CN102869233A - Integrally-formed finned heat radiating device - Google Patents
Integrally-formed finned heat radiating device Download PDFInfo
- Publication number
- CN102869233A CN102869233A CN2011101984818A CN201110198481A CN102869233A CN 102869233 A CN102869233 A CN 102869233A CN 2011101984818 A CN2011101984818 A CN 2011101984818A CN 201110198481 A CN201110198481 A CN 201110198481A CN 102869233 A CN102869233 A CN 102869233A
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- China
- Prior art keywords
- heat abstractor
- electronic component
- fin heat
- fold
- bonding land
- Prior art date
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Abstract
The invention relates to an integrally-formed finned heat radiating device used for being mounted in a space-limited electronic device. When a platy connecting area of the finned heat radiating device is fixedly connected onto an electronic element through a connecting material, and the heat radiating area of the finned heat radiating device can be increased through multiple creases in crease areas horizontally extended from the two sides of the connecting area, so that the heat generated by the electronic element in the operating state can be effectively taken away. The connecting area and the crease areas are integrally formed through heat conducting metal, and the crease areas can be properly bent or deformed in order to coordinate with the element distribution at the periphery of the electronic element to be connected with the crease areas relative to the connecting area, so that the finned heat radiating device can be applicable to various occasions without being additionally processed.
Description
Technical field
The relevant a kind of heat abstractor of the present invention, espespecially a kind of one-body molded slimming heat abstractor for the slimming electronic product.
Background technology
For electronic component, for example display chip in the computer apparatus or microprocessor, the control chip in the flat-surface television, the chip of various functional module group ... Deng, when running, especially easily producing high temperature, this moment, radiator was just played the part of important role.Generally speaking, in the more unrestricted computer apparatus in space, radiator is the combination of many radiating fins, and the fan of arranging in pairs or groups, and with pressure the thermal source on the radiating fin is taken away.Yet be in the flat-panel screens (such as liquid crystal display, LCD TV, LCD TV etc.) of flattening in integral body, can't use the three-dimensional heat abstractor of normal operation in computer apparatus, the use radiator fan of also can't arranging in pairs or groups.So present in the electronic installation of limited space system, usually how direct on the electronic component of easy generation heat energy, directly paste the piece of metal conducting strip, so that the heat energy on the electronic component is taken away.Yet a sheet of metal conducting strip of this list is subject to the heat-conducting area that its size has, and heat-conducting effect is limited.
Description of drawings
Fig. 1 is the schematic diagram of disclosed integrated fin heat abstractor one first embodiment.
Fig. 2 is the side schematic view of the heat abstractor of Fig. 1.
Fig. 3 is the side schematic view that heat abstractor the first embodiment of Fig. 1 is fixed in an electronic component.
Fig. 4 is the side schematic view that heat abstractor one second embodiment is fixed in an electronic component.
The main element symbol description
1,2 fin heat abstractors, 10 bonding lands
21 first fold districts, 20 fold districts
22 second fold districts, 30 grafting materials
40 insulating trips, 50 electronic components
51 crystal grain, 60 circuit boards
211,221 fold L
1, L
2, D
1, D
2Direction
Summary of the invention
For addressing the above problem, the invention provides a kind of integrated heat abstractor, in the confined space, provide excellent radiating effect for the electronic component that generates heat.
The invention provides a kind of integrated fin heat abstractor, include a bonding land and a fold district.This bonding land is used for being fixed in the heat energy that an electronic component produces to conduct this electronic component, and this bonding land is for the laminated structure of extending along a horizontal direction and have a bonding area, and this bonding area is not less than the area of the crystal grain in this electronic component.Extend from the both sides of this bonding land along the axle with this horizontal direction parallel in this fold district, and the part in this fold district can produce a displacement and produce distortion with this axle.
Fin heat abstractor provided by the present invention under limited spatial limitation, has enough large area of dissipation compared to known sheet fin, and the heat energy that can effectively electronic component be produced when operating is taken away.Its integrated structure can be saved material cost and the processing cost of heat abstractor, and the laminated structure of slimming and fold district also can cooperate the element of the electronic component periphery that engages to distribute and suitable bending distortion, make heat abstractor not need other processing can be used in various occasions.
Embodiment
Please refer to Fig. 1 and Fig. 2, Fig. 1 is the schematic diagram of disclosed integrated fin heat abstractor the 1 one the first embodiment, and Fig. 2 is the side schematic view of fin heat abstractor 1.Fin heat abstractor 1 is used for the heat energy that conduction produces at the electronic component of running, to reach the effect of heat radiation.For reaching better radiating effect, fin heat abstractor 1 preferably is metal material copper or aluminium matter.In the present invention, fin heat abstractor 1 is by the copper sheet of thin type sheet or aluminium flake is one-body molded makes, and therefore only needs to carry out simple machining program, can save the material and the assembly cost that a plurality of sub-elements assemblings are fixed as a radiator.
