CN103185818A - Active differential probe with ultra-low input capacitance - Google Patents
Active differential probe with ultra-low input capacitance Download PDFInfo
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- CN103185818A CN103185818A CN2011104492586A CN201110449258A CN103185818A CN 103185818 A CN103185818 A CN 103185818A CN 2011104492586 A CN2011104492586 A CN 2011104492586A CN 201110449258 A CN201110449258 A CN 201110449258A CN 103185818 A CN103185818 A CN 103185818A
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Abstract
The invention provides an active differential probe with ultra-low input capacitance, which comprises two probe input terminals and a differential probe amplification module with double input ends, wherein a damping resistor and an RC (resistor-capacitor) parallel circuit are connected between each probe input terminal and one input end of the differential probe amplification module in series; each RC parallel circuit is formed by connecting an input resistor to an input capacitor in parallel; the input resistors and the input capacitors are arranged on insulation substrates; each input capacitor is a micro-strip interdigital capacitor and is formed by top layer copper foil of each insulation substrate; each input resistor is connected between a first via hole and a second via hole, and mounted at a position, opposite to each micro-strip interdigital capacitor, on a bottom layer of each insulation substrate. According to the probe, the micro-strip interdigital capacitors serve as the input capacitors, so that the ultra-low input capacitance of the probe is realized, and the consistency of the two input capacitors is ensured.
Description
Technical field
The present invention relates to measurement, technical field of measurement and test, particularly relate to a kind of active differential probe, more especially a kind of active differential probe with ultralow input capacitance.
Background technology
In the thermometrically field, probe is to connect circuit-under-test and surveying instrument, gathers measured signal and is transferred to the equipment of surveying instrument.Probe needs in its frequency band can distortionless detection signal, circuit-under-test or signal is not had a negative impact.This need pop one's head in and have bigger input resistance and less input capacitance, high input resistance and little input capacitance can be told very little electric current from circuit-under-test, reduce the influence to circuit-under-test, input resistance need be more a lot of greatly than the resistance of circuit-under-test itself, and more little input capacitance is then more little to the influence of high-frequency signal.Therefore, design the probe with high input resistance and little input capacitance and have very important meaning.
At present, general oscillographic passive probe all has very high input resistance, and when signal was direct current, input impedance was very high, can be good at finishing low frequency signal and detects task.Therefore but the input capacitance of this passive probe is relevant with the design of the length of probe wire and the sharp circuit of popping one's head in, and what be difficult to do is very little, generally greater than 10pF.Because its bigger input capacitance, when frequency raise, its impedance sharply descended, and the detection of high-frequency signal is impacted.And, the general capacitive effect of using the damping cable with big resistance to reduce cable of passive probe, however damping wire is bigger to the loss ratio of high-frequency signal.Above-mentioned 2 problems have limited the detection bandwidth of passive probe greatly.
Because passive probe is existing problem in detecting high-frequency signal, therefore the active differential probe has appearred again.Be that CN200910237397.5 China publication file discloses a kind of active differential voltage probe 100 as application number, in conjunction with reference to figure 1, described active differential voltage probe comprises handle end 101, coaxial cable, probe amplification module 102, the probe point connects input end IN+ and the IN-of two handle sections, be used for connecting circuit-under-test, obtain measured signal, the output terminal of probe amplification module 102 then exports signal to oscillograph by coaxial cable 3.
Input end IN+ is connected with damping resistance R1P, and input end IN-is connected with damping resistance R1N.This damping resistance R1P is in series with the RC bleeder circuit of resistance R 2P, capacitor C 1P formation in parallel.This damping resistance R1N is in series with the RC bleeder circuit of resistance R 2N, capacitor C 1N formation in parallel.The other end of this resistance R 2P, the capacitor C 1P RC bleeder circuit that constitutes in parallel is connected in the handle cathode output end.The other end of this resistance R 2N, the capacitor C 1N RC bleeder circuit that constitutes in parallel is connected in the handle cathode output end.
The handle cathode output end links to each other with probe amplification module 102 electrode input ends by coaxial cable 1.The handle cathode output end links to each other with probe amplification module 102 negative inputs by coaxial cable 2.
In order to guarantee the positive negative input symmetry of active differential probe, get R1P=R1N when generally designing, R2P=R2N, C1P=C1N.
