CN102870213A - Epoxy coating on substrate for die attach - Google Patents

Epoxy coating on substrate for die attach Download PDF

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Publication number
CN102870213A
CN102870213A CN2011800048240A CN201180004824A CN102870213A CN 102870213 A CN102870213 A CN 102870213A CN 2011800048240 A CN2011800048240 A CN 2011800048240A CN 201180004824 A CN201180004824 A CN 201180004824A CN 102870213 A CN102870213 A CN 102870213A
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CN
China
Prior art keywords
window
substrate
epoxy
naked core
clamping plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800048240A
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Chinese (zh)
Inventor
顾伟
吕忠
S.巴加思
邱进添
H.塔基亚
刘向阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SanDisk SemiConductor Shanghai Co Ltd
SanDisk Information Technology Shanghai Co Ltd
Original Assignee
SanDisk SemiConductor Shanghai Co Ltd
SanDisk Information Technology Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/CN2011/073688 external-priority patent/WO2012149686A1/en
Application filed by SanDisk SemiConductor Shanghai Co Ltd, SanDisk Information Technology Shanghai Co Ltd filed Critical SanDisk SemiConductor Shanghai Co Ltd
Priority to CN201710689572.9A priority Critical patent/CN107481947A/en
Priority to CN2011800048240A priority patent/CN102870213A/en
Publication of CN102870213A publication Critical patent/CN102870213A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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Abstract

A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp.

Description

Be used for the suprabasil epoxy coating that naked core is installed
Technical field
Present technique relates to the manufacturing of semiconductor device.
Background technology
The fast development of portable consumer electronic device demand promotes the demand of high capacity storage device.Nonvolatile semiconductor memory device such as flash-storing card is just becoming the needs that are widely used in the development that satisfies digital information storage and exchange.Their portability, multifunctionality and robust design, be accompanied by their high reliability and large capacity, made such storage device be used for ideally the electronic installation of broad variety, described electronic installation for example comprises digital camera, digital music player, electronic game machine, PDA and mobile phone.
Semiconductor storage typically comprises substrate, and such as printed circuit board (PCB), this printed circuit board (PCB) is etched to comprise the conductive pattern with contact pad and electric trace.A lot of semiconductor naked cores are formed on the semiconductor wafer together, and then are independent semiconductor naked core by section.Then one or more semiconductor naked cores are engaged to substrate, and form between the contact pad of the naked core bond pads on the one or more semiconductor naked cores and substrate and be electrically connected.Then signal can transmit between one or more semiconductor naked cores and outside main device by conductive pattern.
Naked core is installed film (DAF) and typically is used for the semiconductor naked core is engaged to substrate.Typically, before the independent semiconductor naked core of cutting into slices, DAF is bonded to the back side (non-validity) of whole semiconductor chip.Then slicing band is applied on the DAF, after section each naked core is kept together.After applying DAF and slicing band, chip can be cut, and for example uses cast-cutting saw.In cutting process, can produce the problem such as DAF burr (burring) or grappling effect (anchor effect).The grappling effect at DAF by the nip phenomenon of slicing band of the DAF of blade cuts place.The anchoring effect of DAF can be increased in the load that the naked core after the section picks up, and can cause naked core to damage and pick up fault.
Description of drawings
Fig. 1 is the flow chart that is used to form according to the semiconductor naked core of the embodiment of native system.
Fig. 2 is the vertical view of semiconductor wafer, can make a plurality of semiconductor naked cores according to the embodiment of native system from this semiconductor wafer.
Fig. 3 is the vertical view from the amplification of the semiconductor naked core of the wafer of Fig. 2.
Fig. 4 is for making the flow chart that is used for the native system substrate and uses substrate and semiconductor naked core mounting semiconductor.
Fig. 5 is for showing the flow chart of the further details of the step of naked core installation epoxy among Fig. 4.
Fig. 6 is the vertical view according to the substrate panel of present technique.
Fig. 7 is the vertical view of the amplification of the substrate in the substrate panel among Fig. 6.
Fig. 8 is the vertical view according to the window clamping plate of the embodiment of native system.
Fig. 9 is for being placed in shower nozzle on the substrate panel and the vertical view of window clamping plate according to present technique.
Figure 10 is for being placed in shower nozzle on the substrate panel and the stereogram of window clamping plate according to present technique
Figure 11 is for being placed in shower nozzle on the substrate panel and the edge view of window clamping plate according to present technique.
Figure 12 is the stereogram that is placed in shower nozzle, window clamping plate and cleaning follower on the substrate panel according to present technique.
