CN103280514A - Method for automatically packaging LED module - Google Patents

Abstract

The invention discloses a method for automatically packaging an LED module. The technological processes such as LED substrate automatic feeding and discharging, lens automatic feeding and discharging and LED substrate automatic transmitting are added based on the traditional LED module packaging technology including lens covering, blank pressing and the glue injecting technology. A technological model of LED module packaging is established based on LED module packaging automation. The technological model parameters comprise the LED substrate feeding time, the LED lens feeding time, the lens covering time, the lens support discharging time, the lens blank pressing time, the lens glue injecting time, the technology transferring time between the adjacent technological processes, the lens glue injecting workstation, the LED module average packaging time, the packaging technology beat and the LED module packaging efficiency. The LED module packaging efficiency is optimized based on the LED module packaging technology model, the purpose that the processes such as the LED module packaging lens covering, blank pressing and glue injecting are optimally allocated is achieved, and labor productivity is improved.

Description

A kind of LED module encapsulation automatic mode

Technical field

The present invention relates generally to semiconductor application and encapsulation field, relates in particular to a kind of LED module encapsulation automatic mode.

Background technology

The great power LED volume is little, the life-span is long, electro-optical efficiency is high, is the 4th generation " green illumination light source ".In light source manufacturings such as street lamp, flood lights, be with a wide range of applications, be subjected to increasing attention.The encapsulation of LED module is the terminal critical process that the LED light fixture is made, and the quality of encapsulation directly influences the performance of product, and packaging efficiency concerns labour cost and the market competitiveness of LED product.

Be depicted as LED disjunctor lens module as Fig. 1 a and Fig. 1 b, 11 are the LED disjunctor lens carrier before cutting edge, and 12 is the substrate of LED module, comprises aluminium base, ceramic wafer etc., 13 is led chip, 14 are LED lens installation groove, and 15 are the LED disjunctor lens carrier after cutting edge, and 16 is simple grain LED lens, 17 is the LED hole for injecting glue, 18 is the LED steam vent, and Fig. 1 a is the schematic diagram before the LED lid lens, and Fig. 1 b is the schematic diagram after the LED lid lens.

At this moment, the packaging technology of LED module comprises: a plurality of technologies such as blanking, the flanging of LED lens and injecting glue of the material loading of LED lens and substrate, lid lens, LED disjunctor lens carrier.The encapsulation of tradition LED module, manual mode is all adopted in the blanking of the material loading of LED disjunctor lens, substrate and LED disjunctor lens carrier; And lid lens, side cut and injecting glue process using separate equipment are effectively not integrated each other, and the percent of automatization of LED module encapsulation is not high.

Summary of the invention

At above-mentioned technical problem, the present invention is intended to solve the problems of the technologies described above at least to a certain extent.

The object of the present invention is to provide a kind of LED module encapsulation automatic mode, to improve the percent of automatization of LED module encapsulation.

A kind of LED module encapsulation automatic mode is characterized in that, described method comprises step based on LED module encapsulation automation complete set of equipments:

1) material loading: comprise LED substrate automatic charging, the automatic charging of LED disjunctor lens;

2) lid lens: with the LED lens cover on substrate, lens and lens recess pressing disjunctor, and the disjunctor lens are cut edge;

3) lens carrier blanking: the automatic blanking of LED lens side cut support;

4) lens flanging: after rims of the lens is heated, lens and lens recess are compressed;

5) lens injecting glue: aim at the lens hole for injecting glue and inject glue.

Described step 1 to the processing total time of step 5 comprises: the technology change-over time between LED substrate material loading time, LED lens material loading time, lid lens time, lens carrier blanking time, lens flanging time, the adjacent step with each of lens injecting glue time.

Described step 2 and step 4, step 5 adopt the multistation parallel work-flow.

The present invention further realizes the optimization of LED module packaging efficiency, and by improving the packaging technology beat, realizes distributing rationally of stations such as LED module cap lens, flanging and injecting glue, raises labour productivity.

Description of drawings

Fig. 1 a is the schematic diagram before the LED lid lens;

Fig. 1 b is the schematic diagram after the LED lid lens;

Fig. 2 is New LED module encapsulation automation process flow chart;

Fig. 3 is LED module encapsulation automation process model schematic diagram;

Embodiment

The present invention is further detailed explanation below in conjunction with drawings and Examples.