As shown in Figure 1, fin heat abstractor 1 comprises a bonding land 10 and a fold district 20.Bonding land 10 is (such as the L among the figure along horizontal direction
1L
2The laminated structure of direction) extending, and bonding land 10 has bonding area A.In Fig. 2,20 in fold district along horizontal direction (such as the L among the figure
1L
2Direction) 10 the both sides horizontal-extending from the bonding land, and have a plurality of fold 211,221.These fold 211 of the present embodiment, 221 bending shape are the ㄇ font, and the pattern part of its bending is vertical with the horizontal direction of its extension, a part and horizontal direction parallel; And fold 211,221 kink height depend on the environment that fin heat abstractor 1 is installed.Since fold district 20 by 10 both sides, bonding land towards L
1L
2The laminated structure bending that direction is extended forms, therefore when fin heat abstractor 1 has specific size because of the environment of installing, a plurality of fold 211 that the fold district 20 of fin heat abstractor 1 has, 221 can increase the area of dissipation of fin heat abstractor 1 significantly, thereby the heat energy that more promptly electronic component is produced is taken away.
Please continue with reference to figure 2.In the first embodiment of the present invention, the fold district 20 of fin heat abstractor 1 comprises one first fold district 21 and one second fold district 22, wherein the first fold district 21 from the bonding land 10 1 sides along horizontal direction to L
1Direction is extended, the second fold district 22 from the bonding land 10 relative opposite sides along horizontal direction to L
2Direction is extended.Since the first fold district 21 and the second fold district 22 by 10 both sides, bonding land towards L
1L
2The laminated structure bending that direction is extended forms, and therefore a plurality of fold 211,221 in the first fold district 21 and the second fold district 22 have in fact identical thickness with bonding land 10.In the present invention, make the thin type sheet copper sheet of fin heat abstractor 1 or the thinner thickness of aluminium flake, therefore can allow fold district 20 with respect to bonding land 10 along vertical direction (or the D among the figure
1D
2Direction) slight movement and deformation.In other words, suppose that fold district 20 is along 10 both sides extending from the bonding land with an x axle of horizontal direction parallel, then the part in fold district 20 can produce a displacement and produce distortion with this x axle, so that fold district 20 cooperates the element of these electronic component peripheries to distribute, and vertically a little up or down distortion is (such as the first fold district 21 of showing with dotted line among Fig. 2 namely along D
1Direction is upwards distortion a little), to avoid interelement contact; For example, when fin heat abstractor 1 is installed on the electronic component that needs heat radiation, the fold district 20 of the 10 both sides (D that can optionally make progress a little in the bonding land
1Direction) or downwards (D
2Direction) bending distortion is to avoid other elements on it or under it.
In other embodiments of the invention, fold district 20 also can only comprise the first fold district 21 or the second fold district 22, that is the fold district 20 of fin heat abstractor 1 10 the wherein side horizontal-extending in the bonding land only, makes heat abstractor have more flexible application.
Please refer to Fig. 3, Fig. 3 is the side schematic view that fin heat abstractor 1 is fixed in an electronic component 50, and 50 in electronic component is an element that needs heat radiation wherein on the circuit board 60.In the embodiments of figure 3, fin heat abstractor 1 comprises a grafting material 30 in addition, and it can be double faced adhesive tape or thermosetting cement.Grafting material 30 is fixed in first on the bonding land 10, is pasted on the surface of electronic component 50 wishs heat radiation again, makes bonding land 10 be fixed in the heat energy that produces when operating with conduction electron element 50 on the electronic component 50.In electronic component 50, wherein the crystal grain 51 of being that it mainly produces heat energy, the bonding area A that therefore is engaged in the bonding land 10 on the electronic component 50 by grafting material 30 is not less than the area of crystal grain 51 (seeing through crystal grain 51 tops that grafting material 30 directly is contacted with electronic component 50) at least on practice.Preferably, the bonding area A of bonding land 10 can be contained the area of electronic component 50, with complete overlay electronic element 50, the heat of electronic component 50 all can be conducted via contact bonding land 10.In other words, the bonding area A among Fig. 1 is the area that grafting material 30 makes bonding land 10 and electronic component 50 Joints.What specify is, in the present invention, fin heat abstractor 1 is by bonding land 10 and electronic component 50 thermal contact conductances, and 20 in fold district is 10 outside horizontal-extendings and not contacting with electronic component 50 from the bonding land.
Please refer to Fig. 4, Fig. 4 is the side schematic view that fin heat abstractor the 2 one the second embodiment are fixed in electronic component 50.Wherein in the fold district of fin heat abstractor 2 20 1 sides (be a side of face circuit board 60 at Fig. 4) insulating trip 40 is set in addition, thus, can guarantee fin heat abstractor 2 when being fixed in electronic component 50, the fold district 20 that extends bonding land 10 is subject to the obstruct of insulating trip 40 and can contact with each other with other electronic component on the circuit board 60 and situation about being short-circuited.
