CN103175001A - Light-emitting diode (LED) lighting component - Google Patents

Light-emitting diode (LED) lighting component Download PDF

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Publication number
CN103175001A
CN103175001A CN2012105698400A CN201210569840A CN103175001A CN 103175001 A CN103175001 A CN 103175001A CN 2012105698400 A CN2012105698400 A CN 2012105698400A CN 201210569840 A CN201210569840 A CN 201210569840A CN 103175001 A CN103175001 A CN 103175001A
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China
Prior art keywords
unit
cap unit
layer
base board
sidewall sections
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Granted
Application number
CN2012105698400A
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Chinese (zh)
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CN103175001B (en
Inventor
卢建乔
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YUYAO TAILIAN LIGHTING ELECTRIC CO Ltd
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YUYAO TAILIAN LIGHTING ELECTRIC CO Ltd
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Priority to CN201210569840.0A priority Critical patent/CN103175001B/en
Publication of CN103175001A publication Critical patent/CN103175001A/en
Application granted granted Critical
Publication of CN103175001B publication Critical patent/CN103175001B/en
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Abstract

The invention provides a light-emitting diode (LED) lighting component which comprises an LED chip unit, a substrate unit and a cap unit. The LED chip unit is arranged on the substrate unit, the LED chip unit is wrapped by the cap unit and the cap unit is detachably arranged on the substrate unit and, so that no gaps exist among the cap unit, the LED chip unit and the substrate unit. The cap unit comprises a side wall part and a top part, wherein the side wall part and the top part form an integration; the side wall part is light-proof, the top part is provided with a first layer which is light-transmitted, a second layer for containing fluorescent powder and a third layer which is light-transmitted; the second layer is sandwiched between the first layer and the third layer; and the fluorescent powder is arranged in the second layer uniformly. By means of the LED light component, pollution of the fluorescent powder to the environment can be reduced when the LED light component is scrapped.

