CN103162100A - Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip - Google Patents
Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip Download PDFInfo
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- CN103162100A CN103162100A CN2011104038536A CN201110403853A CN103162100A CN 103162100 A CN103162100 A CN 103162100A CN 2011104038536 A CN2011104038536 A CN 2011104038536A CN 201110403853 A CN201110403853 A CN 201110403853A CN 103162100 A CN103162100 A CN 103162100A
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Abstract
The invention discloses a method for integration packaging of an alternating current or direct current light-emitting diode (LED) light source by a formal structure LED chip. According to the formal structureLED chip, a P electrode (positive electrode) and an N electrode (negative electrode) are both on the light emitting surface of the LED chip. The method for the integration packaging of the alternating current or direct current LED light source by the formal structure LED chip has the advantages that sizes and weights of LED lamps and lanterns can be reduced, costs and designing difficulty of the LED lamps and lanterns can be reduced, light emitting stability of the LED light source is improved, LED luminous flux is increased, and brightness of the LED lamps and lanterns is improved.
Description
Technical field
The present invention relates to that a kind of formal dress structure LED chip integration packaging becomes to exchange or the method for direct-current LED light source, this formal dress structure LED chip refers to coexist LED chip on the LED chip exiting surface of P electrode (being positive electrode) and N electrode (being negative electrode).
Background technology
What LED encapsulation was adopted except several companies is the LED chip encapsulation (as: CREE, OSRAM) of vertical stratification, and most what adopt is that the LED chip of positive assembling structure encapsulates, but its LED light source that encapsulates is all the employing low-voltage DC supply.In our life, power supply commonly used is AC power, is restricted will for like this LED light source in the application of light fixture.Method commonly used is exactly to be equipped with suitable LED driving power on light fixture now, although solved the powerup issue of LED light source, has but increased the cost of light fixture, the weight and volume of light fixture and life-span and the stability of light fixture.
Summary of the invention
One of purpose of the present invention is: a kind of method that the LED chip integration packaging of positive assembling structure is become alternating current LED light source is provided, and then the method is applied to actual LED encapsulation, produce alternating current LED light source, reduce on the one hand the cost of LED light fixture, reduce the volume and weight of LED light fixture, increase the centrality of LED light source bright dipping and the soften of bright dipping, reduce the difficulty of LED light source luminous intensity distribution in lamp applications; Reduce on the other hand the design difficulty of light fixture, improve lamp life.
Two of purpose of the present invention is: a kind of method that the LED chip integration packaging of positive assembling structure is become the direct-current LED light source is provided, and the LED light source that adopts the method to encapsulate, thereby increase the luminous flux of LED light source, improve the centrality of LED light source bright dipping and the soften of bright dipping, reduce the luminous intensity distribution difficulty of LED light source in lamp applications, improve the brightness of light fixture.
One of purpose of the present invention can realize by following four kinds of technical schemes:
1. technical scheme ()
A. design and produce the LED support for encapsulation
a. make LED support pedestal 1, as Fig. 1 a-1, 1a-2, 1b-1, 1b-2, 1c-1, 1c-2, 1d-1, 1d-2, adopt high-thermal conductive metal material (as: gold, silver, copper, aluminium etc.) or high heat conductive carbon/metal composite material (as: yellow gold, albronze etc.) or high heat conduction nonmetallic materials (as: pottery etc.) or high-thermal conductive metal and nonmetallic composite (as: copper and nanometer carbon pipe composite material, aluminium and purification graphite composite material etc.) or other highly heat-conductive material making LED support pedestal 1, make the cup 2 of chip placement in the center upper surface of pedestal 1, referred to as the die bond cup, in the surrounding of pedestal 1 (as Fig. 1 a-2, 1c-2) or central lower surface (as Fig. 1 b-2, 1d-2) make fixing hole 3 or screw rod 4 or the screw 5 of fixed L ED support.
B. make LED support lead-in wire part 6, as Fig. 1 a-1,1a-2,1b-1,1b-2,1c-1,1c-2,1d-1,1d-2, the insulating frame 7 that this lead-in wire spare 6 is made by resistant to elevated temperatures insulating materials and the electrode slice 8 of being made by the good metal material of high heat-conductivity conducting performance (as: gold, silver, copper, aluminium etc.) or the good metallic composite (as: yellow gold, aerdentalloy etc.) of high heat-conductivity conducting performance or the good nonmetallic materials of other high heat-conductivity conducting performance or composite form.8 at least 2 of electrode slices all are positioned at the middle part of insulating frame 7, and an end of electrode slice 8 is near die bond cup 2 or in the inside of die bond cup 2, so as with LED chip between be electrically connected to, be called the second solder joint 10; The other end of electrode slice 8 is away from die bond cup 2 or in the outside of die bond cup 2, so as with external power source between be electrically connected to, be called electrode 11.
C. the assembly and connection between pedestal 1 and lead frame 6
As Fig. 1 a-1,1a-2,1b-1,1b-2,1c-1,1c-2,1d-1,1d-2, can all can by the bonding alternate manner that fits together or adopt high temperature hot pressing or directly adopt the high temperature ejection formation maybe both are combined closely of resistant to elevated temperatures glue between pedestal 1 and lead frame 6.
Except adopting above LED support, also can be according to actual conditions, adopt the conventional LED support in market or design the support of other profile.
B. according to the supply voltage of designed alternating current LED light source, determine the quantity of series LED chip 9.
Its concrete grammar is as follows: at first determine the supply voltage U of LED light source and the average pressure drop VF of selected chip 9, then use supply voltage U divided by the average pressure drop VF of LED chip 9, be the LED chip quantity N of required series connection, generally calculate gained quantity and round.
Alternating current 220V as supply voltage U, the average pressure drop VF of selected LED chip 9 is 3.5V, and the quantity=220/3.5=62.85 of the LED chip 9 of required series connection rounds 63, here can suitably increase the quantity of LED chip 9, can be according to the actual conditions Self-adjustment.
C. according to the power W of designed alternating current LED light source
Light, determine the total quantity of LED chip 9 and the connected mode of LED chip.
Its concrete grammar is as follows: at first determine LED light source power W
LightAnd the power W of institute's menu LEDs chip 9
Core, then use LED light source power W
LightPower W divided by single LEDs chip 9
Core, be the total quantity N of required LED chip 9
Always, this quantity is generally got the integer larger than calculated value.
Determine the quantity N of series LED chip 9 and the power W of designed alternating current LED light source according to the supply voltage of designed alternating current LED light source
LightDetermine the total quantity N of LED chip 9
AlwaysAfterwards, the also joint group that can calculate thus LED chip is counted M, i.e. M=N
Always/ N.The connected mode of the LED chip of so designed alternating current LED light source is that N goes here and there M also.