Figure 13 is the edge view of window cleaning mechanism of sidewall that is arranged as the window of clean window clamping plate.
Figure 14 is the edge view of window cleaning mechanism when the sidewall of the window of clean window clamping plate.
Figure 15 is the edge view according to the semiconductor package body of present technique.
Figure 16 shows the window clamping plate according to alternative embodiment of the present invention.
Figure 17-22 is at the different structure according to the window in the window clamping plate of present technique.
Embodiment
Now, describe embodiment with reference to Fig. 1 to 22, this embodiment is relevant with semiconductor device, and this semiconductor device comprises the semiconductor naked core that engages with substrate by the epoxy layer that puts on the substrate panel.It should be understood that can be the much different form of the present invention implements, be limited to embodiment set forth herein and should not be construed as.But, provide these embodiment so that describedly disclose thoroughly and complete, and the present invention exchanged all sidedly to those skilled in the art.Certainly, the present invention is intended to cover replacement, modification and the equivalent of these embodiment, and it is included in the scope and spirit of the present invention of claims restriction.In addition, in the detailed description of the present invention below, a lot of details have been set forth, in order to thorough understanding of the present invention is provided.Yet those of ordinary skill in the art should be understood that the detail that the present invention can be such and realizes.
Here the term " top " that adopts, " end ", " on ", D score, " vertical " and/or " level " only be purpose convenient and that illustrate, and do not mean that the restriction description of the invention, because the commutative position of the project of indication.
The forming process of the semiconductor naked core that is used for native system is described with reference to the vertical view of the flow chart of Fig. 1 and Fig. 2 and 3 now.Fig. 2 shows the vertical view of semiconductor wafer 100, and it is used for a plurality of semiconductor naked core of batch machining 102(, and one of them marks at Fig. 2).Fig. 3 shows single semiconductor naked core 102, and it is obtained by above-mentioned wafer 100 sections.Can be by form the integrated circuit package (components) of semiconductor naked core 102 at wafer 100 such as the already known processes of deposited film, photoetching, composition (patterning) and Impurity Diffusion (diffusion of impurities) in step 200.In an embodiment, naked core 102 can be the memory naked core, for example the nand flash memory naked core.Yet naked core 102 can be the semiconductor naked core of other types in a further embodiment, such as NOR as an example, and DRAM and various other memory naked core.
The formation of integrated circuit can comprise the naked core bond pads 104(that forms by already known processes, and one of them marks in Fig. 3) formation, this already known processes includes but not limited to plating, evaporation, silk screen printing (screen printing) or various depositing operation.Bond pads 104 is for the semiconductor naked core that semiconductor naked core 102 is electrically connected to other, or printed circuit board (PCB), lead frame or other substrates of hereinafter describing.Bond pads 104 shown in Figure 3 only is the purpose of explanation, and along the marginal existence of naked core 102 than shown in Figure 3 more manying or few bond pads.And, when bond pads 104 is shown as along two edges, can provide in a further embodiment the bond pads 104 along one, three or four edge.
In step 204, the end face (effectively) that comprises the wafer 100 of integrated circuit is applied in band for grinding back surface technique.In step 206, the surface that applies band can be supported on the chuck, and can in the back side of wafer 100 (non-effective) execution grinding back surface technique, make as known in the art naked core 102 be thinned to the thickness of expectation.In step 210, the naked core 102 on the wafer 100 can be tested because of functional defect.This test comprises for example wafer final test, the sorting of electronics naked core and circuit probe.
In step 212, wafer can transmit from the grinding back surface chuck, and slicing band can put on the non-effective surface of wafer 100.In step 216, the back side of naked core can be supported on the chuck, and each naked core 102 can be obtained by wafer slice.Slice process can relate to first group of perpendicular cuts (by the stereogram of Fig. 2 and 3) and second group of horizontal resection stereogram of Fig. 2 and 3 (again by), first group of perpendicular cuts is along the edge between the adjacent naked core 102, and second group of horizontal resection is along the edge between the adjacent naked core 102.In the embodiment that replaces, but executive level cutting before perpendicular cuts.Can carry out slicing step by cutting blade or by laser.Finish on the basis of slicing step, can pick up and settle naked core in substrate, as described below.Because do not have the DAF band to be applied on the wafer 100, can avoid the difficult point relevant with DAF burr (burring).
