CN103280410A - 用于有效地制成可抽换式外围卡的方法 - Google Patents
用于有效地制成可抽换式外围卡的方法 Download PDFInfo
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- CN103280410A CN103280410A CN2013101875133A CN201310187513A CN103280410A CN 103280410 A CN103280410 A CN 103280410A CN 2013101875133 A CN2013101875133 A CN 2013101875133A CN 201310187513 A CN201310187513 A CN 201310187513A CN 103280410 A CN103280410 A CN 103280410A
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- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Abstract
本发明涉及一种用于有效地制成可抽换式外围卡的方法。本发明揭示用于制造集成电路产品的改良的技术。这些改良的技术能够使集成电路产品更小且制造成本更低。本发明的一个方面在于,集成电路产品是每次一批地制成,且将该批集成电路产品单分成单独的集成电路产品是使用非线性(例如非矩形或曲线形)锯割或切割作业,以使所形成的单独集成电路封装不再需要完全为矩形。本发明的另一个方面在于,集成电路产品可使用半导体组装处理来制成,以使提供外部封装或容器这一需要变成可选的。
Description
本申请是申请号为200480017458.2、申请日为2004年6月16、发明名称为“用于有效地制成可抽换式外围卡的方法”的发明专利申请的分案申请。
技术领域
本发明涉及集成电路产品,且更具体而言,涉及含有一个或多个集成电路的可抽换式外围卡。
背景技术
随着使存储器集成电路(IC)封装变小及使其存储密度变大这一趋势的延续,需要在封装集成电路方面有所进步。一个最新的进步涉及到在单个IC封装内堆叠多个集成电路小片。此种内部封装堆叠涉及到将一较小的电路小片堆叠到一较大的电路小片上。每一电路小片均丝焊至一衬底上。此种类型的堆叠例如已用于相同功能的电路小片(例如,两个闪速存储器电路小片)或不同功能的电路小片(例如,一个闪速存储器电路小片与一个SRAM电路小片)。另外,对于堆叠的芯片级封装(堆叠的CSP)及堆叠的薄小外形封装(TSOP),已进行了两个或三个电路小片的堆叠。
存储卡普遍地用于存储供用于各种产品(例如电子产品)的数字数据。目前,日益需要这些存储卡存储越来越大量的数据。存储卡通常提供非易失性数据存储,因而这些存储卡非常流行和有用,这是因为其甚至在断电后也能保持数据。存储卡的实例为使用Flash(闪速)型或EEPROM型存储单元来存储数据的闪卡。闪卡具有相对小的形体因数并已用于为例如以下等产品存储数据:照相机,计算机(手持式、笔记本式及台式计算机)、机顶盒、手持式或其他小型音频播放器/录音器(例如MP3装置)、及医用监视器。闪卡的一主要供货商是位于Sunnyvale,CA的SanDisk公司。
遗憾的是,形体因数相对小的高密度存储卡的制造很复杂。一个复杂之处在于存储卡的最终形体因数是不规则的,即不为矩形。不规则的形体因数可起各种作用,例如限制将其以一特定取向连接至一连接器或端口,从而提供一位置基准或一锁定位置等。然而,集成电路组件通常具有规则的形状,即矩形形状,且还须受到保护以防止用户损坏。因而,通常,存储卡具有一由包围集成电路组件的规则形状的盖、框架或外封装所界定的不规则的形体因数。所述盖、框架或外封装常常由塑料制成。形体因数不规则的另一问题在于,围绕集成电路组件组装该盖、框架或外封装并不属于半导体制造过程,因而必须在可能一不同的制造工厂中在一单独的生产线中进行。
因此,需要改良制造小形体因数存储卡的方法。
发明内容
大体而言,本发明涉及用于制成集成电路产品的改良的技术。这些改良的技术能够使集成电路产品更小且制造成本更低。本发明的一个方面在于,集成电路产品是每次一批地制成,且将该批集成电路产品单分成单独的集成电路产品是使用非线性(例如非矩形或曲线形)锯割或切割作业,以使所形成的单独集成电路封装不再需要完全为矩形。本发明的另一个方面在于,集成电路产品可使用半导体组装处理来制成,以使提供外部封装或容器这一需要变成可选的。
所述集成电路产品可涉及可抽换式外围卡或其他使用半导体组装技术形成的可抽换式媒体。一种类型的可抽换式外围卡称为存储卡。存储卡通常是小的基于集成电路的产品,其用于提供数据存储。这些存储卡插入于电子装置(包括计算机、照相机、移动电话及PDA)上的端口或连接器内或由这些端口或连接器所接纳。
本发明可按许多种方式实施,包括作为一种系统、设备、装置或方法来实施。下面将说明本发明的数个实施例。