[0013]Power W as LED light source
LightBe 3W, selected LED chip 9 is of a size of the little chip of 10mil*23mil, and the specified input current of this chip is 20mA, and voltage is 3.0-3.4V, is averaged voltage 3.2V, and its power is 0.064W, quantity=the W of required LED chip 9
Light/ W
Core=3/0.064=46.875 rounds and is 47.Here can flexible, can according to actual conditions, reduce the input current IF of LED chip 9, thereby reduce the power of LED chip 9, increase the quantity of LED chip 9, can guarantee so on the one hand the use safety of LED chip 9, can make on the other hand design more flexible and changeable.
D. the LED chip of arranging is also fixing.
connected mode according to above-mentioned definite LED chip, be that N goes here and there M also, at first at the placement location of the die bond cup 2 internal labeling LED chips 9 of LED support pedestal 1, the arrangement of all LED chips can be arranged according to matrix-style (as Fig. 2 a) or interlace mode arranges (as Fig. 2 b) or watermelon line mode is arranged (as Fig. 2 c) or other can make the LED light source bright dipping even, the mode of uniform heat distribution is arranged, then adopt the glue of the good elargol of heat conductivility or other good heat conductivity or material or adopt the eutectic welding manner or alternate manner is fixed to LED support die bond cup 2 interior corresponding position with LED chip 9, then will be electrically connected to gold thread 13 or silver-colored line 14 or the good material of other electric conductivity between LED chip 9 and LED chip 9 and between the second solder joint 10 on LED chip 9 and electrode slice 8, on reaching, the surrounding of LED chip 9 seals up silica gel or epoxy resin or other light transmission good glue or material at last, can obtain the alternating current LED light source of integration packaging.If needed LED light source is white light, should be before sealing, sealing again after fluorescent material is coated on the surface of LED chip 9 is if monochromatic light directly carries out sealing and gets final product.In the arrangement mode of above-mentioned LED chip 9, the P electrode (positive electrode) of all LED chips 9 must be on electrode slice 8 positive pole of the second solder joint 10, the N electrode (negative electrode) of all LED chips 9 must be on electrode slice 8 negative pole of the second solder joint 10.
2. technical scheme (two)
Technical scheme (two) is the optimization process of carrying out on technical scheme (one's) basis.as Fig. 3 a, 3b, 3c, its main optimize the content is: increase the LED chip identical with technical scheme () LED chip 9 quantity used, then carry out positive reciprocal permutation, namely at first increase the LED chip 9 identical with technical scheme () quantity, then these LED chips 9 are together in series according to calculating required LED chip series connection quantity N, form LED chip series connection group, and guarantee the P electrode (namely anodal) of every group of LED chip of connecting 9 all in the same direction, N electrode (being negative pole) also all in the same direction, then these LED chip series connection groups all are fixed to LED chip 9 in LED support die bond cup 2 according to the fixed form in technical scheme (), its modes of emplacement is according to P electrode (namely anodal) positive pole of the second solder joint 10 on electrode slice 8 of first group of LED chip, the N electrode of first group of LED chip (being negative pole) negative pole of the second solder joint 10 on electrode slice 8, the P electrode of second group of LED chip (namely anodal) negative pole of the second solder joint on electrode slice 8, the N electrode of second group of LED chip (namely anodal) positive pole of the second solder joint on electrode slice 8, the modes of emplacement of the 3rd group of LED chip modes of emplacement with first group of LED chip is identical, the modes of emplacement of the 4th group of LED chip modes of emplacement with second group of LED chip is identical, and 2M organizes altogether, and the rest may be inferred.In fact, also the modes of emplacement of first group of LED chip can be made into the modes of emplacement of second group of LED chip, the modes of emplacement of second group of LED chip just makes the modes of emplacement of first group of LED chip into so; The modes of emplacement of the 3rd group of LED chip still modes of emplacement with first group of LED chip is identical, and the modes of emplacement of the 4th group of LED chip still modes of emplacement with second group of LED chip is identical, and 2M organizes altogether, and the rest may be inferred.
Place the LED chip group according to technique scheme, its group number is all even number, for the 2M group, odd number can not occur.
3. technical scheme (three)
Technical scheme (three) is the optimization process of carrying out on the basis of technical scheme () and technical scheme (two).As Fig. 4 a-1,4a-2,4a-3,4b-1,4b-2,4b-3,4c-1,4c-2,4c-3,5a, 5b, 5c, its main optimize the content is: increase electric capacity 12 on the basis of technical scheme () and technical scheme (two), and with these electric capacity 12 with LED chip 9 use gold threads or silver-colored line used or other electric conductivity is good and material that be convenient to weld is electrically connected to, its connected mode is in parallel.Electric capacity 12 and the parallel way of LED chip 9 used can be that each LED chip 9 electric capacity 12 in parallel or every N LED chip are composed in series LED chip and connect after group after an electric capacity 12 of parallel connection or every N LED chip be composed in series LED chip series connection group, in this series connection group, n LED chip is in parallel (here with electric capacity 12 again, N is the integral multiple of n), can carry out designed, designed according to actual conditions.
Above-mentioned electric capacity 12 is generally chosen the little patch capacitor of volume or other and is convenient to be installed on electric capacity on LED support.In the design process of reality, the magnitude of voltage of selected electric capacity 12 should be higher than the magnitude of voltage of LED light source use, as design a kind of LED light source that can use under the alternating current 220V condition of power supply, the magnitude of voltage of selected electric capacity 12 should be higher than 220V, and can select magnitude of voltage is that the electric capacity of 300V left and right carries out in parallel with LED chip 9.The magnitude of voltage of electric capacity 12 can suitably be chosen according to the application of reality.The volume of electric capacity 12 can be chosen after calculating with the time of quantity, power and the required power supply of the LED chip of Capacitance parallel connection in design process.
4. technical scheme (four)
Technical scheme (four) is the optimization process of carrying out on the basis of technical scheme (), technical scheme (two) and technical scheme (three).As Fig. 6 a, 6b, 6c, 6d, 6e, 6f, its main optimize the content is: increase the electronic devices and components of resistance or current regulator diode or rectifier bridge or commutation diode or other energy current limliting or constant current or rectification on the basis of technical scheme (), technical scheme (two) and technical scheme (three), hereinafter to be referred as the permanent rectifying component 17 that is limited.The permanent rectifying component 17 of this limit is to adopt gold thread or silver-colored line or other to conduct electricity very well and the material being convenient to weld is electrically connected to the second solder joint 10 on LED chip 9 or electrode slice 8, its with the connected mode of LED chip 9 for connecting.