The active differential voltage probe of said structure, differential signal is by input end IN+ and IN-input.Resistance R 1P and R1N are damping resistance, be used for reducing popping one's head in and circuit-under-test between the vibration that brings of lead-in inductance.R2P, C1P and R2N, C1N have constituted input resistance and the input capacitance of difference detector.
Also introduced the implementation of multiple probe amplification module in the above-mentioned open file, the structure among Fig. 1 only is its a kind of implementation.But the core of probe amplification module all is to be made of amplifier, because the positive-negative input end of amplifier is empty short, has only common-mode signal, can regard differential mode ground as, therefore the input capacitance of probe comprises capacitor C 1P, the C1N in the circuit, the stray capacitance when also comprising by board design.Stray capacitance comprises input end IN+ and IN-stray capacitance over the ground, each components and parts stray capacitance over the ground, probe amplifier input end stray capacitance over the ground etc., so stray capacitance exists all the time, and the two-way stray capacitance is because PCB design, element encapsulation etc. and not the same.
Therefore, need key design capacitor C 1P, C1N.Because capacitor C 1P, C1N are very little, be generally less than 1pF, the employing patch capacitor is realized, even the high Q electric capacity of existing high precision on the employing market, be subject to device itself, its full accuracy A shelves also can only be realized ± 0.05pF, are difficult to realize the consistance of two-way input capacitance under the situation that stray capacitance exists all the time.
Summary of the invention
In order to address the above problem, the invention provides a kind of active differential probe with ultralow input capacitance, can realize ultralow input capacitance, keep the good consistance of two-way input capacitance simultaneously.
Active differential probe with ultralow input capacitance of the present invention comprises:
Two probe input terminals and the difference detector amplification module with double input end include a damping resistance and a RC parallel circuit of being connected in series between the input end of each described probe input terminal and described difference detector amplification module;
Described RC parallel circuit is connected in parallel and constitutes by being arranged on a input resistance on the insulated substrate and an input capacitance;
Described input capacitance is little band interdigital electric capacity, is made of the top layer Copper Foil of described insulated substrate;
The input end of each described little band interdigital electric capacity connects with corresponding damping resistance by first via hole that is arranged on the described insulated substrate, and output terminal is by being arranged on the corresponding input end connection of second via hole and described difference detector amplification module on the described insulated substrate;
Described input resistance is connected between described first via hole and second via hole, and is installed on the position relative with described little band interdigital electric capacity of described insulated substrate bottom.
The present invention realizes the ultralow input capacitance that active differential is popped one's head in by adopting little band interdigital electric capacity as input capacitance, is easy to capacitance value, is easy to guarantee the consistance of two-way input capacitance; In order to reduce the volume of cabling inductance and probe, input resistance is arranged on the position relative with little band interdigital electric capacity of insulated substrate bottom simultaneously, connects input resistance and little band interdigital electric capacity by via hole.
Illustrate as a kind of, in the active differential probe of the present invention, the distance between described input resistance and described first via hole is smaller or equal to the distance between described input resistance and described second via hole.
Illustrate as another, in the active differential probe of the present invention, the distance between described input resistance and described first via hole is less than the distance between described input resistance and described second via hole.
Illustrate as a kind of, in the active differential probe of the present invention, described insulated substrate is two-sided pcb board.
Illustrate as a kind of, in the active differential probe of the present invention, described little band interdigital electric capacity comprises two groups of fingers arranged in a crossed manner that constitute with Copper Foil; Wherein each of one group refers to have identical length; The length that each of another group refers to is according to the capacitance setting.
Illustrate as a kind of, in the active differential probe of the present invention, described little band interdigital electric capacity comprises two groups of fingers arranged in a crossed manner that constitute with Copper Foil; Wherein one group finger is set to adopt the multistage of binding line binding connection, and the quantity of its section is according to the capacitance setting.
Illustrate as a kind of, in the active differential of the present invention probe, described little band interdigital electric capacity comprises the copper coin of correspondence with it with one group of finger that constitutes with the Copper Foil of pcb board top layer and; Described finger is connected with described first via hole, and the area that refers to is according to the capacitance setting; Described copper coin is arranged in the pcb board between described finger and the input resistance, and is connected with described second via hole.
Illustrate as a kind of, in the active differential probe of the present invention, described damping resistance is connected with the top layer terminals of described first via hole.
Illustrate as a kind of, in the active differential probe of the present invention, the input end of institute's difference detector amplification module is connected with the top layer terminals of described second via hole.
Illustrate as a kind of, in the active differential probe of the present invention, described damping resistance is arranged on the top layer of described pcb board.
