CN103296183A - LED (light-emitting diode) lens forming method with temperature and glue control - Google Patents
LED (light-emitting diode) lens forming method with temperature and glue control Download PDFInfo
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- CN103296183A CN103296183A CN2013102094954A CN201310209495A CN103296183A CN 103296183 A CN103296183 A CN 103296183A CN 2013102094954 A CN2013102094954 A CN 2013102094954A CN 201310209495 A CN201310209495 A CN 201310209495A CN 103296183 A CN103296183 A CN 103296183A
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Abstract
The invention relates to the field of LEDs (light-emitting diodes), and discloses an LED lens forming method with temperature and glue control. The method includes the following steps: 101, fixing an LED chip in a base through silver paste or insulating paste or metal soldering paste, or fixing the chip in the base in a eutectic way; 103, spotting glue on the surface of the base according to the following equation to form a lens which is changed into a bullet shape from a convex-lens shape, wherein the equation is h Rho *[ (t*H*T)/P]. In the equation, h refers to height of the lens, H refers to distance between a gluing head and the surface of the chip and ranges from 0m to 100m, t refers to temperature of the bottom of a support and ranges from 30 DEG C to 200 DEG C, T refers to time and ranges from 0s to 600s, P refers to glue feeding speed and ranges from 0ml/s to 1ml/s, and Rho refers to multiplying power coefficient which is a positive real number and is adjusted according to actual conditions of the base. Products processed by the method are low in cost and high in yield.
Description
Technical field
The present invention relates to the LED field, especially relate to the LED lens forming method of a kind of temperature and glue amount control.
Background technology
LED is exactly the meaning of light-emitting diode, and the heart of LED is a semi-conductive wafer, and an end of wafer is attached on the support, and an end is negative pole, and the other end connects the positive pole of power supply, makes entire wafer by epoxy encapsulation.The packaging technology of tradition band lens SMD type LED has: 1, solid crystalline substance and bonding wire in support, after white light must and toast at fluorescent material on the point and do, adopt quantitative or constant-pressure type point glue again, glue is distributed on the support, and then employing quantitative point glue, baking through certain condition, colloid is at gravity, effect such as tension force down, form nearly hemispherical lens, this method is because glue has the stage of reduction in the process medium viscosity that heats up, therefore highly decrease after the baking, the ratio of the lens height of formation and radius is usually less than 1: 1, and the method can't effectively be controlled at vpg connection simultaneously.2, solid lens assembling, adopt the gluing mode that connects to be fixed in rack surface in type lens, to obtain the optical effect between chip and the lens, the solid lens assembly method, big to the support limitation, can only mate has the fixedly support of buckle, and associativity is bad between lens and the fluorescent glue, the easy xanthochromia of bonding agent, lens cost height.3, utilize the mould moulding, as the disclosed a kind of method for packing with lens SMD type LED of state patent documentation CN102368514A, it is with the direct screening of SMD type LED paster support after electroplating, at solid brilliant machine point glue fixed chip, then the chip set box that fixes is put into baking box, the baking crystal-bonding adhesive makes its curing; The chip set box that is cured is put into bonding equipment, adopt gold thread or alloy wire with chip P/N knot and support bonding; Support behind the bonding is directly entered the mould of being with lens, with silicones or silica gel injection moulding mould, be with a lens SMD type LED injection-compression molding thereby finish by press; Though and this processing method can process the luminous SMD LED of various angles; but it will utilize the higher mould of pre-ready-made precision with the support fastening; fill glue by injector, heating makes glue curing, again with support and the lens after solidifying from mould; form lens; the method has very high requirement at mould and die accuracy, and therefore, such die cost is quite high; simultaneously, the equipment auxiliary material also has quite high cost.
Summary of the invention
For overcoming the shortcoming of traditional handicraft, the invention provides a kind of temperature and glue amount utilized and control to process the forming method that makes the LED lens that product cost is low, rate of finished products is high.
The objective of the invention is to realize by following technical measures that the LED lens forming method that a kind of temperature and glue amount are controlled comprises the steps:
101, led chip is fixed in the pedestal with silver-colored slurry or insulating cement or brazing metal, or adopts the eutectic mode that chip is fixed in the pedestal;
103, base-plates surface according under establish an equation and carry out a glue, can realize by the lens of convex lens shape to bullet shape; Described equation is:
H is lens height, and H is Glue dripping head to height, the scope of rack surface is that 0-100mm is adjustable, and t is the frame bottom temperature, and scope is that 30-200 ℃ of adjustable, T is the time, and scope is that 0-600S is adjustable, and P plastic emitting speed, scope are that 0-1ml/ is adjustable second; ρ is a times rate coefficient, is arithmetic number, adjusts according to the pedestal actual conditions.