Disclosed fin heat abstractor is used in the restricted electronic installation of installing space, when the sheet bonding land of fin heat abstractor is fixed on the electronic component by grafting material, the a plurality of fold that have from the horizontally extending fold in both sides, bonding land district can increase the area of dissipation of fin heat abstractor, and the heat energy that effectively electronic component is produced when operating is taken away.Make so that heat-conducting metal is one-body molded in bonding land and fold district, and the fold district can cooperate the element of the electronic component periphery that engages to distribute and the suitable bending distortion of relative bonding district generation, make fin heat abstractor not need other processing can be used in various occasions, and can effectively avoid interelement interference.
The above only is preferred embodiment of the present invention, and all equalizations of doing according to the present patent application claim change and modify, and all should belong to covering scope of the present invention.
Claims (10)
1. integrated fin heat abstractor includes:
One bonding land is used for being fixed in the heat energy that an electronic component produces to conduct this electronic component, and this bonding land is for the laminated structure of extending along a horizontal direction and have a bonding area, and this bonding area is not less than the area of the crystal grain in this electronic component; And
One fold district extend from the both sides of this bonding land along the axle with this horizontal direction parallel, and the part in this fold district can produce a displacement and produce distortion with this axle.
2. fin heat abstractor as claimed in claim 1, it is characterized in that, other comprises a grafting material, be arranged between this bonding land and this electronic component, so that this bonding land is fixed in this electronic component, this bonding area makes the area of this bonding land and this electronic component Joint for this grafting material.
3. fin heat abstractor as claimed in claim 2 is characterized in that, this grafting material is double faced adhesive tape or thermosetting cement.
4. fin heat abstractor as claimed in claim 1 is characterized in that, this bonding area is not less than the area of this electronic component.
5. fin heat abstractor as claimed in claim 1 is characterized in that, the laminated structure bending that this fold district is extended along this horizontal direction by these both sides, bonding land forms.
6. fin heat abstractor as claimed in claim 5 is characterized in that, this fin heat abstractor is by copper sheet or aluminium flake is one-body molded makes.
7. fin heat abstractor as claimed in claim 1 is characterized in that, other comprises an insulating trip, is arranged at this fold district one side, and with this electronic component homonymy.
8. fin heat abstractor as claimed in claim 1 is characterized in that, this fold district has a plurality of fold, and this bonding land has the identical thickness of essence with these a plurality of fold.
9. fin heat abstractor as claimed in claim 1 is characterized in that, this fold district does not contact this electronic component.
10. fin heat abstractor as claimed in claim 1 is characterized in that, the pattern of this fold district bending is the ㄇ font, and part is vertical with this horizontal direction, part and this horizontal direction parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110198481.8A CN102869233B (en) | 2011-07-04 | Integrated fin heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110198481.8A CN102869233B (en) | 2011-07-04 | Integrated fin heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102869233A true CN102869233A (en) | 2013-01-09 |
| CN102869233B CN102869233B (en) | 2016-12-14 |
Family
ID=
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5550326A (en) * | 1994-07-13 | 1996-08-27 | Parker-Hannifin Corporation | Heat dissipator for electronic components |
| US5829512A (en) * | 1995-08-29 | 1998-11-03 | Silicon Graphics, Inc. | Heatsink and method of forming a heatsink |
| US6208517B1 (en) * | 1999-09-10 | 2001-03-27 | Legerity, Inc. | Heat sink |
| US6728106B2 (en) * | 2001-03-16 | 2004-04-27 | Lg Electronics, Inc. | Heat dissipation structure of integrated circuit (IC) |
| CN101389201A (en) * | 2007-09-11 | 2009-03-18 | 李钧塘 | Elastic heat conducting and radiating device |
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5550326A (en) * | 1994-07-13 | 1996-08-27 | Parker-Hannifin Corporation | Heat dissipator for electronic components |
| US5829512A (en) * | 1995-08-29 | 1998-11-03 | Silicon Graphics, Inc. | Heatsink and method of forming a heatsink |
| US6208517B1 (en) * | 1999-09-10 | 2001-03-27 | Legerity, Inc. | Heat sink |
| US6728106B2 (en) * | 2001-03-16 | 2004-04-27 | Lg Electronics, Inc. | Heat dissipation structure of integrated circuit (IC) |
| CN101389201A (en) * | 2007-09-11 | 2009-03-18 | 李钧塘 | Elastic heat conducting and radiating device |
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| PB01 | Publication | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20190704 |
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| CF01 | Termination of patent right due to non-payment of annual fee |