CN103336410A - Device for enhancing capability of lithographic process and lithographic process using same - Google Patents
Device for enhancing capability of lithographic process and lithographic process using same Download PDFInfo
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- CN103336410A CN103336410A CN2013102647308A CN201310264730A CN103336410A CN 103336410 A CN103336410 A CN 103336410A CN 2013102647308 A CN2013102647308 A CN 2013102647308A CN 201310264730 A CN201310264730 A CN 201310264730A CN 103336410 A CN103336410 A CN 103336410A
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Abstract
The invention discloses a device for enhancing the capability of a lithographic process, and a lithographic process using the device. Relevant parameters of a multi-gray circular lighting aperture are adjusted according to the requirements of the lithographic process, so that an incident ray irradiates the surface of a silicon wafer in the illumination quantity according with the process requirements after passing through the multi-gray circular lighting aperture, so as to form a final pattern by a photoresist at the surface of the silicon wafer. Thus, the lithographic process is further finished. By adopting the device for enhancing the capability of the lithographic process and the lithographic process using the device provided by the invention, the synthetic resolutions and process windows of patterns of different sizes can be effectively improved; line width dimensions of the patterns of different sizes are balanced; and the problems of cost increase and output reduction of the multi-exposure process are avoided. Thus, the production efficiency is improved; the manufacturing cost is reduced; and the apparatus yield is also improved.
Description
Technical field
The present invention relates to a kind of lithographic equipment and photoetching method, relate in particular to a kind of photoetching process that strengthens the device of photolithographic process capability and utilize this device to carry out.
Background technology
The manufacturing of semiconductor devices need be passed through roads up to a hundred technology, and photoetching process is in critical role as the main technique step of patterning in the manufacture process of semiconductor devices.Fig. 1 is the structural representation of traditional photolithographic exposure system; Fig. 2 is the plan structure synoptic diagram of circular iris among Fig. 1; As shown in the figure, traditional photolithographic exposure system comprises: circular iris 101, collector lens 102 and projecting lens 104, and circular iris 101, collector lens 102 and projecting lens 104 arrange successively from top to bottom; When carrying out photolithographic exposure technology, photomask 103 is positioned between collector lens 102 and the projecting lens 104, silicon substrate 105 is positioned over projecting lens 104 belows, incident ray 100 passes through circular iris 101 and collector lens 102 along axis, figure place on photomask 103 forms diffraction, diffraction light is interfered the formation component graphics through projecting lens 104 backs on silicon substrate 105 surfaces, thereby finishes photolithographic exposure technology.Wherein, the partial coherence factor sigma of circular iris 101 is to describe an important parameter of circular iris size.
Along with the development of semiconductor devices, dimension of picture constantly dwindles, and traditional circular iris lighting system more and more can not satisfy technology requirement.Multiple resolution enhance technology (Resolution Enhancement Techniques is called for short RET) grows up gradually.Off-axis illumination (off-axis illumination) is the technology of wherein comparatively using always.The off-axis illumination aperture has multiple choices, and level Four off-axis illumination aperture and annular off-axis illumination aperture are wherein two kinds.
Level Four off-axis illumination aperture is often used in the resolution that raising is arranged the intensive figure with less spatial separation at certain two specific direction, and Fig. 3 is the structural representation that adopts the photolithographic exposure system of level Four off-axis illumination aperture; Fig. 4 is the plan structure synoptic diagram of level Four off-axis illumination aperture; As shown in the figure, adopt the photolithographic exposure system of level Four off-axis illumination aperture to comprise: level Four off-axis illumination aperture 201, collector lens 202 and projecting lens 204, and level Four off-axis illumination aperture 201, collector lens 202 and projecting lens 204 arrange successively from top to bottom; When carrying out photolithographic exposure technology, photomask 203 is positioned between collector lens 202 and the projecting lens 204, silicon substrate 205 is positioned over projecting lens 204 belows, level Four off-axis illumination aperture 201 and collector lens 202 are passed through with the direction that axis necessarily departs from incident ray 200 edges, figure place on photomask 203 forms diffraction, diffraction light is interfered the formation component graphics through projecting lens 204 backs on silicon substrate 205 surfaces, thereby finishes photolithographic exposure technology.Wherein, the partial coherence factor sigma of level Four off-axis illumination aperture 201
In, σ
Out, light hole opening angle α and light hole orientation and relative direction angle β be the important parameter of describing level Four off-axis illumination aperture size, width and direction.This level Four off-axis illumination aperture can only have effectiveness preferably to the figure that some specific direction is arranged, but can't play the effectiveness of photolithographic exposure to the figure that all directions are arranged.