As a kind of optimal way, led chip is fixing with silver slurry or insulating cement in described 101, and then fixing back baking 30-120 minute under 100-175 degree temperature conditions uses the sealing wire in the bonding equipment that led chip and pedestal are bound.As be the eutectic mode, then need not baking this time, the upside-down mounting eutectic also need not bonding wire.
As a kind of optimal way, also comprise 102 before described 103, spot printing is mixed with the glue of fluorescent material on the chip surface on the pedestal, and baking is dry.As in lens glue, being mixed with fluorescent material, then need not a powder and baking this time.
Concrete, described sealing wire is gold thread, silver-colored line, copper cash, aluminum steel or alloy wire.
As a kind of optimal way, the height of described step 103 lens is 0.3-3 with the ratio of radius: 1.
Concrete, described pedestal is SMD support, pcb board, ceramic substrate, aluminium base, copper base or film.
Method of the present invention can process lens of LED of different height and shape, thereby realize the different rising angle of led light source, can mate by more convenient and ready-made secondary lens, even the secondary lens that can save, directly realize the needed effect of light fixture by one-time formed collector lens.Processing method of the present invention does not need to use lens molding die, and is follow-up without glossing yet, so the present invention has the advantage that cost is low, technology is simple, rate of finished products is high.
Description of drawings
Fig. 1 is the cross-sectional view of the LED of embodiment of the invention method processing.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the present invention is described in further detail.
With reference to figure 1, the LED lens forming method of a kind of temperature and the control of glue amount comprises the steps:
101, led chip 2 usefulness silver slurry or insulating cement are fixed in the SMD support 4;
102 and baking 30-120 minute under 100-175 degree temperature conditions, silver slurry or insulating cement are solidified after, adopt the eutectic mode then to need not baking this time;
103, use the sealing wire in the bonding equipment that led chip 2 and support 4 are bound, the upside-down mounting eutectic then need not bonding wire, and 3 surface points of the chip on SMD support 4 are coated fluorescent material 3 then; As in lens glue, being mixed with fluorescent material, then need not this powder step.
104, rack surface according under establish an equation and carry out a glue, can realize by the lens 1 of convex lens shape to bullet shape; Described equation is:
H is lens height, and H is Glue dripping head to height, the scope of rack surface is that 0-100mm is adjustable, and t is the frame bottom temperature, and scope is that 30-200 ℃ of adjustable, T is the time, and scope is that 0-600S is adjustable, and P plastic emitting speed, scope are that 0-1ml/ is adjustable second.ρ is a times rate coefficient, is arithmetic number, adjusts according to the pedestal actual conditions.
This method is utilized different temperature, in the colloid forming process, form height gradually, the lens that vary in size, only need control temperature and some glue time and glue amount, can form needed lens height and diameter, the height of the lens of this method processing and the ratio of radius can be at 0.3-3: adjust in 1.Angle design is provided effectively and method easily.This method also adopts viscosity at the glue of 30-90paS, and this glue predry condition is 150 degree 3-15S, according to the temperature characterisitic of glue, also can finish moulding LED lens on the SMD LED of fluorescent material spot printing.
Can use this method at plane formula pedestals such as pcb board, ceramic substrate, aluminium base, films in other embodiments, as long as step 102,103 is done the part adjustment.
More than be that the SMD LED lens forming method of temperature of the present invention and the control of glue amount is set forth; be used for helping to understand the present invention; but embodiments of the present invention are not restricted to the described embodiments; anyly do not deviate from the change done under the principle of the invention, modification, substitute, combination, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (6)
1. the LED lens forming method of a temperature and glue amount control is characterized in that comprising the steps:
101, led chip is fixed in the pedestal with silver-colored slurry or insulating cement or brazing metal, or adopts the eutectic mode that chip is fixed in the pedestal;
103, base-plates surface according under establish an equation and carry out a glue, can realize by the lens of convex lens shape to bullet shape; Described equation is:
H is lens height, and H is Glue dripping head to height, the scope of rack surface is that 0-100mm is adjustable, and t is the frame bottom temperature, and scope is that 30-200 ℃ of adjustable, T is the time, and scope is that 0-600S is adjustable, and P plastic emitting speed, scope are that 0-1ml/ is adjustable second; ρ is a times rate coefficient, is arithmetic number, adjusts according to the pedestal actual conditions.