The permanent rectifying component 17 of this limit can use one or more in each LED light source.Use one be with the permanent rectifying component 17 of this limit be positioned over LED chip 9 foremost or rearmost end (as Fig. 6 a, 6c, 6e) connect with all LED chips, with restriction or the total current of stable LED chip; Using a plurality of is group number according to designed all chips in parallel of LED light source, and one of series connection should the permanent rectifying component 17(of limit such as Fig. 6 b, 6d, 6f in every group), also can connect several, as long as can reach the effect of current limliting or constant current or rectification.
This limits permanent rectifying component 17 in actual applications, and the current limliting required according to LED chip 9 or constant current or rectification effect are selected.
The current limliting that the permanent rectifying component 17 of this limit reaches or the effect of constant current or rectification are: guarantee LED chip 9 in use, be less than or equal to the rated current of LED chip 9 to the supply current of LED chip 9.In fact here can flexible, can make Self-adjustment according to the needs of practical application, namely supply current can equal the rated current of LED chip 9 less than the rated current of LED chip 9, also can be suitably greater than the rated current of LED chip 9.
the technology that provides according to technical scheme () or technical scheme (two) or technical scheme (three) or technical scheme (four) is with LED chip 9 and other electronic devices and components (as: electric capacity, resistance, current regulator diode, rectifier bridge etc.) be fixed after arranging, then carry out bonding wire, namely to adopt gold thread or silver-colored line or other material that conducts electricity very well with between LED chip 9 and LED chip 9, on LED chip 9 and electrode slice 8 between the second solder joint 10, between LED chip 9 and electric capacity 12, between LED chip 9 and the permanent rectifying component 17 of limit, on electric capacity 12 and electrode slice 8 between the second solder joint 10, limit on permanent rectifying component 17 and electrode slice 8 and be electrically connected between the second solder joint 10, then the semi-finished product of bonding wire being completed carry out the sealing processing can produce the finished product LED light source.Here illustrate, if encapsulation is the monochromatic light LED light source, the direct sealing of the semi-finished product of bonding wire being completed is processed and just can be produced the monochromatic light LED light source; If encapsulation is white LED light source, be coated with fluorescent material before sealing, then carry out sealing, can produce white LED light source.
Two of purpose of the present invention can be achieved through the following technical solutions:
A. design and produce the LED support for encapsulation
a. make LED support pedestal 1, as Fig. 1 a-1, 1a-2, 1b-1, 1b-2, 1c-1, 1c-2, 1d-1, 1d-2, adopt high-thermal conductive metal material (as: gold, silver, copper, aluminium etc.) or high heat conductive carbon/metal composite material (as: yellow gold, albronze etc.) or high heat conduction nonmetallic materials (as: pottery etc.) or high-thermal conductive metal and nonmetallic composite (as: copper and nanometer carbon pipe composite material, aluminium and purification graphite composite material etc.) or other highly heat-conductive material making LED support pedestal 1, make the cup 2 of chip placement in the center upper surface of pedestal 1, referred to as the die bond cup, in the surrounding of pedestal 1 (as Fig. 1 a-2, 1c-2) or central lower surface (as Fig. 1 b-2, 1d-2) make fixing hole 3 or screw rod 4 or the screw 5 of fixed L ED support.
B. make LED support lead-in wire part 6, as Fig. 1 a-1,1a-2,1b-1,1b-2,1c-1,1c-2,1d-1,1d-2, the insulating frame 7 that this lead-in wire spare 6 is made by resistant to elevated temperatures insulating materials and the electrode slice 8 of being made by the good metal material of high heat-conductivity conducting performance (as: gold, silver, copper, aluminium etc.) or the good metallic composite (as: yellow gold, aerdentalloy etc.) of high heat-conductivity conducting performance or the good nonmetallic materials of other high heat-conductivity conducting performance or composite form.8 at least 2 of electrode slices all are positioned at the middle part of insulating frame 7, and an end of electrode slice 8 is near die bond cup 2 or in the inside of die bond cup 2, so as with LED chip between be electrically connected to, be called the second solder joint 10; The other end of electrode slice 8 is away from die bond cup 2 or in the outside of die bond cup 2, so as with external power source between be electrically connected to, be called electrode 11.
C. the assembly and connection between pedestal 1 and lead frame 6
As Fig. 3 a-1,3a-2,3b-1,3b-2,3c-1,3c-2,3d-1,3d-2, can all can by the bonding alternate manner that fits together or adopt high temperature hot pressing or directly adopt the high temperature ejection formation maybe both are combined closely of resistant to elevated temperatures glue between pedestal 1 and lead frame 6.
Except adopting above LED support, also can be according to actual conditions, adopt the conventional LED support in market or design the support of other profile.
B. the connected mode of determining between LED chip according to rated operational voltage VF, rated operational current IF and the selected LED chip 9 of designed LED light source.
its concrete grammar is as follows: at first the rated operational current IF according to designed LED light source chooses LED chip 9, the rated operational current IF of the LED light source that general warranty is designed is the integral multiple of selected LED chip 9 rated current or all can than the integral multiple of selected LED chip 9 rated current is smaller or bigger, also can be little more a lot of than the integral multiple of the rated current of selected LED chip 9, but can not be more much larger than the integral multiple of LED chip 9 rated current of choosing, can increase the temperature of LED chip itself so on the one hand, can reduce the light extraction efficiency of LED chip itself on the other hand.
After selected LED chip, according to the rated operational voltage VF of designed LED light source, determine that LED chip 9 needs the quantity N of the LED chip of series connection; Rated operational current IF according to designed LED light source, determine that the LED chip group of LED chip 9 required parallel connections counts M, the connected mode of so designed LED light source is that N goes here and there M also, namely first the every N of selected LED chip 9 LED chip is together in series, and then selects the M group in parallel the series connection group of N chip.
C. the LED chip of arranging is also fixing.
connected mode according to above-mentioned definite LED chip 9, N string M also, at first at the placement location of the die bond cup 2 internal labeling LED chips 9 of LED support pedestal 1, the arrangement of all LED chips can be arranged according to matrix-style (as Fig. 4 a) or interlace mode arranges (as Fig. 4 b) or watermelon line mode is arranged (as Fig. 4 c) or other can make the LED light source bright dipping even, the mode of uniform heat distribution is arranged, then adopt the glue of the good elargol of heat conductivility or other good heat conductivity or material or adopt the eutectic welding manner or alternate manner is fixed to LED support die bond cup 2 interior corresponding position with LED chip 9, then will be electrically connected to gold thread 13 or silver-colored line 14 or the good material of other electric conductivity between LED chip 9 and LED chip 9 and between the second solder joint 10 on LED chip 9 and electrode slice 8, on reaching, the surrounding of LED chip 9 seals up silica gel or epoxy resin or other light transmission good glue or material at last, can obtain the direct-current LED light source of integration packaging.If needed LED light source is white light, should be before sealing, sealing again after fluorescent material is coated on the surface of LED chip 9 is if monochromatic light directly carries out sealing and gets final product.In the arrangement mode of above-mentioned LED chip 9, the P electrode (positive electrode) of all LED chips 9 must be on electrode slice 8 positive pole of the second solder joint 10, the N electrode (negative electrode) of all LED chips 9 must be on electrode slice 8 negative pole of the second solder joint 10.