Illustrate as a kind of, in the active differential probe of the present invention, described input resistance adopts Chip-R.
Active differential probe with ultralow input capacitance provided by the invention has been realized the ultralow input capacitance of probe, also makes the consistance of probe two-way input capacitance good simultaneously, makes that consistance is good between the different probes, and be easy to produce that cost is low.
Description of drawings
Fig. 1 is the circuit theory diagrams of the disclosed active differential probe 100 of the prior art in the background technology;
Fig. 2 is the circuit theory diagrams of active differential probe 200 of the present invention;
Fig. 3 is the structural representation of little band interdigital electric capacity 300 of the present invention;
Fig. 4 is a kind of structural representation of active differential probe 200 of the present invention;
Fig. 5 is the structure principle chart of little band interdigital electric capacity 500 of the present invention;
Fig. 6 is the structure principle chart of little band interdigital electric capacity 600 of the present invention;
Fig. 7 is another structural representation of active differential probe 200 of the present invention;
Fig. 8 is the structure principle chart of little band interdigital electric capacity 700 of the present invention;
Fig. 9 is another structural representation of active differential probe 200 of the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
With reference to figure 2, embodiments of the invention provide a kind of active differential probe 200, described active differential probe 200 comprises two probe input terminal IN+, IN-and a difference detector amplification module 202, between an input end of each probe input terminal and difference detector amplification module 202, be respectively arranged with a damping resistance R11 and R21, input capacitance C11 and C21, input resistance R12 and R22; Input terminal IN+ connects the end of damping resistance R11, the other end of damping resistance R11 connects input capacitance C11 and input resistance R12 respectively, and the other end of input capacitance C11 and input resistance R12 is connected to an input end of difference detector amplification module 202 by coaxial cable; Input terminal IN-connects the end of damping resistance R21, the other end of damping resistance R21 connects input capacitance C21 and input resistance R22 respectively, and the other end of input capacitance C21 and input resistance R22 is connected another input end of difference detector amplification module 202 by coaxial cable; Two probe input terminal IN+ and IN-can be connected the probe point of probe respectively, and the output terminal of difference detector amplification module 202 then connects surveying instruments such as oscillograph by coaxial cable.
In the present embodiment, the probe amplifier 102 that described difference detector amplification module 202 adopts as shown in fig. 1.
As a kind of distortion, described difference detector amplification module 202 also can adopt the disclosed other forms of probe amplifier of Chinese publication application documents CN200910237397.5.
In conjunction with reference to figure 3, input capacitance C11 described in the present embodiment and C21 adopt little band interdigital electric capacity 300, described little band interdigital electric capacity 300 comprises that first group arranged in a crossed manner refers to that 303 and second groups refer to that 304, the first groups refer to be provided with input end and refer to be provided with output terminal 302 for 301, the second groups.
In the present embodiment, in order to guarantee the positive negative input symmetry of active differential probe, get R11=R21 during design, R12=R22, C11=C21; Described two damping resistance R11, R21 and two input resistance R12, R22 all adopt Chip-R to realize that the Chip-R volume is little, and high frequency performance is superior, can not increase the volume of probe handle section, also adapts to the high frequency demand.
As a kind of distortion, described damping resistance R11 and R21 also can adopt lead resistance, can also adopt wire resistor, can also adopt carbon resister etc.
As a kind of distortion, described input resistance R12 and R22 also can adopt lead resistance, can also adopt wire resistor, can also adopt carbon resister etc.
In the present embodiment, two damping resistance R11 and R21, two input resistance R12 and R22, two input capacitance C11 and C21 are arranged on the two-sided pcb board, as the handle end of active differential probe 200.Because the two-way incoming line between probe input terminal IN+, IN-and the difference detector amplification module 202 is identical, present embodiment is that example describes with a road of probe input terminal IN+ place.
In the present embodiment, in conjunction with reference to figure 4, described input capacitance C11 adopts little band interdigital electric capacity 300, directly constituted by the top layer Copper Foil on the described pcb board 201, damping resistance R11 also is arranged on the top layer of described pcb board 201, first via hole 203 is set between damping resistance R11 and the input capacitance C11, pad is set as terminals on the top layer of described first via hole 203, the input end of input capacitance C11 (also being the input end 301 of described little band interdigital electric capacity 300) and damping resistance R11 are connected to the top layer pad of first via hole 203 respectively by cabling; The opposite side of input capacitance C11 is provided with second via hole 204, pad is set as terminals on the top layer of described second via hole 204, the output terminal of input capacitance C11 (also being the output terminal 302 of described little band interdigital electric capacity 300) is connected to the top layer pad of described second via hole 204 by cabling, and difference detector amplification module 202 then also is connected to the top layer pad of described second via hole 204 by coaxial cable.