作为一种同时形成复数个集成电路产品的方法,本发明的一个实施例包括至少如下步骤:提供一具有复数个范例的多范例引线框架或衬底;将一个或多个电路小片附装至所述多范例引线框架或衬底的至少一侧上的每一个范例;将所述一个或多个电路小片中的每一电路小片电连接至所述引线框架或衬底上的相应范例;使用一模塑化合物将所述复数个范例一同囊封于所述多范例引线框架或衬底的所述至少一侧上;及使用至少非线性成形来单分所述复数个范例中的每一范例,从而形成集成电路产品。
作为一种集成电路产品,通过根据一实施例包含如下步骤的作业来成批制成:提供一具有复数个范例的多范例引线框架或衬底;将一个或多个电路小片附装至所述多范例引线框架或衬底的至少一侧上的每一范例;将所述一个或多个电路小片中的每一电路小片电连接至所述引线框架或衬底的相应范例;使用一模塑化合物将所述复数个范例一同囊封于所述多范例引线框架或衬底的所述至少一侧上;及使用至少非线性成形来单分所述复数个范例中的每一范例,其中通过所述作业制成的所述复数个范例中的一个范例即为所述集成电路产品。
作为一种用于同时形成复数个存储卡且其中每一存储卡均包含至少一存储器电路小片及一控制器电路小片的方法,本发明的一个实施例包括至少如下步骤:提供一具有复数个范例的多范例引线框架;将所述多范例引线框架附装至一可抽换式带上;在所述多范例引线框架中每一范例的一部分上放置电路小片附着材料;经由对应于每一范例的电路小片附着材料将所述存储器电路小片附装至每一范例;将所述控制器电路小片相对于每一范例固定;将每一存储器电路小片及控制器电路小片电连接至所述多范例引线框架中的相应范例;此后,使用一模塑化合物将所述范例囊封在一起;及随后,使用至少非线性成形来单分每一范例。
作为一种用于同时形成复数个存储卡且其中每一存储卡均包含至少一存储器电路小片及一控制器电路小片的方法,本发明的一个实施例包括至少如下步骤:提供一具有复数个范例的多范例印刷电路板;相对于每一范例来附着所述存储器电路小片;相对于每一范例来固定所述控制器电路小片;将每一存储器电路小片及控制器电路小片电连接至所述多范例印刷电路板中的相应范例;此后,使用一模塑化合物将所述范例囊封在一起;及随后,使用至少非矩形成形来单分每一范例。
结合以举例方式显示本发明原理的附图来阅读下文详细说明,本发明的其他方面及优点将变得一目了然。
附图说明
通过下文的详细说明并结合附图,将易于了解本发明,附图中相同的参考编号均表示相同的结构元件,附图中:
图1A为一所制造半导体产品的平面图;
图1B为一所制造半导体产品根据图1A中所示参考线A-A′截取的剖面图;
图2A及2B显示一可根据本发明制成的集成电路产品的一种代表性形状;
图2C为一本发明另一实施例的集成电路产品的俯视图;
图3为一根据本发明之一实施例的成批集成电路产品处理的流程图;
图4为一根据本发明之一实施例的成批存储卡处理的流程图;
图5A及5B为根据本发明另一实施例的成批存储卡处理的流程图。
具体实施方式
本发明涉及用于制成集成电路产品的改良的技术。这些改良的技术能够使集成电路产品更小且制造成本更低。本发明的一个方面在于,集成电路产品是每次一批地制成,且将该批集成电路产品单分成单独的集成电路产品是使用非线性(例如非矩形或曲线形)锯割或切割作业,以使所形成的单独集成电路封装不再需要完全为矩形。本发明的另一个方面在于,集成电路产品可使用半导体组装处理来制成,以使提供外部封装或容器这一需要变成可选的。
集成电路产品可使用半导体组装技术来制成。集成电路产品也可具有减小的形体因数。所述减小的形体因数可处于芯片级封装级别。此外,所述形体因数可在半导体制造的半导体组装级加以界定。
集成电路产品可涉及可抽换式外围卡。可抽换式外围卡可用于许多种应用中并执行许多种不同的功能。一种类型的可抽换式外围卡称为存储卡。存储卡通常是小的基于集成电路的产品,其用于提供数据存储。这些存储卡插入于电子装置(包括计算机、照相机、移动电话及PDA)上的端口或连接器内或由这些端口或连接器所接纳。存储卡可为非易失性存储卡。存储卡可包含堆叠于一衬底或引线框架的一侧或两侧上的多个集成电路芯片。
下文参照图1A-5B来说明本发明这一方面的实施例。然而,所属技术领域的技术人员将易知,本文参照这些图式给出的详细说明是用于解释性目的,因为本发明的范围超出这些有限的实施例。
图1A为一所制造半导体产品的平面图。所制造半导体产品的基底是一多范例衬底100。多范例衬底100具有一模塑化合物102,模塑化合物102用于囊封一集成电路产品的复数个范例104中每一范例104处所设置的电路(即半导体电路小片)。所述集成电路产品的范例104表示为104-1,104-2,104-3,104-4,...,104-n。每一范例104均代表一集成电路产品。换句话说,所制造的半导体产品具有一集成电路产品阵列。因而,当处理多范例衬底100以在其上形成范例104时,能够以成批的模式制作集成电路产品。