Fig. 5 is the plan structure synoptic diagram of annular off-axis illumination aperture; As shown in the figure, partial coherence factor sigma
In, σ
OutIt is the important parameter of describing annular off-axis illumination aperture 301 sizes and width, annular off-axis illumination aperture 301 is because the symmetry of its circumference, the figure that all directions are arranged all has certain effectiveness, but for the figure that some specific direction is arranged, its effectiveness is then not as level Four off-axis illumination aperture.
Fig. 6 is that the different spaces spacing of off-axis illumination aperture is to the synoptic diagram that influences of figure live width dimension difference; As shown in the figure, horizontal ordinate represents spatial separation, ordinate represents the difference of live width size, in existing off-axis illumination aperture, when spatial separation was big, the difference of live width size was bigger, thereby can influence the device live width behind photoetching, the etching technics, cause device not meet process requirements, thereby influence the yield of device.In device products, especially in the logic product, there is the figure of various different sizes in a large number, though single off-axis illumination aperture can effectively improve the resolution of small size figure, can not guarantee that the figure of different size has enough resolution.Some figure even can't be rasterized forms and forbids the spatial separation zone.
For the photolithographic process capability of balance different size spatial separation figure, a kind of method is to adopt the method for photolithographic exposure of dual off-axis illumination aperture.(publication number: US20100165317) adopted the hydridization illumination aperture that comprises bipolar illumination aperture and annular illumination aperture, Fig. 7 is the plan structure synoptic diagram that comprises the hydridization illumination aperture of bipolar illumination aperture and annular illumination aperture to United States Patent (USP); As shown in the figure, this hydridization illumination aperture 401 comprises bipolar illumination aperture 402 and annular illumination aperture 403, this method effectively raises a certain specific direction arrangement and has the resolution of the intensive figure of minimum space spacing by the off-axis illumination of two different sizes, reduced the live width size than the fluctuation in the large space pitch area, reduced forming the risk of forbidding the spatial separation zone.
But this hydridization illumination aperture is limited to the resolution effectiveness of the multi-direction spread geometry of balance, and only with the partial coherence factor sigma of two different sizes and two kinds of off-axis illuminations lacking dirigibility aspect the live width size of the various figures of balance and the process window, be difficult to the figure of different size is reached the optimised process balance.In addition, can also adopt the double exposure method of different size off-axis illumination aperture to remedy the problem that exposure is mated in the prior art, but the double exposure method can cause the increase of manufacturing cost, and cause the production quantum of output to descend.
Summary of the invention
Problem at above-mentioned existence, the invention provides a kind of photoetching process that strengthens the device of photolithographic process capability and utilize this device to carry out, lacking dirigibility to overcome in the prior art aspect the live width size of the various figures of balance and the process window, be difficult to the figure of different size is reached the problem of optimised process balance, simultaneously also overcome available technology adopting double exposure method and cause the increase of manufacturing cost, and the problem that causes the production quantum of output to descend.
To achieve these goals, the technical scheme taked of the present invention is:
A kind of device that strengthens photolithographic process capability is applied in the photoetching process of silicon chip, and described system comprises collector lens, and wherein, described system also comprises the annular of gray scale more than illumination aperture;
Described many gray scales annular illumination aperture is arranged at the pupil plane of described collector lens; Also be provided with level Four illumination combination on described many gray scales annular illumination aperture;
Wherein, described level Four illumination combination comprises four light holes.
The device of above-mentioned enhancing photolithographic process capability, wherein, described many gray scales annular illumination aperture is to have many gray scales annular illumination aperture that at least three kinds of different gray scale annulus distribute.
The device of above-mentioned enhancing photolithographic process capability, wherein, described light hole is the light hole with multiple intensity profile.
