CN103063081B - Shape memory alloy driven thermal switch - Google Patents
Shape memory alloy driven thermal switch Download PDFInfo
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- CN103063081B CN103063081B CN201210579588.1A CN201210579588A CN103063081B CN 103063081 B CN103063081 B CN 103063081B CN 201210579588 A CN201210579588 A CN 201210579588A CN 103063081 B CN103063081 B CN 103063081B
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Abstract
The invention relates to a shape memory alloy driven thermal switch which comprises a heat conduction cylinder, a central support, a heat insulation cylinder and a heat conduction belt. The central support is arranged in the heat conduction cylinder, the heat conduction belt is arranged on the heat conduction cylinder and fixed on the upper portion of the central support, the heat insulation cylinder is arranged at an inner edge of the upper end of the heat conduction cylinder, and a bottom cover is arranged at the bottom of the heat conduction cylinder. The central support is of a boss-shaped hollow structure, a polarization spring is arranged in a cavity of the central support, a lower section boss of the central support is in clearance fit with the cavity of the bottom cover, and a shape memory alloy spring is sleeved at the periphery of the central support. The shape memory alloy driven thermal switch uses memory effects of shape memory alloy to integrate temperature sensing and driving functions and efficiently and rapidly achieve automatic control on heat flux, and the shape memory alloy driven thermal switch is good in adiabaticity during breaking, good in thermal conductivity after closing and capable of replacing a traditional temperature control device to be used in a special occasion and has advantages of being big in deflection, big in freedom degree of the deformation direction, capable of sharply deforming along changes of the temperature, high in power weight ratio and the like.
Description
Technical field
The present invention relates to a kind of Temperature-controlled appliance, be specifically related to the thermal switch that heat conductivility marmem fine and excellent heat insulating performance after disconnecting drives after a kind of closure.
Background technology
Thermal switch is a kind of by the thermal resistance of heat conduction approach being controlled to the heat transfer element of realizing active thermal control.Up to the present, thermal switch technology has had very great development, there is the multiple thermal switch based on different principle to obtain practical application, comprise that bimetal leaf drives thermal switch, low-grade fever intumescent thermal switch, paraffin to drive thermal switch, GAP TYPE thermal switch and memorial alloy thermal switch.These traditional thermal switch have many inherent defects, and as bimetal leaf thermal switch, structure is comparatively complicated, and the limited thermal contact resistance that causes of bimetallic driving force is larger; GAP TYPE thermal switch is mainly applicable under utmost point low temperature environment, very high to requirement on machining accuracy, higher to the seal request of device, complicated structure; If microdilatancy type cryogenic heat switch is used in the occasion of long-term closure, may there is cold welding, while causing disconnecting, cannot open.
Summary of the invention
The present invention be directed to a kind of novel thermal switch that traditional thermal control proposes with the existent defect of thermal switch, it adopts brand-new working mechanism, realizes the function that traditional thermal switch can not complete, and opens rear good adiabatic function, and closed rear thermal conductivity is fine and thrust is large.
the present invention is adopted following technical scheme by realizing its object: the thermal switch that a kind of marmem drives, comprise heat-conducting cylinder, central supported, adiabatic cylinder and thermal conductive belt, described central supported is placed in heat-conducting cylinder, described thermal conductive belt is placed on heat-conducting cylinder and is fixed on described central supported top, described adiabatic cylinder is placed in edge in heat-conducting cylinder upper end, and the bottom of described heat-conducting cylinder is provided with bottom; Described central supported is boss-shaped hollow structure, and its inner chamber is provided with bias spring, the hypomere boss of described central supported and described bottom inner chamber matched in clearance, and the periphery of described central supported is nested with shape memory alloy spring.
Described thermal conductive belt is fixed on movable block by clamp nut, and described movable block is nested with and is fixed on central supported top.
Between described shape memory alloy spring lower end and central supported, be provided with mat insulation.
Described bias spring and shape memory alloy spring are Compress Spring.
beneficial effect of the present invention: adopt marmem as driving material, temperature-sensitive is integrated with driving function, realize the efficient automatic control to heat flow rapidly, substitute the use of traditional attemperating unit at special occasions, the present invention has that deflection is large, the deformation direction free degree large, deformation, power-weight ratio high can sharply occur variation with temperature, and the less advantage of size is more remarkable, and its switch over travel scope is large, open rear thermal insulation good, and after closed, thermal conductivity is fine.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
The schematic diagram of thermal resistance when Fig. 2 is Fig. 1 switch closure;
The schematic diagram of thermal resistance when Fig. 3 is the disconnection of Fig. 1 switch.
