CN102937663A - Packaging structure and method for kernel module of intelligent electricity meter - Google Patents
Packaging structure and method for kernel module of intelligent electricity meter Download PDFInfo
- Publication number
- CN102937663A CN102937663A CN2011102338057A CN201110233805A CN102937663A CN 102937663 A CN102937663 A CN 102937663A CN 2011102338057 A CN2011102338057 A CN 2011102338057A CN 201110233805 A CN201110233805 A CN 201110233805A CN 102937663 A CN102937663 A CN 102937663A
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- electric meter
- intelligent electric
- chip
- nucleus module
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention discloses a packaging structure for a kernel module of an intelligent electricity meter. The packaging structure comprises a substrate, a plurality of intelligent electricity meter functional chips, bonding wires, a protection layer and a ball grid array (BGA), wherein the substrate is used for bearing a plurality of chips, the plurality of the intelligent electricity meter functional chips are arranged at preset positions on the substrate surface, the bonding wires achieve electrical connection between the functional chips and circuits on the substrate, the protection layer is covered on the functional chips and the bonding wires, and the BGA is formed on the back side of the substrate. The packaging structure is compact, so that the area and the size of the whole module are reduced greatly. The invention further provides a packaging method for the kernel module of the intelligent electricity meter.
Description
Technical field
The present invention relates to the chip encapsulation technology field, particularly a kind of encapsulating structure of intelligent electric meter nucleus module and method for packing thereof.
Background technology
Along with people to the requirement of the electronic product development to directions such as miniaturization, multi-functional, environment-friendly types, people make great efforts to seek to do electronic system more little, integrated level is more and more higher, function is done more and more, and is more and more stronger.
Traditional intelligent ammeter module is that the function electronic circuit that each is packaged couples together by corresponding logic at last, and this needs external a large amount of placement-and-routing to finish this connection, thereby can occupy areas a large amount of on the circuit board, also increases the cabling difficulty.Simultaneously, because wire sizes and via size on the circuit board are also excessive, the area of whole system and volume also can and then be strengthened.This not only makes the encapsulating structure of whole intelligent ammeter module oversize, also causes manufacturing cost to rise.
Traditional intelligent electric meter encapsulating structure more and more can't satisfy people to the requirement of miniaturization of electronic products, high integration.
Summary of the invention
The invention provides a kind of encapsulating structure and method for packing of intelligent electric meter nucleus module, to solve the problems referred to above of existing intelligent electric meter nucleus module encapsulating structure.The present invention provides a kind of method for packing of intelligent electric meter nucleus module in addition.
The invention provides a kind of encapsulating structure of intelligent electric meter nucleus module, comprising:
Be used for carrying the substrate of a plurality of chips;
Be arranged at a plurality of intelligent electric meter functional chips in precalculated position on the substrate surface;
Realize the bonding wire that electrically connects between the circuit on described each functional chip and the substrate;
Cover the protective seam of described functional chip and bonding wire;
Form BGA (the Ball Grid Array) welded ball array with described substrate back.
Optionally, described substrate is single or multiple lift compound printed-wiring board (PWB), and the applying position periphery of reserving chip at described substrate surface is provided with the spun gold bonding pads.
Optionally, be provided with BGA at the back side of described substrate and plant the pad metal that ball needs.
Optionally, form a kind of or its alloy in the material copper, nickel, gold of described spun gold bonding pads; Form material that described BGA plants the pad metal that ball needs and comprise a kind of or its alloy in copper, nickel, the gold.
Optionally, the intelligent electric meter functional chip comprises MCU chip, 485 chips, computation chip, ESAM, and storer, logical circuit and clock chip and other are used for realizing ammeter function discrete component.
Optionally, described protective seam is the plastic packaging glue that organic polymer material forms, and its thickness and area are enough to coat intelligent electric meter functional chip, bonding wire and the bonding pads of substrate surface.
Optionally, form described bonding wire material and comprise gold, copper or described gold or aldary.
Optionally, described BGA welded ball array is braze metal.
The present invention also provides a kind of method for packing of intelligent electric meter nucleus module, comprises the steps:
Be provided for substrate, periphery is provided with the spun gold bonding pads in the applying position of described substrate surface chip, is provided with the connecting circuit that connects the intelligent electric meter functional chip in the described substrate;
Described intelligent electric meter functional chip is mounted on the predetermined assigned address of described substrate surface;
Be connected with the corresponding spun gold bonding pads of described substrate surface by the lead pad of lead-in wire with described each functional chip;
Form the protective seam of the intelligent electric meter functional chip, bonding wire and the bonding pads that coat described substrate surface at described substrate surface;
Form the BGA welded ball array at described substrate back.