The device of above-mentioned enhancing photolithographic process capability, wherein, the difference of described gray scale is step difference or transition type difference.
The device of above-mentioned enhancing photolithographic process capability, wherein, the outer ring partial coherence coefficient of described many gray scales annular illumination aperture is σ
Out1, the inner round portion coefficient of coherence of described many gray scales annular illumination aperture is σ
In1
Wherein, described outer ring partial coherence factor sigma
Out1Be 0.7～0.9, described inner round portion coefficient of coherence σ
In1Be 0.3～0.5.
The device of above-mentioned enhancing photolithographic process capability, wherein, described light hole be shaped as part annulus, circle or oval.
The device of above-mentioned enhancing photolithographic process capability, wherein, four described light holes are arranged at ad-hoc location in described many gray scale illumination apertures according to process requirements, and each described light hole is all not overlapping.
The device of above-mentioned enhancing photolithographic process capability, wherein, the outer ring partial coherence coefficient of described level Four illumination combination is σ
Out2, the inner round portion coefficient of coherence of described level Four illumination combination is σ
In2
Wherein, described outer ring partial coherence factor sigma
Out2Be 0.7～0.9, described inner round portion coefficient of coherence σ
In2Be 0.5～0.7.
The device of above-mentioned enhancing photolithographic process capability, wherein, the opening angle of described level Four illumination combination is α, the orientation of described level Four illumination combination and the angle of relative direction are β;
Wherein, described opening angle α is 15 °～50 °, described angle β: α≤β≤180 °-α.
The photoetching process that a kind of device that utilizes above-mentioned enhancing photolithographic process capability carries out is applied to wherein, comprising in the photoetching process of silicon chip:
Regulate the correlation parameter of many gray scales annular illumination aperture according to process requirements;
Described many gray scales annular illumination aperture is placed the pupil plane of collector lens;
Incident ray by described many gray scales annular illumination aperture and collector lens after, form diffraction light at photomask place diffraction;
Described diffraction light forms final graphics through interfering behind the projecting lens in the photoresist that described silicon chip upper surface covers;
Continue follow-up curing and development operation, finish the photoetching process of described silicon chip;
Wherein, described many gray scales annular illumination aperture is provided with the level Four illumination combination that comprises four light holes.
Above-mentioned photoetching process, wherein, the correlation parameter of described many gray scales annular illumination aperture comprises: outer ring partial coherence factor sigma
Out1, inner round portion coefficient of coherence σ
In1With the annulus gray scale, and the outer ring partial coherence factor sigma of described level Four illumination combination
Out2, the inner round portion coefficient of coherence is σ
In2, opening angle α, orientation and relative direction angle β and light hole gray scale.
Above-mentioned photoetching process, wherein, described incident ray meets the exposure of process requirements by described many gray scales annular illumination aperture and collector lens with one.
Above-mentioned photoetching process, wherein, described incident light wavelength is: 436nm, 365nm, 248nm or 193nm.
Above-mentioned photoetching process, wherein, described incident light is the different gray scale photic zones by described many gray scales annular illumination aperture completely or partially.
Technique scheme has following advantage or beneficial effect:
The present invention passes through according to the photoetching process demand, adjust the outer ring partial coherence coefficient of many gray scales annular illumination aperture, the inner round portion coefficient of coherence, the outer ring partial coherence coefficient of annulus intensity profile and level Four illumination combination, the inner round portion coefficient of coherence, the light hole opening angle, light hole orientation and relative direction angle, the combination of light hole gray scale, thereby after making incident ray through this many gray scales annular illumination aperture, can expose to silicon chip surface with the exposure that meets process requirements, and then make the photoresist of silicon chip surface form final graphics, further finish photoetching process; The device of enhancing photolithographic process capability provided by the invention and the photoetching process of utilizing this device to carry out, can effectively improve synthetic resolution and the process window of various different size figures, balance the live width size of various different size figures, and avoided the problem that cost increases and quantum of output reduces of multiexposure, multiple exposure technology, and then improved production efficiency and reduced manufacturing cost, and improved the yield of device.
