CN103234175A - Method for installing LED in backlight module and LED jointing structure - Google Patents
Method for installing LED in backlight module and LED jointing structure Download PDFInfo
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- CN103234175A CN103234175A CN2013101131443A CN201310113144A CN103234175A CN 103234175 A CN103234175 A CN 103234175A CN 2013101131443 A CN2013101131443 A CN 2013101131443A CN 201310113144 A CN201310113144 A CN 201310113144A CN 103234175 A CN103234175 A CN 103234175A
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- adhesive tape
- conductive adhesive
- led
- positive
- terminal pad
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Abstract
The embodiment of the invention discloses a method for installing an LED (Light Emitting Diode) in a backlight module and an LED jointing structure. The structure comprises a plastic substrate, at least one LED and a conductive rubber strip; the positive pole of the conductive rubber strip is communicated with the positive pole of a power supply of the backlight module; the negative pole of the conductive rubber strip is communicated with the negative pole of the power supply of the backlight module; both the positive pole of the conductive rubber strip and the negative pole of the conductive rubber strip are adhered onto the plastic substrate; and a positive pin and a negative pin of the LED are respectively pressed on the positive pole and the negative pole of the conductive rubber strip.
Description
Technical field
The present invention relates to the liquid crystal module manufacturing technology, relate in particular to a kind of method and LED bonding structure that LED is installed in module backlight.
Background technology
Module backlight is one of key part and component of liquid crystal module, because liquid crystal itself does not possess the characteristics of luminescence, therefore, must add a light emitting source in the liquid crystal panel bottom surface, can reach full color display effect, the function of module backlight just is to provide sufficient brightness and the planar light source that is evenly distributed, and makes normally show image of liquid crystal panel, in general, module backlight is made up of optical modules such as led light source, film, bright enhancement film, light-diffusing films.
The assembling mode of existing led light source all is earlier with FPC(Flexible Printed Circuit, flexible PCB) double faced adhesive tape is attached to the exiting surface of film, will have the FPC of piece LED to stick on the film by the FPC double faced adhesive tape then.
This FPC and SMT(Surface Mounted Technology, the surface mounting technology of utilizing) there is the defective easily fall part and to train off the position in the mounting means of welding procedure piece LED, and is difficult to process again, causes that technology is loaded down with trivial details, cost is higher.
Summary of the invention
Embodiment of the invention technical problem to be solved is, a kind of method and LED bonding structure that LED is installed in module backlight is provided, and can avoid LED often to fall the problem of part and off normal, is easy to repeat maintenance, has reduced production cost.
In order to solve the problems of the technologies described above, the embodiment of the invention provides a kind of method that LED is installed in module backlight, may further comprise the steps:
The positive source of module backlight is connected to a conductive adhesive tape positive pole, the power cathode of module backlight is connected to described conductive adhesive tape negative pole;
All paste described conductive adhesive tape positive pole and conductive adhesive tape negative pole on the plastic base;
Positive pin and the negative pin of LED are pressed to respectively on described conductive adhesive tape positive pole and the conductive adhesive tape negative pole.
Wherein, described method is further comprising the steps of:
Before the positive pin of LED and negative pin being pressed on the anodal and conductive adhesive tape negative pole of described conductive adhesive tape respectively, draw at least one positive terminal pad at described conductive adhesive tape positive pole, draw at least one negative terminal pad at described conductive adhesive tape negative pole;
The positive pin of described LED is pressed on the described positive terminal pad, the negative pin of described LED is pressed on the described negative terminal pad.
Wherein, described method is further comprising the steps of:
When all pasting described conductive adhesive tape positive pole and conductive adhesive tape negative pole on the plastic base, make described conductive adhesive tape anodal parallel with the conductive adhesive tape negative pole.
Wherein, described method is further comprising the steps of:
When described conductive adhesive tape positive pole is drawn at least one positive terminal pad, make the lead-out wire of described positive terminal pad anodal vertical with described conductive adhesive tape;
When described conductive adhesive tape negative pole is drawn at least one negative terminal pad, make the lead-out wire of described negative terminal pad vertical with described conductive adhesive tape negative pole.
Wherein, described positive terminal pad, negative terminal pad and lead-out wire thereof form by the extension of conductive adhesive tape.