The flow chart of Figure 4 and 5 shows the step that forms the substrate panel and semiconductor naked core 102 is installed at the substrate panel according to native system.Fig. 6 shows the vertical view of substrate panel 110, and substrate panel 110 comprises a plurality of substrate 112(, and one of them is numbered in Fig. 6).In the example that illustrates hereinafter and describe, substrate 112 for example can be printed circuit board (PCB) (PCB), but in a further embodiment, substrate can be lead frame or band carries automatically joint (TAB) band.The formation of single substrate 112 has below been described.It should be understood that the following description occurs in each substrate of panel 110.
Each substrate 112 can be formed by the nuclear core with top and/or end conductive layer.This nuclear core can be formed by various dielectric materials (for example polyimide laminates, the epoxy resin that comprises FR4 and FR5, bismaleimide-triazine resin (BT) etc.).Although unimportant to the present invention, examine core and can have thickness between 40 microns (μ m) to 200 microns (μ m), and can outside this scope, change at the thickness of alternative embodiment center core.Can be pottery or organic at alternative embodiment center core.
Can be formed by copper or copper alloy, copper facing or copper-beryllium, copper facing iron or other metal and the material that becomes known for the substrate panel at the conductive layer of nuclear around the core.Conductive layer can have the thickness of about 10 μ m to 25 μ m, but the thickness of this layer can change outside this scope in alternative embodiment.
In step 220, one or two conductive layer on the nuclear core can be etched to conductive pattern (conductance pattern), known this conductive pattern is used for passing on signal between semiconductor naked core 102 and external device (ED) (not shown).Etched conductive pattern can be included in electric trace 116 and the contact pad 120 on the upper surface of substrate 112.As is known, also can provide via hole (vias) 124, be used for signal is conveyed to the different layer of substrate 112.When semiconductor device was land grid array (LGA) encapsulation, the contact finger (not shown) also can be defined on the lower surface of substrate 112.Personnel are known such as the art, can apply solder mask on the top and bottom surface of substrate 112, and contact pad 116 and/or contact finger can be coated with one or more gold layers, for example in electroplating technology.
In step 224, surface mount component can be soldered to the contact pad 120 of substrate 112.Surface mount component can comprise the passive device such as resistance, electric capacity and/or inductance.Scolder refluxes in known reflux technique in step 228.
In step 230, naked core is installed epoxy layer and can be sprayed in each substrate 112 on the panel 120.Further details with reference to the different views description of step 230 of the flow chart of figure 5 and Fig. 8 to 22.In step 270, substrate panel 110 is placed on the platform that sprays in the epoxy position.In step 274, window clamping plate (window clamp) 130 are placed on the substrate panel.Fig. 8 to 11 shows the example of window clamping plate 130.The window clamping plate can be formed by the metal of for example stainless steel (grade 440C), yet also can use the material of other rigidity.Window clamping plate 130 can comprise window part 132, and it has flange 134 and 136(Fig. 8 and 11 in both sides).Window part 132 can comprise a plurality of windows 138, and it is the opening that is formed in the clamping plate 130 and passes completely through clamping plate 130.
In an embodiment, single-row window 138 can be arranged in the window part 132, and the quantity of window 138 can with panel 110 on the quantity Matching of a row substrate 112.In an illustrated embodiment, on panel 110, one show four substrates 112, and at window clamping plate 130 four windows 138 are arranged.It should be understood that the row on panel 110 can have more or less substrate 112, and at window clamping plate 130 corresponding more or less window 138 is arranged.The quantity that should further be appreciated that the substrate 112 that has of row on panel 110 is compared with the quantity of a row window 138 that has at clamping plate 130 can be greater or lesser.And, as described below, on clamping plate 130, multiple row window 138 can be arranged, with panel 110 on the quantity of row of substrate 112, or the quantity Matching of part row.
In an embodiment, following explanation, the size and dimension of each window 138 is identical with the size and dimension of wanting to be installed on the semiconductor naked core 102 in the substrate 112.The length of window 138 and width are corresponding with any length and the width of spendable naked core 102.The orientation of window is identical with the orientation of naked core 102 on will being installed on substrate 112.Each window 138 is a spaced segment distance approx, and this distance is corresponding with the position of the semiconductor naked core 102 of wanting to be installed on a row substrate 112.
In an embodiment, each window 138 is limited by the sidewall perpendicular to the primary flat of window part 132.The thickness at window 138 of window part 132 can for example be 0.4mm.It should be understood that in a further embodiment the angle of the sidewall between the primary flat of window part 132 can be less than or greater than 90 °.In such an embodiment, the size of window 138 is corresponding with the size of naked core 102, and this naked core 102 is on the lower surface of the upper surface of window part 132 or window part 132.
