CN103196958A - Organic-substrate-based passive radio capacitive humidity sensor packaging structure - Google Patents
Organic-substrate-based passive radio capacitive humidity sensor packaging structure Download PDFInfo
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- CN103196958A CN103196958A CN2013101177146A CN201310117714A CN103196958A CN 103196958 A CN103196958 A CN 103196958A CN 2013101177146 A CN2013101177146 A CN 2013101177146A CN 201310117714 A CN201310117714 A CN 201310117714A CN 103196958 A CN103196958 A CN 103196958A
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Abstract
The invention discloses an organic-substrate-based passive radio capacitive humidity sensor packaging structure, which comprises a humidity sensitive capacitor, an organic packaging substrate, a planar spiral inductor, a back connecting wire, an external connection pad, an internal connection pad, a sealing cover, an upper covering layer and a lower covering layer, wherein the humidity sensitive capacitor and the planar spiral inductor are respectively and fixedly connected to the top surface of the organic packaging substrate; one end of the back connecting wire is connected with an external port of the planar spiral inductor, and the other end of the back connecting wire is connected with the external connection pad which is connected with one electrode of the humidity sensitive capacitor; an internal connecting wire of the planar spiral inductor is connected with the internal connection pad which is connected with the other electrode of the humidity sensitive capacitor; and the sealing cover is fixedly connected onto the organic packaging substrate through an adhesive layer. The humidity sensor packaging structure consists of the wireless passive elements and has the performance advantages of no contact, small size and low power consumption.
Description
Technical field
The invention belongs to sensor technical field, specifically, relate to a kind of passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate.
Background technology
Humidity sensor is widely used in fields such as meteorological detection, agricultural production, Industry Control, Medical Devices.In recent years, the development of humidity sensor more and more trends towards microminiaturization.Existing miniature humidity sensor type mainly comprise condenser type, resistance-type, pressure resistance type and MEMS (micro electro mechanical system) (English full name: Micro-Electro-Mechanical Systems, be called for short in the literary composition: MEMS) etc.The wireless telemetering sensor comprises two big classes at present: active remote measurement and passive remote measurement.Active remote measurement refers to have in the sensor-based system power supply, and this remote mode can two-way long Distance Transmission sensor signal, but its system complex, size are big, and battery needs to change.Passive remote measurement refers to there is not power supply in the sensor-based system, utilize inductive coupling or radio frequency (English full name: Radio Frequency, be called for short in the literary composition: RF) reflection modulation realizes obtaining of signal, this remote mode signal transmission distance is short, but volume is little, do not need to change battery, can work indefinite duration in theory.Wherein, (corresponding English is that " LC tank, be called for short in the literary composition: LC) the passive and wireless humidity sensor is the topmost class in the passive remote measurement for inductance, capacitor loop.
Along with the development in sensor market, wireless senser will become an important directions of Internet of Things development.But the microminiaturized heighten degree of sensor, pin problem is a big problem that needs solution, and some occasion can not be used lead-in wire in addition, and this just needs to use wireless senser.
Summary of the invention
Technical matters:Technical matters to be solved by this invention is: a kind of passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate is provided, this humidity sensor encapsulating structure adopts the wireless and passive element to constitute, and has noncontact, volume feature performance benefit little, low in energy consumption.