Correspondingly, the present invention also provides a kind of LED bonding structure for module backlight, comprise plastic base, at least one LED and conductive adhesive tape, described conductive adhesive tape is anodal to be communicated with the positive source of module backlight, described conductive adhesive tape negative pole is communicated with the power cathode of module backlight, described conductive adhesive tape positive pole and conductive adhesive tape negative pole all stick on the described plastic base, and the positive pin of described LED and negative pin press to respectively on described conductive adhesive tape positive pole and the described conductive adhesive tape negative pole.
Wherein, described conductive adhesive tape positive pole comprises at least one positive terminal pad, comprises at least one negative terminal pad on the described conductive adhesive tape negative pole, and the positive pin of described LED is pressed together on the described positive terminal pad, and the negative pin of described LED is pressed together on the described negative terminal pad.
Wherein, described conductive adhesive tape is anodal parallel with the conductive adhesive tape negative pole.
Wherein, the lead-out wire of described positive terminal pad is anodal vertical with described conductive adhesive tape, and the lead-out wire of described negative terminal pad is vertical with described conductive adhesive tape negative pole.
Wherein, described positive terminal pad, negative terminal pad and lead-out wire thereof form by the extension of conductive adhesive tape.
Implement the embodiment of the invention, has following beneficial effect: replace FPC by utilize conductive adhesive tape at plastic base, directly LED is pressed on the conductive adhesive tape then, can avoid LED usually to fall the defective of part, off normal, be easy to repeat maintenance, thereby reduced process complexity and production cost.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the flow chart of the method that LED is installed in module backlight that provides of preferred embodiment of the present invention;
Fig. 2 is the schematic diagram of the LED bonding structure that provides of preferred embodiment of the present invention.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Seeing also Fig. 1, is the flow process of the method that LED is installed in module backlight that provides of preferred embodiment of the present invention, and this method comprises:
Step S100, the positive source of module backlight is connected to a conductive adhesive tape positive pole, the power cathode of module backlight is connected to described conductive adhesive tape negative pole.
Step S101, described conductive adhesive tape positive pole and conductive adhesive tape negative pole are all pasted on the plastic base.Wherein, plastic base can be made by various plastic materials such as PET.Conductive adhesive tape is commonly called as and is the zebra bar, by electric silica gel and insulation silica gel alternatively layered stack after cure moulding.
Step S102, positive pin and the negative pin of LED pressed to respectively on described conductive adhesive tape positive pole and the conductive adhesive tape negative pole.The process of pressing comprises utilizes vacuum cups to draw components and parts, need to aim at the position of LED positive and negative electrode, in addition, need apply certain pressure during pressing, in order to the positive pin of LED, negative pin and electric adhesive tape are fitted tightly, thereby LED are pasted on the conductive adhesive tape.Wherein, conductive adhesive tape can be two-sided conductive adhesive tape.
The method that LED is installed in module backlight that the embodiment of the invention provides, by utilize conductive adhesive tape to replace FPC at plastic base, directly LED is pressed on the conductive adhesive tape then, can avoid LED usually to fall the defective of part, off normal, be easy to repeat maintenance, thereby reduced process complexity and production cost.
Preferably, in step S101, positive pin and the negative pin of LED directly can be pressed on conductive adhesive tape positive pole and the conductive adhesive tape negative pole, but standard is neat more in order to make configuration, can also be before step S101, earlier draw at least one positive terminal pad at described conductive adhesive tape positive pole, draw at least one negative terminal pad at described conductive adhesive tape negative pole; Positive pin with described LED presses on the described positive terminal pad then, and the negative pin of described LED is pressed on the described negative terminal pad.。That is to say, draw the positive terminal pad that at least one is used for the positive pin of applying LED at the conductive adhesive tape positive pole, draw the negative terminal pad that at least one is used for the negative pin of applying LED at the conductive adhesive tape negative pole, wherein positive terminal pad is preferably corresponding one by one with negative terminal pad.As a rule, when all pasting described conductive adhesive tape positive pole and conductive adhesive tape negative pole on the plastic base, make described conductive adhesive tape anodal parallel with the conductive adhesive tape negative pole; When described conductive adhesive tape positive pole is drawn at least one positive terminal pad, make the lead-out wire of described positive terminal pad anodal vertical with described conductive adhesive tape; When described conductive adhesive tape negative pole is drawn at least one negative terminal pad, make the lead-out wire of described negative terminal pad vertical with described conductive adhesive tape negative pole.And positive terminal pad, negative terminal pad and lead-out wire thereof form by the extension of conductive adhesive tape.
