mentioned ink layer 20, the region that conductive layer 30 touches ink layer 20 forms non-conductive region 301, relative to the non-conductive area 301 on ground 10 surface, the region that this conductive layer 30 does not contact with ink layer 20, then form the conducting wire 11 of tool conductivity, make conductive layer 30 surface increase evenness simultaneously thus, reduce the thickness of whole clearing electricity conductive construction simultaneously.
What foregoing embodiments was mentioned removes liquid 40 is a kind of at dissolving and the solution that can not reduce the conductivity being in contact with it conductive layer 30 after divesting ink layer 20.
The manufacture method embodiment (one) of aforementioned transparent conducting wire and (two), wherein this conductive layer contains surfactant and at least one binding agent (binder), this surfactant further containing UV absorbent or light stabilizer wherein at least one. plant; This binding agent (binder) is further containing PU, polyester, acryl, one at least wherein.The conducting polymer of this conductive layer is poly (3,4-ethylenedioxythiophene) during " poly-(3; fen of 4-vinyl dioxy base plug " (PEDOT), include at least one polymeric acid (polyacid) further, as PSS (polystyenesulfonate).; This electroconductive polymer layer includes silane silane and couplant wherein at least one further; And the electrical impedance value (Resistivity) of conductive layer on the surface of transparent ground is lower than 2,000ohm/square; The penetrance of the visible ray (380nm-800nm) of conductive layer is more than 65%.This conductive layer be use comprise line bar mode (Wire Bar Method), roller rubbing method (Roller Coatng Method), slit examination rubbing method (Slot Die Coating), method of spin coating (Spin Coating Method), stitch thin rubbing method (Knife Over Coating " Gap Coating "), spraying process (Spray) wherein a kind of mode formed.
The application of the present invention's " structure of electrically conducting transparent circuit and manufacture method " at least comprises nesa coating (Transparent Conductive Film, " TCF "), liquid crystal display (LCD), heat-protecting glass, contact panel (Touch Panel), film resistor (Thin Film Resistor), membrane transistor (Thin FilmTransistor), luminous original paper (Light-Emitting Device), solar cell (Solar Cell), flexible electronic (Printed Electronics).
The above description of this invention is illustrative, and nonrestrictive, and those skilled in the art is understood, and can carry out many amendments, change or equivalence, but they all will fall within the scope of protection of the present invention in the spirit and scope of claim restriction to it.
Claims (29)
1. a structure for electrically conducting transparent circuit, is characterized in that, comprises:
One ground;
The conductive layer that one conducting polymer coating is formed invests this surface of bottom material, and this conducting polymer coating contains a kind of internal conducting polymer;
One has the soluble transparent ink layer of polar solvent, be attached to the predetermined region not needing to conduct electricity on conductive layer surface, and make ink layer accelerate Drying and curing by heat energy or radiation a kind of mode at least wherein, and the electrical impedance value improving ink layer institute contact conductive layer is extremely non-conductive higher than more than at least 100 times of conductive layer original impedance value, make to be transformed into by the conductive layer that ink layer covers not have a non-conductive area of conductivity, the region not contacting ink layer relative to conductive layer on surface of bottom material then has conductivity, be able to thus form required conducting wire on ground.
2. the structure of electrically conducting transparent circuit as claimed in claim 1, is characterized in that, this internal conducting polymer at least comprises poly-3,4-vinyl dioxy base plug fens, one of them conducting polymer of pyrroles.
3. the structure of electrically conducting transparent circuit as claimed in claim 1, it is characterized in that, this ink layer is a kind of radiation hardening type ink, and this radiation comprises ultraviolet, visible ray and electron beam one of them.
4. the structure of electrically conducting transparent circuit as claimed in claim 1, it is characterized in that, the formation of this ink layer is with mode of printing or visualization way.
5. the structure of electrically conducting transparent circuit as claimed in claim 1, is characterized in that, this heat energy comprise hot blast and infrared ray one of them.
