CN103050884A - Driving method of laser tube core semiconductor refrigerator - Google Patents
Driving method of laser tube core semiconductor refrigerator Download PDFInfo
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- CN103050884A CN103050884A CN2012105867127A CN201210586712A CN103050884A CN 103050884 A CN103050884 A CN 103050884A CN 2012105867127 A CN2012105867127 A CN 2012105867127A CN 201210586712 A CN201210586712 A CN 201210586712A CN 103050884 A CN103050884 A CN 103050884A
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Abstract
The invention discloses a driving method of a laser tube core semiconductor refrigerator. The driving method comprises the following steps that A, the temperature of a laser tube core is measured, in addition, whether the temperature of the laser tube core reaches the specified temperature or not is judged, and if the specified temperature is not reached, the difference value between the practical temperature and the specified temperature is calculated; B, the heating or the refrigeration of the semiconductor refrigerator is controlled in a linear driving and pulse width driving alternation node, so the temperature is alternately changed in a coarse adjustment and fine adjustment mode; C, after the temperature of the laser tube core reaches the specified temperature, the semiconductor refrigerator stops working, the temperature detection of a laser tube is maintained, and when the temperature of the laser tube is different from the specified temperature, steps A, B and C are repeated. The method has the advantages that a semiconductor drive can be fast driven to reach the specified temperature, in addition, the precision is higher, the robust performance is good, meanwhile, the manufacture cost and the complexity degree are lower, and the applicability of the semiconductor refrigerator to each field can be effectively improved.
Description
Technical field
The present invention relates to the fiber optic transmission system technical field, relate in particular to the laser of a kind of driving method to the laser die semiconductor cooler and employing the method.
Background technology
High power semiconductor lasers (LD) plays an important role in optical fiber sensing system.The output wavelength of LD, current threshold, peak power output and minimum power fluctuation all directly are subject to the impact of working temperature, so working temperature is very important for the LD tube core, must provide constant and can the accurate working temperature of adjusting to LD.Semiconductor cooler (TEC) is the core devices in the high power LD temperature control system, and it heats LD according to the change in resistance that is built in the thermistor in the tube core or freezes, and guarantees that LD works in temperature constant state.The driving method of semiconductor cooler comprises pulsewidth Driving technique and Linear Driving technology.Pulsewidth Driving technique efficient is high, and heat power consumption is low.This kind method design flexibility is better simultaneously, and the control parameter can be according to the variation real time altering controller parameter of object, and robustness is relatively good.But the electronic device of pulsewidth Driving technique produces very strong electromagnetic interference.Conductibility and radiativity electromagnetic interference family disturb other electronic system and or electronic equipment normally move, even cause misoperation.The Linear Driving technical efficiency is low, and power consumption is large, but it does not have ripple voltage, and electromagnetic interference is little, and control system is relatively simple, possesses certain robustness, is not very strong for the drift sensitiveness of system parameters.
In Practical Project, usually adopt above a kind of method as the method that drives semiconductor cooler.Although every kind of method has its distinctive advantage, the shortcoming that all can't avoid it to have.More advanced method is to adopt pulsewidth to drive the technology that combines with feedback in the market, so not only drive efficiency is higher, also solve to a certain extent to get the problem of control accuracy, yet still can't solve the excessive phenomenon of its driftance in high-precision application places.
Summary of the invention
The object of the invention is to propose a kind of driving method to the laser die semiconductor cooler, semiconductor cooler be can drive fast and assigned temperature and accuracy height reached, robustness is good, manufacturing cost and complexity are all lower simultaneously, and effectively raise semiconductor cooler in the application in various fields.
For reaching this purpose, the present invention by the following technical solutions:
A kind of driving method to the laser die semiconductor cooler may further comprise the steps:
Steps A: the temperature of measurement laser die, and judge whether the temperature of laser die reaches assigned temperature, if do not reach the difference between assigned temperature calculating actual temperature and the assigned temperature;
Step B: adopt Linear Driving and pulsewidth to drive the mode that alternates and control semiconductor cooler and heat or freeze, thereby make temperature with changing that the mode of coarse adjustment and fine tuning replaces;
Step C: after the temperature of laser die reached assigned temperature, semiconductor cooler quit work, but kept the temperature detection to laser tube, if the temperature of laser tube is with after assigned temperature is different, and repeating step A, B and C.
As a kind of preferred version of above-mentioned driving method to the laser die semiconductor cooler, in steps A, adopt and measure the temperature that method that thermistor forms is measured laser die.
As a kind of preferred version of above-mentioned driving method to the laser die semiconductor cooler, the mode of temperature coarse adjustment is Linear Driving in step B.
As a kind of preferred version of above-mentioned driving method to the laser die semiconductor cooler, the mode of temperature fine tuning is that pulsewidth drives in step B.
As a kind of preferred version of above-mentioned driving method to the laser die semiconductor cooler, the resistance according to thermistor in step B is replaced type of drive.
A kind of preferred version as above-mentioned driving method to the laser die semiconductor cooler is divided into several stages with actual temperature and the difference between the assigned temperature that calculates in the steps A.