As a kind of distortion, in conjunction with reference to figure 9, described damping resistance R11 can not be arranged on the described pcb board 201, and as device existence separately, at described pcb board 201 pad 205 is set, described damping resistance R11 is connected to described pad 205 by connecting line 206, and then is connected to described first via hole 203.
As another distortion, described damping resistance R11 can be connected with the pad that described first via hole 203 is positioned at described pcb board 201 top layers, and then connects described input capacitance C11 and described input resistance R12; Also can be connected with the pad that described first via hole 203 is positioned at described pcb board 201 bottoms, and then connect described input capacitance C11 and described input resistance R12.
As another distortion, the input end of described difference detector amplification module 202 can be connected with the pad that described second via hole 204 is positioned at described pcb board 201 top layers by coaxial cable, and then connects described input capacitance C11 and described input resistance R12; Also can be connected with the pad that described second via hole 204 is positioned at described pcb board 201 bottoms 201, and then connect described input capacitance C11 and described input resistance R12.
As another distortion, described insulated substrate also can adopt four layers of pcb board, can also adopt six layers of pcb board, can also adopt more multi-layered pcb board to realize, only the Copper Foil in each middle layer need be removed to get final product.
In the present embodiment, described input resistance R12 adopts Chip-R to realize, described input resistance R12 is connected between described first via hole 203 and second via hole 204, be installed on the position relative with described input capacitance C11 of described pcb board 201 bottoms, described input resistance R12 is connected by the pad of the setting on cabling and first via hole 203 and second via hole, 204 bottoms, and the distance H 1 between described input resistance R12 and described first via hole 203 is less than the distance H 2 between described input resistance R12 and described second via hole 204.Namely reduce the cable run distance between described input resistance R12 and described first via hole 203 as far as possible, do like this and can effectively reduce problems such as cabling inductance, stray capacitance.
As a kind of distortion, the distance H 1 between described input resistance R12 and described first via hole 203 also can be equal to, or greater than the distance H 2 between described input resistance R12 and described second via hole 204.With respect to the scheme of H1 less than H2, the scheme that H1 is equal to or greater than H2 can increase stray inductance, and the effect that influences damping resistance to a certain degree brings certain concussion can for the response of high-frequency signal.
In the present embodiment, in conjunction with reference to figure 3, first group of described little band interdigital electric capacity 300 refers to that 303 comprise 3 fingers, second group refers to that 304 comprise 2 fingers, described two groups refer to that 303,304 is arranged in a crossed manner, have coincidence face and refer to interbody spacer, can change capacitance by area and the finger interbody spacer that changes coincidence face.Because described little band interdigital electric capacity 300 adopts the Copper Foil of pcb board 201 top layers to constitute, it is set, and each refers to all have identical width, refer to that interbody spacer is all identical, first group refers to that 3 fingers of 303 are provided with identical length, only reaches the purpose that changes capacitance by changing second group of length that refers to 304 finger.
When actual production, can at first carry out emulation to described little band interdigital electric capacity 300, for example adopt the capacitance of the described little band interdigital electric capacity 300 of ADS software emulation of Agilent company, can design needed two groups and refer to 303 and 304 finger interbody spacer, the data such as length that refer to, directly be drawn in the top layer of pcb board 201 then, cut described second group with laser or milling cutter then and refer to two fingers of 304, length is reduced, reach the purpose that reduces capacitance, consider the making error of PCB, can realize being lower than the electric capacity of 0.1pF, realize the production of active differential probe 200.
In order further to improve the precision of described active differential probe 200, when described little band interdigital electric capacity 300 is cut, a standard probe is set, the waveform of described active differential probe 200 outputs and the same waveform of described standard probe output are compared, adjust in described little band interdigital electric capacity 300 second group of length that refers to two fingers of 304 by cutting then, make the waveform of described active differential probe 200 outputs consistent with the waveform of described standard probe output, namely finished the design to described little band interdigital electric capacity 300.
As a kind of distortion, in conjunction with reference to figure 5, described two input capacitance C11, C21 also can adopt little band interdigital electric capacity 500, be with the difference of described little band interdigital electric capacity 300, its second group refers to that two fingers of 502 have been divided into a plurality of sections, with binding line 503 bindings, each section all refers to that with another group 501 constitute littler one by one electric capacity like this, changes capacitance by binding line 503 is chosen disconnected mode between each section.
During actual production, also can at first carry out emulation to described little band interdigital electric capacity 500, design first group and refer to 501 length, design second group refer to 502 the section length and quantity, with binding line 503 bindings, binding is a kind of routing mode in the chip production technology.
In order further to improve precision, when choosing disconnected described binding line 503, a standard probe also can be set, the waveform of described active differential probe 200 outputs and the same waveform of described standard probe output are compared, change the capacitance of described little band interdigital electric capacity 500 then by the mode of choosing disconnected binding line 503 successively, consider the error that PCB makes, can realize being lower than the electric capacity of 0.1pF.
As another distortion, in conjunction with reference to figure 6, described two input capacitance C11, C12 also can adopt little band interdigital electric capacity 600, be with the difference of described little band interdigital electric capacity 300, first group of described little band interdigital electric capacity 600 refers to that 601 comprise 5 fingers, and the length of described 5 fingers differs, second group refers to that 602 comprise 4 fingers that length is identical, described first group refer to 601 each refer to arrange in proportion, for example refer to 6011: refer to 6012: refer to 6013: refer to 6014: refer to that 6015 length ratio adopted 1: 1: 2: 3: 3 ratio setting.The capacitance of needed input capacitance C11 is divided into very, goes out first group by design of Simulation and refer to that 601 and second groups refer to each length that refers to of 602.
During actual production, refer to that with first group the whole or part of 601 different finger cuts away, and can realize different capacitances with laser or milling cutter.
In order further to improve precision, a standard probe also is set, the waveform of described active differential probe 200 outputs and the same waveform of described standard probe output are compared, refer to adjust electric capacity with laser or milling cutter cutting then, consider the error that PCB makes, can realize being lower than the electric capacity of 0.1pF.
As another distortion, in conjunction with reference to figure 7 and Fig. 8, described two input capacitance C11, C12 also can adopt little band interdigital electric capacity 700, be with the difference of described little band interdigital electric capacity 300,700 of described little band interdigital electric capacity include a group of being arranged on described pcb board 201 top layers and refer to 701, and a copper coin 702 is set in described pcb board 201 simultaneously.The planar structure of described finger 701 has been shown among Fig. 8 A, has comprised that length is identical and 5 fingers that width is different, and be provided with the input end that is connected with described first via hole 203; Described copper coin 702 has been shown among Fig. 8 B, and has been provided with the output terminal that is connected with described second via hole 204.Described copper coin 702 is oppositely arranged with described finger 701, constitutes electric capacity.Capacitance then with refer to that 701 is relevant with the overlapping area of copper coin 702, spacing, PCB specific inductive capacity etc.
During actual production, also can at first carry out emulation to described little band interdigital electric capacity 700, design and refer to each length that refers to and width in 701, design the area of copper coin, cut whole finger by laser or milling cutter then or partly refer to, come capacitance value.
In order further to improve precision, a standard probe also can be set, the waveform of described active differential probe 200 outputs and the same waveform of described standard probe output are compared, refer to adjust electric capacity with laser or milling cutter cutting then, consider the error that PCB makes, can realize being lower than the electric capacity of 0.1pF.
As another distortion, described input end and the output terminal of little band interdigital electric capacity 300,500,600,700 all can arrange arbitrarily, and be not subjected to restrictions such as position, in conjunction with Fig. 3, Fig. 5, Fig. 6 as can be seen, described input end can be consistent with the length direction of described finger with output terminal, be arranged on the centre position, also can be arranged on the centre position; In conjunction with Fig. 8 also as can be seen, described input end also can be vertical with the length direction of described finger.Therefore, the position of input end and output terminal is to not influence of the present invention.
As another distortion, two groups of positions that refer to of little band interdigital electric capacity 300,500,600 can certainly be changed, for example little band interdigital electric capacity 500 also can be arranged on binding line first group and refers to, change capacitance by changing first group of length that refers to, perhaps first group is referred to be set to comprise 2 fingers, and refer to be set to comprise 3 fingers with second group.As can be seen, the quantity that each group refers to, length etc. all can not exert an influence to the present invention, can realize electric capacity of the present invention.