图1B为一所制造半导体产品根据图1A中所示参考线A-A′截取的剖面图。在图1B中,每一范例104-1、104-2及104-3分别包含一第一半导体电路小片106-1、106-2及106-3。集成电路小片106安装于多范例衬底100上。在一实施例中,多范例衬底100代表或对应于一印刷电路板(PCB)。此外,每一范例104-1、104-2及104-3可分别包含一第二半导体电路小片108-1、108-2及108-3。如图1B所示,第二半导体电路小片108可堆叠于第一半导体电路小片106上。第一半导体电路小片106可分别直接安装于多范例衬底100的范例104上或者通过一电路小片附着或粘合材料附着至多范例衬底100的范例104上。第二半导体电路小片108可分别直接安装(即堆叠)于第一半导体电路小片106上或者通过一电路小片附着或粘合材料附着至第一半导体电路小片106上。再进一步,在一实施例中,半导体电路小片106及108可分别通过丝焊110电连接至多范例衬底100的范例104。例如,半导体电路小片106-1及108-1可通过丝焊110-1电连接至多范例衬底100的范例104-1。
因而,通过使用多范例衬底100及在制造期间在其上形成复数个集成电路产品范例,可按成批模式(即并行地)制造集成电路产品。然而,当在各个范例104上放置模塑化合物102对其进行囊封时,模塑化合物会形成一相对于多范例衬底100覆盖所有范例104的整体结构。此后,必须从所述整体结构中独立或单分出各个集成电路产品范例104。就此而言,将所制造半导体产品锯割或切割成其多个范例。根据本发明的一个方面,这些集成电路产品的形状并非完全为矩形,因而将所制造半导体产品单分成各个单独的范例是实施非线性(例如非矩形或者曲线形)锯割。可使用极薄的锯宽并以高的精度及清晰度来有效地实施此种锯割,以使锯割作业非常精细。
图2A及2B显示一根据本发明可制成的集成电路产品的一种代表性形状。在图2A中,将一集成电路产品200显示成其外形的一部分具有一曲线形区域202。因而,当从一具有一多范例衬底及一整体模塑化合物的所制造半导体产品中单分多个范例时,锯割作业需要能够有效地锯割所制造半导体产品以便制成集成电路产品200。在本实例中,所述锯割作业使用线性切割与非线性切割的组合。线性(矩形)切割易于实现,但进行非线性(曲线形)切割以得到曲线形区域202却要求如下文所更详细说明来进行精密的锯割作业。
图2B为一具有一曲线形区域222的集成电路产品220的俯视图。集成电路产品220大体上类似于图2A所示的集成电路产品200。然而,集成电路产品220的曲线形区域222具有两个由一斜面隔开的小的圆的区域,而在图2A中,曲线形区域202是两个无斜面部分的圆的区域(例如S形曲线)。甚至在其中通过使线性切口相交叉而使图2B所示的这两个小的圆形区域成为锐角时,也可将曲线形区域202归类为非矩形区域。
图2C为一本发明另一实施例的集成电路产品250的俯视图。集成电路产品250具有一类似于图2B所示集成电路产品220中曲线形区域222的曲线形区域252。另外,集成电路产品250包含一缺口254。缺口254是一通过锯割作业获得的相对小的细部。缺口254可用作集成电路产品250的一参考点或一挚扣(例如闩锁挚扣)区域,其可在将集成电路产品250插入至一用于接纳集成电路产品250的连接器或容座内时使用。为能够制成这种小的形体,缺口254的小的尺寸要求进行精密的锯割作业。
因此,锯割作业能够制成在其外部本体或形体因数中具有弯曲部分或小形体的集成电路产品。一般而言,由于至少一个部分弯曲、为多个面或者不为矩形,因而所形成的集成电路产品为非矩形形状。下文将进一步说明用于制成这些集成电路产品的作业。
图3为一根据本发明之一实施例的成批集成电路产品处理300的流程图。成批集成电路产品处理300用于制成复数个集成电路产品。例如,所制成的集成电路产品可为图2A-2C所示的集成电路产品。
成批集成电路产品处理300首先提供302一多范例引线框架或衬底。所述引线框架或衬底用于为可同时形成于所述引线框架或衬底上的复数个多范例中的每一范例支撑集成电路产品的装置或部件。倘若为一引线框架,则该引线框架通常为一导电金属,例如铜。倘若为衬底,则该衬底常常为一印刷电路板(PCB)。例如,倘若为一衬底,则所述多范例衬底可为图1A所示的多范例衬底100。
接下来,如果需要,可将一个或多个无源部件附着304至所述多范例引线框架或衬底中的每一范例。此处,如果要制成的集成电路产品将包含一个或多个无源部件,则可将这些无源部件附着304至每一范例。无源部件的例子包括电容器及电阻器。另外,将一个或多个电路小片(集成电路小片)或集成电路芯片附着306至所述多范例引线框架或衬底中的每一范例。对于每一范例而言,所述一个或多个电路小片将附着至引线框架或衬底上对应于那一范例的区域内。所述一个或多个电路小片可直接附着至引线框架或衬底,或者可通过一电路小片附着材料或其他媒介物附着至引线框架或衬底上。此外,在一实施例中,如果一范例的多个电路小片将附着至引线框架或衬底中对应于那一范例的区域内,则这些电路小片可按堆叠方式(各电路小片彼此堆叠)附着。堆叠于一下部电路小片上的电路小片可直接附着至下部电路小片,或者可通过一电路小片附着材料或其他媒介物附着至下部电路小片。
