CN103212784A - Rapid processing method for laser Punch - Google Patents
Rapid processing method for laser Punch Download PDFInfo
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- CN103212784A CN103212784A CN2012100156985A CN201210015698A CN103212784A CN 103212784 A CN103212784 A CN 103212784A CN 2012100156985 A CN2012100156985 A CN 2012100156985A CN 201210015698 A CN201210015698 A CN 201210015698A CN 103212784 A CN103212784 A CN 103212784A
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Abstract
The invention relates to a rapid processing method for a laser Punch, mainly solving the problems of the requirement of re-heating treatment and a slow processing speed during laser repeat processing in the prior art. The invention adopts the technical scheme that the rapid processing method for the laser Punch comprises the following steps of a) under a punch mode, controlling the laser outgoing pulse by the adoption of a computer, and controlling the number of the pulse by adjusting a frequency and punchtime; b) adjusting appropriate laser power, single-pulse energy density, laser frequency and a punch time parameter, enabling the laser to process a material to the extent of cutting through or semi-engraving under the punch mode; c), measuring the sizes of laser light spots punched by the step b), and determining a distance among punch points according to the precision requirement needed by the processing of the material; d), replacing size images of the light spots in the step c) into punch point images, and setting the distance among the punch points to be the distance in the step c); and e), selecting all punch points, and carrying out the processing. According to the invention, the problems are better solved, and the rapid processing method can be applied to the laser processing industry.
Description
Technical field
The present invention relates to a kind of Ultra-Violet Laser punch fast processing method.
Background technology
In laser processing technology, the mode of operation of general laser instrument is made as pulse mode, when running into more unmanageable workpiece, adopts the processing that repeats for one time one time usually, up to being effective.The drawback of doing like this is that material cools off usually when processing reprocessing for one time, need during Laser Processing laser again with the material production fuel factor, thereby further cutting has just been wasted a lot of unnecessary times in the middle of this.And general processing mode attaches most importance to and is added with the worker, and every the repetition once all will return the figure starting point from the figure terminal point, and these idle runnings of walking also can be wasted a lot of times.
Chinese patent CN100398249 discloses a kind of laser cutting device, comprising: the material delivery device), its board-like material transports to feeding direction; Processing head, it can be to the material irradiating laser; Head moving device, it is used to make processing head to move on the feeding direction of material and width; The upstream side supporting arrangement, it is the upstream side supporting material below processing head, and dwindles along with processing head enlarges on feeding direction to moving of feeding direction and the support region of material; The downstream supporting arrangement, the part that has cut is supported in its downstream below processing head, and dwindles along with processing head enlarges on feeding direction to moving of feeding direction and the support region of the part that has cut.
Chinese patent CN101537535 discloses a kind of aplanatic light path control device of laser cutter, comprise that compensatory reflex illuminating apparatus structure on lasing light emitter, the light path and compensation mechanism thereof drive, speculum, laser cutting head and driving thereof on the laser cutting head, a line slideway auxiliary on the shared crossbeam of compensatory reflex illuminating apparatus structure and laser cutting head, compensation mechanism driving and laser cutting head drive a transmission on the shared crossbeam; The direction of motion of compensatory reflex illuminating apparatus structure is consistent with the direction of motion of laser cutting head also to be begun simultaneously and stops, and the ratio between the movement velocity V2 on the crossbeam line slideway auxiliary is compensatory reflex illuminating apparatus structure: V1: V2=1: 2 at movement velocity V1 on the crossbeam line slideway auxiliary and laser cutting head.When laser cutting head during along Y direction move distance 2Y, the move distance of compensatory reflex mirror is Y, thereby guarantees that optical path length is constant.
Above-mentioned patent does not all disclose fast processing method of the present invention.This patent proposes a kind of laser punch fast processing method, and this method process is: each hot spot is worked into ideal effect (cut and wear or half quarter) and reprocesses next hot spot, has avoided repeating heat treated phenomenon, has reached the method for rapid processing.
Summary of the invention
Technical problem to be solved by this invention is that existing laser repeats to add man-hour, needs heat treatment again, the problem that working (machining) efficiency is low, the invention provides a kind of method of laser punch rapid processing, this method has the repetition of avoiding heat treatment phenomenon, advantage of high processing efficiency.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows: a kind of laser punch fast processing method comprises following step:
A) under the punch pattern, adopt the pulse of computer control laser emitting, by the number of regulating frequency and punch time control impuls;
B) regulate suitable laser power, single pulse energy metric density, laser frequency and punch time parameter, make laser under the punch pattern, materials processing is worn or half degree of carving to cutting;
C) size of the laser facula of getting measuring process b), the spacing between each punch point is determined in required according to materials processing again required precision;
D) graphics processing is replaced with the punch dot pattern, the spacing between each punch point is made as the spacing in the step c);
E) select the punch point entirely, process.
In the technique scheme, the required precision in the step c) is flatness of edges and smoothness requirement, and the Duplication that generally requires laser facula is more than 70%.The required time of Punch processing mode is: △ t1+50 △ t, and wherein, △ t1 is the used time of material preheater, △ t is needed time of processing.