In figure: 1, clamp nut, 2, movable block, 3, thermal conductive belt, 4, adiabatic cylinder, 5, shape memory alloy spring, 6, bias spring, 7, mat insulation, 8, central supported, 9, heat-conducting cylinder, 10, bottom.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
As shown in Figure 1, the present invention includes thermal conductive belt 3, movable block 2, central supported 8, heat-conducting cylinder 9, bottom 10 and adiabatic cylinder 4.Bottom 10 is located at heat-conducting cylinder 9 lower port, and both are threaded connection.Central supported 8 is placed in heat-conducting cylinder 9, it is three grades of boss-shaped hollow structures, be positioned at the inner chamber matched in clearance of hypomere boss and the bottom 10 of lower end, shape memory alloy spring 5 is placed in central supported 8, the upper end of shape memory alloy spring 5 is resisted against edge in the upper end of heat-conducting cylinder 9, and lower end abutment is on the mat insulation 7 of hypomere boss face of being located at central supported 8.Adiabatic cylinder 4 is arranged at edge in heat-conducting cylinder 9 upper ends, and central supported 8 stage casing boss are through adiabatic cylinder 4.In the cavity of bias spring 6 centerings supports 8, its upper end is resisted against on central supported 8 stage casing boss, and lower end abutment is on bottom 10.Movable block 2 is sheathed on central supported 8 epimere boss, and thermal conductive belt 3 is fixed on movable block 2 by clamp nut 1.Thermal conductive belt 3 is flexible thermal conductive belt.
The effect of clamp nut 1 is for fastening movable block and flexible thermal conductive belt, makes the two have good contact, is a kind of nonstandard special nut; The effect of heat-conducting cylinder is and equipment connection, and plays conductive force, adopts oxygen-free copper or red copper manufacture, has less thermal resistance, and inside has spring fixed seat structure to be used for fixing spring; Central supported is limited in the middle of adiabatic cylinder and bottom, is used for supporting and driving movable block, and be the shell structure that adopts titanium alloy to manufacture, there is high strength, large thermal resistance; Adiabatic cylinder, by heat-conducting cylinder and the isolation of central supported heat, adopts polytetrafluoroethylene (PTFE) manufacture, has lower thermal conductivity factor; The effect of memory alloy spring is to experience variations in temperature and closed required driving force is provided, and adopts one-way shape memory alloy material; Bias spring provides and disconnects required driving force, material selection carbon steel; The effect of bottom is to support bias spring, is threaded structure, can regulate by rotation bottom the decrement of bias spring.
In the present invention, between all parts, there are two kinds of connected modes: be threaded, matched in clearance contact.Between bottom and heat-conducting cylinder, be threaded connection, adopt fine thread, there is good modulability; Between central supported and bottom, be clearance fit relationship, only, radially spacing, axially can move freely; Between central supported and adiabatic cylinder, be clearance fit relationship, equally only, radially spacing, axially can move freely; Between adiabatic cylinder and heat-conducting cylinder, adopt interference fits to be connected, play heat-blocking action; Between clamp nut and central supported, adopt and be threaded, be fixed on thermal switch top.
When the present invention assembles, first outside central supported 8, put shape memory alloy spring 5, then have the central supported 8 of shape memory alloy spring 5 to be placed in heat-conducting cylinder 9 from heat-conducting cylinder 9 bottoms by cover.Adiabatic cylinder 4 is arranged at edge in heat-conducting cylinder 9 upper ends, and the stage casing boss of central supported 8 is through adiabatic cylinder 4.A mat insulation 7 is installed in the hypomere boss contact position of shape memory alloy spring 5 lower ends and central supported 8, bias spring 6 centerings are supported to 8 inner chambers, and seal and be fixed up with bottom 10, matched in clearance between the hypomere boss of central supported 8 and bottom 10 inner chambers, is convenient to central supported 8 and moves up and down.On central supported 8 epimere boss, put movable block 2, then a flexible thermal conductive belt 3 is enclosed within on movable block 2, finally with clamp nut 1, thermal conductive belt 3 is fixed.
The thermal resistance schematic diagram when the switch closed and disconnected of the present invention as shown in Figures 2 and 3, when the temperature of heat-conducting cylinder 9 raises gradually from lower temperature, arrive after the _ s of Austenite of shape memory alloy spring 5, the elastic modelling quantity of shape memory alloy spring 5 increases, it is large that spring rate becomes, thereby overcome the elastic force of bias spring 6, promoting movable block 2 moves downward, complete the closed action of thermal switch, now closed rear thrust is large, the thermal resistance of heat transfer path becomes very little, now thermal conductivity is best, the heat of realizing controlled object passes through heat-conducting cylinder successively, movable block, flexible thermal conductive belt outwards transmits.Otherwise, when the temperature of heat-conducting cylinder 9 reduces gradually, reach to shape after the martensitic phase height of memory alloy spring 5, the elastic modelling quantity of shape memory alloy spring 5 reduces, and spring rate reduces, and 6 of bias springs overcome the elastic force of shape memory alloy spring 5, promoting movable block 2 moves upward, complete and disconnect action, after now disconnecting, thermal conductivity is minimum, good adiabatic function.