Technical scheme:For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate, this humidity sensor encapsulating structure comprises humidity sensitive electric capacity, organic base plate for packaging, is provided with the planar spiral inductor of connection wire and external port, back side connecting line, be connected pad, interior connection pad, capping, upper caldding layer and lower caldding layer outward, wherein
Humidity sensitive electric capacity is fixedly connected on the end face of organic base plate for packaging by glue-line, and planar spiral inductor is fixedly connected on the end face of organic base plate for packaging, and planar spiral inductor is looped around the outside of humidity sensitive electric capacity; The outer pad that connects is connected the end face that pad is fixedly connected on organic base plate for packaging respectively with interior, and connects pad and interior connection pad outward between planar spiral inductor and humidity sensitive electric capacity;
Organic base plate for packaging is provided with to be electroplated accessibke porosity and electroplates inner via hole, electroplates inner via hole between humidity sensitive electric capacity and planar spiral inductor, electroplates accessibke porosity between organic base plate for packaging edge and planar spiral inductor;
Back side connecting line is positioned at the bottom surface of organic base plate for packaging, and connecting line one end in the back side passes the plating accessibke porosity, is connected with the external port of planar spiral inductor, and the back side connecting line other end passes the plating inner via hole, connects with the outer pad that is connected; The outer pad that connects is connected with a utmost point of humidity sensitive electric capacity by outer bonding lead-in wire; The connection wire of planar spiral inductor connects with the interior pad that is connected, and interior connection pad is connected by another utmost point of interior bonding wire and humidity sensitive electric capacity;
Upper caldding layer is connected the end face of organic base plate for packaging, and planar spiral inductor is between upper caldding layer and organic base plate for packaging; Lower caldding layer is connected the bottom surface of organic base plate for packaging, and back side connecting line is between lower caldding layer and organic base plate for packaging;
Capping is fixedly connected on the top of organic base plate for packaging by glue-line.
Further, have bleeder vent in the described capping.
Further, described passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate also comprises filter membrane, and filter membrane pastes on the inwall of capping.
Further, the thickness of described planar spiral inductor is the 10-20 micron
Beneficial effect:Compared with prior art, the present invention has following beneficial effect:
1. by constituting completely without the source element, volume is little, low in energy consumption, can be used as contactless moisture measurement occasion.Humidity sensor encapsulating structure of the present invention comprises humidity sensitive electric capacity, organic base plate for packaging, is provided with the planar spiral inductor of connection wire and external port, back side connecting line, be connected pad, interior connection pad, upper caldding layer and lower caldding layer outward.These parts are all passive element.There is planar spiral inductor 3 to be looped around around the humidity sensitive electric capacity 1 on organic base plate for packaging surface.This can reduce the volume of humidity sensor.Simultaneously, the humidity sensor encapsulating structure is low in energy consumption.At first this humidity sensor belongs to passive mode, and sensor node itself does not contain power supply, and itself does not consume any energy.Secondly, during this humidity sensor work, by inductive coupling, absorb the energy of outside sensing circuit, simultaneously humidity information is passed.Owing to be electric capacity-humidity sensitive, LC loop power absorbed also is low-down.Utilize sensitization capacitance to detect the variation of humidity, utilize the inductive coupling output signal.Humidity sensor encapsulating structure of the present invention can use the occasion that can not use lead-in wire at some, such as Humidity Detection in the seal chamber etc.
2. can be used for the Humidity Detection under the rugged surroundings.Humidity sensor encapsulating structure of the present invention has been avoided component failure that temperature effect etc. causes in the active device etc. by constituting completely without the source element, goes for the Humidity Detection under the rugged surroundings such as high temperature.
3. has high Q value microhenry inductance.Humidity sensor encapsulating structure of the present invention belongs to LC resonant mode passive and wireless sensor.In order to improve the performance of this class sensor, often need the microhenry inductance of high Q value, and general on-chip inductor is difficult to reach this requirement.Because in influencing numerous factors of inductance Q value, metal layer thickness is topmost.Metal layer thickness is more high, and the quality factor q value is more high.Normally obtain by sputtering technology based on the metal level of microelectronic processing technology, metal level is about 1-2 μ m usually, and the last metal level of pressure transducer of the present invention and lower metal layer adopt electroplating technology to obtain, and the thickness of last metal level and lower metal layer can reach tens microns respectively.The present invention adopts the encapsulation integrated inductor, and organic base plate for packaging wherein provides device needed high Q value microhenry inductance again namely as the base plate for packaging of sensor.Therefore, than LC passive and wireless sensor of the same type, sensor resonant tank quality factor q value height of the present invention, performance is better.
Description of drawings
Fig. 1 is the assembly structure figure of humidity sensitive electric capacity of the present invention, organic base plate for packaging and planar spiral inductor.