Among the present invention, the operation principle of punch pattern is:, under the punch pattern, the pulse of computer control laser emitting is by the number of regulating frequency and punch time control impuls.The laser punch fast processing method concrete steps that this patent proposes are as follows: regulate suitable parameters (laser power, the single pulse energy metric density, frequency and punch time), the effect that allows laser under the punch pattern, on material, process to want (cut wear or half carve); Measure the first step and get the size of hot spot, the spacing between each punch point is determined in required according to materials processing again required precision (flatness of edges and smoothness); Original figure is replaced with the punch point, and the spacing between each punch point is made as the spacing in second step; Select the punch point entirely, process.
The invention has the advantages that: under the punch pattern, each hot spot is worked into ideal effect (cut and wear or half quarter) and reprocesses next hot spot, has avoided repeating heat treated phenomenon, has reached the method for rapid processing.The present invention solves laser and repeats to add the heat treated again problem of needs in man-hour, has improved the efficient of Laser Processing.Experimental data shows, adopts processing method working (machining) efficiency of the present invention to improve more than 200%, has obtained better technical effect.
Description of drawings
Fig. 1 is punch processing mode and general processing mode contrast schematic diagram.
Fig. 2 affacts on the material for single laser facula in the general processing mode, and the material heat is schematic diagram over time.
Fig. 3 affacts on the material for single laser facula in the Punch processing mode, and the material heat is schematic diagram over time.
Among Fig. 1,1 is general processing mode; 2 is the punch processing mode.General processing mode adopts the processing that repeats for one time one time, up to being effective.The punch processing mode is reprocessed second hot spot for after first hot spot is worked into effect.
Among Fig. 2, Fig. 3, the comparison diagram of two kinds of methods of single hot spot point has drawn, shown in Figure 2 affacts on the material for single laser facula, the material heat over time, △ t1 is the used time of material preheater, have only the heat of working as to reach more than the T1, material could melt vaporization, just can reach the effect of processing.Suppose that traditional general fashion processing needs processing 50 times, so for the processing of single hot spot point, the general required time of processing mode is: 50(△ t1+ △ t).
Among Fig. 3, the required time of Punch processing mode is: △ t1+50 △ t.
Merely calculate the laser action time, the punch processing mode is saved the time of 49 △ t1.And general processing mode attaches most importance to and is added with the worker, and every the repetition once all will return the figure starting point from the figure terminal point, and these idle runnings of walking also can be wasted a lot of times.
The invention will be further elaborated below by specific embodiment, but be not limited only to present embodiment.
Specific embodiment
[embodiment 1]
A kind of laser punch fast processing method comprises following step: a) under the punch pattern, adopt the pulse of computer control laser emitting, by the number of regulating frequency and punch time control impuls; B) regulate suitable laser power, single pulse energy metric density, laser frequency and punch time parameter, make laser under the punch pattern, materials processing is worn or half degree of carving to cutting; C) size of the laser facula of getting measuring process b), the spacing between each punch point is determined in required according to materials processing again required precision; D) the big or small figure with the hot spot in the step c) replaces with each punch dot pattern, and the spacing between each punch point is made as the spacing in the step c); E) select the punch point entirely, process, as shown in Figure 1, required precision in the step c) is flatness of edges and smoothness requirement, and the required time of Punch processing mode is: △ t1+50 △ t, wherein, △ t1 is the used time of material preheater, and △ t is needed time of processing.
[embodiment 2]
A kind of laser punch fast processing method comprises following step: a) under the punch pattern, adopt the pulse of computer control laser emitting, by the number of regulating frequency and punch time control impuls; B) regulate suitable laser power, single pulse energy metric density, laser frequency and punch time parameter, make laser under the punch pattern, materials processing is worn or half degree of carving to cutting; C) size of the laser facula of getting measuring process b), the spacing between each punch point is determined in required according to materials processing again required precision; D) the big or small figure with the hot spot in the step c) replaces with each punch dot pattern, and the spacing between each punch point is made as the spacing in the step c); E) select the punch point entirely, process, as shown in Figures 2 and 3, the required precision in the step c) is flatness of edges and smoothness requirement.The required time of Punch processing mode is: △ t1+50 △ t, and wherein, △ t1 is the used time of material preheater, △ t is needed time of processing.
Accompanying drawing 2 comparison diagram of two kinds of methods of single hot spot point that drawn, affacting on the material shown in the last figure for single laser facula, the material heat is over time, △ t1 is the used time of material preheater, have only the heat of working as to reach more than the T1, material could melt vaporization, just can reach the effect of processing.Suppose that traditional general fashion processing needs processing 50 times, for the processing of single hot spot point, two kinds of required times of processing mode are so:
General processing mode: 50(△ t1+ △ t);
Punch processing mode: △ t1+50 △ t;
So merely calculate the laser action time, the punch processing mode will be saved the time of 49 △ t1.And general processing mode attaches most importance to and is added with the worker, and every the repetition once all will return the figure starting point from the figure terminal point, and these idle runnings of walking also can be wasted a lot of times.