Temperature according to claim 1 and glue amount control LED lens forming method, it is characterized in that: led chip is fixed with silver slurry or insulating cement in described 101, then toasted 30-120 minute under 100-175 degree temperature conditions fixing back, uses the sealing wire in the bonding equipment that led chip and pedestal are bound.
3. the LED lens forming method of temperature according to claim 1 and glue amount control is characterized in that: also comprise 102 before described 103, spot printing is mixed with the glue of fluorescent material on the chip surface on the pedestal, and baking is dry.
Temperature according to claim 2 and glue amount control LED lens forming method, it is characterized in that: described sealing wire is gold thread, silver-colored line, copper cash, aluminum steel or alloy wire etc.
5. the LED lens forming method of temperature according to claim 1 and glue amount control, it is characterized in that: the height of stating step 103 lens is 0.3-3 with the ratio of radius: 1.
Temperature according to claim 1 and glue amount control LED lens forming method, it is characterized in that: described pedestal is SMD support, pcb board, ceramic substrate, aluminium base, copper base or film.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102094954A CN103296183A (en) | 2013-05-28 | 2013-05-28 | LED (light-emitting diode) lens forming method with temperature and glue control |
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| CN2013102094954A CN103296183A (en) | 2013-05-28 | 2013-05-28 | LED (light-emitting diode) lens forming method with temperature and glue control |
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| CN103296183A true CN103296183A (en) | 2013-09-11 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104042179A (en) * | 2014-07-04 | 2014-09-17 | 王刚 | Integrated medical endoscope system |
| CN109027819A (en) * | 2018-10-08 | 2018-12-18 | 郑州森源新能源科技有限公司 | LED distance light searchlight |
| CN111834512A (en) * | 2020-06-23 | 2020-10-27 | 镇江恒泽光电有限公司 | Efficient LED lamp bead with spherical structure |
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| US20070155033A1 (en) * | 2006-01-05 | 2007-07-05 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing light emitting diode package |
| US20090065792A1 (en) * | 2007-09-07 | 2009-03-12 | 3M Innovative Properties Company | Method of making an led device having a dome lens |
| CN201956395U (en) * | 2011-01-27 | 2011-08-31 | 复旦大学 | Chip on board (COB) technology-based light emitting diode (LED) fluorescent glue dispensing structure |
| WO2012147611A1 (en) * | 2011-04-26 | 2012-11-01 | サンユレック株式会社 | Method and apparatus for manufacturing optical device |
| CN103050604A (en) * | 2012-11-30 | 2013-04-17 | 广州市鸿利光电股份有限公司 | Manufacturing method of MLCOB (Multi Lens Chips On Board) light source module |
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2013
- 2013-05-28 CN CN2013102094954A patent/CN103296183A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070155033A1 (en) * | 2006-01-05 | 2007-07-05 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing light emitting diode package |
| US20090065792A1 (en) * | 2007-09-07 | 2009-03-12 | 3M Innovative Properties Company | Method of making an led device having a dome lens |
| CN201956395U (en) * | 2011-01-27 | 2011-08-31 | 复旦大学 | Chip on board (COB) technology-based light emitting diode (LED) fluorescent glue dispensing structure |
| WO2012147611A1 (en) * | 2011-04-26 | 2012-11-01 | サンユレック株式会社 | Method and apparatus for manufacturing optical device |
| CN103050604A (en) * | 2012-11-30 | 2013-04-17 | 广州市鸿利光电股份有限公司 | Manufacturing method of MLCOB (Multi Lens Chips On Board) light source module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104042179A (en) * | 2014-07-04 | 2014-09-17 | 王刚 | Integrated medical endoscope system |
| CN109027819A (en) * | 2018-10-08 | 2018-12-18 | 郑州森源新能源科技有限公司 | LED distance light searchlight |
| CN111834512A (en) * | 2020-06-23 | 2020-10-27 | 镇江恒泽光电有限公司 | Efficient LED lamp bead with spherical structure |
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Effective date of abandoning: 20171208 |