Description of drawings
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that the present invention and feature thereof, profile and advantage will become.Mark identical in whole accompanying drawings is indicated identical part.Painstakingly proportionally do not draw accompanying drawing, focus on illustrating purport of the present invention.
Fig. 1 is the structural representation of traditional photolithographic exposure system;
Fig. 2 is the plan structure synoptic diagram of circular iris among Fig. 1;
Fig. 3 is the structural representation that adopts the photolithographic exposure system of level Four off-axis illumination aperture;
Fig. 4 is the plan structure synoptic diagram of level Four off-axis illumination aperture;
Fig. 5 is the plan structure synoptic diagram of annular off-axis illumination aperture;
Fig. 6 is that the different spaces spacing of off-axis illumination aperture is to the synoptic diagram that influences of figure live width dimension difference;
Fig. 7 is the plan structure synoptic diagram that comprises the hydridization illumination aperture of bipolar illumination aperture and annular illumination aperture;
Fig. 8 is the structural representation of the device of the enhancing photolithographic process capability that provides of the embodiment of the invention;
Fig. 9 is the plan structure synoptic diagram of the many gray scales annular illumination aperture among Fig. 8 of providing of the embodiment of the invention;
Figure 10 is the schematic flow sheet that utilizes the photoetching process that the device among Fig. 8 carries out that the embodiment of the invention provides;
Figure 11 be adopt that the embodiment of the invention provides utilize the photoetching process that the device among Fig. 8 carries out the time, the different spaces spacing is to the synoptic diagram that influences of figure live width dimension difference.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing and specific embodiment, but not as restriction of the present invention.
Embodiment:
Fig. 8 is the structural representation of the device of the enhancing photolithographic process capability that provides of the embodiment of the invention; Fig. 9 is the plan structure synoptic diagram of the many gray scales annular illumination aperture among Fig. 8 of providing of the embodiment of the invention; Figure 10 is the schematic flow sheet that utilizes the photoetching process that the device among Fig. 8 carries out that the embodiment of the invention provides; As shown in the figure, the device that strengthens photolithographic process capability comprises collector lens 502 and projecting lens 504, also comprise many gray scales annular illumination aperture 501, and this many gray scales annular illumination aperture 501 is positioned at the pupil plane of collector lens 502, projecting lens 504 be positioned at collector lens 502 under, this many gray scales annular illumination aperture 501 is provided with level Four illumination combination, this level Four illumination combination simultaneously comprises four light holes 02, this light hole 02 is the light hole of many intensity profile, and these four light holes 02 are embedded in many gray scales annulus 01 of many gray scales annular illumination aperture.
Wherein, many gray scales annular illumination aperture that many gray scales annular illumination aperture 501 distributes for having three kinds of different gray scale annulus at least, namely many gray scales annulus 01 of this many gray scales annular illumination aperture 501 combines for the annulus with at least three kinds of different gray scales, and the difference of this gray scale is step difference or transition type difference, simultaneously, the outer ring partial coherence coefficient of many gray scales annular illumination aperture 501 is σ
Out1, σ
Out1Be 0.7～0.9, as 0.7,0.71,0.75,0.8,0.85,0.89,0.9 etc., the inner round portion coefficient of coherence of many gray scales annular illumination aperture 501 is σ
In1, σ
In1Be 0.3～0.5, as 0.3,0.31,0.33,0.38,0.43,0.48,0.5 etc.
In addition, above-mentioned light hole 02 be shaped as part annulus, circle or oval, light hole 02 is for having the light hole of multiple intensity profile or the light hole of pure printing opacity, when this light hole 02 was the light hole of multiple intensity profile, the difference of this gray scale was step difference or transition type difference; Simultaneously four light holes 02 is arranged at ad-hoc location in many gray scales illumination apertures according to process requirements, and each light hole 02 is all not overlapping, as be arranged in directions X and Y-direction or other any angular orientation, and the outer ring partial coherence coefficient of level Four illumination combination is σ
Out2, σ
Out2Be 0.7～0.9, as 0.7,0.72,0.78,0.83,0.88,0.9 etc., the inner round portion coefficient of coherence of this level Four illumination combination is σ
In2, σ
In2Be 0.5～0.7, as 0.5,0.51,0.55,0.59,0.63,0.68,0.7 etc., and the opening angle of this level Four illumination combination is α, α is 15 °～50 °, as 15 °, 20 °, 25 °, 30 °, 35 °, 40 °, 45 °, 50 ° etc., the orientation of level Four illumination combination and the angle of relative direction are β, and α≤β≤180 °-α, when α was 15 °, β was 15 °, 20 °, 35 °, 75 °, 95 °, 110 °, 128 °, 135 °, 145 °, 165 °, 175 ° etc.
