CN102916115A - Luminous package - Google Patents
Luminous package Download PDFInfo
- Publication number
- CN102916115A CN102916115A CN2011102600162A CN201110260016A CN102916115A CN 102916115 A CN102916115 A CN 102916115A CN 2011102600162 A CN2011102600162 A CN 2011102600162A CN 201110260016 A CN201110260016 A CN 201110260016A CN 102916115 A CN102916115 A CN 102916115A
- Authority
- CN
- China
- Prior art keywords
- phosphor powder
- packaging part
- light
- luminescence chip
- packing colloid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 32
- 239000000084 colloidal system Substances 0.000 claims abstract description 30
- 239000000843 powder Substances 0.000 claims description 75
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 70
- 238000004020 luminiscence type Methods 0.000 claims description 33
- 238000012856 packing Methods 0.000 claims description 27
- 230000003287 optical effect Effects 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000008119 colloidal silica Substances 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 description 12
- 238000005538 encapsulation Methods 0.000 description 8
- 238000009877 rendering Methods 0.000 description 8
- 238000007598 dipping method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 240000004859 Gamochaeta purpurea Species 0.000 description 1
- 241001085205 Prenanthella exigua Species 0.000 description 1
- 230000009102 absorption Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
- H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
A luminescable package, comprising: the light emitting device comprises a bearing piece, a light emitting chip arranged on the bearing piece, a stop block arranged around the light emitting chip, a first packaging colloid coating the light emitting chip and the stop block, and a second packaging colloid formed on the first packaging colloid.
Description
Technical field
The present invention relates to a kind of chip package, espespecially a kind of can illuminated packaging part.
Background technology
Along with the progress of electronics industry and the arriving of digital Age, various electronic product is all towards the trend development that promotes effect.For each based light emitting device, for example how light-emitting diode (LED) promotes color rendering, light extraction efficiency etc., is the R﹠D direction of at present LED encapsulation industry.
At present white-light LED encapsulation spare is everlasting and is added red fluorescent powder to promote color rendering (color rendering index, CRI) in the phosphor powder.Existing white-light LED encapsulation spare 1 as shown in Figure 1, it comprises: bearing part 10, arrange and be electrically connected at light-emitting diode chip for backlight unit 11 on this bearing part 10, be formed on this bearing part 10 and coat the first colloidal silica 13 of this light-emitting diode chip for backlight unit 11 and coat the second colloidal silica 14 on this first colloidal silica 13, wherein, this second colloidal silica 14 has been inserted red fluorescent powder 141 and yellow phosphor powder 142.
In the existing white-light LED encapsulation spare 1, be shorter than the optical wavelength (being 622-780nm under the ruddiness vacuum) of this red fluorescent powder 141 because of the optical wavelength (being 577-597nm under the gold-tinted vacuum) of this yellow phosphor powder 142, so energy that should yellow phosphor powder 142 is larger, and the large phosphor powder of energy can be by the little phosphor powder absorbed energy of energy, thereby this red fluorescent powder 141 is understood the light ray energy that absorbing yellow phosphor powders 142 send, cause the light extraction efficiency of white-light LED encapsulation spare 1 to reduce, what is more, its light that sends can't present the white light of bright white, produce and have aberration, thereby cause color rendering to descend.
Therefore, how overcoming the variety of problems of prior art, is an important topic in fact.
Summary of the invention
For overcoming the variety of problems of prior art, but main purpose of the present invention be to provide a kind of improving extraction efficiency can illuminated packaging part.
Provided by the present invention can illuminated packaging part, comprising: bearing part; Be located at least one luminescence chip on this bearing part; Be located on this bearing part, and be laid in this luminescence chip block on every side, have the first phosphor powder in this block; Be formed on this bearing part, to coat the first packing colloid of this luminescence chip and block; And be formed at the second packing colloid on this first packing colloid, and have the second phosphor powder in this second packing colloid, the optical wavelength of this second phosphor powder is shorter than the optical wavelength of this first phosphor powder.