Optionally, also comprise following substep in the step that described intelligent electric meter functional chip is mounted on described substrate surface:
Substrate is carried out preheating;
Substrate surface precalculated position gluing after preheating;
Intelligent electric meter chip and substrate surface gluing position are aligned;
With the intelligent electric meter chip attachment in substrate surface gluing position.
Optionally, the intelligent electric meter chip attachment after substrate surface gluing position, is also comprised described substrate pyroprocessing, solidify the step of intelligent electric meter chip.
Optionally, described protective seam is one or more layers of plastic packaging glue.
Optionally, adopt the mode of some glue or coating to form described plastic packaging glue at upper surface of base plate, and heating cure.
Optionally, form the BGA welded ball array at the back side of substrate by the backflow of C4 technique.
Optionally, also comprise the steps: the whole module of finishing encapsulation is cut into slices, and do Performance Detection.
Compared with prior art, the present invention has the following advantages: the encapsulating structure of intelligent electric meter nucleus module of the present invention is with the bare chip of each used in the electric meter system different size dimension models, by becoming one, form a high density, low-loss, panel type meter module cheaply is so that the area of whole module and volume all reduce greatly; Further, the cable run distance of each chip chamber in this structure in the ammeter module shortens, and is more conducive to improve the speed that signal is processed, and improves the performance of ammeter module.
In addition, method cost of the present invention is low and be easy to control, is convenient to scale of mass production.
Description of drawings
Fig. 1 is the cut-open view of embodiment of the encapsulating structure of intelligent electric meter nucleus module of the present invention;
Fig. 2 is the vertical view that the intelligent electric meter chip distributes in substrate surface among the embodiment of encapsulating structure of intelligent electric meter nucleus module of the present invention;
Fig. 3 to Fig. 6 is the schematic diagram of the structure that forms after each step of method for packing of intelligent electric meter nucleus module of the present invention.
Embodiment
A lot of details have been set forth in the following description so that fully understand the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can be in the situation that do similar popularization without prejudice to intension of the present invention, so the present invention is not subjected to the restriction of following public implementation.
Embodiment to the encapsulating structure of intelligent electric meter nucleus module of the present invention is described in detail below in conjunction with accompanying drawing.
Fig. 1 is the cut-open view of embodiment of the encapsulating structure of intelligent electric meter nucleus module of the present invention.Please referring to Fig. 1, in the embodiments of the invention, intelligent electric meter nucleus module encapsulating structure comprises substrate 101, is arranged at a plurality of intelligent electric meter functional chips (the first functional chip 104 and the second functional chip 105 only are shown among Fig. 1) in upper precalculated position, substrate 101 surfaces; Realize the bonding wire 106 that electrically connects between the circuit on described each functional chip and the substrate; Cover the protective seam 107 of described functional chip and bonding wire; Form BGA (the Ball Grid Array) welded ball array 108 with described substrate back.
Wherein, described substrate 101 connects for logic between the realization multi-chip and chip is provided support.It can be single or multiple lift compound printed circuit board (PCB).Be provided with the metal wiring layer more than one deck in described substrate 101 inside, form connecting circuit.It realizes that in order to the logical relation according to chip chamber corresponding electrical equipment connects.Described substrate 101 materials can plastics, pottery etc.
Surperficial precalculated position at described substrate 101 is used for applying intelligent electric meter chip, be provided with spun gold bonding pads 102 at the periphery that remains in advance mounting the intelligent electric meter chip position, spun gold bonding pads 102 can be made of a kind of or its alloy in the materials such as copper, nickel, gold.This spun gold bonding pads is connected with the circuit of substrate inside, and as with the lead pad of the bonding of intelligent electric meter chip.
Also be provided with the needed pad metal 103 of formation BGA array at the back side of described substrate 101, pad metal 103 also can be made of a kind of or its alloy in the materials such as copper, nickel, gold.This pad metal 103 also is connected with the circuit of substrate inside.