In step 274, window clamping plate 130 are aimed at substrate panel 110.For example, in the beginning of epoxy spraying coating process, as shown in Figure 9, can be in the first row on the panel 110 (Far Left) substrate 112 alignment windows clamping plate 130.In step 278, then liquid epoxy is sprayed in the substrate by window 138.Window clamping plate 130 cover the substrate panel, so that epoxy is sprayed in the row substrate 112, only cover the zone that will receive semiconductor naked core 102 of each substrate.In case apply in the substrate of epoxy to row by window 138, then window clamping plate 130 can move with respect to the substrate panel, so that these window clamping plate 130 are placed in the next column substrate, and then liquid epoxy is sprayed at next substrate and lists.It should be understood that spraying coating process is not must be from the leftmost row of the substrate 112 on the panel 110, and when applying liquid epoxy in the listing of substrate 112, can any order carry out.
In an embodiment, it is static that substrate panel 110 can keep during window clamping plate 130 move, and perhaps keeps quiescent period substrate panel 110 removable at window clamping plate 130.Can repeat this technique until liquid epoxy is applied in each substrate 112 on the panel 110.
By comprising the multiple alignment scheme of optical alignment scheme, the position of the expection that window clamping plate 130 can be in substrate 110 is aimed at.In the embodiment of optical alignment, can use reflector and receiver, in substrate panel 110 and at window clamping plate 130, to find to be used for indicating datum hole and/or the reference mark of when aiming at panel and clamping plate.Additionally or alternatively, can use camera or other imaging devices, its move to help panel and clamping plate on time, camera or other imaging device imaging substrate panel 110 and/or window clamping plate 130.
In an embodiment, window clamping plate 130 can be supported by a pair of fixture (not shown) of joint flange 134,136.Shown in the example among Figure 11, flange 134,136 vertically is offset from window part 132.Therefore, fixture can be caught flange 134,136 in the above and below of flange, so that window clamping plate 130 are fixed on the support.In a further embodiment, support can only be engaged in the below of flange 134,136, and window clamping plate 130 then are supported on the fixture owing to gravity.Fixture can be supported translation, with respect to substrate panel 110 along x-direction (Fig. 9) moving window clamping plate 130.In a further embodiment, fixture is used in the translation of the both direction of x-direction and y-direction.
The vertical skew from window part 132 of flange 134,136 allows in window part 132 is flat window clamping plate 130 supported and/or translations when leaning against on the substrate panel 110.In an embodiment, during the technique of spraying epoxy, window part 132 can lean against on the substrate panel 110 with flushing or window part 132 can separate slightly with substrate panel 110.
Figure 10 and 11 shows the shower nozzle 140 that also passes through window 138 on the window clamping plate 130 for epoxy 144 is put on.Shower nozzle can be known being used for and applies liquid epoxy fluid distributor gear, for example by Nordson Asymtek, and Carlsbad, California, USA provides.Also can use the shower nozzle from other manufacturers.The type of spendable epoxy is from Henkel AG﹠amp; Co.KGaA(general headquarters are in the Dusseldorf, Germany) Ablestik WBC-8988UV naked core epoxy is installed.Also can use the epoxy of other types.
The A-state liquid that epoxy 144 can be used as from shower nozzle 140 is applied in.As described below, epoxy can experience subsequently UV and/or heat take cured epoxy as one or more middle B-states, and is completely crued C-state finally then.When being applied in as A-state liquid, epoxy 144 can have 1000 to 10000cP viscosity at 5rpm, and shower nozzle 140 maintains 60 ℃ temperature.It should be understood that these parameters only are the mode of example, and each changeable parameters in a further embodiment.Epoxy can be sprayed in the substrate 112 by window 138, and to having large thickness between 5 μ m to 50 μ m, still this thickness can be the upper of this scope or lower the variation in a further embodiment.
As shown in Figures 9 and 10, shower nozzle 140 can move around in the y-direction, to apply epoxy by each window 138, and every next window.Shower nozzle 140 can move up and down along row.At least the size (this size is transverse to the direct of travel of shower nozzle 140) with corresponding window 138 is identical in the diameter d (Figure 11) of the epoxy of the surface spraying of window part 132, is applied on the whole zone of each window 138 to guarantee epoxy.In an illustrated embodiment, along with shower nozzle is mobile along row in the y-direction, apply spraying epoxy 144 in a window at every turn.Yet, can consider to apply simultaneously epoxy 144 in the window more than.