Above embodiment is only in order to illustrate that technical scheme of the present invention is not intended to limit, although the present invention is had been described in detail with reference to above-described embodiment, those of ordinary skill in the field are to be understood that: still can modify or be equal to replacement the specific embodiment of the present invention, and do not depart from any modification of spirit and scope of the invention or be equal to replacement, it all should be encompassed in the middle of claim scope of the present invention.
Claims (5)
1. the thermal switch that marmem drives, it is characterized in that: comprise heat-conducting cylinder (9), central supported (8), adiabatic cylinder (4) and thermal conductive belt (3), described central supported (8) is placed in heat-conducting cylinder (9), described thermal conductive belt (3) is placed in heat-conducting cylinder (9) and goes up and be fixed on described central supported (8) top, described adiabatic cylinder (4) is placed in edge in heat-conducting cylinder (9) upper end, and the bottom of described heat-conducting cylinder (9) is provided with bottom (10); Described central supported (8) is boss-shaped hollow structure, its inner chamber is provided with bias spring (6), the hypomere boss of described central supported (8) and described bottom (10) inner chamber matched in clearance, the periphery of described central supported (8) is nested with shape memory alloy spring (5).
2. the thermal switch that marmem according to claim 1 drives, is characterized in that: it is upper that described thermal conductive belt (3) is fixed on movable block (2) by clamp nut (1), and described movable block (2) is nested with and is fixed on central supported (8) top.
3. the thermal switch that marmem according to claim 1 drives, is characterized in that: between described shape memory alloy spring (5) lower end and central supported (8), be provided with mat insulation (7).
4. the thermal switch that marmem according to claim 1 drives, is characterized in that: described bias spring (6) and shape memory alloy spring (5) are Compress Spring.
5. the thermal switch driving according to the marmem described in claim 1-4 any one, is characterized in that: described heat-conducting cylinder adopts oxygen-free copper or red copper manufacture; Described central supported adopts titanium alloy manufacture; Described adiabatic cylinder, by heat-conducting cylinder and the isolation of central supported heat, adopts polytetrafluoroethylene (PTFE) manufacture; Described shape memory alloy spring adopts one-way shape memory alloy material; Described bias spring provides and disconnects required driving force, material selection carbon steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210579588.1A CN103063081B (en) | 2012-12-28 | 2012-12-28 | Shape memory alloy driven thermal switch |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210579588.1A CN103063081B (en) | 2012-12-28 | 2012-12-28 | Shape memory alloy driven thermal switch |
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| CN103063081A CN103063081A (en) | 2013-04-24 |
| CN103063081B true CN103063081B (en) | 2014-06-11 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10365049B2 (en) | 2015-07-14 | 2019-07-30 | The Hong Kong University Of Science And Technology | Passive thermal diode |
| CN109441430B (en) * | 2018-12-05 | 2022-02-08 | 西安石油大学 | Device for cooling electronic device in logging tool |
| CN109520368A (en) * | 2018-12-25 | 2019-03-26 | 中国科学院理化技术研究所 | A kind of thermal switch |
| CN110925683B (en) * | 2019-12-18 | 2022-01-18 | 佛山喜运高科技有限公司 | Energy-saving intelligent fire-fighting emergency lamp |
| CN111288415A (en) * | 2020-03-17 | 2020-06-16 | 浙江理工大学 | Electronic type adjustment rotating lampshade |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3717201A (en) * | 1971-04-30 | 1973-02-20 | Cryogenic Technology Inc | Cryogenic thermal switch |
| CN2158523Y (en) * | 1993-05-07 | 1994-03-09 | 中国科学院上海技术物理研究所 | Controlling device for low temp. heat medium |
| CN203067909U (en) * | 2012-12-28 | 2013-07-17 | 中国电子科技集团公司第十六研究所 | Thermal switch driven by shape memory alloy |
-
2012
- 2012-12-28 CN CN201210579588.1A patent/CN103063081B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3717201A (en) * | 1971-04-30 | 1973-02-20 | Cryogenic Technology Inc | Cryogenic thermal switch |
| CN2158523Y (en) * | 1993-05-07 | 1994-03-09 | 中国科学院上海技术物理研究所 | Controlling device for low temp. heat medium |
| CN203067909U (en) * | 2012-12-28 | 2013-07-17 | 中国电子科技集团公司第十六研究所 | Thermal switch driven by shape memory alloy |
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