CN103062653A - Light emitting diode (LED) illuminating device - Google Patents
Light emitting diode (LED) illuminating device Download PDFInfo
- Publication number
- CN103062653A CN103062653A CN2012105687660A CN201210568766A CN103062653A CN 103062653 A CN103062653 A CN 103062653A CN 2012105687660 A CN2012105687660 A CN 2012105687660A CN 201210568766 A CN201210568766 A CN 201210568766A CN 103062653 A CN103062653 A CN 103062653A
- Authority
- CN
- China
- Prior art keywords
- unit
- layer
- led
- base board
- sidewall sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention provides a light emitting diode (LED) illuminating device. The device comprises a produced member and an LED illuminating member. The LED illuminating member comprises an LED chip unit, a substrate unit and a cover unit. The LED chip unit is arranged on the substrate unit, the cover unit is detachably installed on the substrate unit, the cover unit coats the LED chip unit, and no gap exists among the cover unit, the LED chip unit and the substrate unit. The cover unit comprises a side wall part and a top part. The side wall part and the top part form a whole. The side wall part is opaque. The top part is provided with a nonopaque first layer, a second layer containing fluorescent powder and a nonopaque third layer. The second layer is sandwiched between the first layer and the third layer. The fluorescent powder is distributed on the second layer uniformly. The device can reduce the pollution of the fluorescent powder on the environment when the LED illuminating member is rejected.
Description
Technical field
The present invention relates to lighting field, more particularly, the present invention relates to a kind of LED lighting apparatus.
Background technology
LED (Light Emitting Diode) is a kind of solid-state semiconductor devices, and it can be electric energy conversion luminous energy directly.The heart of LED is a semiconductor wafer, and an end of semiconductor wafer is attached on the support (as negative pole), and the other end of semiconductor wafer connects the positive pole of power supply, and whole wafer is got up by epoxy encapsulation.
Semiconductor wafer is comprised of two parts, and a part is P-type semiconductor, occupies an leading position in its hole, the inside, and the other end of semiconductor wafer is N-type semiconductor, mainly is electronics here.When these two kinds of semiconductors couple together, just form one " P-N knot " between them.
When electric current acted on this wafer by wire, electronics will be pushed to the P district, and then electronics will send energy with the form of photon, the luminous principle of LED that Here it is with hole-recombination in the P district.And light wavelength determines the color of light, determines by forming P-N knot material.
Correspondingly, the LED illumination utilizes the solid semiconductor chip as luminescent material, by carrier compound energy of emitting surplus occuring causes photo emissions in semiconductor, directly send red, yellow, blue, green light, on this basis, utilize the principle of three primary colours, add fluorescent material, can send the light of the random color such as red, yellow, blue, green, blue or green, orange, purple, white.The LED illuminating product utilizes LED as the produced ligthing paraphernalia of light source exactly.
But because the LED illumination can use fluorescent material, when LED illumination component or LED illuminating device were scrapped, the fluorescent material of scrapping polluted the environment.
Therefore, hope can provide a kind of fluorescent material that can reduce when the LED illuminating device is scrapped to LED illuminating device and the LED lighting apparatus of the pollution of environment.
Summary of the invention
Technical problem to be solved by this invention is for there being defects in the prior art, and providing a kind of can reduce fluorescent material to the LED lighting apparatus of the pollution of environment when the LED illuminating device is scrapped.