Fig. 2 shows above-mentioned intelligent electric meter functional chip in the distribution of substrate surface.As shown in Figure 2, each intelligent electric meter functional chip is by the surface of alite paste stickup with substrate 101.The intelligent electric meter functional chip comprises respectively MCU chip 206,485 chips 204, computation chip 208, ESAM chip 202, storer 210, logical circuit 104 and clock chip 105 (Fig. 1 is equivalent to arrange among Fig. 2 behind the protective seam cut-open view along XX ' direction).Can certainly also comprise other required chip and components and parts of realizing the ammeter functions of modules.Above-mentioned functional chip is mounted on every a chip and components and parts by mounting technology the relevant position on substrate 101 surfaces.Said chip can be market circulation chip and components and parts product, also can manufacture and design by self-developing.Need to prove, the position that mounts of the various functional chips shown in Fig. 2 only is schematic.Those skilled in the art can arrange the functional chip that consists of the ammeter module arbitrarily on substrate 101 surfaces as required, accordingly, the spun gold bonding pads on the circuit of substrate 101 inside and substrate 101 surfaces can be according to the setting position of functional chip and is designed in advance and make, and no longer gives unnecessary details here.
Please continue referring to Fig. 1,106 1 ends that go between are connected on the pad of chip, and the other end is connected on the pad that is distributed on substrate 101 surfaces around the chip, and the circuit in the chip is connected with circuit in the substrate 101.All chips are all wanted to be communicated with the circuit on the substrate 101 by lead-in wire, thereby can realize the electrical connection between the different chips, and realize the ammeter functions of modules of expection.106 materials that go between comprise gold, copper or described gold or aldary.
Described protective seam 107 is arranged on described substrate 101 surfaces, for the protection of the syndeton of substrate 101 lip-deep chips and chip and substrate 101.In the present embodiment, the plastic packaging glue that described protective seam 107 forms for organic polymer materials, its thickness and area are enough to coat intelligent electric meter functional chip, bonding wire and the bonding pads on substrate 101 surfaces.By protective seam 107, can provide physical mechanical and heating power protection for chip and bonding wire structure, strengthen integrally-built reliability.Certainly, the material of protective seam 107 is not limited to described plastic packaging glue, and it can also be that other can realize defencive function and the material that physical strength is provided, and enumerates no longer one by one here.
The encapsulating structure of the intelligent electric meter nucleus module of above-described embodiment is with the bare chip of each used in the electric meter system different size dimension models, by becoming one, form a high density, low-loss, panel type meter module cheaply is so that the area of whole module and volume all reduce greatly.Further, the cable run distance of each chip chamber in this structure in the ammeter module shortens, and is more conducive to improve the speed that signal is processed, and improves the performance of ammeter module.
The present invention also provides a kind of method for packing of intelligent electric meter nucleus module.Fig. 3 to Fig. 6 is the schematic diagram of the structure that forms after each step in the enforcement of method for packing of intelligent electric meter nucleus module of the present invention.Below in conjunction with Fig. 3 to Fig. 6 method of the present invention is described.
At first, as shown in Figure 3, provide substrate 101.Periphery is provided with spun gold bonding pads 102 in described substrate surface chip applying position, and it is generally by copper, and nickel, gold wait metal to form; Be provided with the wiring layer of the connection that connects the intelligent electric meter functional chip in described substrate inside, for example, can be the two layers of wiring structure.Be provided with BGA at described substrate 101 back sides and plant the required pad metal of ball 103.Described substrate 101 can form with the printed circuit board manufacturing process of routine.Here repeat no more.
Then, described intelligent electric meter functional chip is mounted on the predetermined assigned address of described substrate surface.Schematic diagram after Fig. 3 shows the first functional chip 104 and the second functional chip 105 and is mounted on substrate and mounts.
Wherein, mount and can adopt surface stick-mounting machine, concrete step can comprise carries out preheating to substrate; Substrate surface precalculated position gluing after preheating; Intelligent electric meter chip and substrate surface gluing position are aligned; The intelligent electric meter chip attachment in substrate surface gluing position and to the substrate pyroprocessing, is solidified the step of intelligent electric meter chip.By this step, the intelligent electric meter functional chip can firmly mount on the surface with substrate 101.
Then, as shown in Figure 5,106 lead pad with described each functional chip are connected with the corresponding spun gold bonding pads of described substrate surface by going between.This lead-in wire 106 is generally metal wire or copper cash, or its alloy.
Follow again, as shown in Figure 6, form the protective seam 107 of the intelligent electric meter functional chip, bonding wire and the bonding pads that coat described substrate surface at described substrate surface.In the present embodiment, described protective seam 107 is one or more layers of plastic packaging glue, and the composition of plastic packaging glue is generally organic polymer, and height is as the criterion to cover all bare chips and lead-in wire.Adopt the mode of some glue or coating to form described plastic packaging glue at upper surface of base plate, and heating cure.
At last, as shown in Figure 1, form BGA welded ball array 108 at described substrate 101 back sides.In the present embodiment, form BGA welded ball array 108. by the backflow of C4 technique
Finish after the above-mentioned steps, also comprise the whole module of finishing encapsulation is cut into slices, and do the step of Performance Detection.
The method of above-described embodiment has been broken away from the method for the multimode assembling of traditional electrical list structure, and bare chip is integrated, and area and the volume of whole module all reduce greatly; And this method shortens the cable run distance of each chip chamber in the ammeter module, is more conducive to improve the speed that signal is processed, and improves the performance of ammeter module; In addition, method cost of the present invention is low and be easy to control, is convenient to scale of mass production.
Although the present invention with preferred embodiment openly as above; but it is not to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can make possible change and modification, so protection scope of the present invention should be as the criterion with the scope that claim of the present invention was defined.
Claims (15)
1. the encapsulating structure of an intelligent electric meter nucleus module is characterized in that comprising,
Be used for carrying the substrate of a plurality of chips;
Be arranged at a plurality of intelligent electric meter functional chips in precalculated position on the substrate surface;
Realize the bonding wire that electrically connects between the circuit on described each functional chip and the substrate;
Cover the protective seam of described functional chip and bonding wire;
Be formed at BGA (the Ball Grid Array) welded ball array of described substrate back.
2. the encapsulating structure of intelligent electric meter nucleus module according to claim 1 is characterized in that, described substrate is single or multiple lift stratification compound printed-wiring board (PWB), and the applying position periphery of reserving chip at described substrate surface is provided with the spun gold bonding pads.
3. the encapsulating structure of intelligent electric meter nucleus module according to claim 2 is characterized in that, is provided with BGA at the back side of described substrate and plants the pad metal that ball needs.
4. the encapsulating structure of intelligent electric meter nucleus module according to claim 3 is characterized in that, forms a kind of or its alloy in the material copper, nickel, gold of described spun gold bonding pads; Form material that described BGA plants the pad metal that ball needs and comprise a kind of or its alloy in copper, nickel, the gold.
5. the encapsulating structure of intelligent electric meter nucleus module according to claim 1, it is characterized in that, the intelligent electric meter functional chip comprises MCU chip, 485 chips, computation chip, ESAM, storer, logical circuit and clock chip and other discrete components for realization ammeter function.
6. the encapsulating structure of intelligent electric meter nucleus module according to claim 2; it is characterized in that; described protective seam is the plastic packaging glue that organic polymer material forms, and its thickness and area are enough to coat intelligent electric meter functional chip, bonding wire and the bonding pads of substrate surface.
7. the encapsulating structure of intelligent electric meter nucleus module according to claim 1 is characterized in that, forms described bonding wire material and comprises gold, copper or described gold or aldary.
8. the encapsulating structure of intelligent electric meter nucleus module according to claim 1 is characterized in that, described BGA welded ball array is braze metal.
9. the method for packing of an intelligent electric meter nucleus module is characterized in that comprising the steps,
Be provided for substrate, periphery is provided with the spun gold bonding pads in the applying position of described substrate surface chip, is provided with the connecting circuit that connects the intelligent electric meter functional chip in the described substrate;
Described intelligent electric meter functional chip is mounted on the predetermined assigned address of described substrate surface;
Be connected with the corresponding spun gold bonding pads of described substrate surface by the lead pad of lead-in wire with described each functional chip;
Form the protective seam of the intelligent electric meter functional chip, bonding wire and the bonding pads that coat described substrate surface at described substrate surface;
Form the BGA welded ball array at described substrate back.
10. the method for packing of intelligent electric meter nucleus module according to claim 9 is characterized in that, also comprises following substep in the step that described intelligent electric meter functional chip is mounted on described substrate surface,
Substrate is carried out preheating;
Substrate surface precalculated position gluing after preheating;
Intelligent electric meter chip and substrate surface gluing position are aligned;
With the intelligent electric meter chip attachment in substrate surface gluing position.
11. the method for packing of intelligent electric meter nucleus module according to claim 10 is characterized in that, the intelligent electric meter chip attachment after substrate surface gluing position, is also comprised described substrate pyroprocessing, solidifies the step of intelligent electric meter chip.
12. the method for packing of intelligent electric meter nucleus module according to claim 9 is characterized in that, described protective seam is one or more layers of plastic packaging glue.
13. the method for packing of intelligent electric meter nucleus module according to claim 12 is characterized in that, adopts the mode of some glue or coating to form described plastic packaging glue at upper surface of base plate, and heating cure.
14. the method for packing of intelligent electric meter nucleus module according to claim 9 is characterized in that, refluxing by C4 technique at the back side of substrate forms the BGA welded ball array.