The application also provides the device among a kind of Fig. 8 of utilization to carry out the method for photoetching process, referring to shown in Figure 10, when silicon chip 505 is carried out photoetching process, photomask 503 is positioned between collector lens 502 and the projecting lens 504, concrete distance is determined according to the photoetching process condition, then regulate the correlation parameter of many gray scales annular illumination aperture 501 according to process requirements, after incident light 500 passes through this many gray scales annular illumination aperture 501 and collector lens 502 with an exposure that meets process requirements, form diffraction light at photomask 503 place's diffraction, diffraction light forms figure through projecting lens 504 backs in the photoresist that silicon chip 505 upper surfaces cover, then carry out follow-up curing and development operation, thereby finish the photoetching process of described silicon chip 505.
Wherein, the correlation parameter of many gray scales annular illumination aperture comprises: outer ring partial coherence factor sigma
Out1, inner round portion coefficient of coherence σ
In1With the annulus gray scale, and the outer ring partial coherence factor sigma of level Four illumination combination
Out2, the inner round portion coefficient of coherence is σ
In2, the angle β of opening angle α, orientation and relative direction and light hole gray scale etc., simultaneously, the wavelength of incident light 500 is 436nm, 365nm, 248nm or 193nm, and incident light different gray scale photic zones by many gray scales annular illumination aperture completely or partially.
Figure 11 be adopt that the embodiment of the invention provides utilize the photoetching process that the device among Fig. 8 carries out the time, the different spaces spacing is to the synoptic diagram that influences of figure live width dimension difference; As shown in the figure, horizontal ordinate represents spatial separation, ordinate represents the difference of live width size, in many gray scales annular illumination aperture that the embodiment of the invention provides, when spatial separation is big, the difference of live width size is still less, thereby effectively improve synthetic resolution and the process window of the figure of various different sizes, balance the live width size of various different size figures, and avoided the problem that cost increases and quantum of output reduces of multiexposure, multiple exposure technology, and then improved production efficiency and reduced manufacturing cost, and improved the yield of device.
The embodiment of the invention is passed through according to the photoetching process demand, adjust the outer ring partial coherence coefficient of many gray scales annular illumination aperture, the inner round portion coefficient of coherence, the outer ring partial coherence coefficient of annulus intensity profile and level Four illumination combination, the inner round portion coefficient of coherence, the light hole opening angle, light hole orientation and relative direction angle, the combination of light hole gray scale, thereby after making incident ray through this many gray scales annular illumination aperture, can expose to silicon chip surface with the exposure that meets process requirements, and then make the photoresist of silicon chip surface form final graphics, further finish photoetching process; The device of enhancing photolithographic process capability provided by the invention and the photoetching process of utilizing this device to carry out, can effectively improve synthetic resolution and the process window of various different size figures, balance the live width size of various different size figures, and avoided the problem that cost increases and quantum of output reduces of multiexposure, multiple exposure technology, and then improved production efficiency and reduced manufacturing cost, and improved the yield of device.
In sum, the present invention passes through according to the photoetching process demand, adjust the outer ring partial coherence coefficient of many gray scales annular illumination aperture, the inner round portion coefficient of coherence, the outer ring partial coherence coefficient of annulus intensity profile and level Four illumination combination, the inner round portion coefficient of coherence, the light hole opening angle, light hole orientation and relative direction angle, the combination of light hole gray scale, thereby after making incident ray through this many gray scales annular illumination aperture, can expose to silicon chip surface with the exposure that meets process requirements, and then make the photoresist of silicon chip surface form final graphics, further finish photoetching process; The device of enhancing photolithographic process capability provided by the invention and the photoetching process of utilizing this device to carry out, can effectively improve synthetic resolution and the process window of various different size figures, balance the live width size of various different size figures, and avoided the problem that cost increases and quantum of output reduces of multiexposure, multiple exposure technology, and then improved production efficiency and reduced manufacturing cost, and improved the yield of device.
It should be appreciated by those skilled in the art that those skilled in the art can realize described variation example in conjunction with prior art and above-described embodiment, do not repeat them here.Such variation example does not influence flesh and blood of the present invention, does not repeat them here.
More than preferred embodiment of the present invention is described.It will be appreciated that the present invention is not limited to above-mentioned specific implementations, wherein the equipment of not describing in detail to the greatest extent and structure are construed as with the common mode in this area and are implemented; Any those of ordinary skill in the art, do not breaking away under the technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or being revised as the equivalent embodiment of equivalent variations, this does not influence flesh and blood of the present invention.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (14)
1. a device that strengthens photolithographic process capability is applied in the photoetching process of silicon chip, and described system comprises collector lens, it is characterized in that, described system also comprises the annular of gray scale more than illumination aperture;
Described many gray scales annular illumination aperture is arranged at the pupil plane of described collector lens; Also be provided with level Four illumination combination on described many gray scales annular illumination aperture;
Wherein, described level Four illumination combination comprises four light holes.
2. the device of enhancing photolithographic process capability as claimed in claim 1 is characterized in that, described many gray scales annular illumination aperture is to have many gray scales annular illumination aperture that at least three kinds of different gray scale annulus distribute.
3. the device of enhancing photolithographic process capability as claimed in claim 1 is characterized in that, described light hole is the light hole with multiple intensity profile.
4. as the device of any described enhancing photolithographic process capability in claim 2 or 3, it is characterized in that the difference of described gray scale is step difference or transition type difference.
5. the device of enhancing photolithographic process capability as claimed in claim 1 is characterized in that, the outer ring partial coherence coefficient of described many gray scales annular illumination aperture is σ
Out1, the inner round portion coefficient of coherence of described many gray scales annular illumination aperture is σ
In1
Wherein, described outer ring partial coherence factor sigma
Out1Be 0.7～0.9, described inner round portion coefficient of coherence σ
In1Be 0.3～0.5.
6. the device of enhancing photolithographic process capability as claimed in claim 1 is characterized in that, described light hole be shaped as part annulus, circle or oval.
7. will remove the device of 1 described enhancing photolithographic process capability as right, it is characterized in that, four described light holes are arranged at ad-hoc location in described many gray scale illumination apertures according to process requirements, and each described light hole is all not overlapping.
8. the device of enhancing photolithographic process capability as claimed in claim 1 is characterized in that, the outer ring partial coherence coefficient of described level Four illumination combination is σ
Out2, the inner round portion coefficient of coherence of described level Four illumination combination is σ
In2
Wherein, described outer ring partial coherence factor sigma
Out2Be 0.7～0.9, described inner round portion coefficient of coherence σ
In2Be 0.5～0.7.
9. the device of enhancing photolithographic process capability as claimed in claim 1 is characterized in that, the opening angle of described level Four illumination combination is α, and the orientation of described level Four illumination combination and the angle of relative direction are β;
Wherein, described opening angle α is 15 °～50 °.
10. the photoetching process that the device that utilizes enhancing photolithographic process capability as claimed in claim 1 carries out is applied to it is characterized in that in the photoetching process of silicon chip, comprising:
Regulate the correlation parameter of many gray scales annular illumination aperture according to process requirements;
Described many gray scales annular illumination aperture is placed the pupil plane of collector lens;
Incident ray by described many gray scales annular illumination aperture and collector lens after, form diffraction light at photomask place diffraction;
Described diffraction light forms final graphics through interfering behind the projecting lens in the photoresist that described silicon chip upper surface covers;
Continue follow-up curing and development operation, finish the photoetching process of described silicon chip;
Wherein, described many gray scales annular illumination aperture is provided with the level Four illumination combination that comprises four light holes.
11. photoetching process as claimed in claim 10 is characterized in that, the correlation parameter of described many gray scales annular illumination aperture comprises: outer ring partial coherence factor sigma
Out1, inner round portion coefficient of coherence σ
In1With the annulus gray scale, and the outer ring partial coherence factor sigma of described level Four illumination combination
Out2, the inner round portion coefficient of coherence is σ
In2, opening angle α, orientation and relative direction angle β and light hole gray scale.
12. photoetching process as claimed in claim 10 is characterized in that, described incident ray meets the exposure of process requirements by described many gray scales annular illumination aperture and collector lens with one.
13. photoetching process as claimed in claim 10 is characterized in that, described incident light wavelength is: 436nm, 365nm, 248nm or 193nm.
14. photoetching process as claimed in claim 10 is characterized in that, described incident light is the different gray scale photic zones by described many gray scales annular illumination aperture completely or partially.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4970546A (en) * | 1988-04-07 | 1990-11-13 | Nikon Corporation | Exposure control device |
| JPH08274021A (en) * | 1996-03-11 | 1996-10-18 | Nippon Telegr & Teleph Corp <Ntt> | Projection exposure device |
| CN1140493A (en) * | 1994-02-09 | 1997-01-15 | 米克鲁尼蒂系统工程公司 | Masks for lithographic patterning using off-axis illumination |
| EP0969327A2 (en) * | 1998-06-30 | 2000-01-05 | Canon Kabushiki Kaisha | Multiple exposure method |
| JP2002057081A (en) * | 2000-08-07 | 2002-02-22 | Nikon Corp | Illumination optical apparatus, exposure apparatus and exposure method |
| CN1673866A (en) * | 2004-03-26 | 2005-09-28 | 南亚科技股份有限公司 | Aperture disc applied for optical photoetching system |
| US20050214651A1 (en) * | 2004-03-25 | 2005-09-29 | Yuan-Hsun Wu | Aperture plate for optical lithography systems |
| JP2006278979A (en) * | 2005-03-30 | 2006-10-12 | Nikon Corp | Exposure method and apparatus, and device manufacturing method |
| CN1942828A (en) * | 2004-03-31 | 2007-04-04 | 英特尔公司 | Light source for photolithography |
| US20100165317A1 (en) * | 2008-12-30 | 2010-07-01 | Charles Wallace | Illumination aperture for optical lithography |
-
2013
- 2013-06-27 CN CN201310264730.8A patent/CN103336410B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4970546A (en) * | 1988-04-07 | 1990-11-13 | Nikon Corporation | Exposure control device |
| CN1140493A (en) * | 1994-02-09 | 1997-01-15 | 米克鲁尼蒂系统工程公司 | Masks for lithographic patterning using off-axis illumination |
| JPH08274021A (en) * | 1996-03-11 | 1996-10-18 | Nippon Telegr & Teleph Corp <Ntt> | Projection exposure device |
| EP0969327A2 (en) * | 1998-06-30 | 2000-01-05 | Canon Kabushiki Kaisha | Multiple exposure method |
| JP2002057081A (en) * | 2000-08-07 | 2002-02-22 | Nikon Corp | Illumination optical apparatus, exposure apparatus and exposure method |
| US20050214651A1 (en) * | 2004-03-25 | 2005-09-29 | Yuan-Hsun Wu | Aperture plate for optical lithography systems |
| CN1673866A (en) * | 2004-03-26 | 2005-09-28 | 南亚科技股份有限公司 | Aperture disc applied for optical photoetching system |
| CN1942828A (en) * | 2004-03-31 | 2007-04-04 | 英特尔公司 | Light source for photolithography |
| JP2006278979A (en) * | 2005-03-30 | 2006-10-12 | Nikon Corp | Exposure method and apparatus, and device manufacturing method |
| US20100165317A1 (en) * | 2008-12-30 | 2010-07-01 | Charles Wallace | Illumination aperture for optical lithography |
Non-Patent Citations (2)
| Title |
|---|
| LEW,M.,ET AL: "Interference of a four-hole aperture for on-chip quantitative two-dimensional differential phase imaging", 《OPTICS LETTERS》 * |
| 郭立萍等: "光学光刻中的离轴照明技术", 《激光杂志》 * |
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