Please participate in Fig. 2, the schematic diagram of the LED bonding structure 1 that provides for preferred embodiment of the present invention, this structure 1 comprises plastic base 11, at least one LED12 and conductive adhesive tape, conductive adhesive tape anodal 13 is communicated with the positive source of module backlight, conductive adhesive tape negative pole 14 is communicated with the power cathode of module backlight, described conductive adhesive tape anodal 13 and conductive adhesive tape negative pole 13 all stick on the described plastic base 11, and the positive pin of described LED12 and negative pin press to respectively on described conductive adhesive tape anodal 13 and the described conductive adhesive tape negative pole 14.Wherein, plastic base 11 can be made by various plastic materials such as PET.
The LED bonding structure that the embodiment of the invention provides, by utilize conductive adhesive tape to replace FPC at plastic base, directly LED is pressed on the conductive adhesive tape then, can avoid LED usually to fall the defective of part, off normal, be easy to repeat maintenance, thereby reduced process complexity and production cost.
Preferably, as shown in Figure 2, standard is neat more in order to make configuration, conductive adhesive tape positive pole 13 comprises at least one positive terminal pad 131, conductive adhesive tape negative pole 14 comprises at least one negative terminal pad 141, the positive pin of described LED is pressed together on the described positive terminal pad 131, and the negative pin of described LED is pressed together on the described negative terminal pad 141.That is to say, draw the positive terminal pad 131 that at least one is used for the positive pin of applying LED at conductive adhesive tape positive pole 13, draw the negative terminal pad 141 that at least one is used for the negative pin of applying LED at conductive adhesive tape negative pole 14, wherein positive terminal pad 131 is preferably corresponding one by one with negative terminal pad 141.As a rule, conductive adhesive tape anodal 13 is parallel with conductive adhesive tape negative pole 14, and the lead-out wire of positive terminal pad 131 is vertical with conductive adhesive tape anodal 13, and the lead-out wire of negative terminal pad 141 is vertical with conductive adhesive tape negative pole 14.And positive terminal pad 131, negative terminal pad 141 and lead-out wire thereof form by the extension of conductive adhesive tape.
Above disclosed only is a kind of preferred embodiment of the present invention, certainly can not limit the present invention's interest field with this, one of ordinary skill in the art will appreciate that all or part of flow process that realizes above-described embodiment, and according to the equivalent variations that claim of the present invention is done, still belong to the scope that invention is contained.
Claims (10)
1. the method that LED is installed in module backlight is characterized in that, may further comprise the steps:
The positive source of module backlight is connected to a conductive adhesive tape positive pole, the power cathode of module backlight is connected to described conductive adhesive tape negative pole;
All paste described conductive adhesive tape positive pole and conductive adhesive tape negative pole on the plastic base;
Positive pin and the negative pin of LED are pressed to respectively on described conductive adhesive tape positive pole and the conductive adhesive tape negative pole.
2. the method for claim 1 is characterized in that, described method is further comprising the steps of:
Before the positive pin of LED and negative pin being pressed on the anodal and conductive adhesive tape negative pole of described conductive adhesive tape respectively, draw at least one positive terminal pad at described conductive adhesive tape positive pole, draw at least one negative terminal pad at described conductive adhesive tape negative pole;
The positive pin of described LED is pressed on the described positive terminal pad, the negative pin of described LED is pressed on the described negative terminal pad.
3. method as claimed in claim 2 is characterized in that, described method is further comprising the steps of:
When all pasting described conductive adhesive tape positive pole and conductive adhesive tape negative pole on the plastic base, make described conductive adhesive tape anodal parallel with the conductive adhesive tape negative pole.
4. method as claimed in claim 3 is characterized in that, described method is further comprising the steps of:
When described conductive adhesive tape positive pole is drawn at least one positive terminal pad, make the lead-out wire of described positive terminal pad anodal vertical with described conductive adhesive tape;
When described conductive adhesive tape negative pole is drawn at least one negative terminal pad, make the lead-out wire of described negative terminal pad vertical with described conductive adhesive tape negative pole.