In the aforesaid packaging part, this luminescence chip can be light-emitting diode, and this block can be the silica gel piece, and the laying form of this block can be point-like or frame shape again.
In the aforesaid packaging part, the photochromic of this first phosphor powder can be redness or orange, and photochromic yellow or the green of can be of this second phosphor powder.
As from the foregoing, of the present invention can illuminated packaging part, the second phosphor powder of the first phosphor powder of long optical wavelength and short optical wavelength divided be arranged, and this second phosphor powder is positioned at the outside of this first phosphor powder, the light that this second phosphor powder is sent can not pass through this first phosphor powder, thereby can avoid this first phosphor powder to absorb the light that this second phosphor powder sends, but improving extraction efficiency not only, and the problem that can avoid color rendering to descend.
In addition, by block being laid in around this luminescence chip, this first phosphor powder is distributed in around the luminescence chip, with the light that effectively utilizes this luminescence chip side to be sent, but also improving extraction efficiency.
Description of drawings
Fig. 1 is the generalized section of existing white-light LED encapsulation spare;
Fig. 2 is the generalized section of the embodiment that the present invention can illuminated packaging part;
Fig. 2 a and Fig. 2 b look schematic diagram on the part of different embodiment of Fig. 2; And
Fig. 3 is the generalized section of another embodiment that the present invention can illuminated packaging part.
The primary clustering symbol description
1 white-light LED encapsulation spare
10,20,30 bearing parts
11 light-emitting diode chip for backlight unit
13 first colloidal silicas
14 second colloidal silicas
141 red fluorescent powders
142 yellow phosphor powders
2,3 can illuminated packaging part
200 grooves
The 200a reflecting surface
201 lead frames
202 fin
21,31 luminescence chips
The 21a upper surface
The 21b lower surface
210 electric contact mats
211 adhesion coatings
212 wires
22,32 blocks
220,320 first phosphor powders
23,33 first packing colloids
24,34 second packing colloids
240,340 second phosphor powders
L, S arrow.
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by content disclosed in the present specification.
Notice, the appended graphic structure that illustrates of this specification, ratio, size etc., equal contents in order to cooperate specification to disclose only, understanding and reading for the personage who is familiar with this skill, be not to limit the enforceable qualifications of the present invention, so technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, not affecting under the effect that the present invention can produce and the purpose that can reach, all should still drop on disclosed technology contents and get in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, " top ", " end ", " interior ", " outward " reach terms such as " one ", also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under without essence change technology contents, also ought be considered as the enforceable category of the present invention.
See also Fig. 2, the invention provides a kind of can illuminated packaging part 2, it comprises: a bearing part 20, be located at a luminescence chip 21 on this bearing part 20, be located on this bearing part 20 and be laid at least one block (dam) 22 around this luminescence chip 21, be formed on this bearing part 20 and coat the first packing colloid 23 of this luminescence chip 21 and block 22 and coat the second packing colloid 24 on this first packing colloid 23.
In the present embodiment, described bearing part 20 is fluted body.This bearing part 20 be by a lead frame 201 and a fin 202 as the bottom, form groove 200 in the top, bottom with the encapsulation material again, and make these groove 200 walls form reflecting surface 200a.Relevant bearing part of a great variety can be designed on demand, is not limited to this, and it is not the technical characterictic of this case, so repeat no more.
Described luminescence chip 21 is light-emitting diode (Light Emitting Diode, LED) chip, and it has upper surface 21a and lower surface 21b, has electric contact mat 210 on this upper surface 21a.In present embodiment, the lower surface 21b of this luminescence chip 21 is incorporated on these groove 200 bottom surfaces (fin 202) by adhesion coating 211, and is electrically connected the lead foot of this electric contact mat 210 and this lead frame 201 by a plurality of wires 212.
Described block 22 is for having the silica gel piece of the first phosphor powder 220.In present embodiment, this block 22 is laid on these groove 200 bottom surfaces, and the laying form of this block 22 can be frame shape shown in Fig. 2 a or a plurality of point-like shown in Fig. 2 b.
Described the first packing colloid 23 is colloidal silica.In present embodiment, this first packing colloid 23 is formed in this groove 200, to coat this luminescence chip 21, wire 212 and block 22.
Described the second packing colloid 24 is the colloidal silica with second phosphor powder 240, and the optical wavelength of this second phosphor powder 240 is shorter than the optical wavelength of this first phosphor powder 220.In present embodiment, this second packing colloid 24 is formed on the first packing colloid 23 in this groove 200, and the photochromic of this first phosphor powder 220 be red or orange, and the photochromic of this second phosphor powder 240 be yellow or green, but is not limited to this.
The present invention can not absorb the characteristic of long wavelength's light by the phosphor powder of short optical wavelength, and the first phosphor powder 220 that optical wavelength is long is distributed in and (namely is positioned near packaging part inboard from the bright dipping side of packaging part locating away from, close groove 200 bottoms as shown in the figure), and the second phosphor powder 240 that will lack optical wavelength is located at from the bright dipping side of packaging part locating close to and (namely is positioned near the packaging part outside, close groove 200 tops as shown in the figure), make light that this first phosphor powder 220 sends to bright dipping side (namely among the figure up) when penetrating through this second packing colloid 24, the light that this first phosphor powder 220 sends can not absorbed (opticpath that the first phosphor powder 220 shown in arrow L among the figure sends) by this second phosphor powder 240, to keep light extraction efficiency.
Moreover, when the light that this second phosphor powder 240 sends penetrates to bright dipping side (namely among the figure up), because not passing through this first phosphor powder 220, so the light that this second phosphor powder 240 sends can not absorbed (opticpath that the second phosphor powder 240 shown in arrow S among the figure sends) by this first phosphor powder 220, with improving extraction efficiency.
Again, around this luminescence chip 21, highly higher block 22 is set, make this first phosphor powder 220 be distributed in around this luminescence chip 21, to borrow this first phosphor powder 220 to improve color rendering and the luminous efficiency of the light that is sent these luminescence chip 21 sides, the light that these luminescence chip 21 sides are sent meets user demand, and reaches value.
See also Fig. 3, provide another kind of of the present invention can illuminated packaging part 3, it comprises: a bearing part 30, be located at a luminescence chip 31 on this bearing part 30, be located on this bearing part 30 and be laid at least one block 32 around this luminescence chip 31, be formed on this bearing part 30 and coat the first packing colloid 33 of this luminescence chip 31 and block 32 and coat the second packing colloid 34 on this first packing colloid 33.
Described bearing part 30 is plate.In present embodiment, this bearing part 20 is circuit board.
Described luminescence chip 31 is light-emitting diode (LED) chip, and is electrically connected this bearing part 30 (can routing type or crystal covering type be electrically connected).The mode that relevant luminescence chip 31 is electrically connected bearing part 30 is various, and there is no particular restriction.
Described block 32 is for having the silica gel piece of the first phosphor powder 320.
Described the first packing colloid 33 is colloidal silica.
Described the second packing colloid 34 is the colloidal silica with second phosphor powder 340, and the optical wavelength of this second phosphor powder 340 is shorter than the optical wavelength of this first phosphor powder 320.
As shown in Figure 3, the first phosphor powder 320 that optical wavelength is long is located near packaging part inboard, and the second phosphor powder 340 that will lack optical wavelength is located near the packaging part outside, when the light that this first phosphor powder 320 is sent outwards penetrates through this second packing colloid 34, the light that this first phosphor powder 320 sends can not absorbed by this second phosphor powder 340, to keep light extraction efficiency.
In addition, when the light that this second phosphor powder 340 sends outwards penetrates, because not passing through this first phosphor powder 320, so the light that this second phosphor powder 340 sends can be by these the first phosphor powder 320 absorptions, with improving extraction efficiency.
Again, this first phosphor powder 320 is distributed in around this luminescence chip 31, and to improve color rendering and the light extraction efficiency of the light that is sent these luminescence chip 31 sides, the light that these luminescence chip 31 sides are sent meets user demand.
In sum, of the present invention can illuminated packaging part, mainly by the first phosphor powder outside of the second phosphor powder of short wavelength being located at the long wavelength, when outwards penetrating, the light that this second phosphor powder is sent can not absorbed by this first phosphor powder, but not only improving extraction efficiency, and the problem that can avoid color rendering to descend.
In addition, by the first phosphor powder of long wavelength being located at around this luminescence chip, the light that this luminescence chip side is sent reaches value, with improving extraction efficiency.
Above-described embodiment is only in order to illustrative principle of the present invention and effect thereof, but not is used for restriction the present invention.Any those skilled in the art all can under spirit of the present invention and category, make amendment to above-described embodiment.So the scope of the present invention, should be listed such as claims.
Claims (10)
- One kind can illuminated packaging part, comprising:Bearing part;At least one luminescence chip is located on this bearing part;Block is located on this bearing part, and is laid in around this luminescence chip, has the first phosphor powder in this block;The first packing colloid is formed on this bearing part to coat this luminescence chip and block; AndThe second packing colloid is formed on this first packing colloid, and this second packing colloid has the second phosphor powder, and the optical wavelength of this second phosphor powder is shorter than the optical wavelength of this first phosphor powder.
- 2. according to claim 1 can illuminated packaging part, it is characterized in that this bearing part is plate or fluted body.
- 3. according to claim 1 can illuminated packaging part, it is characterized in that this luminescence chip is light-emitting diode chip for backlight unit.
- 4. according to claim 1 can illuminated packaging part, it is characterized in that this luminescence chip is electrically connected this bearing part.
- 5. according to claim 1 can illuminated packaging part, it is characterized in that this block is the silica gel piece.
- 6. according to claim 1 can illuminated packaging part, it is characterized in that the laying form of this block is point-like or frame shape.
- 7. according to claim 1 can illuminated packaging part, it is characterized in that this first packing colloid is colloidal silica.
- 8. according to claim 1 can illuminated packaging part, it is characterized in that this second packing colloid is colloidal silica.
- 9. according to claim 1 can illuminated packaging part, it is characterized in that the photochromic of this first phosphor powder is red or orange.
- 10. according to claim 1 can illuminated packaging part, it is characterized in that the photochromic of this second phosphor powder is yellow or green.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127692A TWI435479B (en) | 2011-08-04 | 2011-08-04 | Light emitting package |
| TW100127692 | 2011-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102916115A true CN102916115A (en) | 2013-02-06 |
Family
ID=47614416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102600162A Pending CN102916115A (en) | 2011-08-04 | 2011-08-30 | Luminous package |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102916115A (en) |
| TW (1) | TWI435479B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070170454A1 (en) * | 2006-01-20 | 2007-07-26 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same |
| CN101558501A (en) * | 2006-10-12 | 2009-10-14 | 科锐Led照明科技公司 | Lighting device and method of making same |
| US20100078664A1 (en) * | 2008-09-30 | 2010-04-01 | Rene Peter Helbing | Led phosphor deposition |
| US20110050071A1 (en) * | 2009-08-26 | 2011-03-03 | Chia-Tin Chung | Quasi-optical LED package structure for increasing color render index and brightness |
-
2011
- 2011-08-04 TW TW100127692A patent/TWI435479B/en not_active IP Right Cessation
- 2011-08-30 CN CN2011102600162A patent/CN102916115A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070170454A1 (en) * | 2006-01-20 | 2007-07-26 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same |
| CN101558501A (en) * | 2006-10-12 | 2009-10-14 | 科锐Led照明科技公司 | Lighting device and method of making same |
| US20100078664A1 (en) * | 2008-09-30 | 2010-04-01 | Rene Peter Helbing | Led phosphor deposition |
| US20110050071A1 (en) * | 2009-08-26 | 2011-03-03 | Chia-Tin Chung | Quasi-optical LED package structure for increasing color render index and brightness |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI435479B (en) | 2014-04-21 |
| TW201308679A (en) | 2013-02-16 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130206 |