A kind of LED module encapsulation automatic mode, in traditional LED module packaging technology, comprise on the basis of covering lens, flanging and injecting glue technology, added process procedures such as the substrate automatic loading/unloading that the LED module encapsulates, lens automatic loading/unloading, the automatic transmission of LED substrate, and encapsulated between each process procedure integrated mutually.As shown in Figure 2, single led module packaging technology flow process comprises:

S201: comprise LED substrate automatic charging, the automatic charging of LED disjunctor lens;

S202: with the LED lens cover on substrate, lens and lens recess pressing disjunctor, and the disjunctor lens are cut edge;

The automatic blanking of S203:LED lens side cut support;

S204: after rims of the lens is heated, lens and lens recess are compressed;

S205: aim at the lens hole for injecting glue and inject glue;

For the encapsulation of batch LED module, adopt parallel in groups mode.As shown in Figure 3, in the LED module packaging technology model schematic diagram, LED module cap lens technology is finished by n lid lens station is parallel; Flanging technology is finished by m flanging station is parallel; Injecting glue technology is finished by s injecting glue station is parallel, and under the effect of synchronous driving mechanism, guarantees in batches LED module encapsulation material loading, lid lens, blanking, flanging and injecting glue technology time coordination each other.

The note LED substrate material loading time is t _S1, the LED lens material loading time is t _S2, lid lens time of respectively covering the lens station is t _G1～t _Gn, the lens carrier blanking time is t _x, each flanging station the flanging time be t _Y1～t _Ym, each injecting glue station the injecting glue time be t _Z1～t _Zs, and the technology change-over time between each adjacent process procedure be T _Sg, T _Gx, T _XyAnd T _Yz, then batch shown in Figure 3 is the LED module encapsulation of M,

The time of material loading technology is: T ₁=(t _S1+ t _S2) * M

Technology between material loading and the lid lens technology is change-over time: T ₂=T _Sg* M

The time of lid lens technology is: T ₃=max (t _G1, t _G2..., t _Gn) * M/n

Technology between lid lens and the technology for blanking is change-over time: T ₄=T _Gx* M

The time of technology for blanking is: T ₅₌t _x* M

Technology between blanking and the flanging technology is change-over time: T ₆=t _Xy* M

The time of flanging technology is: T ₇=max (t _Y1, t _Y2..., t _Ym) * M/m

Technology between flanging and the injecting glue technology is change-over time: T ₈=T _Yz* M

The time of injecting glue technology is: T ₉=max (t _Z1, t _Z2..., t _Zs) * M/s

Get $\∀t\∈\left\{x\right|x=|T_i-T_j|\},i=j\±1,$ And 1≤i, j≤9, then:

The encapsulation of LED module is defined as average time: T=∑ T _i/ M

LED module packaging technology saturation is defined as:

The packaging technology beat is (inferior/hour): ω=3600/T

The technology saturation is to weigh a parameter of LED module packaging technology ability; It is the embodiment of single led module packaging efficiency that the LED module encapsulates average time.Improve LED module automation packaging efficiency in batches, by improving LED module packaging technology saturation η and shortening the encapsulation of LED module and realize average time, namely will realize:

Because: $\left\{\begin{array}{c}\mathrm{\η}=(1-\frac{\max t}{T\×M})\×100\%=(1-\frac{\max t}{\mathrm{\Σ}{T}_i})\×100\%\\ T=\mathrm{\Σ}{T}_i/M\end{array}\right.$

So at batch M one regularly, improving in batches, the method for LED module automation packaging efficiency is: shorten the overall process time of single led module encapsulation, shorten the time difference maxt between the adjacent technology simultaneously, making it is zero as far as possible.

The above embodiment of the present invention only is for example of the present invention clearly is described, and is not to be restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here need not also can't give all execution modes exhaustive.All any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., all should be included within the protection range of claim of the present invention.

Claims (3)

1. a LED module encapsulation automatic mode is characterized in that, described method comprises step based on LED module encapsulation automation complete set of equipments:

1) material loading: comprise LED substrate automatic charging, the automatic charging of LED disjunctor lens;

2) lid lens: with the LED lens cover on substrate, lens and lens recess pressing disjunctor, and the disjunctor lens are cut edge;

3) lens carrier blanking: the automatic blanking of LED lens side cut support;

4) lens flanging: after rims of the lens is heated, lens and lens recess are compressed;

5) lens injecting glue: aim at the lens hole for injecting glue and inject glue.

2. LED module according to claim 1 encapsulates automatic mode, it is characterized in that described step 1 to the processing total time of step 5 comprises: the technology change-over time between LED substrate material loading time, LED lens material loading time, lid lens time, lens carrier blanking time, lens flanging time, the adjacent step with each of lens injecting glue time.

3. LED module encapsulation automatic mode according to claim 2 is characterized in that described step 2 and step 4, step 5 adopt the multistation parallel work-flow.

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