In order to realize purpose of the present invention, a kind of LED lighting apparatus is provided, comprising:
1) support member; And
2) LED illuminating device comprises: led chip unit, base board unit and cap unit;
Wherein, described led chip cell layout is on described base board unit, and described cap unit is removably mounted on the described base board unit in the mode that covers the described led chip of parcel unit, so that do not have the space between described cap unit and described led chip unit and the described base board unit;
Wherein, described led chip unit has the first height;
Wherein, described cap unit comprises sidewall sections and top section, wherein said sidewall sections and described top section form as a whole, and wherein said sidewall sections is light tight, and wherein, described top section have printing opacity ground floor, be used for holding the second layer of fluorescent material and the 3rd layer of printing opacity, and wherein, described ground floor and described the 3rd layer are clipped in the middle the described second layer, and fluorescent material is evenly arranged in the second layer;
And wherein, when described cap unit is installed in described base board unit and on the direction of described base board unit Surface Vertical, the described sidewall sections of described cap unit be the 3rd distance away from the end of described top section to the distance of the inner surface of the close described sidewall sections of described top section;
Wherein, described base board unit has the groove part corresponding with the profile of the described sidewall sections of described cap unit, the width of the described sidewall sections of wherein said cap unit equals the width of the described groove part of described base board unit, and wherein, described groove part has second degree of depth;
And wherein, the size of described the 3rd distance equals the size of described second degree of depth and the big or small sum of described the first height.
Preferably, the sidewall sections of described cap unit is Heat Conduction Material.
Preferably, the sidewall sections of described cap unit is metal material.
Preferably, the ground floor of the top section of described cap unit and the 3rd layer are plastic material.
By said structure of the present invention, the fluorescent material in the second layer is evenly arranged, thereby so that the light that the photon that the led chip unit is launched and fluorescent material effect produce is gentle, and be conducive to prevent for example ultraviolet leakage.On the other hand because cap unit can unload from the base board unit substrate, so can be when led chip damages, only replace led chip and still use same cap unit, thus can be because of not abandoning fluorescent material in the cap unit contaminated environment.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the overall profile according to the LED illuminating device of the embodiment of the invention.
Fig. 2 schematically shows the overall top view according to the LED illuminating device of the embodiment of the invention.
Fig. 3 schematically shows the cutaway view according to the led chip unit of the LED illuminating device of the embodiment of the invention.
Fig. 4 schematically shows the cutaway view according to the base board unit of the LED illuminating device of the embodiment of the invention.
Fig. 5 schematically shows the cutaway view according to the cap unit of the LED illuminating device of the embodiment of the invention.
Need to prove that accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Notice that the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar element indicates identical or similar label.
The specific embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
Fig. 1 schematically shows the overall profile according to the LED illuminating device of the embodiment of the invention.
As shown in Figure 1, the LED illuminating device according to the embodiment of the invention comprises: led chip unit 1, base board unit 2 and cap unit 3.
Wherein, led chip unit 1 is arranged on the base board unit 2, and cap unit 3 is removably mounted on the base board unit 2 in the mode that covers parcel led chip unit 1, so that do not have the space between cap unit 3 and led chip unit 1 and the base board unit 2.
Thus, because the close contact between led chip unit 1, base board unit 2 and the cap unit 3 can utilize cap unit 3 that led chip unit 1 is mounted to base board unit 2 securely.
Fig. 2 schematically shows the overall top view according to the LED illuminating device of the embodiment of the invention.As shown in Figure 2, wherein show base board unit 2 and cap unit 3 is the situation of holding, but obviously base board unit 2 and cap unit 3 also can be other shapes.
Fig. 3 schematically shows the cutaway view according to the led chip unit of the LED illuminating device of the embodiment of the invention.
As shown in Figure 3, the chip unit that forms for having rule according to the led chip unit 1 of the LED illuminating device of the embodiment of the invention.For example, led chip unit 1 is a rectangle or circular core blade unit.
Wherein, led chip unit 1 has the first height h1.
Fig. 5 schematically shows the cutaway view according to the cap unit 3 of the LED illuminating device of the embodiment of the invention.
As shown in Figure 5, the cap unit 3 according to the LED illuminating device of the embodiment of the invention comprises sidewall sections 31 and top section 32.Wherein, described sidewall sections 31 is light tight.Wherein, top section 32 have printing opacity ground floor 321, be used for holding the second layer 322 of fluorescent material and the 3rd layer 323 of printing opacity.And wherein, ground floor 321 and the 3rd layer 323 are clipped in the middle the second layer 322.