在已将所述一个或多个电路小片附着306至每一范例后,可将每一范例的所述一个或多个电路小片中的每一电路小片电连接308至引线框架或衬底中的一对应部分上。在一实施例中,这些电连接线可设置于电路小片的丝焊焊盘、引线或端子与引线框架或衬底之间。对于丝焊而言,对于每一电连接,均有一小的细导线自电路小片延伸至引线框架或衬底并通过焊料固定就位。
此后,可使用模塑化合物将所述多个范例囊封310于一起。所述模塑化合物形成为一包围引线框架或衬底中每一范例的整体囊封。所形成的囊封也可称为模塑面板。模塑化合物可按各种方式涂敷,包括通过转移成型或淹没成型技术。
另外,如果需要,可对所述模塑化合物应用312标记。例如,所述标记可具有印制于模塑化合物表面上的每一范例的标志或其他信息。所述标记可例如显示装置的制造商、注册商标、及/或类型。
最后,此后可使用至少非矩形成形来单分314每一范例。此处,尽管单分314可包括矩形成形,然而每一范例的成形均对每一范例的至少一部分利用非矩形成形。可使用一锯割装置来实现这种复杂的成形。所述锯割装置应具有一小的切割宽度并能够形成小的细部形状。
锯割装置的例子包括例如水刀切割、激光切割、水引导的激光切割、干媒体切割、及涂敷钻石的线切割。考虑到水刀切割具有小的切割宽度(例如50微米)、能够形成小的形体形状且切割速度快,水刀切割可为较佳的切割装置。也可将水与激光切割一同使用以助于补充或集中其效果。在单分314之后,成批集成电路产品处理300即告完成并结束。
尽管在图3中未显示,然而成批集成电路产品处理300可另外包括在某些实施方案中可能需要的其他作业。例如,在囊封310之后、但在单分314之前,可执行额外的作业来(i)在集成电路产品仍处于其阵列构造的同时测试集成电路产品及/或(ii)涂敷测试插脚及/或导电引线或迹线以提供保护及/或耐磨性。通常,如果提供有测试插脚,则将在引线框架或衬底中的每一范例处形成测试插脚。在一实施例中,在使用测试插脚对每一集成电路产品进行测试之后,可将测试插脚涂敷或覆盖以一保护膜或层(例如,以使各测试插脚端绝缘)。再进一步,在单分314之后,可将每一范例进一步成形以移除尖锐的边缘或使尖锐的边缘平滑。此外,可对每一范例涂敷一聚合物涂层作为一保护表面。又进一步,对于每一范例,可进一步利用一装盖作业来增加一围绕集成电路产品的外封装或盖(成对的盖)。此一封装或盖将为集成电路产品提供一外部罩护并形成其外部产品特征。例如,当所形成的集成电路产品小于产品所需的形体因数时,则将集成电路产品封闭于一外封装或盖中即可将该集成电路产品按比例变换至所需形体因数。
集成电路产品可涉及可抽换式外围卡或其他使用半导体组装技术形成的可抽换式媒体。一种类型的可抽换式外围卡称为存储卡。存储卡通常是小的基于集成电路的产品,其用于提供数据存储。这些存储卡插入于电子装置(包括计算机、照相机、移动电话及PDA)上的端口或连接器内或由这些端口或连接器所接纳。下文将根据存储卡来论述图4、5A及5B,当然通过此种处理也可形成其他集成电路产品。
图4为一根据本发明之一实施例的成批存储卡处理400的流程图。成批存储卡处理400使用集成电路组装处理来每次一批地形成复数个存储卡。成批存储卡处理400首先获得一多范例印刷电路板(PCB)。所述多范例PCB是一层压结构,其包含用于电连接附连至所述PCB的不同装置或部件的导电迹线。在所述PCB上的每一范例处安装404一存储器电路小片。然后,为每一范例在存储器电路小片上安装406一控制器电路小片。此时,对于每一范例,均存在一电路小片堆叠,其中下部的电路小片属于存储器电路小片,而上部的电路小片属于控制器电路小片。然后,将存储器电路小片及控制器电路小片在其各自的范例处丝焊408至PCB。这些焊线用于将存储器电路小片及控制器电路小片电连接至PCB。
此后,对PCB及其上所形成的部件涂敷一模塑化合物410。此处,模塑化合物用于保护各部件及其与PCB的电连接线并为存储卡提供一外部本体。在模塑化合物已固化(或硬化)后,可使用至少非线性成形来单分所述多范例PCB中的每一范例。换句话说,在单分412每一存储卡的过程中,锯割四个边中的每一个边,且在进行该作业的过程中,至少一个边包含一曲线形部分,此要求进行非线性成形来锯割该边。因此,在该批中制成的存储卡的各个范例的外壳或外部结构的至少一部分具有一非线性形状。换句话说,存储卡的外部结构或外壳并非纯粹为矩形,而是包含至少一个具有非线性(或非矩形)形状的区域。例如,在图2A中,集成电路产品200包含将对应于非线性(或非矩形)成形区域的曲线形区域202。较佳地,可在与成批存储卡处理400中的其他作业相同的制造场所中实施单分412。此外,由于能够提供非线性成形/切割,因而能够有利地使存储卡通过此种单分412成形为其最终形状。因而,可由此通过单分412的锯割/切割来决定并非纯粹为矩形(即包含至少一个曲线形区域)的存储卡的外部形体。在单分412之后,成批存储卡处理400即告完成并结束。