The invention has the advantages that:
1. adopt formal dress structure LED chip integration packaging provided by the invention to become the method for alternating current LED light source, because the supply voltage value of the magnitude of voltage of the LED chip of connecting and power supply used approaches, so can directly be connected use with power supply, and do not need to join the LED driving power, thereby can reduce the volume and weight of LED light fixture, reduce cost and the design difficulty of LED light fixture.
2. adopt formal dress structure LED chip integration packaging provided by the invention to become the method for alternating current LED light source, improved the photostability that of LED light source, increased the luminous flux of LED light source.Family expenses power supplies and civil power are all alternating currents, and its voltage direction changes not stopping.And LED chip is semiconductor element, and semiconductor element is all forward conduction, and backward stop for LED chip, is namely that P electrode (being positive electrode) adds forward voltage, and N electrode (being negative electrode) adds negative voltage, and LED chip just can be luminous.And the voltage direction of alternating current is not stop change, causes LED chip in the situation that voltage reversal is can be not luminous, flicker occurs.The present invention has adopted two kinds of methods to avoid this drawback, and the one, the LED chip that increases equivalent amount is oppositely placed; The 2nd, at LED chip side shunt capacitance.Adopt one or both use all in above two kinds of methods, can guarantee that all LED chip continues luminous, flicker can not occur, thereby improved the photostability that of LED light source.Increase the LED chip of equivalent amount, can increase undoubtedly the luminous flux of LED.
3. adopt formal dress structure LED chip integration packaging provided by the invention to become the method for alternating current LED light source, increased stability and the reliability of LED.All LED chips dispatch from the factory, the given load current value of LED chip producer meeting, use LED chip in this load current value scope, any problem can not appear, but surpassed the given load current value of producer, may cause the appearance of the bad problems such as LED light source burns, variable color, light decay.And family expenses or civil power are all alternating currents, and its power supply is extremely unstable, and the present invention adopts the components and parts of series resistance or current regulator diode or rectifier bridge or commutation diode or other energy current limliting or constant current or rectification, to improve stability and the reliability of LED light source.
4. adopt formal dress structure LED chip integration packaging provided by the invention to become the method for direct-current LED light source, can improve the total light flux of LED light source, improve the centrality of LED light source bright dipping and the soften of bright dipping, reduce the luminous intensity distribution design difficulty of LED light source in lamp applications, improve the brightness of LED light fixture.
Description of drawings:
Fig. 1 a-1 is LED flat bracket sectional view provided by the invention;
Fig. 1 a-2 is LED flat bracket plane provided by the invention;
Fig. 1 b-1 is LED screw bracket sectional view provided by the invention;
Fig. 1 b-2 is LED screw bracket plane provided by the invention;
Fig. 1 c-1 is LED wiring board support sectional view provided by the invention;
Fig. 1 c-2 is LED wiring board support plane provided by the invention;
Fig. 1 d-1 is LED screw support sectional view provided by the invention;
Fig. 1 d-2 is LED screw support plane provided by the invention;
Fig. 2 a is the plane that the present invention arranges according to technical scheme () LED chip N string M and unidirectional matrix-style;
Fig. 2 b is the plane that the present invention arranges according to technical scheme () LED chip N string M and unidirectional interlace mode;
Fig. 2 c is the plane that the present invention arranges according to technical scheme () LED chip N string M and unidirectional watermelon line mode;
Fig. 3 a is that the present invention is according to technical scheme (two) LED chip N string 2M and the positive and negative plane that interlocks and press the matrix-style arrangement;
Fig. 3 b is that the present invention is according to technical scheme (two) LED chip N string 2M and the positive and negative plane that interlocks and press the interlace mode arrangement;
Fig. 3 c is the present invention according to technical scheme (two) LED chip N string 2M and the positive and negative staggered and plane arranged by watermelon line mode;
Fig. 4 a-1 is that the present invention is according to technical scheme (three) LED chip N string M and plane unidirectional and that each LED chip electric capacity in parallel is arranged by matrix-style;
To be the present invention press the plane of interlace mode arrangement according to technical scheme (three) LED chip N string M and unidirectional and each LED chip electric capacity in parallel to Fig. 4 a-2;
Fig. 4 a-3 is that the present invention is according to technical scheme (three) LED chip N string M and unidirectional and each LED chip plane that electric capacity is arranged by watermelon line mode in parallel;
Fig. 4 b-1 is that the present invention is according to technical scheme (three) LED chip N string M and plane unidirectional and that each LED chip series connection group electric capacity in parallel is arranged by matrix-style;
Fig. 4 b-2 is that the present invention is according to technical scheme (three) LED chip N string M and plane unidirectional and that each LED chip series connection group electric capacity in parallel is arranged by matrix-style;
Fig. 4 b-3 is that the present invention is according to technical scheme (three) LED chip N string M and plane unidirectional and that each LED chip series connection group electric capacity in parallel is arranged by matrix-style;
Fig. 4 c-1 is that the present invention is according to technical scheme (three) LED chip N string M and unidirectional and every n plane that a LED chip series connection group electric capacity in parallel is arranged by matrix-style;
To be the present invention press the plane of interlace mode arrangement according to technical scheme (three) LED chip N string M and unidirectional and every n LED chip series connection group electric capacity in parallel to Fig. 4 c-2;
Fig. 4 c-3 is that the present invention is according to technical scheme (three) LED chip N string M and unidirectional and every n LED chip series connection group plane that electric capacity is arranged by watermelon line mode in parallel;
Fig. 5 a is the present invention according to technical scheme (three) LED chip N string 2M and positive and negative staggered and plane that each LED chip electric capacity in parallel is arranged by matrix-style;
To be the present invention press the plane of interlace mode arrangement according to technical scheme (three) LED chip N string 2M and positive and negative staggered and each LED chip series connection group electric capacity in parallel to Fig. 5 b;
Fig. 5 c is that the present invention is according to technical scheme (three) LED chip N string 2M and positive and negative staggered and every n LED chip series connection group plane that electric capacity is arranged by watermelon line mode in parallel;
