CN103358028A - Method and system for scribing brittle ultrathin piece by water jet and laser - Google Patents
Method and system for scribing brittle ultrathin piece by water jet and laser Download PDFInfo
- Publication number
- CN103358028A CN103358028A CN2013102977562A CN201310297756A CN103358028A CN 103358028 A CN103358028 A CN 103358028A CN 2013102977562 A CN2013102977562 A CN 2013102977562A CN 201310297756 A CN201310297756 A CN 201310297756A CN 103358028 A CN103358028 A CN 103358028A
- Authority
- CN
- China
- Prior art keywords
- water
- laser
- workpiece
- laser beam
- jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a method and system for scribing a brittle ultrathin piece by a water jet and laser. According to the method, a laser beam penetrates through a water jet beam to focus on the surface of a workpiece; the distance between the center of the jet point, on the surface of the workpiece, of the water jet beam and the center of the focus point, on the surface of the workpiece, of the laser beam is equal to or smaller than 1-2.5 times the radius of the focus point, on the surface of the workpiece, of the laser beam. The distance between an intersection point I and an intersection point II is equal to or smaller than 1-2.5 times the radius of the focus point of the laser beam, wherein the intersection point I is the intersection point of the surface of the workpiece and the water jet beam generated by the jet nozzle of the system, and the intersection point II is the intersection point of the surface of the workpiece and the laser beam. The longitudinal center line of the jet nozzle coincides with the center line of the laser beam. A workbench is provided with a working cavity filled with water; a water layer with a thickness of 0.5-1.5 mm is arranged on the surface of the workpiece on the top surface of a boss at the top of the workbench; the overflow port of the working cavity is connected to a water tank; a water pump is used for pumping water in the water tank into the jet nozzle to generate the water jet. According to the invention, the laser is used for laser ablating and scribing, and the water jet beam is used for cooling and washing a processed area, so that the effect that a processed surface is free from recast layers, residual stress and micro cracks is achieved; the processing efficiency is improved.
Description
Technical field
The present invention relates to technical field of laser processing, be specially a kind of method and system of water jet laser grooving and scribing fragile material superthin section.
Background technology
For electronic product, the market trend of " light, thin, short, little ", the encapsulation of integrated circuit is encapsulated by the stacking-type of one chip being changed into multilayer chip.Stack 7-8 layer chip in the IC, the part of single layer of chips IC before the cumulative volume after the encapsulation is reduced to.Therefore the thickness of silicon chip wafer also reduces to 120 μ m by 650 μ m, the minimum 25 μ m that reached.Silicon chip was whole wafer-process before scribing, obtained the used single-chip of IC packaging process after the scribing.Because a little less than the increase of diameter wafer and the attenuation of thickness, the tension of wafer, crush resistance strength more and more, very responsive to mechanical external force, the fragmentation rate significantly increases during scribing.Simultaneously, circuit integrated on the chip unit are is more and more, and the cutting-up road of Gong cutting apart is less, generally only has about 30 μ m.Therefore, the range of work, machining accuracy, reliability and the stability of scribing equipment are all had higher requirement.
Tradition skive scribing process has reached the limit.For manufacturer, wafer cutting-up technology and process equipment become one of operation that technical difficulty and cost are the highest on the packaging line.In addition, the scribing of low-k material, the LED wafer take sapphire as substrate, aspect MEMS, there is more chip to need punching, opens the processing such as irregularly-shaped hole and local reduction, the chip cutting of compound chip, the chip that is covered with the diamond layer and complex micro structure etc., traditional diamond blade is all not competent.And the market demand sharp increase of these products forces industry to seek the solution of scribing of new generation.
Laser scribing still can be accepted in the quality of some low order application facet, but because of its excessive heat affected area, pollute large and the defective such as thermal deformation is serious, in the processing of integrated circuit is processed, be difficult to be approved.In recent years, Ultra-Violet Laser and femtosecond laser scribing technology have obviously been improved fuel factor and have been improved cut quality.
In all kinds of laser solutions, that the most outstanding is world patent-Switzerland's Laser MicroJet technology (Laser Micro Jet), and this method is to import than hair also in thin little water column water column guiding light beam, light beam total reflection on the gas-liquid interface behind the Laser Focusing.Water cooling workpiece during Laser Processing, performance is excellent aspect the elimination laser thermal effect.Laser MicroJet scribing technology is a lot of extensive uses of high and new technology field abroad.But, be difficult to control in its equipment and make the laser beam of focusing aim at little water column, careless slightly will cause ablating damage the nozzle that produces water column.The depth-to-width ratio of nozzle requires to reach 20, the aperture is minimum, and makes material and be not easy to obtain, and the attrition component nozzle has improved the use cost of this kind method.To be converted to the stable little water column of low-voltage high speed by water cavity also be very rambunctious to the high pressure low speed water in addition, the optical length of light beam in water column, and the energy loss of stimulated Raman scattering is large.These technological difficulties have caused the Laser MicroJet equipment price expensive, and equipment maintenance cost is high, has greatly limited the application of this technology.
For this reason, the people such as doctor Richerzhagen has studied the Compound Machining of Water Jet Guided Laser microfabrication and diamond cut in recent years, has explored the method for gathering two kinds of performance of technical process advantages, but more complicated because of equipment, is difficult to practical application.
Summary of the invention
The objective of the invention is to design a kind of method of water jet laser grooving and scribing fragile material superthin section, laser beam focuses on surface of the work, and Water projectile is equal to or less than laser beam at 1～2.5 times of surface of the work focus point radius in spray site center and the distance of laser beam at the focus point center of surface of the work of surface of the work.Water projectile cools off laser processing zone, and washes away and reduce recast layer, obtains finished surface without recast layer, without residual stress, non-microcracked " three without " processing effect.