因此,不需要一进一步的外封装或本体(例如塑料盖),因而不再需要进行额外的步骤来形成这些封装或本体及随后将各范例插入这些封装或本体内。而且,使用于制成存储卡的工艺更加有效、成本更低。尽管不需要一外部封装或本体,然而如果需要,仍可为各范例提供一外封装或本体。这种封装或本体将为集成电路产品提供一外部罩护并形成其外部产品特征。例如,当所形成的存储卡小于存储卡所需的形体因数时,可将存储卡封闭于一外封装或盖中来将存储卡按比例变换至所需形体因数。
图5A及5B为根据本发明另一实施例的成批存储卡处理500的流程图。成批存储卡处理500是与制成围绕一引线框架制作的集成电路产品(即存储卡)相关的处理。
成批存储卡处理500首先获得502一多范例引线框架。所述多范例引线框架为一导电金属,例如铜。该引线框架经构造以包括一由各个范例形成的阵列,各集成电路产品围绕其固定于一起以供进行成批处理。为提供一临时的基座并保护及支撑所述多范例引线框架的一个表面,将一可拆式聚合物带安装504于所述多范例引线框架的一侧。然后,在所述多范例引线框架中每一范例的一区域处布置506一电路小片附着材料。所述电路小片附着材料通常为非导电形黏合剂。
接下来,在所述多范例引线框架中每一范例的所述区域处的电路小片附着材料上安装508一存储器电路小片。为每一范例在所述存储器电路小片上安装510一控制器电路小片。此处,在每一范例处,控制器电路小片均堆叠于存储器电路小片上。尽管并非必需,然而可在控制器电路小片与存储器电路小片之间布置一电路小片附着材料以将控制器电路小片固定就位及/或使其与存储器电路小片电绝缘。此外,尽管对于每一范例均将控制器电路小片描述为堆叠于存储器电路小片上,然而应了解,控制器电路小片也可与存储器电路小片并排布置于每一范例处以提供一非堆叠式构造。然而,堆叠方法的优点在于,存储卡的总体形体因数可更小。
接下来,将存储器电路小片及控制器电路小片丝焊512至多范例引线框架中各自的范例。此处,使用通过一丝焊工艺布置的导线将存储器电路小片及控制器电路小片的焊盘或引线电连接至多范例引线框架上其各自的范例。然后,对多范例引线框架及其上的部件涂敷514一模塑化合物。所述模塑化合物用于保护各部件(例如电路小片)及其与多范例引线框架的电连接线并为存储卡提供一外部本体。模塑化合物的涂敷514可按各种方式实施,其中一种方式称为转移成型、另一种方式称为淹没成型。
此后,可自多范例引线框架的所述的一侧移除516聚合物带。然后,可将多范例引线框架中曾受所述聚合物带保护的一侧上的外露引线镀518以一种导电材料,例如金。另外,一额外的蚀刻步骤可对引线框架进行轻微蚀刻来弄平引线框架的拐角或边缘,这种小的蚀刻可称为一半式蚀刻。
最后,单分520多范例引线框架中的每一范例以形成单个的存储卡。单分520各范例会界定存储卡的形状。在已将各范例单分520之后,成批存储卡处理500即告完成并结束-已制成一批存储卡。
在一实施例中,单分520可利用非线性成形。换句话说,在单分520每一存储卡的过程中,锯割四个边中的每一个边,且在进行该作业的过程中,至少一个边包含一曲线形部分,此要求进行非线性成形来锯割该边。因此,成批制成的存储卡的各个范例的外壳或外部结构的至少一部分具有一非线性形状。换句话说,在本实施例中,存储卡的外部结构或外壳并非纯粹为矩形,而是包含至少一个具有非线性(或非矩形)形状的区域。例如,在图2A中,集成电路产品200包含将对应于非线性(或非矩形)成形区域的曲线形区域202。有利地,可在与成批存储卡处理500中的其他作业相同的制造场所中实施单分520。此外,由于能够提供非线性成形/切割,因而能够有利地使存储卡通过此种单分520而成形为其最终形状。因而,在本实施例中,可由此通过单分520的锯割/切割来决定并非纯粹为矩形(即包含至少一个曲线形区域)的存储卡的外部形体。在单分520之后,成批存储卡处理500即告完成并结束。
类似于图4所示实施例,不需要一进一步的外封装或本体(例如塑料盖),因而不再需要进行额外的步骤来形成这些封装或本体及随后将各范例插入这些封装或本体内。因此,使得用于制成存储卡的工艺更加有效、成本更低。尽管不需要利用一外部封装或本体,然而如上文所述,也可视需要使用一外封装或本体来设定外部产品形体。例如,当所形成的集成电路产品小于这些产品所需的形体因数时,则将集成电路产品封闭于一外封装或盖中即可按比例变换这些集成电路产品以设定外部产品特征,包括设定所需的形体因数。