Fig. 6 a is that the present invention is according to technical scheme (four) LED chip N string M and plane unidirectional and that permanent rectifying component of limit of all LED chip series connection is arranged by watermelon line mode;
Fig. 6 b is the plane that the present invention arranges by watermelon line mode according to permanent rectifying component of limit of series connection in technical scheme (four) LED chip N string M and unidirectional and each LED chip and joint group;
Fig. 6 c is that the present invention goes here and there 2M and positive and negative interlocking and plane of limitting permanent rectifying component to press the interlace mode arrangement of all LED chips series connection according to technical scheme (four) LED chip N;
To be the present invention press the plane of interlace mode arrangement according to permanent rectifying component of limit of series connection in technical scheme (four) LED chip N string 2M and positive and negative staggered and each LED chip and joint group to Fig. 6 d;
Fig. 6 e plane that to be the present invention arrange by matrix-style according to technical scheme (four) LED chip N string 2M and positive and negative staggered, each LED chip electric capacity in parallel and permanent rectifying component of limit of all LED chips series connection;
Fig. 6 f plane that to be the present invention arrange by matrix-style according to permanent rectifying component of limit of series connection in technical scheme (four) LED chip N string 2M and positive and negative staggered, each LED chip electric capacity in parallel and each LED chip and joint group;
Fig. 7 a is for using the sectional view of the interchange 24V 3W white LED light source that in one of goal of the invention provided by the invention, technical scheme () is made;
Fig. 7 b is for using the plane of the interchange 24V 3W white LED light source that in one of goal of the invention provided by the invention, technical scheme () is made;
Fig. 8 a is for using the sectional view of the interchange 36V 5W white LED light source that in one of goal of the invention provided by the invention, technical scheme (two) is made;
Fig. 8 b is for using the plane of the interchange 36V 5W white LED light source that in one of goal of the invention provided by the invention, technical scheme (two) is made;
Fig. 9 a is for using the sectional view of the alternating current 220V 20W white LED light source that in one of goal of the invention provided by the invention, technical scheme (three) is made;
Fig. 9 b is for using the plane of the alternating current 220V 20W white LED light source that in one of goal of the invention provided by the invention, technical scheme (three) is made;
Figure 10 a is for using the sectional view of the interchange 110V 8W white LED light source that in one of goal of the invention provided by the invention, technical scheme (four) is made;
Figure 10 b is for using the plane of the interchange 110V 8W white LED light source that in one of goal of the invention provided by the invention, technical scheme (four) is made;
Figure 11 a for use goal of the invention provided by the invention two in the sectional view of the direct current 30W white LED light source made of technical scheme;
Figure 11 b for use goal of the invention provided by the invention two in the plane of the direct current 30W white LED light source made of technical scheme;
In figure: 1, pedestal; 2, die bond cup; 3, fixing hole; 4, screw rod; 5, screw; 6, lead frame; 7, insulating frame; 8, electrode slice; 9, LED chip; 10, the second solder joint; 11, electrode; 12, electric capacity; 13, gold thread; 14, silver-colored line; 15, silica gel; 16, epoxy resin; 17, limit permanent rectifying component; 18, elargol; 19, phosphor gel.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as restriction of the present invention.
The specific embodiment
Embodiment 1:
With reference to Fig. 7 a, 7b uses technical scheme () making one interchange 24V input 3W white LED light source in one of goal of the invention provided by the invention.Adopt Fig. 1 c-1, this alternating current LED light source of LED wiring board rack making in 1c-2, the LED chip of selecting is the little chip of 10mil * 23mil.Concrete grammar is as follows:
(1) make LED support.
Make LED support pedestal 1 with aluminium matter silver coating material, at the center of pedestal 1, die bond cup 2 is set.Make LED lead frame 6 with copper silver-plated Copper Foil and glass dimension, then adopt resistant to elevated temperatures glue that lead frame 6 is bonded to and to obtain LED wiring board support on LED support pedestal 1.
(2) according to the supply voltage of designed alternating current LED light source, need to determine the quantity of series LED chip.
The use voltage of the alternating current LED light source of made is for exchanging 24V, and selected LED chip 9 is the little chip of 10mil * 23mil, and the average voltage of its single little chip is 3.2V, and the quantity of so required series LED chip 9 is: 24/3.2=7.5 rounds namely 8.
(3) according to the power W of designed alternating current LED light source
Light, determine total quantity and the connected mode of LED chip 9.
The LED chip 9 of selecting in this embodiment is the little chip of 10mil * 23mil, the rated current of its single LEDs chip 9 is 20mA, average voltage is 3.2V, the power of single LEDs chip 9 is: 0.02 * 3.2=0.064W, the total quantity of so required LED chip is: 3/0.064=46.875, for easy to connect and round requirement, get 48 here, the connected mode of all LED chips 9 be 8 strings 6 also.
(4) according to the connected mode of above-mentioned definite LED chip 9: 8 strings 6 also, elder generation is at the placement location of the die bond cup 2 internal labeling LED chips 9 of the LED support pedestal 1 of made, here the arrangement mode of LED chip 9 is watermelon line mode, then adopt elargol 18 that LED chip 9 is fixed to die bond cup 2 interior relevant position, with baking box, elargol is solidified; To be electrically connected to gold thread 13 between LED chip 9 and LED chip 9 and between the second solder joint 10 on LED chip 9 and LED support lead frame 6 electrode slices 8 again; Then in the surface-coated phosphor gel 19 of LED chip 9, slightly do baking with baking box, last coat on the surface of phosphor gel 19 that silica gel 15 is rear to be cured with baking box, use like this technical scheme in one of goal of the invention provided by the invention (once) make one exchange 24V input 3W white LED light source and completed.
Embodiment 2:
With reference to Fig. 8 a, 8b uses technical scheme (two) making one interchange 36V input 5W white LED light source in one of goal of the invention provided by the invention.Adopt Fig. 1 b-1, this alternating current LED light source of LED wiring board rack making in 1b-2, the LED chip of selecting is the little chip of 9mil * 21mil.Concrete grammar is as follows:
(1) make LED support.
Make LED support pedestal 1 with copper silver coating material, make die bond cup 2 at the center of pedestal 1.Make LED lead frame 6 with copper silver-plated copper sheet and plastics PPA, then adopt hot pressing that lead frame 6 is fixed on LED support pedestal 1 and can obtain the LED screw bracket.
(2) according to the supply voltage of designed alternating current LED light source, need to determine the quantity of series LED chip.
The use voltage of the alternating current LED light source of made is for exchanging 36V, and selected LED chip 9 is the little chip of 9mil * 21mil, and the average voltage of its single little chip is 3.2V, and the quantity of so required series LED chip 9 is: 36/3.2=11.25 rounds namely 11.