Above-described embodiment relates to the window clamping plate, and these window clamping plate have the window that is arranged as row, with the substrate panel on row substrate coupling.In alternative embodiment, the window clamping plate can have the window that is arranged as delegation, with the substrate panel on delegation substrate coupling.
When shower nozzle moved along the row of the window 138 in the window part 132, the epoxy of spraying can be deposited between the window 138 on the window part 132 and around it.As time goes on, this accumulation of epoxy can affect applying of epoxy by window 138.Therefore, in one embodiment, the removable epoxy 144 that is sprayed on the window part 132 of native system in step 280.Be illustrated and be described hereinafter at Figure 12 for the mechanism that removes epoxy 144.
Figure 12 shows window clamping plate 130 and spraying epoxy 144 shower nozzle 140 to the clamping plate 130.Figure 12 further shows cleaning follower (clean-up follower) 150, is used for removing the epoxy 144 that is sprayed on window 138 clamping plate on every side.Cleaning follower 150 comprises a pair roller 154a, 154b, in order to rotate, its be supported on two pairs of each centerings of axle 158(only an axle 158 be visible in Figure 12; Second axle of each centering can be at roller 154a, opposite end upper support roller 154a, the 154b of 154b) on.The upper end (not shown) of cleaning follower 150 can have for the base portion that supports two pairs of axles 158, and comprises the fabric feeder of drive motors, is used for centering on roller 154a, and 154b supplies with fabric 160.For example, drive motors can drive fabric 160 in the z-direction around the roller 154b of back, and the roller 154a that then crosses the front drives fabric 160 in opposite direction.Fabric on the top of cleaning follower 150 feeds device self and can comprise a pair roller, supplies with roller (being used for supplying with the clean part of fabric 160 down to roller 154b) and rolls tightly roller (being used for reception from the used part (comprising the epoxy that removes) of the fabric 160 of roller 154a).
When shower nozzle 140 moved along the row of window 138, the base portion of cleaning follower 150 can be supported translation, or follows shower nozzle 140.Cleaning follower 150 can for example be installed to along the y-direction and moves on the same translation mechanism of shower nozzle, perhaps cleans follower 150 and can be installed on the translation mechanism different from shower nozzle 140.Shower nozzle 140 can spray epoxy to the edge 130a of window clamping plate 130, and shower nozzle stops spraying thereon, but shower nozzle can continue in the translation of y-direction, arrives the also edge 130a of clean window clamping plate 130 to allow cleaning follower 150.
In an embodiment, fabric 160 can be absorbefacient fabric.Back shaft 158 positioning roller 154a, 154b and window part 132 surperficial adjacent is so that the surface of fabric 160 contact window part 132 when its translation, to absorb and to remove the epoxy that is sprayed on the window part 132.
It should be understood that cleaning follower 150 can have other structure of wide range of types, be used for driving fabric to remove the epoxy that is sprayed on the window part 132 on the surface of window part 132.In alternative embodiment, the cleaning follower can comprise single roller 154.Can consider other mechanism.And, in a further embodiment, can omit cleaning follower 150 fully.In such an embodiment, but window clamping plate 130 periodic variations, to avoid the extra accumulation at the lip-deep epoxy of window clamping plate 130.
Fig. 9 show window clamping plate 130 and applied epoxy 144 to substrate 112 about 2/3rds on shower nozzle 140(for clear, omitted cleaning follower 150).In case A-state liquid epoxy 144 is applied in all substrates 112 on the panel 110, panel 110 can be moved into partly solidified position in step 282, with cured epoxy 144 to B-states partly.This partly solidified step is avoided the diffusion of epoxy, but still allows epoxy that the semiconductor naked core is received and be engaged to (as hereinafter illustrated) in the substrate.Curing schedule 282 can be the UV curing schedule, but can be in a further embodiment the step that is heating and curing.
When cleaning follower 150 can remove epoxy from the upper surface of window clamping plate 130, epoxy also can be piled up at the sidewall of window 138.Therefore, in an embodiment, can periodically carry out window cleaning 286.Figure 13 and 14 shows the example of window cleaning mechanism 164, and it is included in supplies with roller 170 and roll tightly the fabric 168 that connects between the roller 172.Can drive by the motor (not shown) and roll tightly roller 172, with the direction moving fabric 168 between roller 170,172 at arrow a.