As can be seen from the above description, embodiments of the invention have solved the problem that the input capacitance precision described in the background technology and consistance are difficult to guarantee, a kind of active differential probe that adopts little band interdigital electric capacity to realize is provided, realized the ultralow input capacitance of active differential probe, the consistance of probe two-way input capacitance is good under the situation that stray capacitance exists, and then makes that also the consistance between the different probes is good; Also overcome simultaneously the problem of the PCB circuit design difficulty of bringing because the handle end volume is little, also effectively reduced because of stray capacitance that cabling brings, stray inductance etc., and be easy to produce, cost is low.
Above-described only is specific embodiments of the invention; institute is understood that; the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; and be not intended to limit the scope of the invention; all any modifications of within thought of the present invention and principle, making, be equal to replacement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the active differential with ultralow input capacitance is popped one's head in, and comprising:
Two probe input terminals and the difference detector amplification module with double input end include a damping resistance and a RC parallel circuit of being connected in series between the input end of each described probe input terminal and described difference detector amplification module;
Described RC parallel circuit is connected in parallel and constitutes by being arranged on a input resistance on the insulated substrate and an input capacitance;
It is characterized in that:
Described input capacitance is little band interdigital electric capacity, is made of the top layer Copper Foil of described insulated substrate;
The input end of each described little band interdigital electric capacity connects with corresponding damping resistance by first via hole that is arranged on the described insulated substrate, and output terminal is by being arranged on the corresponding input end connection of second via hole and described difference detector amplification module on the described insulated substrate;
Described input resistance is connected between described first via hole and second via hole, and is installed on the position relative with described little band interdigital electric capacity of described insulated substrate bottom.
2. active differential according to claim 1 is popped one's head in, and it is characterized in that:
Distance between described input resistance and described first via hole is smaller or equal to the distance between described input resistance and described second via hole.
3. active differential according to claim 1 is popped one's head in, and it is characterized in that:
Distance between described input resistance and described first via hole is less than the distance between described input resistance and described second via hole.
4. according to claim 2 or 3 described active differential probes, it is characterized in that:
Described insulated substrate is two-sided pcb board.
5. active differential according to claim 4 is popped one's head in, and it is characterized in that:
Described little band interdigital electric capacity comprises two groups of fingers arranged in a crossed manner that constitute with Copper Foil;
Wherein each of one group refers to have identical length;
The length that each of another group refers to is according to the capacitance setting.
6. active differential according to claim 4 is popped one's head in, and it is characterized in that:
Described little band interdigital electric capacity comprises two groups of fingers arranged in a crossed manner that constitute with Copper Foil;
Wherein one group finger is set to adopt the multistage of binding line binding connection, and the quantity of its section is according to the capacitance setting.
7. active differential according to claim 4 is popped one's head in, and it is characterized in that:
Described little band interdigital electric capacity comprises the corresponding copper coin with it with one group of finger that constitutes with the Copper Foil of pcb board top layer and;
Described finger is connected with described first via hole, and the area that refers to is according to the capacitance setting;
Described copper coin is arranged in the pcb board between described finger and the input resistance, and is connected with described second via hole.
8. according to claim 5 or 6 or 7 described active differential probes, it is characterized in that:
Described damping resistance is connected with the top layer terminals of described first via hole.
9. according to claim 5 or 6 or 7 described active differential probes, it is characterized in that:
The input end of institute's difference detector amplification module is connected with the top layer terminals of described second via hole.
10. according to claim 1 or 2 or 3 described active differential probes, it is characterized in that:
Described input resistance adopts Chip-R.
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| CN201110449258.6A CN103185818B (en) | 2011-12-29 | 2011-12-29 | A kind of active differential probe with ultra-low input capacitance |
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| CN201110449258.6A CN103185818B (en) | 2011-12-29 | 2011-12-29 | A kind of active differential probe with ultra-low input capacitance |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117310292A (en) * | 2023-11-28 | 2023-12-29 | 深圳市鼎阳科技股份有限公司 | System, method and medium for measuring input impedance of high-frequency power supply probe |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117310292A (en) * | 2023-11-28 | 2023-12-29 | 深圳市鼎阳科技股份有限公司 | System, method and medium for measuring input impedance of high-frequency power supply probe |
| CN117310292B (en) * | 2023-11-28 | 2024-01-30 | 深圳市鼎阳科技股份有限公司 | System, method and medium for measuring input impedance of high-frequency power supply probe |
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| CN103185818B (en) | 2017-03-29 |
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