Described sidewall sections 31 and described top section 32 form as a whole.
Preferably, the ground floor 321 of the top section 32 of the cap unit 3 of LED illuminating device and the 3rd layer 323 are plastic material, thereby can reduce the manufacturing cost of LED illuminating device.
By said structure, the fluorescent material in the second layer 322 is evenly arranged, thereby so that the light that the photon that led chip unit 1 is launched and fluorescent material effect produce is gentle, and be conducive to prevent for example ultraviolet leakage.On the other hand because cap unit 3 can unload from base board unit 2 substrates, so can be when led chip damages, only replace led chip and still use same cap unit 3, thus can be because of not abandoning fluorescent material in the cap unit 3 contaminated environment.
Wherein, when cap unit 3 is installed in base board unit 2 and on the direction of base board unit 2 Surface Verticals, the sidewall sections 31 of cap unit 3 is the 3rd distance h 3 away from the end of top section 32 to the distance of the inner surface of the close sidewall sections 31 of top section 32.
The width of the described sidewall sections 31 of wherein said cap unit 3 equals the width of the described groove part 21 of described base board unit 2.
Fig. 4 schematically shows the cutaway view according to the base board unit 2 of the LED illuminating device of the embodiment of the invention.
As shown in Figure 4, have the groove part 21 corresponding with the profile of the sidewall sections 31 of described cap unit 3 according to the base board unit 2 of the LED illuminating device of the embodiment of the invention.Wherein, groove part 21 has the second degree of depth h2.
Wherein, the size of the 3rd distance h 3 equals the size of the second degree of depth h2 and the big or small sum of the first height h1.
That is, h3=h2+h1.
Preferably, the sidewall sections 31 of described cap unit 3 is Heat Conduction Material, metal material for example, thus be conducive to the heat radiation of led chip unit 1.
The LED lighting apparatus comprises above-mentioned LED illuminating device and support member.As it will be appreciated by those skilled in the art that as long as support member plays a supporting role, it does not play the effect of the present invention that limits.
Be understandable that although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (4)
1. LED lighting apparatus is characterized in that comprising:
1) support member; And
2) LED illuminating device comprises: led chip unit, base board unit and cap unit;
Wherein, described led chip cell layout is on described base board unit, and described cap unit is removably mounted on the described base board unit in the mode that covers the described led chip of parcel unit, so that do not have the space between described cap unit and described led chip unit and the described base board unit;
Wherein, described led chip unit has the first height;
Wherein, described cap unit comprises sidewall sections and top section, wherein said sidewall sections and described top section form as a whole, and wherein said sidewall sections is light tight, and wherein, described top section have printing opacity ground floor, be used for holding the second layer of fluorescent material and the 3rd layer of printing opacity, and wherein, described ground floor and described the 3rd layer are clipped in the middle the described second layer, and fluorescent material is evenly arranged in the second layer;
And wherein, when described cap unit is installed in described base board unit and on the direction of described base board unit Surface Vertical, the described sidewall sections of described cap unit be the 3rd distance away from the end of described top section to the distance of the inner surface of the close described sidewall sections of described top section;
Wherein, described base board unit has the groove part corresponding with the profile of the described sidewall sections of described cap unit, the width of the described sidewall sections of wherein said cap unit equals the width of the described groove part of described base board unit, and wherein, described groove part has second degree of depth;
And wherein, the size of described the 3rd distance equals the size of described second degree of depth and the big or small sum of described the first height.
2. LED lighting apparatus according to claim 1 is characterized in that, the sidewall sections of described cap unit is Heat Conduction Material.
3. LED lighting apparatus according to claim 2 is characterized in that, the sidewall sections of described cap unit is metal material.