A kind of preferred version as above-mentioned driving method to the laser die semiconductor cooler carries out Linear Driving in the phase I of the temperature difference, and second stage is carried out pulsewidth and driven, and alternately semiconductor cooler is controlled in this order.
A kind of employing laser to the driving method of laser die semiconductor cooler as previously discussed, it is characterized in that, comprise the laser die, semiconductor cooler and the thermistor that are integrated in one, for the semiconductor cooler controller that semiconductor cooler is controlled, and the master controller that is used for data analysis and whole device is controlled.
As a kind of preferred version of above-mentioned laser, described semiconductor cooler controller comprises pulse-width modulation and linear modulation generator.
Beneficial effect of the present invention is: the present invention is by providing a kind of method to the laser die semiconductor cooler, it is by adopting the mode that pulsewidth drives and Linear Driving replaces that semiconductor cooler is driven, thereby make temperature with changing that the mode of coarse adjustment and fine tuning replaces, it not only can drive fast semiconductor drivers and reach assigned temperature, and precision is higher, robust performance is good, manufacturing cost and complexity are lower simultaneously, can effectively improve semiconductor cooler in the application in each field.
Description of drawings
Fig. 1 is the structural representation of the laser that provides of the specific embodiment of the invention;
Fig. 2 is the control flow to semiconductor cooler that the specific embodiment of the invention provides;
Fig. 3 is the control model to semiconductor cooler that the specific embodiment of the invention provides;
Wherein:
1: laser; 2: laser die; 3: semiconductor cooler; 4: thermistor; 5: the semiconductor cooler controller; 6: master controller.
Embodiment
Further specify technical scheme of the present invention below in conjunction with accompanying drawing and by embodiment.
A kind of fast accurately to the driving method of laser die semiconductor cooler, it may further comprise the steps:
Steps A: the temperature of measurement laser die, and judge whether the temperature of laser die reaches assigned temperature, if do not reach the difference between assigned temperature calculating actual temperature and the assigned temperature;
Can be according to the variations in temperature in the external world and the linear principle that changes according to thermistor, the resistance according to thermistor in this step is measured the laser die temperature.
Step B: adopt Linear Driving and pulsewidth to drive the mode that alternates and control semiconductor cooler and heat or freeze, thereby make temperature with changing that the mode of coarse adjustment and fine tuning replaces;
In this step to the mode of temperature coarse adjustment for semiconductor cooler is carried out Linear Driving, the mode of fine tuning drives for semiconductor cooler being carried out pulsewidth; Simultaneously temperature difference measured in the steps A is divided into several stages, and carries out Linear Driving in the phase I of the temperature difference, second stage is carried out pulsewidth and is driven, and alternately semiconductor cooler is controlled in this order.
Step C: after the temperature of laser die reached assigned temperature, semiconductor cooler quit work, but kept the temperature detection to laser tube, if the temperature of laser tube is with after assigned temperature is different, and repeating step A, B and C.
As shown in Figure 1, the application has also proposed a kind of laser 1 that adopts above-mentioned driving method to the laser die semiconductor cooler, it comprises laser die 2, semiconductor cooler 3 and thermistor 4, wherein semiconductor cooler 3 is used to laser die heating or refrigeration, thermistor 4 is used for measuring the temperature of laser die, for the ease of laser die being heated or freezing, with more accurate to the temperature survey of laser die 2, laser die 2, semiconductor cooler 3 and thermistor 4 become one; Laser 1 also comprises for the semiconductor cooler controller 5 that semiconductor cooler 3 is controlled, and the master controller 6 that is used for receive data, carries out data analysis and the semiconductor cooler controller is sent control command.For the compactedness and the minimizing manufacturing cost that strengthen laser, pulse-width modulation and linear modulation generator are integrated in the semiconductor cooler controller.
Below in conjunction with Fig. 2 and Fig. 3 and concrete data the mentioned driving method to the laser die semiconductor cooler of the application being described.
At first, whether calculate actual temperature at the driving initial stage identical with assigned temperature, if the different differences that calculate actual temperature and assigned temperature are T and this temperature are divided into several stages, in this execution mode, the temperature difference is divided into 8 sections, simultaneously whole the semiconductor cooler control procedure is all needed the resistance of thermistor is measured, and determine to be in that stage of the temperature difference according to the variation of its resistance; Semiconductor cooler is loaded constant current, carry out Linear Driving until the laser die variations in temperature reaches eight of total amplitude of variation/for the moment, to the semiconductor cooler load pulses, carrying out pulsewidth drives. then reach four of total amplitude of variation/for the moment in the laser die variations in temperature, semiconductor cooler is loaded constant current, carry out Linear Driving. at last reach eight of total amplitude of variation/three o'clock in the laser die variations in temperature, to the semiconductor cooler load pulses, carry out pulsewidth and drive, thereby reach 1/2nd of total amplitude of variation.By that analogy, until reach the temperature of appointment.Whole process can be described as coarse adjustment-fine tuning-coarse adjustment-fine tuning-coarse adjustment-fine tuning-coarse adjustment-fine tuning.Linear Driving is equivalent to coarse adjustment, and the temperature of laser die is changed fast.Pulsewidth drives and is equivalent to fine tuning, the temperature of laser die is changed accurately, and the variations in temperature after the coarse adjustment is cushioned.