(3) according to the power W of designed alternating current LED light source
Light, determine total quantity and the connected mode of LED chip 9.
The LED chip 9 of selecting in this embodiment is the little chip of 9mil * 21mil, the rated current of its single LEDs chip 9 is 20mA, average voltage is 3.2V, the power of single LEDs chip 9 is: 0.02 * 3.2=0.064W, the total quantity of so required LED chip is: 5/0.064=78.125, for easy to connect and round requirement, here get 77, but this technical scheme (two) is the optimization of carrying out on technical scheme (one's) basis, the number needs of LED chip 9 doubles, be 154, so the connected mode of all LED chips 9 be 11 strings 14 also.
(4) according to the connected mode of above-mentioned definite LED chip 9: 11 strings 14 also, elder generation is at the placement location of the die bond cup 2 internal labeling LED chips 9 of the LED support pedestal 1 of made, here LED chip 9 is arranged (as Fig. 8 b) according to positive and negative staggered watermelon line mode, be that LED chip 9 is seen on the whole, it is arranged as the watermelon decorative pattern, and the positive pole of P electrode (being positive electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8 of first group of LED chip series connection group that is composed in series by 11 LEDs chips 9, the negative pole of N electrode (being negative electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8, the negative pole of P electrode (being positive electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8 of second group of LED chip series connection group that is composed in series by 11 LEDs chips 9, the positive pole of N electrode (being negative electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8, the electrode of the 3rd group of LED chip 9 points to first group identical, the electrode of the 4th group of LED chip 9 points to second group identical, the rest may be inferred, then adopt elargol 18 that LED chip 9 is fixed to die bond cup 2 interior relevant position, with baking box, elargol is solidified, to be electrically connected to silver-colored line 14 between LED chip 9 and LED chip 9 and between the second solder joint 10 on LED chip 9 and LED support lead frame 6 electrode slices 8 again, then in the surface-coated phosphor gel 19 of LED chip 9, slightly do baking with baking box, last coat on the surface of phosphor gel 19 that silica gel 15 is rear to be cured with baking box, use like this having completed exchanging 36V input 5W white LED light source that in one of goal of the invention provided by the invention, technical scheme (two) is made.
Embodiment 3:
With reference to Fig. 9 a, 9b uses technical scheme (two) making one alternating current 220V input 20W white LED light source in one of goal of the invention provided by the invention.Adopt Fig. 1 a-1, this alternating current LED light source of LED wiring board rack making in 1a-2, the LED chip of selecting is the little chip of 10mil * 23mil.Concrete grammar is as follows:
(1) make LED support.
Make LED support pedestal 1 with copper silver coating material, make die bond cup 2 at the center of pedestal 1.Make LED lead frame 6 with copper silver-plated copper sheet and plastics PPA, then adopt ejection formation that lead frame 6 is fixed on LED support pedestal 1 and can obtain the LED flat bracket.
(2) according to the supply voltage of designed alternating current LED light source, need to determine the quantity of series LED chip.
The voltage that uses of the alternating current LED light source of made is alternating current 220V, selected LED chip 9 is the little chip of 10mil * 23mil, the average voltage of its single little chip is 3.3V, and the quantity of so required series LED chip 9 is: 220/3.3=66.7 rounds namely 66.
(3) according to the power W of designed alternating current LED light source
Light, determine total quantity and the connected mode of LED chip 9.
the LED chip 9 of selecting in this embodiment is the little chip of 10mil * 23mil, the rated current of its single LEDs chip 9 is 20mA, average voltage is 3.3V, the power of single LEDs chip 9 is: 0.02 * 3.3=0.066W, the total quantity of so required LED chip is: 20/0.066=303.03, for easy to connect and round requirement, here get 330, but this technical scheme (three) is the optimization of carrying out on the basis of technical scheme () and technical scheme (two), the number needs of LED chip 9 doubles, be 660, so the connected mode of all LED chips 9 be 66 strings 10 also.
(4) according to the connected mode of above-mentioned definite LED chip 9: 66 strings 10 also, elder generation is at the placement location of the die bond cup 2 internal labeling LED chips 9 of the LED support pedestal 1 of made, here LED chip 9 is arranged according to positive and negative staggered matrix-style and each LED chip electric capacity 12(in parallel such as Fig. 9 b), be that LED chip 9 is seen on the whole, it is arranged as the matrix of 66*10, and the positive pole of P electrode (being positive electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8 of first group of LED chip series connection group that is composed in series by 66 LEDs chips 9, the negative pole of N electrode (being negative electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8, the negative pole of P electrode (being positive electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8 of second group of LED chip series connection group that is composed in series by 66 LEDs chips 9, the positive pole of N electrode (being negative electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8, the electrode of the 3rd group of LED chip 9 points to first group identical, the electrode of the 4th group of LED chip 9 points to second group identical, the rest may be inferred, each the LED chip 9 sides electric capacity 12 in parallel that is arranging again, then adopt elargol 18 that LED chip 9 and electric capacity 12 are fixed to die bond cup 2 interior relevant position, with baking box, elargol is solidified, to be electrically connected to gold thread 13 between LED chip 9 and LED chip 9, between LED chip 9 and electric capacity 12 and between the second solder joint 10 on LED chip 9 and LED support lead frame 6 electrode slices 8 again, then in the surface-coated phosphor gel 19 of LED chip 9, slightly do baking with baking box, last coat on the surface of phosphor gel 19 that silica gel 15 is rear to be cured with baking box, use like this alternating current 220V input 20W white LED light source that in one of goal of the invention provided by the invention, technical scheme (three) is made and just completed.
Embodiment 4:
With reference to Figure 10 a, 10b uses technical scheme (two) making one interchange 110V input 8W white LED light source in one of goal of the invention provided by the invention.Adopt Fig. 1 a-1, this alternating current LED light source of LED wiring board rack making in 1a-2, the LED chip of selecting is the little chip of 10mil * 23mil.Concrete grammar is as follows:
(1) make LED support.
Make LED support pedestal 1 with copper silver coating material, make die bond cup 2 at the center of pedestal 1.Make LED lead frame 6 with copper silver-plated copper sheet and plastics PPA, then adopt ejection formation that lead frame 6 is fixed on LED support pedestal 1 and can obtain the LED flat bracket.
(2) according to the supply voltage of designed alternating current LED light source, need to determine the quantity of series LED chip.
The use voltage of the alternating current LED light source of made is for exchanging 110V, selected LED chip 9 is the little chip of 10mil * 23mil, the average voltage of its single little chip is 3.3V, and the quantity of so required series LED chip 9 is: 110/3.3=33.3 rounds namely 34.