4. LED lighting apparatus according to claim 1 and 2 is characterized in that, the ground floor of the top section of described cap unit and the 3rd layer are plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210568766.0A CN103062653B (en) | 2012-12-24 | 2012-12-24 | Light emitting diode (LED) illuminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210568766.0A CN103062653B (en) | 2012-12-24 | 2012-12-24 | Light emitting diode (LED) illuminating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103062653A true CN103062653A (en) | 2013-04-24 |
| CN103062653B CN103062653B (en) | 2015-07-08 |
Family
ID=48105417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210568766.0A Expired - Fee Related CN103062653B (en) | 2012-12-24 | 2012-12-24 | Light emitting diode (LED) illuminating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103062653B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105222072A (en) * | 2014-10-24 | 2016-01-06 | 成都世纪光合作用科技有限公司 | Long-range high-power Dimmable lighting device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030156416A1 (en) * | 2002-02-21 | 2003-08-21 | Whelen Engineering Company, Inc. | Led light assembly |
| US6796680B1 (en) * | 2000-01-28 | 2004-09-28 | Lumileds Lighting U.S., Llc | Strip lighting |
| CN101487581A (en) * | 2008-01-17 | 2009-07-22 | 富士迈半导体精密工业（上海）有限公司 | LED light source module |
| CN202307890U (en) * | 2011-11-09 | 2012-07-04 | 深圳市灏天光电有限公司 | Novel integrated high-power LED (light-emitting diode) packaging structure |
-
2012
- 2012-12-24 CN CN201210568766.0A patent/CN103062653B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6796680B1 (en) * | 2000-01-28 | 2004-09-28 | Lumileds Lighting U.S., Llc | Strip lighting |
| US20030156416A1 (en) * | 2002-02-21 | 2003-08-21 | Whelen Engineering Company, Inc. | Led light assembly |
| CN101487581A (en) * | 2008-01-17 | 2009-07-22 | 富士迈半导体精密工业（上海）有限公司 | LED light source module |
| CN202307890U (en) * | 2011-11-09 | 2012-07-04 | 深圳市灏天光电有限公司 | Novel integrated high-power LED (light-emitting diode) packaging structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105222072A (en) * | 2014-10-24 | 2016-01-06 | 成都世纪光合作用科技有限公司 | Long-range high-power Dimmable lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103062653B (en) | 2015-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6478964B2 (en) | Wavelength conversion material and use thereof | |
| JP6616065B2 (en) | Light emitting module and lighting device related thereto | |
| JP2022002328A (en) | Light emitting module and manufacturing method thereof | |
| US8350280B2 (en) | Light emitting diode with light conversion | |
| CN204204899U (en) | A kind of high-color rendering white-light exempts from packaged LED | |
| CN104976547A (en) | Light emitting diode assembly and light emitting diode bulb using same | |
| JP2015022859A (en) | Luminaire | |
| CN103062653B (en) | Light emitting diode (LED) illuminating device | |
| CN103820118B (en) | Phosphor composition and the light emitting device packaging piece with this phosphor composition | |
| TW201644068A (en) | Light-emitting structure, lamp and backlight module | |
| CN101872819A (en) | Yellow light emitting diode and light emitting device | |
| CN103175001B (en) | Light-emitting diode (LED) lighting component | |
| CN204680689U (en) | Light-emitting device, illumination light source and lighting device | |
| CN105280622A (en) | LED packaging structure and light emitting device | |
| CN205508869U (en) | Side -emitting LED chip | |
| CN103050489B (en) | LED (Light Emitting Diode) illuminating device | |
| TWI469316B (en) | Led lighting device | |
| CN204345536U (en) | A kind of quanta point material light guide plate of side entrance back module | |
| CN105336733A (en) | LED package structure and light-emitting device | |
| CN102937252A (en) | LED (light emitting diode) lighting equipment | |
| US20130228811A1 (en) | Light source device having light emitting diode | |
| CN102983126B (en) | Led luminous chip array packaging structure | |
| CN202178294U (en) | Fluorescent plate | |
| CN204204854U (en) | Tunable optical COB light source module | |
| CN209087797U (en) | A kind of transfer base substrate and substrate volume |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20181224 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |