CN103296185A - Inverted trapezoidal LED support and LED light source thereof - Google Patents
Inverted trapezoidal LED support and LED light source thereof Download PDFInfo
- Publication number
- CN103296185A CN103296185A CN2012100527913A CN201210052791A CN103296185A CN 103296185 A CN103296185 A CN 103296185A CN 2012100527913 A CN2012100527913 A CN 2012100527913A CN 201210052791 A CN201210052791 A CN 201210052791A CN 103296185 A CN103296185 A CN 103296185A
- Authority
- CN
- China
- Prior art keywords
- led
- reflecting wall
- conducting bracket
- support
- inverted trapezoidal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses an inverted trapezoidal LED support and an LED light source of the inverted trapezoidal LED support, and relates to the technical field of LEDs, so that the lighting effect is improved, and loss is reduced. The LED support mainly comprises an electric conduction support, a packaging substrate and an inverted trapezoidal reflecting barrier, wherein an area used for placement of chips is formed on the packaging substrate and at the center position of the electric conduction support, the area is mainly used for placement of the LED chips, and the reflecting barrier is in an inverted trapezoidal shape, is connected with the electric conduction support and can be used for providing a reflecting path.
Description
Affiliated technical field
The present invention relates to a kind of light-emitting diode (LED) technical field, especially a kind of New LED encapsulation.
Background technology
Light-emitting diode (LED) is response current and be excited to produce the semiconductor device of versicolor light.The color of the light that is produced by LED is mainly determined by the semi-conductive chemical composition of LED.This LED compares with the traditional luminescent device that uses filament has a plurality of advantages, switches property such as longer life-span, lower driving voltage, better initial exciting characteristic, higher freedom from vibration and the anti-power supply repeatedly of Geng Gao.Therefore, the demand to this LED increases just gradually.
In recent years, LED has all been adopted in large scale liquid crystal display (LCD) fast development in its light-emitting device and the back lighting device.But be not 100% be utilized by the light that chip sends, this mainly is because the cause that the light of chip sides is wasted.
Summary of the invention
In order to solve the problems referred to above of existing LED encapsulation technology, the invention provides a kind of LED encapsulating structure and manufacturing way thereof, in order to improving light output efficiency, and improve light efficiency, reduce loss.
Another object of the present invention proposes a reflecting wall exactly, by accommodation reflex wall and conducting bracket angle, and the needed lighting angle of easier acquisition.
The technical solution adopted for the present invention to solve the technical problems is: the LED encapsulating structure comprises an encapsulation base, its inside has the chip put area, in order to place a led chip, a conducting bracket, an and reflecting wall, link to each other with conducting bracket, trapezoidal inclined-plane and 0 °＜α of conducting bracket angle＜90 °, for led chip provides a reflection approach.The plane reflection wall can effectively concentrate on required light-emitting zone to sidelight, if reflecting surface is that fold plane then can effectively be eliminated dazzle.
The invention has the beneficial effects as follows: reduce the light energy loss, have high light output efficiency, have more the function of easy control rising angle.Its manufacture method must special extra equipment, only forms reflecting wall simultaneously, the cost burden on the no additional materials in the same step that forms conducting bracket.
Description of drawings
The present invention is further described below in conjunction with accompanying drawing.
Accompanying drawing 1 is light source irradiation schematic diagram of the present invention.
Accompanying drawing 2 is structural representations of the present invention.
Embodiment
As shown in Figure 1: the present invention is fully used sidelight by falling the sidelight that trapezoidal reflecting wall refraction luminous element sends.
In Fig. 2: 1. fall trapezoidal reflecting wall 2. conductive gold wires; 3.LED chip; 4. silica-gel lens; 5. encapsulation base; 6. conducting bracket;
The base of support of the present invention (6) links to each other with reflecting wall (1), and led chip (3) is in the protruding part of support (6) central authorities, and encapsulation base (5) is filled protection (4) by silica gel, and reflecting wall (1) is 40 ° with horizontal plane angle (7); The whole LED timbering material is that metal material or ceramic-metal composite are made.
Claims (7)
1. LED encapsulating structure, mainly by: conducting bracket, encapsulation base and reflecting wall are formed; Conducting bracket is the main part of LED encapsulating structure; Encapsulation base has a special zone of placing led chip in the central authorities of support; It is trapezoidal that reflecting wall mainly becomes, and is connected with conducting bracket.
2. LED encapsulating structure according to claim 1 is characterized in that, described conducting bracket material is selected from a group that is made up of gold, silver, copper, iron, aluminium and alloy thereof.
3. LED encapsulating structure according to claim 1 is characterized in that, described encapsulation base material is the mixing of epoxy resin, glass fibre, titanium oxide, calcium oxide or above material.
4. LED encapsulating structure according to claim 1 is characterized in that, the common cup-like structure that forms of described conducting bracket and described reflecting wall.
According to the described reflecting wall of claim for trapezoidal, inclined-plane and 0 °＜α of conducting bracket angle＜90 °.
6. the material according to the described reflecting wall of claim is the highly reflective material.
7. be plane or fold plane according to the described reflecting wall of claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100527913A CN103296185A (en) | 2012-03-02 | 2012-03-02 | Inverted trapezoidal LED support and LED light source thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100527913A CN103296185A (en) | 2012-03-02 | 2012-03-02 | Inverted trapezoidal LED support and LED light source thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103296185A true CN103296185A (en) | 2013-09-11 |
Family
ID=49096762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100527913A Pending CN103296185A (en) | 2012-03-02 | 2012-03-02 | Inverted trapezoidal LED support and LED light source thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103296185A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5894196A (en) * | 1996-05-03 | 1999-04-13 | Mcdermott; Kevin | Angled elliptical axial lighting device |
| JP2006261366A (en) * | 2005-03-17 | 2006-09-28 | Reimei Giken Kogyo Kk | Method for packaging led to printed-wiring board, and led packaging printed-wiring board |
| CN101009340A (en) * | 2006-01-25 | 2007-08-01 | 亿光电子工业股份有限公司 | LED encapsulation structure and its making method |
| CN101364626A (en) * | 2007-08-07 | 2009-02-11 | 亿光电子工业股份有限公司 | LED device |
| CN101867006A (en) * | 2010-06-11 | 2010-10-20 | 合肥超维微电子科技有限公司 | LED light equalizing chip |
| CN202651189U (en) * | 2011-09-20 | 2013-01-02 | 河南森源电气股份有限公司 | Inverse trapezium LED support |
-
2012
- 2012-03-02 CN CN2012100527913A patent/CN103296185A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5894196A (en) * | 1996-05-03 | 1999-04-13 | Mcdermott; Kevin | Angled elliptical axial lighting device |
| JP2006261366A (en) * | 2005-03-17 | 2006-09-28 | Reimei Giken Kogyo Kk | Method for packaging led to printed-wiring board, and led packaging printed-wiring board |
| CN101009340A (en) * | 2006-01-25 | 2007-08-01 | 亿光电子工业股份有限公司 | LED encapsulation structure and its making method |
| CN101364626A (en) * | 2007-08-07 | 2009-02-11 | 亿光电子工业股份有限公司 | LED device |
| CN101867006A (en) * | 2010-06-11 | 2010-10-20 | 合肥超维微电子科技有限公司 | LED light equalizing chip |
| CN202651189U (en) * | 2011-09-20 | 2013-01-02 | 河南森源电气股份有限公司 | Inverse trapezium LED support |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130911 |