When window clamping plate 130 separate with substrate panel 110 (in the same instrument of spraying epoxy 144, or in different instruments), but the window 138 of window cleaning mechanism 164 clean window clamping plate 130.Window cleaning mechanism 164 further comprises piston 180, and it is formed has the size and dimension that is similar to window 138.Piston 180 can be slightly less than window 138, thinks at the sidewall of window 138 and the fabric leaving space between the piston 180.
In operation, window clamping plate 130 can be supported on the window cleaning mechanism 164, and window 138 is aligned on the piston 180 simultaneously.Then the driven plunger that can make progress, by the window 138 of aiming at, so fabric 168 is pushed upwardly through window.The sidewall contact of fabric 168 and window is to absorb and to remove the epoxy that can be deposited on the sidewall.Then removable piston, moving window clamping plate 130 with next window 138(will be cleaned on piston 180) aim at, and repeat continuously this technique until each window 138 is cleaned.Can periodically carry out this operation, for example apply epoxy 144 to whole panel 110 after.Also can after the substrate that applies the one or more row of epoxy to panel 110, carry out this step.In a further embodiment, also can other interval carry out this step.And, in a further embodiment, can omit window cleaning mechanism 164 fully.In such an embodiment, but window clamping plate 130 periodic variations, to avoid the excessive accumulation of the epoxy in the sidewall of window 138.
Now, be back to the flow chart of Fig. 4, after aforesaid naked core installation epoxy was applied in, in step 234, naked core 102 can be mounted to each substrate 112, on the top of B-state epoxy 144.In step 236, carry out the further curing that naked core is installed epoxy 144.In an embodiment, this curing can be the intermediate solidification that enough semiconductor naked core 102 is engaged in position, but still is not the C-state.The step 236 of further solidifying in a further embodiment, can be epoxy 144 is cured to final C-state fully.When epoxy is partly solidified and when not reaching the C-state, can be 90 ℃ and time to be to carry out curing schedule 236 in 30 minutes the heating process in temperature.It should be understood that in a further embodiment this temperature and duration can change.When epoxy is cured to the C-state fully, can be 175 ℃ and time to be to carry out curing schedule 236 in 2 hours the heating process in temperature.It should be understood that in a further embodiment this temperature and duration can change.
In step 240, by being connected to naked core bond pads 104 on the naked core 102 and the conductor wire between the contact pad 120 in the substrate 112, but naked core 102 Bondings are to substrate 112.Can consider at the top of naked core 102 one or more extra naked cores to be installed.When extra naked core is installed, also can be with these naked core Bondings to substrate in step 240.Figure 15 shows naked core 102 by the edge view of Bonding 182 Bondings to substrate 112.Controller naked core 184 also can be installed on the top of naked core lamination, and in step 240 Bonding to substrate.Controller naked core 184 can for example be ASIC, but can be in a further embodiment other controller naked core.
In step 242, the naked core 102 on the lamination and any extra naked core by Bonding to substrate 112, naked core is stacked in the step 242 and can be encapsulated in the moulding compound 188.Moulding compound 188 can be known epoxy resin such as obtaining from Sumitomo company and Nitto Denko company (the two all is provided with parent company in Japan).
As above indicated, in step 236, after being installed on naked core 102 in the substrate 112, epoxy 144 can only partly solidify.If so, after encapsulation step 242, can carry out final curing schedule 244, so that part to be set at it epoxy 144 is cured to C-state epoxy fully.When having carried out earlier the completely curing of C-state epoxy in step 236, step 244 can be omitted.
In step 248, encapsulation with solidify after device can then separate with the substrate panel, the semiconductor device 190(that finishes with formation is as shown in figure 15).In step 250, can check and test the semiconductor device 190 of finishing.In certain embodiments, the semiconductor device 190 of finishing in step 252 optionally encapsulates to advance in the lid.
Above-mentioned window clamping plate 130 can comprise single-row window 138.As described, alternatively, can have more than a row window 138, embodiment as shown in Figure 16.In the embodiment of Figure 16, window clamping plate 130 have the array of four row windows 138.When using substrate panel 110 shown in Figure 6, panel can be placed in first group of 16 substrate on the left side (or vice versa), and when clamping plate 130 maintenances are static all 16 can be coated with upper epoxy.Then clamping plate 130 can move in second group of 16 substrate on the right (or vice versa), and second group can be applied.Can consider that columns that window clamping plate 130 have can be identical with the number of substrate row on the panel 110.In these embodiments, the window in each row and the position alignment that epoxy is applied to each substrate.