本发明的集成电路产品可用于存储系统中。本发明可进一步涉及一种包含上述存储系统的电子系统。存储系统通常用于存储供用于各种电子产品的数字数据。存储系统常常可自电子系统中拆下以便可携带所存储的数字数据。这些存储系统可称为存储卡。本发明的存储系统可具有相对小的形体因数并可用于为例如以下等电子产品存储数字数据:照相机、手持式或笔记本式计算机、网络卡、网络电器、机顶盒、手持式或其他小型音频播放器/录音器(例如MP3装置)、及医用监视器。存储卡的例子包括PC卡(以前的PCMCIA装置)、闪卡、闪盘、多媒体卡、及ATA卡。作为一个例子,存储卡可使用闪速(Flash)型或EEPROM型存储单元来存储数据。更一般地说。存储系统可不仅涉及存储卡而且还涉及存储棒或某些其他半导体存储器产品。
本发明具有许多种优点。不同的实施例或实施方案可产生一种或多种下述优点。本发明的一个优点在于,集成电路产品(例如存储卡)可制作得更小。例如,可以芯片级封装水平来确定存储卡的尺寸。本发明的另一优点在于,集成电路产品的组装可完全使用一半导体组装生产线来实施。本发明的又一优点在于,用于形成集成电路产品的模塑化合物及衬底或引线框架可用作外表面或外部表面。通过对所述外表面或外部表面的复杂成形,集成电路产品可形成有曲线形区域及/或小的形体。这些小的形体可用于功能性或装饰性目的。本发明的再一优点在于,可按快速且成本有效的方式制成集成电路产品。本发明的另一优点在于,可在半导体组装级上设定集成电路产品(例如可抽换式外围卡)的形体因数。本发明的还一优点在于,环绕的塑料壳、本体或框架变成视需要选用,此在不使用时可缩短制造时间及降低制造成本、而在使用时可使外部产品特征(例如形体因数)能够灵活设定。
根据本书面说明,本发明的许多特征及优点一目了然,因而,随附权利要求书意欲涵盖本发明的所有这些特征及优点。此外,由于所属技术领域的技术人员将易于得出许多种修改及改变,因而并不期望将本发明限定至所示及所述的确切构造及作业。因此,可将所有合适的修改及等效形式重新分类为属于本发明范畴内。
Claims (58)
1.一种用于同时形成多个集成电路产品的方法,所述方法包括:
提供一具有多个范例的多范例引线框架或衬底;
将一个或多个电路小片附装至所述多范例引线框架或衬底的至少一侧上的所述范例中的每一个范例;
将所述一个或多个电路小片中的每一电路小片电连接至所述引线框架或衬底上的相应范例;
此后,使用一模塑化合物将所述多范例引线框架或衬底的所述至少一侧上的所述多个范例囊封于一起;及
随后,使用对所述多个范例中每一范例的至少一个区域的至少非线性成形来单分所述多个范例中的每一范例,从而形成所述集成电路产品,所述单分步骤提供的所述集成电路产品包括具有第一部分、第二部分和第三部分的侧面,所述第一部分与所述第三部分平行,所述第二部分以倾斜的角度在所述第一部分和所述第三部分之间延伸,所述第三部分包括缺口,当所述集成电路产品被插入容座内时,所述缺口作为挚扣区域以接纳部件。
2.如权利要求1所述的方法,其中所述电连接包括将所述一个或多个电路小片中的每一电路小片丝焊至所述引线框架或衬底中的所述相应范例。
3.如权利要求1所述的方法,其中所述囊封形成一模塑面板。
4.如权利要求1所述的方法,其中通过由一激光器提供的一激光束来实施所述单分。
5.如权利要求1所述的方法,其中通过一高压水射流来实施所述单分。
6.如权利要求5所述的方法,其中所述水射流包含水及一磨料两者。
7.如权利要求1所述的方法,其中所述衬底是一印刷电路板。
8.如权利要求1所述的方法,进一步包括无源部件,所述无源部件附着至所述多范例引线框架或衬底的每一范例,其中所述无源部件包括一电阻器与一电容器中的至少一个。
9.如权利要求1-8中任一项所述的方法,其中所述一个或多个电路小片为半导体电路小片。
10.如权利要求1-8中任一项所述的方法,其中所述集成电路产品为存储卡。
11.如权利要求1所述的方法,其中所述集成电路产品为可抽换式、非矩形外围卡。
12.如权利要求1所述的方法,其中所述方法进一步包括:
在所述囊封之前,将一个或多个无源部件附着至所述范例中的每一范例。
13.如权利要求1所述的方法,其中所述方法进一步包括:
对用于所述多个范例中的每一范例的所述模塑化合物应用一标记。
14.如权利要求13所述的方法,其中所述标记为一印制标记。
15.如权利要求1所述的方法,
其中所述囊封形成一模塑面板,且
其中所述单分所述范例中的每一范例将所述模塑面板切割成多个作为集成电路产品的模塑封装。
16.如权利要求15所述的方法,其中所述模塑封装为存储卡。
17.如权利要求16所述的方法,其中所述方法进一步包括:
在所述单分之后对所述范例中的每一范例涂敷一涂层。
18.如权利要求16所述的方法,其中所述方法进一步包括:
在所述单分之后将一外壳固定至所述范例中的每一范例。
19.如权利要求1所述的方法,其中通过所述单分对所述范例中的每一范例进行所述非线性成形是在所述单分期间通过曲线形或非矩形切割来实现。
20.如权利要求1所述的方法,其中在所述囊封之后且在所述单分之前实施对所述范例的电测试。
21.如权利要求1所述的方法,其中所述方法进一步包括:
在所述单分之后对所述范例中的每一范例涂敷一涂层。