Present embodiment has solved laser and has repeated to add the heat treated again problem of needs in man-hour, has improved the efficient of Laser Processing.
[embodiment 3]
A kind of laser punch fast processing method comprises following step: a) under the punch pattern, adopt the pulse of computer control laser emitting, by the number of regulating frequency and punch time control impuls; B) regulate suitable laser power, single pulse energy metric density, laser frequency and punch time parameter, make laser under the punch pattern, materials processing is worn or half degree of carving to cutting; C) size of the laser facula of getting measuring process b), the spacing between each punch point is determined in required according to materials processing again required precision; D) the big or small figure with the hot spot in the step c) replaces with each punch dot pattern, and the spacing between each punch point is made as the spacing in the step c); E) select the punch point entirely, process, the required time of Punch processing mode is: △ t1+50 △ t, and wherein, △ t1 is the used time of material preheater, △ t is needed time of processing.
Experiment shows, traditional processing mode cost 10 seconds, and the punch processing mode only needed for 3 seconds, had improved working (machining) efficiency greatly.
Claims (3)
1. laser punch fast processing method comprises following step:
A) under the punch pattern, adopt the pulse of computer control laser emitting, by the number of regulating frequency and punch time control impuls;
B) regulate suitable laser power, single pulse energy metric density, laser frequency and punch time parameter, make laser under the punch pattern, materials processing is worn or half degree of carving to cutting;
C) size of the laser facula of getting measuring process b), the spacing between each punch point is determined in required according to materials processing again required precision;
D) the big or small figure with the hot spot in the step c) replaces with each punch dot pattern, and the spacing between each punch point is made as the spacing in the step c);
E) select the punch point entirely, process.
2. laser punch fast processing method according to claim 1 is characterized in that the required precision in the step c) is flatness of edges and smoothness requirement, and the Duplication that requires laser facula is more than 70%.
3. laser punch fast processing method according to claim 1 is characterized in that the required time of Punch processing mode is: △ t1+50 △ t, and wherein, △ t1 is the used time of material preheater, △ t is needed time of processing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100156985A CN103212784A (en) | 2012-01-19 | 2012-01-19 | Rapid processing method for laser Punch |
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| CN2012100156985A CN103212784A (en) | 2012-01-19 | 2012-01-19 | Rapid processing method for laser Punch |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639591A (en) * | 2013-11-21 | 2014-03-19 | 吕武全 | Laser marking method |
| CN109070272A (en) * | 2016-07-01 | 2018-12-21 | 宝马股份公司 | Method for welded unit |
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| JPH11145581A (en) * | 1997-11-10 | 1999-05-28 | Hitachi Seiko Ltd | Method and equipment for drilling printed board |
| CN2571530Y (en) * | 2002-09-25 | 2003-09-10 | 江苏大学 | Laser blast wave technology based quick mould mfg. device |
| US20060086702A1 (en) * | 1999-12-28 | 2006-04-27 | Gsi Group Corp | Energy-efficient, laser-based method and system for processing target material |
| CN101131470A (en) * | 2007-09-21 | 2008-02-27 | 北京工业大学 | Diaphragm ultraviolet laser micromachining system used for scanning electron microscope and method thereof |
| CN201702512U (en) * | 2010-06-28 | 2011-01-12 | 苏州市博海激光科技有限公司 | Laser on-line punching device for thin materials |
-
2012
- 2012-01-19 CN CN2012100156985A patent/CN103212784A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11145581A (en) * | 1997-11-10 | 1999-05-28 | Hitachi Seiko Ltd | Method and equipment for drilling printed board |
| US20060086702A1 (en) * | 1999-12-28 | 2006-04-27 | Gsi Group Corp | Energy-efficient, laser-based method and system for processing target material |
| CN2571530Y (en) * | 2002-09-25 | 2003-09-10 | 江苏大学 | Laser blast wave technology based quick mould mfg. device |
| CN101131470A (en) * | 2007-09-21 | 2008-02-27 | 北京工业大学 | Diaphragm ultraviolet laser micromachining system used for scanning electron microscope and method thereof |
| CN201702512U (en) * | 2010-06-28 | 2011-01-12 | 苏州市博海激光科技有限公司 | Laser on-line punching device for thin materials |
Non-Patent Citations (1)
| Title |
|---|
| H.H.雷卡林等: "《材料的激光加工》", 30 June 1982, article "《提高加工的精度和重复性的方法》", pages: 204-210 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639591A (en) * | 2013-11-21 | 2014-03-19 | 吕武全 | Laser marking method |
| CN109070272A (en) * | 2016-07-01 | 2018-12-21 | 宝马股份公司 | Method for welded unit |
| CN109070272B (en) * | 2016-07-01 | 2021-05-04 | 宝马股份公司 | Method for welding components |
| US11839930B2 (en) | 2016-07-01 | 2023-12-12 | Bayerische Motoren Werke Aktiengesellschaft | Method for welding components |
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Application publication date: 20130724 |