Figure 17-22 shows the different embodiment of window 138, can be provided on the window clamping plate 130.Figure 17 shows the above embodiments, and window 138 is installed on the epoxy 144 that applies by window 138 with semiconductor naked core 102() overall size, shape and direction coupling.(for the sake of clarity, in each figure of Figure 17-22, semiconductor naked core 102 is shown in broken lines).In Figure 18, window 138 is less than naked core 102 on length and width, causes than circlet oxygen zone, naked core zone.The shape of window 138 is not to be necessary for rectangle.In an embodiment, window 138 can be circle, and is avette or oval.In the embodiment of Figure 18, the bight is shown as rounding.
In Figure 19, window 138 has the length less than naked core 102, and in Figure 20, and window 138 has the width less than naked core 102.
Until herein, described window 138 has single opening, and it is not to be necessary for so in a further embodiment.Figure 21 has illustrated that the opening of window 138 is the embodiment of diagonal slits.This can cause the bar of epoxy 144 to be applied in the substrate 112 of naked core 102 belows.Slit can be vertical or level in a further embodiment.Figure 22 has illustrated that the opening of window 138 is the embodiment in the hole of circle.This can cause the circle of epoxy 144 to be applied in the substrate 112 of naked core 102 belows.Can consider other structures of window 138.
In an embodiment, semiconductor naked core 102 can be one or more flash chips, and therefore, in conjunction with controller naked core 184, device 190 can be used as flash memory device.Be understood that device 190 can comprise the semiconductor naked core that is configured to carry out other functions in the further embodiment of native system.Device 190 can be used in a plurality of memory card, and this memory card includes but not limited to compact flash (CompactFlash card), smart media (SmartMedia) card, memory stick, safe digital card, mini SD(miniSD) card, little SD(microSD) card, USB storage card etc.
Generally speaking, in an embodiment, present technique relates to a kind of substrate panel, and this substrate panel comprises: a plurality of substrates; With a plurality of zone of dispersions that apply naked core installation epoxy, this zone does not have suprabasil semiconductor naked core.
In a further embodiment, present technique relates to the system that is used to form the substrate panel, and this system comprises: have the panel of a plurality of substrates, each substrate comprises for the zone that receives the semiconductor naked core; With the window clamping plate, it can be received on the panel, and comprises one or more windows, is applied to the zone that receives the semiconductor naked core in the substrate by this window epoxy.
In another embodiment, present technique relates to the method for making the semiconductor panel, and the method includes the steps of: (a) limit a plurality of substrates at panel, each substrate comprises conductive pattern and is used for receiving the zone of semiconductor naked core; And (b) apply liquid epoxy in the zone that be used for to receive the semiconductor naked core of each substrate.
In yet another embodiment, present technique relates to the method for making semiconductor device, and the method includes the steps of: (a) limit a plurality of substrates at panel, each substrate comprises conductive pattern and is used for receiving the zone of semiconductor naked core; (b) settle the window clamping plate at least a portion of substrate panel, the window clamping plate comprise in row and the delegation's window one of at least; (c) by the zone that be used for receive semiconductor naked core of at least one column or row window spraying liquid epoxy to substrate; And (d) at the zone of substrate installation semiconductor naked core, this zone receives described liquid epoxy in described step (c).
The front is described in detail the present invention for the purpose that illustrates and illustrate.It does not mean that is exhaustive or limits the invention to disclosed precise forms.According to top instruction, many modifications and variations all are possible.Described embodiment is chosen as the principle that the present invention and practical application thereof are described best, during with actual uses therefore considered being suitable for, can make other technical staff utilize better among the various embodiment the present invention with various modifications.Scope of the present invention is intended to defined by the appended claims.

Claims (28)

1. substrate panel comprises:
A plurality of substrates; And
A plurality of zone of dispersions that apply naked core installation epoxy, this zone does not have described suprabasil semiconductor naked core.
2. substrate panel according to claim 1 wherein applies size and dimension and the size and dimension coupling of wanting to be installed on the semiconductor naked core on the described substrate panel that described naked core is installed the zone of dispersion of epoxy.
3. substrate panel according to claim 1 wherein applies described naked core and the size and dimension of zone of dispersion of epoxy is installed less than the size and dimension of wanting to be installed on the semiconductor naked core on the described substrate panel.
4. system that forms the substrate panel comprises:
Panel with a plurality of substrates, each described substrate comprise for the zone that receives the semiconductor naked core; And
The window clamping plate, described window clamping plate can be received on the described panel, and comprise one or more windows, are applied to the described zone that receives the semiconductor naked core in the described substrate by this window epoxy.