22.一种通过包含至少如下步骤的作业成批制成的集成电路产品:
提供一具有多个范例的多范例引线框架或衬底;
将一个或多个电路小片附着至所述多范例引线框架或衬底的至少一侧上的所述范例中的每一范例;
将所述一个或多个电路小片中的每一电路小片电连接至所述引线框架或衬底的相应范例;
此后,使用一模塑化合物将所述多范例引线框架或衬底的所述至少一侧上的所述多个范例囊封于一起;及
随后,使用所述多个范例中的每一范例的至少一个区域的至少非线性成形来单分所述多个范例中的每一范例,
借此通过所述作业制成的所述多个范例中的一个范例即为所述集成电路产品,所述集成电路产品包括第一侧和第二侧,所述第二侧具有第一部分、第二部分和第三部分,所述第一部分与所述第三部分平行,所述第二部分以倾斜的角度在所述第一部分和所述第三部分之间延伸,所述第一部分与所述第一侧之间间隔的距离小于所述第三部分与所述第一侧之间间隔的距离。
23.如权利要求22所述的集成电路产品,其中通过所述单分对所述范例中每一范例的所述非线性成形是在所述单分期间通过曲线形或非矩形切割来实现。
24.如权利要求22所述的集成电路产品,其中在制成所述集成电路产品中使用的一额外作业包括:在所述单分之后围绕所述范例中的每一范例固定一外部外封装。
25.如权利要求22-24中任一项所述的集成电路产品,其中所述集成电路产品为一存储卡。
26.如权利要求22-24中任一项所述的集成电路产品,其中所述集成电路产品为一可抽换式、非矩形外围卡。
27.一种用于同时形成多个存储卡且其中所述存储卡中每一存储卡均包含至少一存储器电路小片及一控制器电路小片的方法,所述方法包括:
提供一具有多个范例的多范例引线框架;
将所述多范例引线框架附着至一可抽换式带上;
在所述多范例引线框架的所述范例的每一范例的一部分上放置电路小片附着材料;
通过对应于所述范例中每一范例的所述电路小片附着材料将所述存储器电路小片附着至所述范例中的每一范例;
相对于所述范例中的每一范例固定所述控制器电路小片;
将所述存储器电路小片及所述控制器电路小片中的每一个电连接至所述多范例引线框架中的相应范例;
此后,使用一模塑化合物将所述范例囊封于一起;及
随后,使用所述多个范例中每一范例的至少一个区域的至少非线性成形来单分所述范例中的每一范例,所述单分步骤提供的所述集成电路产品包括具有第一部分、第二部分和第三部分的侧面,所述第一部分与所述第三部分平行,所述第二部分以倾斜的角度在所述第一部分和所述第三部分之间延伸,所述第三部分包括缺口,当所述集成电路产品被插入容座内时,所述缺口作为挚扣区域以接纳部件。
28.如权利要求27所述的方法,其中所述可抽换式带为一聚合物带。
29.如权利要求27所述的方法,其中对于所述范例中的每一范例,所述固定用于将所述控制器电路小片安装于所述存储器电路小片上,借此将所述控制器电路小片堆叠于所述存储器电路小片上。
30.如权利要求27所述的方法,其中所述方法进一步包括:
在所述囊封之后且在所述单分之前,移除所述可抽换式带。
31.如权利要求30所述的方法,其中所述范例中的每一范例包括所述相应范例的作为所述引线框架一部分的外露电接点。
32.如权利要求31所述的方法,其中所述方法进一步包括:
在所述移除所述可抽换式带之后且在所述单分之前,电镀所述范例中每一范例的所述电接点。
33.如权利要求27所述的方法,其中所述电连接包括将所述存储器电路小片与所述控制器电路小片中的每一者至少丝焊至所述多范例引线框架中的所述相应范例。
34.如权利要求27所述的方法,其中通过由一激光器提供的一激光束来实施所述单分。
35.如权利要求27所述的方法,其中通过一高压水射流来实施所述单分。
36.如权利要求35所述的方法,其中所述水射流包含至少水及一磨料。
37.如权利要求27所述的方法,其中所述存储卡为模塑卡,所述模塑卡中的每一个均具有一由所述模塑化合物提供的外壳而无任何其他外部壳体。
38.如权利要求27所述的方法,其中所述存储卡是用于提供数据存储的可抽换式、非矩形外围卡。
39.如权利要求27所述的方法,其中所述囊封用于囊封附着有所述存储器电路小片与所述控制器电路小片的所述范例的所述引线框架的至少一侧,从而囊封所述存储器电路小片与所述控制器电路小片。
40.如权利要求27所述的方法,其中通过所述单分对所述范例中每一范例的所述非线性成形是在所述单分期间通过曲线形或非矩形切割来实现。
41.如权利要求40所述的方法,其中所述方法进一步包括:
在所述单分之后,围绕所述范例中的每一范例固定一外部外封装。
42.一种用于同时形成多个存储卡且其中所述存储卡中每一存储卡均包含至少一存储器电路小片及一控制器电路小片的方法,所述方法包括:
提供一具有多个范例的多范例印刷电路板;
相对于所述范例中的每一范例来附着所述存储器电路小片;
相对于所述范例中的每一范例来固定所述控制器电路小片;
将所述存储器电路小片及所述控制器电路小片中的每一者电连接至所述多范例印刷电路板中的相应范例;