15. the method for packing of intelligent electric meter nucleus module according to claim 9 is characterized in that, also comprises the steps: the whole module of finishing encapsulation is cut into slices, and does Performance Detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110233805.7A CN102937663B (en) | 2011-08-16 | 2011-08-16 | The encapsulating structure of kernel module of intelligent electricity meter and method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110233805.7A CN102937663B (en) | 2011-08-16 | 2011-08-16 | The encapsulating structure of kernel module of intelligent electricity meter and method for packing |
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| CN102937663A true CN102937663A (en) | 2013-02-20 |
| CN102937663B CN102937663B (en) | 2016-04-27 |
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| CN201110233805.7A Expired - Fee Related CN102937663B (en) | 2011-08-16 | 2011-08-16 | The encapsulating structure of kernel module of intelligent electricity meter and method for packing |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105374804A (en) * | 2015-12-08 | 2016-03-02 | 深圳佰维存储科技有限公司 | Intelligent wearable device |
| CN105525332A (en) * | 2014-10-24 | 2016-04-27 | 中国科学院苏州纳米技术与纳米仿生研究所 | Method for lowering bonding thermal stress of brazing filler metal and packaged chip |
| CN107731763A (en) * | 2017-11-14 | 2018-02-23 | 湖北三江航天红峰控制有限公司 | A kind of chip encapsulation module and integrated AD harvesters |
| CN112636896A (en) * | 2019-12-27 | 2021-04-09 | 西南石油大学 | Non-interactive verifiable multi-type encrypted data aggregation method facing smart power grid |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6521994B1 (en) * | 2001-03-22 | 2003-02-18 | Netlogic Microsystems, Inc. | Multi-chip module having content addressable memory |
| CN1490858A (en) * | 2002-10-14 | 2004-04-21 | 矽品精密工业股份有限公司 | Spheric grid array semiconductor chip package procedure |
| US6798054B1 (en) * | 2000-07-28 | 2004-09-28 | Siliconware Precision Industries Co., Ltd. | Method of packaging multi chip module |
| CN2935472Y (en) * | 2006-08-02 | 2007-08-15 | 力成科技股份有限公司 | Ball grid array packaging structure |
| CN101145549A (en) * | 2006-09-13 | 2008-03-19 | 力成科技股份有限公司 | Ball grating array package structure and package method |
| CN201063342Y (en) * | 2007-07-06 | 2008-05-21 | 威宇科技测试封装有限公司 | Multiple-chip packaging structure |
| CN102103165A (en) * | 2009-12-17 | 2011-06-22 | 深圳先进技术研究院 | Electricity meter |
-
2011
- 2011-08-16 CN CN201110233805.7A patent/CN102937663B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6798054B1 (en) * | 2000-07-28 | 2004-09-28 | Siliconware Precision Industries Co., Ltd. | Method of packaging multi chip module |
| US6521994B1 (en) * | 2001-03-22 | 2003-02-18 | Netlogic Microsystems, Inc. | Multi-chip module having content addressable memory |
| CN1490858A (en) * | 2002-10-14 | 2004-04-21 | 矽品精密工业股份有限公司 | Spheric grid array semiconductor chip package procedure |
| CN2935472Y (en) * | 2006-08-02 | 2007-08-15 | 力成科技股份有限公司 | Ball grid array packaging structure |
| CN101145549A (en) * | 2006-09-13 | 2008-03-19 | 力成科技股份有限公司 | Ball grating array package structure and package method |
| CN201063342Y (en) * | 2007-07-06 | 2008-05-21 | 威宇科技测试封装有限公司 | Multiple-chip packaging structure |
| CN102103165A (en) * | 2009-12-17 | 2011-06-22 | 深圳先进技术研究院 | Electricity meter |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105525332A (en) * | 2014-10-24 | 2016-04-27 | 中国科学院苏州纳米技术与纳米仿生研究所 | Method for lowering bonding thermal stress of brazing filler metal and packaged chip |
| CN105374804A (en) * | 2015-12-08 | 2016-03-02 | 深圳佰维存储科技有限公司 | Intelligent wearable device |
| CN107731763A (en) * | 2017-11-14 | 2018-02-23 | 湖北三江航天红峰控制有限公司 | A kind of chip encapsulation module and integrated AD harvesters |
| CN112636896A (en) * | 2019-12-27 | 2021-04-09 | 西南石油大学 | Non-interactive verifiable multi-type encrypted data aggregation method facing smart power grid |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102937663B (en) | 2016-04-27 |
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