Fig. 2 is the structure figure of organic base plate for packaging among the present invention.
Fig. 3 is parts explosive view of the present invention.
Fig. 4 is for being provided with the structural representation of upper caldding layer and lower caldding layer among the present invention.
Have among the figure: humidity sensitive electric capacity 1, organic base plate for packaging 2, planar spiral inductor 3, glue-line 4, electroplate accessibke porosity 5, electroplate inner via hole 6, back side connecting line 7, connect pad 8, interior connection pad 9, outer bonding lead-in wire 10, interior bonding wire 11, filter membrane 12, capping 13, bleeder vent 14, upper caldding layer 15, lower caldding layer 16, connection wire 17, external port 18 outward.
Embodiment
Below in conjunction with drawings and Examples technical scheme of the present invention is described in further detail.
As shown in Figure 1 to Figure 3, a kind of passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate of the present invention comprises humidity sensitive electric capacity 1, organic base plate for packaging 2, is provided with the planar spiral inductor 3, back side connecting line 7 of connection wire 17 and external port 18, is connected pad 8, interior connection pad 9, capping 13, upper caldding layer 15 and lower caldding layer 16 outward.Organic base plate for packaging 2 can adopt polyimide (PI), polymeric liquid crystal copolymer (LCP), and perhaps polyethylene terephthalate (PET) is made.Humidity sensitive electric capacity 1 is fixedly connected on the end face of organic base plate for packaging 2 by glue-line 4.Planar spiral inductor 3 is fixedly connected on the end face of organic base plate for packaging 2.Planar spiral inductor 3 is looped around the outside of humidity sensitive electric capacity 1.Humidity sensitive electric capacity 1 and planar spiral inductor 3 are positioned at the same side of organic base plate for packaging 2, and between humidity sensitive electric capacity 1 and the planar spiral inductor 3 space are arranged.The outer pad 8 that connects is connected the end face that pad 9 is fixedly connected on organic base plate for packaging 2 respectively with interior.Outer connection pad 8 and interior connection pad 9 are between planar spiral inductor 3 and humidity sensitive electric capacity 1.Organic base plate for packaging 2 is provided with to be electroplated accessibke porosity 5 and electroplates inner via hole 6.Electroplate inner via hole 6 between humidity sensitive electric capacity 1 and planar spiral inductor 3, electroplate accessibke porosity 5 between organic base plate for packaging 2 edges and planar spiral inductor 3.Back side connecting line 7 is positioned at the bottom surface of organic base plate for packaging 2.Connecting line 7 one ends in the back side pass electroplates accessibke porosity 5, is connected with the external port 18 of planar spiral inductor 3.Connecting line 7 other ends in the back side pass electroplates inner via hole 6, connects with the outer pad 8 that is connected.The outer pad 8 that connects is connected with a utmost point of humidity sensitive electric capacity 1 by outer bonding lead-in wire 10.The connection wire 17 of planar spiral inductor 3 connects with the interior pad 9 that is connected.Interior connection pad 9 is connected by another utmost point of interior bonding wire 11 and humidity sensitive electric capacity 1.Upper caldding layer 15 is connected the end face of organic base plate for packaging 2, and planar spiral inductor 3 is between upper caldding layer 15 and organic base plate for packaging 2.Lower caldding layer 16 is connected the bottom surface of organic base plate for packaging 2, and back side connecting line 7 is between lower caldding layer 16 and organic base plate for packaging 2.Capping 13 is fixedly connected on the top of organic base plate for packaging 2 by glue-line.The packaging protection effect is played in capping 13, and simultaneously, this capping 13 can also be supported filter membrane 12, prevents that filter membrane 12 from pasting on the structure of capping 13 belows, and the influence heat radiation influences performance.
Further, have bleeder vent 14 in the described capping 13.In capping 13 bleeder vent 14 is set, can allows capping 13 inner air and outer air circulate, allow the extraneous humidity of humidity sensitive electric capacity 1 impression change.