(3) according to the power W of designed alternating current LED light source
Light, determine total quantity and the connected mode of LED chip 9.
the LED chip 9 of selecting in this embodiment is the little chip of 10mil * 23mil, the rated current of its single LEDs chip 9 is 20mA, average voltage is 3.3V, the power of single LEDs chip 9 is: 0.02 * 3.3=0.066W, the total quantity of so required LED chip is: 8/0.066=121.2, for easy to connect and round requirement, here get 136, but this technical scheme (four) is technical scheme (one), the optimization of carrying out on the basis of technical scheme (two) and technical scheme (three), the number needs of LED chip 9 doubles, be 272, so the connected mode of all LED chips 9 be 34 strings 8 also.
(4) according to the connected mode of above-mentioned definite LED chip 9: 34 strings 8 also, elder generation is at the placement location of the die bond cup 2 internal labeling LED chips 9 of the LED support pedestal 1 of made, here LED chip 9 is arranged according to positive and negative staggered matrix-style, connect one in each LED chip electric capacity 12 in parallel and every 34 LEDs chip series connection groups and limit permanent rectifying component 17(such as Figure 10 b), be that LED chip 9 is seen on the whole, it is arranged as the matrix of 34*8, and first group by 34 LEDs chips 9 and limit the positive pole of P electrode (being positive electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8 of the LED chip series connection group that permanent rectifying component 17 is composed in series, the negative pole of N electrode (being negative electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8, second group by 34 LEDs chips 9 and limit the negative pole of P electrode (being positive electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8 of the LED chip series connection group that permanent rectifying component 17 is composed in series, the positive pole of N electrode (being negative electrode) second solder joint 10 on LED support lead frame 6 electrode slices 8, the electrode of the 3rd group of LED chip 9 points to first group identical, the electrode of the 4th group of LED chip 9 points to second group identical, the rest may be inferred, each the LED chip 9 sides electric capacity 12 in parallel that is arranging again, then adopt elargol 18 that LED chip 9, limit permanent rectifying component 17 and electric capacity 12 are fixed to die bond cup 2 interior relevant position, with baking box, elargol is solidified, again with between LED chip 9 and LED chip 9, between LED chip 9 and electric capacity 12, between LED chip 9 and the permanent rectifying component 17 of limit, LED chip 9 and limitting between the second solder joint 10 on permanent rectifying component 17 and LED support lead frame 6 electrode slices 8 is electrically connected to gold thread 13, then in the surface-coated phosphor gel 19 of LED chip 9, slightly do baking with baking box, last coat on the surface of phosphor gel 19 that silica gel 15 is rear to be cured with baking box, use like this having completed exchanging 110V input 8W white LED light source that in one of goal of the invention provided by the invention, technical scheme (three) is made.
The permanent rectifying component 17 of the above limit can be the electronic devices and components of resistance, current regulator diode, rectifier bridge, commutation diode or other energy current limliting or constant current or rectification.
Embodiment 5:
With reference to Figure 11 a, 11b, use goal of the invention provided by the invention two in technical scheme make a direct current 24V, 1.4A input 30W white LED light source.Adopt Fig. 1 d-1, this alternating current LED light source of LED wiring board rack making in 1d-2, the LED chip of selecting is the little chip of 45mil * 45mil.Concrete grammar is as follows:
(1) make LED support.
Make LED support pedestal 1 with copper silver coating material, make die bond cup 2 at the center of pedestal 1.Make LED lead frame 6 with copper silver-plated copper sheet and plastics PPA, then adopt hot pressing that lead frame 6 is bonded to and to obtain LED screw support on LED support pedestal 1.
(2) connected mode of determining between LED chip according to rated operational voltage VF, rated operational current IF and the selected LED chip 9 of designed LED light source.
In this embodiment, the rated operational current of designed direct-current LED light source is 1.4A, and voltage is 24V.
Selected LED chip 9 is the chip of 45mil * 45mil, the rated current of its single LEDs chip 9 is 350mA, and average voltage is 3.2V, and the rated operational voltage of designed LED light source is direct current 24V, the quantity of so required series LED chip 9 is: 24/3.2=7.5 rounds namely 8; Its rated operational current is 1.4A, and the group number of the LED chip 9 of so required parallel connection is: 1.4/0.35=4.The connected mode of designed direct-current LED light source is: 8 strings 4 also.
(3) according to the connected mode of above-mentioned definite LED chip 9: 8 strings 4 also, elder generation is at the placement location of the die bond cup 2 internal labeling LED chips 9 of the LED support pedestal 1 of made, here the arrangement mode of LED chip 9 is watermelon line mode, then adopt elargol 18 that LED chip 9 is fixed to die bond cup 2 interior relevant position, with baking box, elargol is solidified; To be electrically connected to gold thread 13 between LED chip 9 and LED chip 9 and between the second solder joint 10 on LED chip 9 and LED support lead frame 6 electrode slices 8 again; Then in the surface-coated phosphor gel 19 of LED chip 9, slightly do baking with baking box, last coat on the surface of phosphor gel 19 that silica gel 15 is rear to be cured with baking box, use like this goal of the invention provided by the invention two in a direct current 24V, the 1.4A input 30W white LED light source made of technical scheme just completed.
Claims (10)
1. a formal dress structure LED chip integration packaging becomes the method for alternating current LED light source, comprises the following steps:
A. design and produce the LED support for encapsulation;
A. use high-thermal conductive metal material (as: gold, silver, copper, aluminium etc.) or high heat conductive carbon/metal composite material (as: yellow gold, albronze etc.) or high heat conduction nonmetallic materials (as: pottery etc.) or high-thermal conductive metal and nonmetallic composite (as: copper and nanometer carbon pipe composite material, aluminium and purification graphite composite material etc.) or other highly heat-conductive material to make the LED support pedestal, and make the die bond cup in the center of pedestal;
B. the insulating frame of making of resistant to elevated temperatures insulating materials and the electrode slice of being made by the good metal material of high heat-conductivity conducting performance (as: gold, silver, copper, aluminium etc.) or the good metallic composite (as: yellow gold, aerdentalloy etc.) of high heat-conductivity conducting performance or the good nonmetallic materials of other high heat-conductivity conducting performance or composite form the LED support lead frame;
C. the assembly and connection between pedestal and lead frame;
B. according to the supply voltage of designed alternating current LED light source, determine the quantity of series LED chip 9;
C. according to the power W of designed alternating current LED light source
Light, determine the total quantity of LED chip 9 and the connected mode of LED chip;
D. arrange LED chip, electric capacity, the permanent whole components and parts of limit, and they are fixed in LED support die bond cup;
E. can current limliting with LED chip, electric capacity, resistance or current regulator diode or rectifier bridge or commutation diode or other with gold thread or silver-colored line or the good material of other electric conductivity or the electronic devices and components of constant current or rectification and the second solder joint on lead frame be electrically connected to;
F. fill fluorescent material and or other transparent encapsulation material in placing the cup of LED chip.
2. formal dress structure LED chip integration packaging according to claim 1 becomes the method for alternating current LED light source, it is characterized in that: the average voltage of the supply voltage according to LED light source in application and selected LED chip for encapsulating, calculating needs the rear voltage of LED chip series connection of how much quantity approach or equate with the supply voltage of LED light source, and the LED chip of these quantity is connected, form the series connection group; Again according to the total quantity of the required LED chip of power calculation of the general power of LED light source and selected LED chip for encapsulation; Calculate at last the group number of the LED chip series connection group of required parallel connection according to the total quantity of the quantity of series connection core assembly sheet and required LED chip.