5. system according to claim 4, wherein said one or more window is a row window, quantity and the location matches of the row substrate on this row window and the described panel.
6. system according to claim 5, it is corresponding that a wherein said row window and being used in a row substrate receive size, shape and the position in zone of semiconductor naked core.
7. system according to claim 4, wherein said one or more window is delegation's window, quantity and the location matches of the delegation's substrate on this delegation's window and the described panel.
8. system according to claim 7, it is corresponding that wherein said delegation window and being used in delegation's substrate receive size, shape and the position in zone of semiconductor naked core.
9. system according to claim 4, wherein said one or more window comprises the multiple row of window and the array of multirow, quantity and the location matches of the columns and rows of a plurality of substrates on the columns and rows of this window array and the described panel.
10. system according to claim 4 further comprises the cleaning follower, removes for the epoxy that will put on described window clamping plate.
11. system according to claim 10, described cleaning follower comprises fabric, and the described window clamping plate of this clothing in contact put on the epoxy of described window clamping plate with absorption.
12. system according to claim 10 further comprises the window cleaning mechanism, for the epoxy of the sidewall that removes the one or more window that puts on described window clamping plate.
13. system according to claim 4 further comprises shower nozzle, is used for applying liquid epoxy by described one or more window.
14. system according to claim 13, wherein said shower nozzle is installed as row or the delegation's window translation in the described window clamping plate.
15. the method for the manufacture of the semiconductor panel comprises following steps:
(a) limit a plurality of substrates at described panel, each substrate has conductive pattern and is used for receiving the zone of semiconductor naked core; And
(b) apply liquid epoxy in the described zone for receiving the semiconductor naked core of each substrate.
16. method according to claim 15 further comprises the step of covering the part outside described suprabasil described zone for receiving the semiconductor naked core, puts on the described part of described substrate to prevent liquid epoxy.
17. method according to claim 15, described step (b) comprise the step of using the window clamping plate with window, epoxy is by this window spraying.
18. method according to claim 17 further comprises the step (d) that removes the epoxy that puts on described window clamping plate.
19. method according to claim 15, further be included in described step (b) afterwards partly solidified epoxy be the step (e) of B-state epoxy.
20. comprising, method according to claim 15, described step (b) apply simultaneously described epoxy in the step of the whole row of substrate.
21. comprising, method according to claim 15, described step (b) apply simultaneously described epoxy in the step of the whole row of substrate.
22. comprising, method according to claim 15, described step (b) apply simultaneously described epoxy in the step of the array of multiple row and multirow.
23. a method of making semiconductor device comprises following steps:
(a) limit a plurality of substrates at described panel, each substrate comprises conductive pattern and is used for receiving the zone of semiconductor naked core;
(b) settle the window clamping plate at least a portion of described substrate panel, described window clamping plate comprise in row and the delegation's window one of at least;
(c) by the described zone for receive semiconductor naked core of described at least one column or row window spraying liquid epoxy to described substrate; And
(d) in the described zone of described substrate the semiconductor naked core is installed, described zone receives described liquid epoxy in described step (c).
24. method according to claim 23 further comprises the step for the part outside the zone that receives described semiconductor naked core that described window clamping plate cover described substrate, puts on the described part of described substrate to prevent liquid epoxy.
25. method according to claim 23 further comprises the step (e) that removes the epoxy that puts on described window clamping plate.
26. method according to claim 23 further is included in the step (f) that described step (d) before the partly solidified described epoxy of semiconductor naked core on the described zone of described substrate is installed.
27. method according to claim 26 further is included in the step (g) that the described step (d) of semiconductor naked core on the described zone of the described substrate described epoxy of further curing afterwards is installed.
28. method according to claim 23, described step (c) comprise the shower nozzle of a described epoxy of mobile spraying in the described column or row, spray described epoxy with the window by described column or row.
CN2011800048240A 2011-05-05 2011-10-14 Epoxy coating on substrate for die attach Pending CN102870213A (en)

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CN2011800048240A CN102870213A (en) 2011-05-05 2011-10-14 Epoxy coating on substrate for die attach

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CNPCT/CN2011/073688 2011-05-05
PCT/CN2011/073688 WO2012149686A1 (en) 2011-05-05 2011-05-05 Epoxy coating on substrate for die attach
PCT/CN2011/080794 WO2012149803A1 (en) 2011-05-05 2011-10-14 Epoxy coating on substrate for die attach
CN2011800048240A CN102870213A (en) 2011-05-05 2011-10-14 Epoxy coating on substrate for die attach

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