Further, described passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate also comprises filter membrane 12, and filter membrane 12 pastes on the inwall of capping 13.Filter membrane 12 can prevent that impurity such as extraneous dust from entering in the humidity sensitive electric capacity 1, influences performance.
In the passive and wireless electric capacity formula humidity sensor encapsulating structure of said structure, humidity sensitive electric capacity 1 sticks on organic base plate for packaging 2 by glue-line 4, and organic base plate for packaging has planar spiral inductor 3 to be looped around around the humidity sensitive electric capacity 1 on 2 surfaces.This can reduce the volume of humidity sensor.Take all factors into consideration inductance value and the quality factor q value of planar spiral inductor 3, planar spiral inductor 3 is generally taked hollow structure.In the middle of like this humidity sensitive electric capacity 1 being placed, just can not increase the size of entire device.The connection wire 17 of planar spiral inductor 3 links to each other with the interior pad 9 that is connected, and interior connection pad 9 is connected by a utmost point of interior bonding wire 11 and humidity sensitive electric capacity 1; The external port 18 of planar spiral inductor 3 is successively by electroplating accessibke porosity 5, back side connecting line 7, electroplating inner via hole 6 and link to each other with the outer pad 8 that is connected, and connects pad 8 outward and is connected with another utmost point of electric capacity on the humidity sensitive electric capacity nude film 1 by outer bonding lead-in wire 10.Humidity sensitive electric capacity 1 and planar spiral inductor 3 two ends interconnect, and form LC(inductance, capacitor loop) resonant tank.
Further, the thickness of planar spiral inductor 3 is the 10-20 micron.The metal layer thickness of existing sensors is about 1-2 μ m.Planar spiral inductor 3 thickness of the present invention are greater than the metal layer thickness of existing sensors, favourable raising inductance quality factor q value.
The principle of work of the humidity sensor encapsulating structure of said structure is: the output of capacitance type humidity sensor is electric capacity, for electric capacity is exported, the present invention adopts the way of output of passive and wireless, so outer coilloading, with the mode of capacitor and inductor (LC) resonance, what measure is frequency, be exactly that f equals the evolution of (LC), if frequency f has changed like this, inductance L is constant, just can know the value of capacitor C.
The course of work of the humidity sensor encapsulating structure of said structure is: humidity sensitive electric capacity 1 obtains different capacitances at first according to the variation of extraneous humidity.After the resonant circuit that humidity sensitive electric capacity 1 and planar spiral inductor 3 constitute interacted, the resonance frequency of entire circuit will change.Obtain changes in capacitance according to change of resonance frequency, thus the humidity of obtaining.
The ohmic loss of wire coil is the main factor that suppresses planar inductor quality factor q value, and two Basic Ways of reduction certain-length coil resistance improve conductivity exactly and increase sectional area.Splash-proofing sputtering metal inductance on traditional sheet, the thickness of splash-proofing sputtering metal limited (normally below two microns).Make the inductance of same width, the sectional area of on-chip inductor is little, and planar spiral inductor 3 sectional areas among the present invention are bigger, thereby improves inductance Q value.