Know-why of the present invention has below been described in conjunction with specific embodiments.These are described just in order to explain principle of the present invention, and can not be interpreted as by any way limiting the scope of the invention.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (9)
1. the driving method to the laser tube semiconductor cooler is characterized in that, may further comprise the steps:
Steps A: the temperature of measurement laser die, and judge whether the temperature of laser die reaches assigned temperature, if do not reach the difference between assigned temperature calculating actual temperature and the assigned temperature;
Step B: adopt Linear Driving and pulsewidth to drive the mode that alternates and control semiconductor cooler and heat or freeze, thereby make temperature with changing that the mode of coarse adjustment and fine tuning replaces;
Step C: after the temperature of laser die reached assigned temperature, semiconductor cooler quit work, but kept the temperature detection to laser tube, if the temperature of laser tube is with after assigned temperature is different, and repeating step A, B and C.
2. the driving method to the laser die semiconductor cooler according to claim 1 is characterized in that, in steps A, adopts the method for measuring the thermistor resistance to measure the temperature of laser die.
3. the driving method to the laser die semiconductor cooler according to claim 1, its feature with, the mode of temperature coarse adjustment is Linear Driving in step B.
4. the driving method to the laser die semiconductor cooler according to claim 3, its feature with, the mode of temperature fine tuning is that pulsewidth drives in step B.
5. the driving method to the laser die semiconductor cooler according to claim 1, its feature with, the resistance according to thermistor in step B is replaced type of drive.
6. the driving method to the laser die semiconductor cooler according to claim 1, its feature with, actual temperature and the difference between the assigned temperature that calculates in the steps A is divided into several stages.
7. according to claim 5 or 6 described driving methods to the laser die semiconductor cooler, its feature with, carry out Linear Driving in the phase I of the temperature difference, second stage is carried out pulsewidth and is driven, and alternately semiconductor cooler is controlled in this order.
8. laser that adopts the driving method to the laser die semiconductor cooler as claimed in claim 1, it is characterized in that, comprise the laser die, semiconductor cooler and the thermistor that are integrated in one, for the semiconductor cooler controller that semiconductor cooler is controlled, and the master controller that is used for data analysis.
9. laser according to claim 1, its feature with, described semiconductor cooler controller comprises pulse-width modulation and linear modulation generator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105867127A CN103050884A (en) | 2012-12-28 | 2012-12-28 | Driving method of laser tube core semiconductor refrigerator |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012105867127A CN103050884A (en) | 2012-12-28 | 2012-12-28 | Driving method of laser tube core semiconductor refrigerator |
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| CN103050884A true CN103050884A (en) | 2013-04-17 |
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| CN2012105867127A Pending CN103050884A (en) | 2012-12-28 | 2012-12-28 | Driving method of laser tube core semiconductor refrigerator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107562087A (en) * | 2016-06-30 | 2018-01-09 | 南京中兴软件有限责任公司 | Temprature control method and device, optical module based on heater |
| CN115377787A (en) * | 2022-10-25 | 2022-11-22 | 北京中星时代科技有限公司 | Pulse width control method, laser energy control method and related equipment |
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| CN102306904A (en) * | 2011-08-04 | 2012-01-04 | 南昌航空大学 | High-precision semiconductor laser system based on feedforward decoupling control |
| CN102519167A (en) * | 2011-12-20 | 2012-06-27 | 江苏飞格光电有限公司 | Linear thermoelectric cooler (TEC) driving circuit |
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- 2012-12-28 CN CN2012105867127A patent/CN103050884A/en active Pending
Patent Citations (5)
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| JPH03240110A (en) * | 1990-02-16 | 1991-10-25 | Keyence Corp | Low voltage type temperature controller |
| US5682748A (en) * | 1995-07-14 | 1997-11-04 | Thermotek, Inc. | Power control circuit for improved power application and temperature control of low voltage thermoelectric devices |
| CN101776929A (en) * | 2010-01-04 | 2010-07-14 | 中兴通讯股份有限公司 | Temperature control method and device of laser with thermoelectric refrigerating unit |
| CN102306904A (en) * | 2011-08-04 | 2012-01-04 | 南昌航空大学 | High-precision semiconductor laser system based on feedforward decoupling control |
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| 周进军等: "用ADN8830实现半导体激光器的自动温度控制", 《光学与光电技术》 * |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107562087A (en) * | 2016-06-30 | 2018-01-09 | 南京中兴软件有限责任公司 | Temprature control method and device, optical module based on heater |
| CN107562087B (en) * | 2016-06-30 | 2024-04-02 | 中兴通讯股份有限公司 | Temperature control method and device based on heater and optical module |
| CN115377787A (en) * | 2022-10-25 | 2022-11-22 | 北京中星时代科技有限公司 | Pulse width control method, laser energy control method and related equipment |
| CN115377787B (en) * | 2022-10-25 | 2023-01-17 | 北京中星时代科技有限公司 | Laser energy control method and related equipment |
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Application publication date: 20130417 |