6. the structure of electrically conducting transparent circuit as claimed in claim 1, it is characterized in that, this ground comprise transparent PETG, Merlon, PEN, polyimides, cyclic olefine copolymer, acryl, coating and glass one of them.
7. the structure of electrically conducting transparent circuit as claimed in claim 1, is characterized in that, this ink layer and conductive layer wherein one of at least contain fluorescer, brightener and colorant one of them.
8. the structure of electrically conducting transparent circuit as claimed in claim 1, it is characterized in that, this conductive layer contains surfactant, and this surfactant is further containing UV absorbent and light stabilizer wherein at least one.
9. the structure of electrically conducting transparent circuit as claimed in claim 1, it is characterized in that, this conductive layer contains binding agent, this binding agent contain PU, polyester and acryl one of them.
10. the structure of electrically conducting transparent circuit as claimed in claim 1, is characterized in that, when the conducting polymer of this conductive layer is for poly-3,4-vinyl dioxy base plug fen, includes at least one polymeric acid further.
The structure of 11. electrically conducting transparent circuits as claimed in claim 1, is characterized in that, this conductive layer uses line rod method, roller rubbing method, slit examination rubbing method, method of spin coating, stitch thin rubbing method and spraying process wherein a kind of mode formed.
The structure of 12. electrically conducting transparent circuits as claimed in claim 1, is characterized in that, the original electrical resistance value of the conductive layer on the surface of this ground lower than 2,000 Ω/.
The structure of 13. electrically conducting transparent circuits as claimed in claim 1, it is characterized in that, this conductive layer includes couplant further.
The structure of 14. electrically conducting transparent circuits as claimed in claim 1, it is characterized in that, the visible ray penetrance of this conductive layer is more than 65%.
The manufacture method of 15. 1 kinds of electrically conducting transparent circuits, is characterized in that, comprises:
A) conductive layer that a conducting polymer coating is formed is coated in a surface of bottom material, and this conductive layer is solidified, this conducting polymer coating contains a kind of internal conducting polymer;
B) an available ink layer that liquid removed that removes with polar solvent characteristic is attached to the predetermined conductive layer surface not needing to conduct electricity, the conductive layer contacted is transformed into do not have the non-conductive region of conductivity to be present on ground with ink layer;
C) by aforementioned ink layer, by heat energy and radiation wherein at least a kind of mode make it accelerate to solidify, and make the electrical impedance value of ink layer raising institute contact conductive layer at least extremely non-conductive higher than more than 100 times of conductive layer original electrical resistance value, then there is conductivity relative to conductive layer area surface of bottom material not contacting ink layer; And
The liquid that removes d) by one with polar solvent characteristic removes above-mentioned ink layer, and conductive layers make contact forms non-conductive region to the region of ink layer, and the region that conductive layer does not contact with ink layer then forms the conducting wire of tool conductivity.
The manufacture method of 16. electrically conducting transparent circuits as claimed in claim 15, is characterized in that, this removes liquid and removes the conductive layer that ink layer contacts with ink layer simultaneously.
The manufacture method of 17. electrically conducting transparent circuits as claimed in claim 15, is characterized in that, this internal conducting polymer at least comprises poly-3,4-vinyl dioxy base plug fens, one of them conducting polymer of pyrroles.
The manufacture method of 18. electrically conducting transparent circuits as claimed in claim 15, is characterized in that, this ink layer is a kind of radiation hardening type ink, and this radiation comprises ultraviolet, visible ray and electron beam one of them.
The manufacture method of 19. electrically conducting transparent circuits as claimed in claim 15, it is characterized in that, the formation of this ink layer is with mode of printing or visualization way.
The manufacture method of 20. electrically conducting transparent circuits as claimed in claim 15, is characterized in that, this heat energy comprise hot blast and infrared ray one of them.
The manufacture method of 21. electrically conducting transparent circuits as claimed in claim 15, it is characterized in that, this ground comprise transparent PETG, Merlon, PEN, polyimides, cyclic olefine copolymer, acryl, coating and glass one of them.