Claims (4)
1. passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate, it is characterized in that, this humidity sensor encapsulating structure comprises humidity sensitive electric capacity (1), organic base plate for packaging (2), is provided with the planar spiral inductor (3) of connection wire (17) and external port (18), back side connecting line (7), be connected pad (8), interior connection pad (9), capping (13), upper caldding layer (15) and lower caldding layer (16) outward, wherein
Humidity sensitive electric capacity (1) is fixedly connected on the end face of organic base plate for packaging (2) by glue-line (4), planar spiral inductor (3) is fixedly connected on the end face of organic base plate for packaging (2), and planar spiral inductor (3) is looped around the outside of humidity sensitive electric capacity (1); The outer pad (8) that connects is connected the end face that pad (9) is fixedly connected on organic base plate for packaging (2) respectively with interior, and connects pad (8) outward and interior connection pad (9) is positioned between planar spiral inductor (3) and the humidity sensitive electric capacity (1);
Organic base plate for packaging (2) is provided with to be electroplated accessibke porosity (5) and electroplates inner via hole (6), electroplate inner via hole (6) and be positioned between humidity sensitive electric capacity (1) and the planar spiral inductor (3), electroplate accessibke porosity (5) and be positioned between organic base plate for packaging (2) edge and the planar spiral inductor (3);
Back side connecting line (7) is positioned at the bottom surface of organic base plate for packaging (2), and connecting line (7) one ends in the back side pass electroplates accessibke porosity (5), be connected with the external port (18) of planar spiral inductor (3), back side connecting line (7) other end passes electroplates inner via hole (6), connects with the outer pad (8) that is connected; The outer pad (8) that connects is connected with a utmost point of humidity sensitive electric capacity (1) by outer bonding lead-in wire (10); The connection wire (17) of planar spiral inductor (3) connects with the interior pad (9) that is connected, and interior connection pad (9) is connected by another utmost point of interior bonding wire (11) and humidity sensitive electric capacity (1);
Upper caldding layer (15) is connected the end face of organic base plate for packaging (2), and planar spiral inductor (3) is positioned between upper caldding layer (15) and the organic base plate for packaging (2); Lower caldding layer (16) is connected the bottom surface of organic base plate for packaging (2), and back side connecting line (7) is positioned between lower caldding layer (16) and the organic base plate for packaging (2);
Capping (13) is fixedly connected on the top of organic base plate for packaging (2) by glue-line.
2. according to the described passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate of claim 1, it is characterized in that, have bleeder vent (14) in the described capping (13).
3. according to claim 1 or 2 described passive and wireless electric capacity formula humidity sensor encapsulating structures based on organic substrate, it is characterized in that also comprise filter membrane (12), filter membrane (12) pastes on the inwall of capping (13).
4. according to the described passive and wireless electric capacity formula humidity sensor encapsulating structure based on organic substrate of claim 3, it is characterized in that the thickness of described planar spiral inductor (3) is the 10-20 micron.
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| CN2013101177146A CN103196958A (en) | 2013-04-08 | 2013-04-08 | Organic-substrate-based passive radio capacitive humidity sensor packaging structure |
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Cited By (5)
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|---|---|---|---|---|
| CN103344679A (en) * | 2013-07-16 | 2013-10-09 | 西安电子科技大学 | LTCC (Low Temperature Co-Fired Ceramic)-based passive LC (inductive-capacitive) humidity sensor |
| CN106197537A (en) * | 2016-06-29 | 2016-12-07 | 东南大学 | The passive wireless sensor that a kind of humiture is integrated |
| CN106365105A (en) * | 2016-09-24 | 2017-02-01 | 苏州捷研芯纳米科技有限公司 | MEMS technology based gas sensor package and batch processing method thereof |
| CN109253757A (en) * | 2018-09-26 | 2019-01-22 | 东南大学 | A kind of flexible passive is wireless humidity, pressure integrated sensor |
| WO2021169020A1 (en) * | 2020-02-24 | 2021-09-02 | 东南大学 | Passive wireless detection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103344679A (en) * | 2013-07-16 | 2013-10-09 | 西安电子科技大学 | LTCC (Low Temperature Co-Fired Ceramic)-based passive LC (inductive-capacitive) humidity sensor |
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| CN106365105A (en) * | 2016-09-24 | 2017-02-01 | 苏州捷研芯纳米科技有限公司 | MEMS technology based gas sensor package and batch processing method thereof |
| CN109253757A (en) * | 2018-09-26 | 2019-01-22 | 东南大学 | A kind of flexible passive is wireless humidity, pressure integrated sensor |
| WO2020062529A1 (en) * | 2018-09-26 | 2020-04-02 | 东南大学 | Flexible passive wireless integrated humidity and pressure sensor |
| CN109253757B (en) * | 2018-09-26 | 2020-05-19 | 东南大学 | Flexible passive wireless humidity and pressure integrated sensor |
| WO2021169020A1 (en) * | 2020-02-24 | 2021-09-02 | 东南大学 | Passive wireless detection device |
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Application publication date: 20130710 |