Description

The LED illuminating device
Technical field
The present invention relates to lighting field, more particularly, the present invention relates to a kind of LED illuminating device.
Background technology
LED (Light Emitting Diode) is a kind of solid-state semiconductor devices, and it can be electric energy conversion directly luminous energy.The heart of LED is a semiconductor wafer, and an end of semiconductor wafer is attached on a support (as negative pole), and the other end of semiconductor wafer connects the positive pole of power supply, and whole wafer is got up by epoxy encapsulation.
Semiconductor wafer is comprised of two parts, and a part is P-type semiconductor, occupies an leading position in its hole, the inside, and the other end of semiconductor wafer is N-type semiconductor, is mainly electronics here.When these two kinds of semiconductors couple together, just form one " P-N knot " between them.
When electric current acted on this wafer by wire, electronics will be pushed to the P district, and electronics with hole-recombination, then will send energy with the form of photon, the luminous principle of LED that Here it is in the P district.And light wavelength determines the color of light, determines by forming P-N knot material.
Correspondingly, the LED illumination utilizes the solid semiconductor chip as luminescent material, by carrier, compound energy of emitting surplus occuring causes photo emissions in semiconductor, directly send red, yellow, blue, green light, on this basis, utilize the principle of three primary colours, add fluorescent material, can send the light of the random color such as red, yellow, blue, green, blue or green, orange, purple, white.The LED illuminating product utilizes LED as the produced ligthing paraphernalia of light source exactly.
But because the LED illumination can use fluorescent material, when LED illumination component or LED illuminating device were scrapped, the fluorescent material of scrapping polluted the environment.
Therefore, hope can provide a kind of fluorescent material that can reduce when the LED illuminating device is scrapped to LED illuminating device and the LED lighting apparatus of the pollution of environment.
Summary of the invention
Technical problem to be solved by this invention is for having defects in prior art, providing a kind of fluorescent material that can reduce when the LED illuminating device is scrapped to LED illuminating device and the LED lighting apparatus of the pollution of environment.
According to a first aspect of the invention, provide a kind of LED illuminating device, it comprises: LED chip unit, base board unit and cap unit; Wherein, described LED chip cell layout is on described base board unit, and described cap unit is removably mounted on described base board unit in the mode of the covering described LED chip of parcel unit, so that there is no the space between described cap unit and described LED chip unit and described base board unit; Wherein, described LED chip unit has the first height; Wherein, described cap unit comprises sidewall sections and top section, wherein said sidewall sections and described top section form as a whole, and wherein said sidewall sections is light tight, and wherein, described top section have printing opacity ground floor, be used for holding the second layer of fluorescent material and the 3rd layer of printing opacity, and wherein, described ground floor and described the 3rd layer are clipped in the middle the described second layer, and fluorescent material is evenly arranged in the second layer; And wherein, when described cap unit is arranged on described base board unit and on the direction of described base board unit Surface Vertical, the described sidewall sections of described cap unit be the 3rd distance away from the end of described top section to the distance of the inner surface of the close described sidewall sections of described top section; Wherein, described base board unit has the groove part corresponding with the profile of the described sidewall sections of described cap unit, the width of the described sidewall sections of wherein said cap unit equals the width of the described groove part of described base board unit, and wherein, described groove part has second degree of depth; And wherein, the size of described the 3rd distance equals the size of described second degree of depth and the big or small sum of described the first height.
Preferably, the sidewall sections of described cap unit is Heat Conduction Material.
Preferably, the sidewall sections of described cap unit is metal material.
Preferably, the ground floor of the top section of described cap unit and the 3rd layer are plastic material.
By said structure of the present invention, the fluorescent material in the second layer is evenly arranged, thereby the light that makes photon that the LED chip unit launches and fluorescent material effect produce is gentle, and is conducive to prevent for example ultraviolet leakage.On the other hand, because cap unit can unload from the base board unit substrate, thus can when damage, LED chip only replace LED chip and still use same cap unit, thus can be because of abandoning fluorescent material in cap unit and contaminated environment.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention, more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the overall profile according to the LED illuminating device of the embodiment of the present invention.
Fig. 2 schematically shows the overall top view according to the LED illuminating device of the embodiment of the present invention.
Fig. 3 schematically shows the cutaway view according to the LED chip unit of the LED illuminating device of the embodiment of the present invention.
Fig. 4 schematically shows the cutaway view according to the base board unit of the LED illuminating device of the embodiment of the present invention.
Fig. 5 schematically shows the cutaway view according to the cap unit of the LED illuminating device of the embodiment of the present invention.
Need to prove, accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Note, the accompanying drawing of expression structure may not be to draw in proportion.And in accompanying drawing, identical or similar element indicates identical or similar label.
The specific embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
Fig. 1 schematically shows the overall profile according to the LED illuminating device of the embodiment of the present invention.
As shown in Figure 1, the LED illuminating device according to the embodiment of the present invention comprises: LED chip unit 1, base board unit 2 and cap unit 3.
Wherein, LED chip unit 1 is arranged on base board unit 2, and cap unit 3 is removably mounted on base board unit 2 in the mode that covers parcel LED chip unit 1, so that there is no the space between cap unit 3 and LED chip unit 1 and base board unit 2.
Thus, due to the close contact between LED chip unit 1, base board unit 2 and cap unit 3, can utilize cap unit 3 that LED chip unit 1 is mounted to base board unit 2 securely.
Fig. 2 schematically shows the overall top view according to the LED illuminating device of the embodiment of the present invention.As shown in Figure 2, wherein show base board unit 2 and cap unit 3 is the situation of holding, but obviously base board unit 2 and cap unit 3 can be also other shapes.
Fig. 3 schematically shows the cutaway view according to the LED chip unit of the LED illuminating device of the embodiment of the present invention.
As shown in Figure 3, the chip unit that forms for having rule according to the LED chip unit 1 of the LED illuminating device of the embodiment of the present invention.For example, LED chip unit 1 is a rectangle or circular core blade unit.
Wherein, LED chip unit 1 has the first height h1.
Fig. 5 schematically shows the cutaway view according to the cap unit 3 of the LED illuminating device of the embodiment of the present invention.
As shown in Figure 5, the cap unit 3 according to the LED illuminating device of the embodiment of the present invention comprises sidewall sections 31 and top section 32.Wherein, described sidewall sections 31 is light tight.Wherein, top section 32 have printing opacity ground floor 321, be used for holding the second layer 322 of fluorescent material and the 3rd layer 323 of printing opacity.And wherein, ground floor 321 and the 3rd layer 323 are clipped in the middle the second layer 322.
Described sidewall sections 31 and described top section 32 form as a whole.
Preferably, the ground floor 321 of the top section 32 of the cap unit 3 of LED illuminating device and the 3rd layer 323 are plastic material, thereby can reduce the manufacturing cost of LED illuminating device.
By said structure, the fluorescent material in the second layer 322 is evenly arranged, thereby the light that makes photon that LED chip unit 1 launches and fluorescent material effect produce is gentle, and is conducive to prevent for example ultraviolet leakage.On the other hand, because cap unit 3 can unload from base board unit 2 substrates, thus can when damage, LED chip only replace LED chip and still use same cap unit 3, thus can be because of abandoning fluorescent material in cap unit 3 and contaminated environment.
Wherein, when cap unit 3 is arranged on base board unit 2 and on the direction of base board unit 2 Surface Verticals, the sidewall sections 31 of cap unit 3 is the 3rd distance h 3 away from the end of top section 32 to the distance of the inner surface of the close sidewall sections 31 of top section 32.
The width of the described sidewall sections 31 of wherein said cap unit 3 equals the width of the described groove part 21 of described base board unit 2.
Fig. 4 schematically shows the cutaway view according to the base board unit 2 of the LED illuminating device of the embodiment of the present invention.
As shown in Figure 4, have the groove part 21 corresponding with the profile of the sidewall sections 31 of described cap unit 3 according to the base board unit 2 of the LED illuminating device of the embodiment of the present invention.Wherein, groove part 21 has the second degree of depth h2.
Wherein, the size of the 3rd distance h 3 equals the size of the second degree of depth h2 and the big or small sum of the first height h1.
That is, h3=h2+h1.
Preferably, the sidewall sections 31 of described cap unit 3 is Heat Conduction Material, metal material for example, thus be conducive to the heat radiation of LED chip unit 1.
Be understandable that, although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement to make many possible changes and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.

Claims (4)

1. a LED illuminating device, is characterized in that, comprising:
LED chip unit, base board unit and cap unit;
Wherein, described LED chip cell layout is on described base board unit, and described cap unit is removably mounted on described base board unit in the mode of the covering described LED chip of parcel unit, so that there is no the space between described cap unit and described LED chip unit and described base board unit;
Wherein, described LED chip unit has the first height;
Wherein, described cap unit comprises sidewall sections and top section, wherein said sidewall sections and described top section form as a whole, and wherein said sidewall sections is light tight, and wherein, described top section have printing opacity ground floor, be used for holding the second layer of fluorescent material and the 3rd layer of printing opacity, and wherein, described ground floor and described the 3rd layer are clipped in the middle the described second layer, and fluorescent material is evenly arranged in the second layer;
And wherein, when described cap unit is arranged on described base board unit and on the direction of described base board unit Surface Vertical, the described sidewall sections of described cap unit be the 3rd distance away from the end of described top section to the distance of the inner surface of the close described sidewall sections of described top section;
Wherein, described base board unit has the groove part corresponding with the profile of the described sidewall sections of described cap unit, the width of the described sidewall sections of wherein said cap unit equals the width of the described groove part of described base board unit, and wherein, described groove part has second degree of depth;
And wherein, the size of described the 3rd distance equals the size of described second degree of depth and the big or small sum of described the first height.
2. LED illuminating device according to claim 1, is characterized in that, the sidewall sections of described cap unit is Heat Conduction Material.
3. LED illuminating device according to claim 2, is characterized in that, the sidewall sections of described cap unit is metal material.
4. LED illuminating device according to claim 1 and 2, is characterized in that, the ground floor of the top section of described cap unit and the 3rd layer are plastic material.
CN201210569840.0A 2012-12-24 2012-12-24 Light-emitting diode (LED) lighting component Expired - Fee Related CN103175001B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210569840.0A CN103175001B (en) 2012-12-24 2012-12-24 Light-emitting diode (LED) lighting component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210569840.0A CN103175001B (en) 2012-12-24 2012-12-24 Light-emitting diode (LED) lighting component

Publications (2)

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CN103175001A true CN103175001A (en) 2013-06-26
CN103175001B CN103175001B (en) 2015-07-08

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030156416A1 (en) * 2002-02-21 2003-08-21 Whelen Engineering Company, Inc. Led light assembly
US6796680B1 (en) * 2000-01-28 2004-09-28 Lumileds Lighting U.S., Llc Strip lighting
CN101487581A (en) * 2008-01-17 2009-07-22 富士迈半导体精密工业(上海)有限公司 LED light source module
CN202307890U (en) * 2011-11-09 2012-07-04 深圳市灏天光电有限公司 Novel integrated high-power LED (light-emitting diode) packaging structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6796680B1 (en) * 2000-01-28 2004-09-28 Lumileds Lighting U.S., Llc Strip lighting
US20030156416A1 (en) * 2002-02-21 2003-08-21 Whelen Engineering Company, Inc. Led light assembly
CN101487581A (en) * 2008-01-17 2009-07-22 富士迈半导体精密工业(上海)有限公司 LED light source module
CN202307890U (en) * 2011-11-09 2012-07-04 深圳市灏天光电有限公司 Novel integrated high-power LED (light-emitting diode) packaging structure

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Granted publication date: 20150708

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