The manufacture method of 22. electrically conducting transparent circuits as claimed in claim 15, is characterized in that, this ink layer and conductive layer wherein one of at least containing fluorescer, brightener and colorant one of them.
The manufacture method of 23. electrically conducting transparent circuits as claimed in claim 15, it is characterized in that, this conductive layer contains surfactant, and this surfactant is further containing UV absorbent and light stabilizer wherein at least one.
The manufacture method of 24. electrically conducting transparent circuits as claimed in claim 15, it is characterized in that, this conductive layer contains binding agent, this binding agent contain PU, polyester and acryl one of them.
The manufacture method of 25. electrically conducting transparent circuits as claimed in claim 15, is characterized in that, when the conducting polymer of this conductive layer is for poly-3,4-vinyl dioxy base plug fen, includes at least one polymeric acid further.
The manufacture method of 26. electrically conducting transparent circuits as claimed in claim 15, is characterized in that, this conductive layer uses line rod method, roller rubbing method, slit examination rubbing method, method of spin coating, stitch thin rubbing method and spraying process wherein a kind of mode formed.
The manufacture method of 27. electrically conducting transparent circuits as claimed in claim 15, is characterized in that, the original electrical resistance value of the conductive layer on the surface of this ground lower than 2,000 Ω/.
The manufacture method of 28. electrically conducting transparent circuits as claimed in claim 15, it is characterized in that, this conductive layer includes couplant further.
The manufacture method of 29. electrically conducting transparent circuits as claimed in claim 15, it is characterized in that, the visible ray penetrance of this conductive layer is more than 65%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110106193.5A CN102762026B (en) | 2011-04-27 | 2011-04-27 | Structure and manufacturing method of transparent conducting circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110106193.5A CN102762026B (en) | 2011-04-27 | 2011-04-27 | Structure and manufacturing method of transparent conducting circuit |
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| Publication Number | Publication Date |
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| CN102762026A CN102762026A (en) | 2012-10-31 |
| CN102762026B true CN102762026B (en) | 2015-03-18 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103613281A (en) * | 2013-11-01 | 2014-03-05 | 深圳市海富莱电子有限公司 | Graphical method capable of forming conductive function pattern and application |
| WO2015062068A1 (en) * | 2013-11-01 | 2015-05-07 | 深圳市海富莱电子有限公司 | Patterning method and application for forming conductive functional pattern |
| WO2016172315A1 (en) * | 2015-04-21 | 2016-10-27 | Chasm Technologies, Inc. | Transparent conductive film |
| CN105750155B (en) * | 2016-03-17 | 2019-01-08 | 深圳市尊宝精密光学有限公司 | A kind of UV transfer printing process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5976284A (en) * | 1995-11-22 | 1999-11-02 | The United States Of America As Represented By The Secretary Of The Navy | Patterned conducting polymer surfaces and process for preparing the same and devices containing the same |
| CN1843066A (en) * | 2003-08-26 | 2006-10-04 | 伊斯曼柯达公司 | Method of patterning an electroconductive layer on a support |
| CN1842543A (en) * | 2003-08-26 | 2006-10-04 | 伊斯曼柯达公司 | Photopatterning of conductive electrode layers containing electrically-conductive polymer particles |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6461680B2 (en) * | 1999-12-23 | 2002-10-08 | Nikon Corporation | Simplified fabrication method of toroidal charged particle deflector vanes |
| TWI268813B (en) * | 2002-04-24 | 2006-12-21 | Sipix Imaging Inc | Process for forming a patterned thin film conductive structure on a substrate |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5976284A (en) * | 1995-11-22 | 1999-11-02 | The United States Of America As Represented By The Secretary Of The Navy | Patterned conducting polymer surfaces and process for preparing the same and devices containing the same |
| CN1843066A (en) * | 2003-08-26 | 2006-10-04 | 伊斯曼柯达公司 | Method of patterning an electroconductive layer on a support |
| CN1842543A (en) * | 2003-08-26 | 2006-10-04 | 伊斯曼柯达公司 | Photopatterning of conductive electrode layers containing electrically-conductive polymer particles |
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