此后,使用一模塑化合物将所述范例囊封于一起;及
随后,使用至少非矩形成形来单分所述范例中的每一范例,所述单分步骤提供的所述集成电路产品包括具有第一部分、第二部分和第三部分的侧面,所述第一部分与所述第三部分平行,所述第二部分以倾斜的角度在所述第一部分和所述第三部分之间延伸,所述第三部分包括缺口,当所述集成电路产品被插入容座内时,所述缺口作为挚扣区域以接纳部件。
43.如权利要求42所述的方法,其中对于所述范例中的每一范例,所述固定用于将所述控制器电路小片安装于所述存储器电路小片上,借此将所述控制器电路小片堆叠于所述存储器电路小片上。
44.如权利要求43所述的方法,其中对于所述范例中的每一范例,所述存储器电路小片均安装于所述印刷电路板上。
45.如权利要求42所述的方法,其中所述范例中的每一范例均在所述印刷电路板上包含外露的电接点。
46.如权利要求42所述的方法,其中所述电连接包括将所述存储器电路小片与所述控制器电路小片中的每一者至少丝焊至所述多范例印刷电路板中的所述相应范例。
47.如权利要求42所述的方法,其中通过由一激光器提供的一激光束来实施所述单分。
48.如权利要求42所述的方法,其中通过使用一激光束及水来实施所述单分。
49.如权利要求42所述的方法,其中通过一高压水射流来实施所述单分。
50.如权利要求49所述的方法,其中所述水射流包含至少水及一磨料。
51.如权利要求42-50中任一项所述的方法,其中所述存储卡为模塑卡,所述模塑卡中的每一个均具有一由所述模塑化合物提供的外壳而无任何其他外部壳体。
52.如权利要求42-50中任一项所述的方法,其中所述存储卡是用于提供数据存储的可抽换式外围卡。
53.如权利要求42-50中任一项所述的方法,其中所述囊封用于囊封附着有所述存储器电路小片与所述控制器电路小片的所述范例的所述印刷电路板的至少一侧,从而囊封所述存储器电路小片与所述控制器电路小片。
54.如权利要求42-50中任一项所述的方法,其中所述方法进一步包括:
在所述单分之后,围绕所述范例中的每一范例固定一外部外封装。
55.如权利要求1-21中任一项所述的方法,其中通过所述单分对所述范例中的每一范例进行所述非线性成形是在所述单分期间通过曲线形或非矩形切割来实现。
56.如权利要求1所述的方法,其中所述方法进一步包括:
在所述单分之后对所述范例中的每一范例涂敷一涂层。
57.如权利要求16所述的方法,其中所述方法进一步包括:
在所述单分之后对所述存储卡中的每一存储卡涂敷一涂层。
58.如权利要求16所述的方法,其中所述方法进一步包括:
在所述单分之后将一外壳固定至所述存储卡中的每一存储卡。
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- 2004-06-16 WO PCT/US2004/019381 patent/WO2005001909A2/en active Application Filing
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- 2004-06-16 JP JP2006517356A patent/JP5117048B2/ja not_active Expired - Fee Related
- 2004-06-21 TW TW093117976A patent/TWI345178B/zh not_active IP Right Cessation
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WO2005001909A3 (en) | 2005-02-24 |
CN1809921A (zh) | 2006-07-26 |
JP5384588B2 (ja) | 2014-01-08 |
JP5117048B2 (ja) | 2013-01-09 |
US20060267165A1 (en) | 2006-11-30 |
JP2007526624A (ja) | 2007-09-13 |
US8354749B2 (en) | 2013-01-15 |
US20040259291A1 (en) | 2004-12-23 |
US7094633B2 (en) | 2006-08-22 |
WO2005001909A2 (en) | 2005-01-06 |
TWI345178B (en) | 2011-07-11 |
EP1642326A2 (en) | 2006-04-05 |
TW200508980A (en) | 2005-03-01 |
JP2012033178A (ja) | 2012-02-16 |
KR100996320B1 (ko) | 2010-11-23 |
KR20060024436A (ko) | 2006-03-16 |
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