5. method as claimed in claim 4 is characterized in that, described positive terminal pad, negative terminal pad and lead-out wire thereof form by the extension of conductive adhesive tape.
6. LED bonding structure that is used for module backlight, it is characterized in that, comprise plastic base, at least one LED and conductive adhesive tape, described conductive adhesive tape is anodal to be communicated with the positive source of module backlight, described conductive adhesive tape negative pole is communicated with the power cathode of module backlight, described conductive adhesive tape positive pole and conductive adhesive tape negative pole all stick on the described plastic base, and the positive pin of described LED and negative pin press to respectively on described conductive adhesive tape positive pole and the described conductive adhesive tape negative pole.
7. LED bonding structure as claimed in claim 6, it is characterized in that, described conductive adhesive tape positive pole comprises at least one positive terminal pad, comprise at least one negative terminal pad on the described conductive adhesive tape negative pole, the positive pin of described LED is pressed together on the described positive terminal pad, and the negative pin of described LED is pressed together on the described negative terminal pad.
8. LED bonding structure as claimed in claim 7 is characterized in that, described conductive adhesive tape is anodal parallel with the conductive adhesive tape negative pole.
9. LED bonding structure as claimed in claim 8 is characterized in that, the lead-out wire of described positive terminal pad is anodal vertical with described conductive adhesive tape, and the lead-out wire of described negative terminal pad is vertical with described conductive adhesive tape negative pole.
10. LED bonding structure as claimed in claim 9 is characterized in that, described positive terminal pad, negative terminal pad and lead-out wire thereof form by the extension of conductive adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101131443A CN103234175A (en) | 2013-04-02 | 2013-04-02 | Method for installing LED in backlight module and LED jointing structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101131443A CN103234175A (en) | 2013-04-02 | 2013-04-02 | Method for installing LED in backlight module and LED jointing structure |
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| CN103234175A true CN103234175A (en) | 2013-08-07 |
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| CN2013101131443A Pending CN103234175A (en) | 2013-04-02 | 2013-04-02 | Method for installing LED in backlight module and LED jointing structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106773295A (en) * | 2016-12-21 | 2017-05-31 | 武汉华星光电技术有限公司 | A kind of backlight module |
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| CN101365907A (en) * | 2006-03-31 | 2009-02-11 | 香港应用科技研究院有限公司 | Illumination system and display device |
| CN201724110U (en) * | 2010-08-20 | 2011-01-26 | 河南光之源太阳能科技有限公司 | High-power LED street lamp |
| CN201787425U (en) * | 2010-07-02 | 2011-04-06 | 刘胜 | LCD backlight module with integrated display housing |
| CN202103085U (en) * | 2011-04-13 | 2012-01-04 | 广州南科集成电子有限公司 | Thermoelectric separation type LED integrated light source board |
| CN102339926A (en) * | 2010-07-21 | 2012-02-01 | 富士康(昆山)电脑接插件有限公司 | Lead frame assembly for light-emitting diodes (LEDs) and method for manufacturing same |
| CN202452301U (en) * | 2012-02-09 | 2012-09-26 | 苏州东山精密制造股份有限公司 | Direct type light-emitting diode (LED) backlight module |
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2013
- 2013-04-02 CN CN2013101131443A patent/CN103234175A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124997A (en) * | 1993-05-28 | 1996-06-19 | 安德鲁·R·福伯 | Light, audio and current related assemblies, attachments and devices with conductive compositions |
| US5404282A (en) * | 1993-09-17 | 1995-04-04 | Hewlett-Packard Company | Multiple light emitting diode module |
| CN101365907A (en) * | 2006-03-31 | 2009-02-11 | 香港应用科技研究院有限公司 | Illumination system and display device |
| CN201787425U (en) * | 2010-07-02 | 2011-04-06 | 刘胜 | LCD backlight module with integrated display housing |
| CN102339926A (en) * | 2010-07-21 | 2012-02-01 | 富士康(昆山)电脑接插件有限公司 | Lead frame assembly for light-emitting diodes (LEDs) and method for manufacturing same |
| CN201724110U (en) * | 2010-08-20 | 2011-01-26 | 河南光之源太阳能科技有限公司 | High-power LED street lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106773295A (en) * | 2016-12-21 | 2017-05-31 | 武汉华星光电技术有限公司 | A kind of backlight module |
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Application publication date: 20130807 |