3. formal dress structure LED chip integration packaging according to claim 1 and 2 becomes the method for alternating current LED light source, it is characterized in that: LED chip can be unidirectional array with respect to the arrangement mode of the second solder joint or electrode on the LED support lead frame, can be also positive and negative being staggered;
Unidirectional array is namely: the negative pole of the positive pole of the P electrode of all LED chips of a. (being positive electrode) the second solder joint or electrode on LED support lead frame electrode slice, N electrode (being negative electrode) the second solder joint or electrode on LED support lead frame electrode slice; The positive pole of the negative pole of the P electrode of all LED chips (being positive electrode) the second solder joint or electrode on LED support lead frame electrode slice b., N electrode (being negative electrode) the second solder joint or electrode on LED support electrically-conducting frame pole piece;
Positive and negative being staggered is namely: the negative pole of the positive pole of the P electrode (i.e. positive pole) of first group of LED chip of a series connection core assembly sheet the second solder joint or electrode on LED support lead frame electrode slice, the N electrode of first group of LED chip (being negative pole) the second solder joint or electrode on LED support lead frame electrode slice; The positive pole of the negative pole of the P electrode of second group of LED chip (namely anodal) the second solder joint or electrode on LED support lead frame electrode slice, the N electrode of second group of LED chip (i.e. positive pole) the second solder joint or electrode on LED support lead frame electrode slice; The arrangement mode of the 3rd group of LED chip arrangement mode with first group of LED chip is identical; The arrangement mode of the 4th group of LED chip arrangement mode with second group of LED chip is identical, and the rest may be inferred.
4. according to claim 1 to 3, the described formal dress structure LED chip of any one integration packaging becomes the method for alternating current LED light source, it is characterized in that: can place electric capacity in LED support, and be the mode of being connected in parallel between electric capacity and LED chip, its mode of being connected in parallel can be: after each LED chip electric capacity in parallel or every N LED chip are composed in series after LED chip series connection group an electric capacity of parallel connection or every N LED chip and are composed in series LED chip series connection group, in this series connection group n LED chip again with Capacitance parallel connection (here, N is the integral multiple of n), here can carry out designed, designed according to actual conditions.
5. according to claim 1 to 4, the described formal dress structure LED chip of any one integration packaging becomes the method for alternating current LED light source, it is characterized in that: can place the permanent whole components and parts of limit in LED support, and limitting between permanent whole components and parts and LED chip is to be connected in series mode, and it is connected in series mode and can is: a. will limit permanent rectifying component be positioned over LED chip foremost or rearmost end connect with all LED chips; B. according to the group number of designed all chips in parallel of LED light source, one of series connection should the permanent rectifying component of limit in every group, also can connect several.
6. formal dress structure LED chip integration packaging becomes the method for alternating current LED light source according to claim 1 or 5, it is characterized in that: the permanent whole components and parts of described limit can be that resistance, current regulator diode, rectifier bridge, commutation diode or other can current limlitings or the electronic devices and components of constant current or rectification.
7. a formal dress structure LED chip integration packaging becomes the method for direct-current LED light source, comprises the following steps:
A. design and produce the LED support for encapsulation;
A. use high-thermal conductive metal material (as: gold, silver, copper, aluminium etc.) or high heat conductive carbon/metal composite material (as: yellow gold, albronze etc.) or high heat conduction nonmetallic materials (as: pottery etc.) or high-thermal conductive metal and nonmetallic composite (as: copper and nanometer carbon pipe composite material, aluminium and purification graphite composite material etc.) or other highly heat-conductive material to make the LED support pedestal, and make the die bond cup in the center of pedestal;
B. the insulating frame of making of resistant to elevated temperatures insulating materials and the electrode slice of being made by the good metal material of high heat-conductivity conducting performance (as: gold, silver, copper, aluminium etc.) or the good metallic composite (as: yellow gold, aerdentalloy etc.) of high heat-conductivity conducting performance or the good nonmetallic materials of other high heat-conductivity conducting performance or composite form the LED support lead frame;
C. the assembly and connection between pedestal and lead frame;
B. the connected mode of determining between LED chip according to rated operational voltage VF, rated operational current IF and the selected LED chip 9 of designed LED light source;
D. arrange LED chip, and they are fixed in LED support die bond cup;
E. with gold thread or silver-colored line or the good material of other electric conductivity, the second solder joint on LED chip and LED support lead frame electrode slice is electrically connected to;
F. fill fluorescent material and or other transparent encapsulation material in placing the cup of LED chip.
8. according to claim 1 or 7 described formal dress structure LED chip integration packagings become the method for interchange or direct-current LED light source, and it is characterized in that: described transparent encapsulation material is silica gel, epoxy resin, silica gel or other transparency material.
9. according to claim 1 or 7 described formal dress structure LED chip integration packagings become the method for interchange or direct-current LED light source, it is characterized in that: the mode that described LED chip and other components and parts are fixed in LED support pedestal die bond cup can be: a. adopts glue or the material of elargol or gold size or other good heat conductivity to carry out bonding; B. adopt the tin cream welding; C. adopt the eutectic welding; D. adopt hot ultrasonic gold goal welding or other to be convenient to weld or bonding mode.
10. according to claim 1 or 7 described formal dress structure LED chip integration packagings become the method for interchange or direct-current LED light source, it is characterized in that: the method that provides according to claim 1 and claim 2 or claim 7 determine LED chip series connection quantity and and the joint group number after, the arrangement of its LED chip can according to matrix-style, interlace mode, watermelon line mode or other can make the LED light source bright dipping evenly, the mode of uniform heat distribution arranges.
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| CN2011104038536A CN103162100A (en) | 2011-12-08 | 2011-12-08 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
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Application publication date: 20130619 |