Another object of the present invention is the system of a kind of water jet laser grooving and scribing fragile material superthin section of design, comprise laser controlling unit, pulse laser and condenser lens and workbench, also has water jet nozzle, laser beam passes Water projectile, the delineation of the fragile material superthin section of high-quality and efficient again free of surface defects is finished in Water projectile cooling laser bundle processing district.
The method of the water jet laser grooving and scribing fragile material superthin section of the present invention's design, laser beam focuses on surface of the work and processes, laser beam of the present invention passes Water projectile, focuses on surface of the work, and Water projectile is equal to or less than laser beam at 1～2.5 times of surface of the work focus point radius in spray site center and the distance of laser beam at the focus point center of surface of the work of surface of the work.
Laser beam passes Water projectile, focusing on surface of the work processes, joining because of Water projectile and surface of the work, be that spray site and the laser beam of Water projectile is close or overlap at the focus point of surface of the work, water jet at a high speed is to cooling and the souring of laser processing zone, reduced the recast layer of laser processing zone, made the finished surface of workpiece without recast layer, without residual stress, non-microcracked.After laser beam passes Water projectile, focus at surface of the work, laser beam can not damage jet nozzle.
Method according to above-mentioned water jet laser grooving and scribing fragile material superthin section, the system of the water jet laser grooving and scribing fragile material superthin section of the present invention's design, comprise laser controlling unit, pulse laser and condenser lens, the laser controlling unit connects, the control impuls laser instrument, the laser beam line focus lens focus that pulse laser sends, workpiece is fixed on the workbench, and workbench is equipped with workbench X-axis driving mechanism and workbench Y-axis driving mechanism.Laser beam line focus lens focus is in surface of the work.Also comprise jet nozzle, the Water projectile of its generation is equal to or less than laser beam at 1～2.5 times of surface of the work focus point radius in spray site center and the distance of laser beam at the focus point center of surface of the work of surface of the work.
Described jet nozzle injection diameter is the mm magnitude.
The longitudinal centre line of described water jet and laser beam central lines, laser beam line focus lens, pass and pass water jet behind the spray orifice of jet nozzle, focus on surface of the work, laser beam is at the focus point center of surface of the work and the Water projectile spray site center superposition at surface of the work.
The water of described water jet is ultra-pure water, and described ultra-pure water is deionized water or distilled water.
There is the working chamber of dress water the workbench top, and the boss of bench-top is positioned at working chamber, and the surface of the work of workbench boss end face is lower than the water surface 0.5～1.5mm in the working chamber, and namely surface of the work has the water layer of 0.5～1.5mm.
Working chamber has overfall, and the minimum point of overfall is higher than surface of the work 0.5～1.5mm on the workbench, with the water depth on holding workpiece surface.
The overfall of working chamber accesses the pond through overflow pipe, and storage produces the water of jet in the pond, and the import of water pump accesses in the pond, draws the water in the pond through filter, exit of pump access jet nozzle, and the press water that pumps produces water jet through jet nozzle.
Described exit of pump accesses jet nozzle through ball valve, and ball valve is equivalent to cock, and opening the ball valve water pump can be to jet nozzle force feed water.
Described exit of pump is through an end of threeway connection pressure regulating overflow valve, and the other end of pressure regulating overflow valve connects jet nozzle, and the 3rd end takes back the pond through the overflow surge pipe.Regulate the hydraulic pressure that pressure regulating overflow valve adjustable water pump is transported to jet nozzle, thus the water jet jet velocity of regulating jet nozzle.The water jet jet velocity is adjusted according to the thickness of the material of processing.
X-axis servomotor and Y-axis servomotor be connecting working table X-axis driving mechanism and workbench Y-axis driving mechanism respectively, and X-axis servomotor and Y-axis servomotor all are connected with computer.
Workpiece is fixed in workbench boss end face during the use of the system of this water jet laser grooving and scribing fragile material superthin section, is in the laser beam focal zone, regulates the overfall height of working chamber, and making the surface of the work water depth is 0.5～1.5mm;
Confirm that pipeline is unimpeded, open ball valve, open water pump, regulate pressure regulating overflow valve, make water produce the stable Water projectile of high speed through jet nozzle, and make Water projectile be equal to or less than 1～2.5 times of laser beam focus point radius in the spray site center of surface of the work and the distance of laser beam at the focus point center of surface of the work;
Regulate the laser controlling unit, the control impuls laser instrument produces laser beam, regulate condenser lens, laser beam focuses on surface of the work, X-axis servomotor and Y-axis servomotor drive respectively workbench X-axis driving mechanism and workbench Y-axis driving mechanism, it is mobile in X-axis and Y-axis to drive workbench, the laser beam that focuses on carries out the etching scribing to the surface of the work on the workbench by set path, meanwhile, Water projectile cools off workpiece 6 surface laser processing districts, wash away, avoid producing recast layer, the water layer of surface of the work further cools off, reduce the temperature difference on the slice work-piece, reach the finished surface of scribing without recast layer, without residual stress, non-microcracked " three nothings " processing effect.
The water pressure that described water pump is sent into jet nozzle is 0.3Mpa～1Mpa.
Compared with prior art, the advantage of the method and system of water jet laser grooving and scribing fragile material superthin section of the present invention is: 1, the stable Water projectile that sprays carries out the Laser Processing scribe region is cooled off, the cooling effect of water can be eliminated heat affecting, eliminates residual stress and micro-crack; Also can take away molten drop and wash away at a high speed, can effectively stop the generation of recast layer, improve the scribing yields of fragile material; 2, guaranteed that the jet beam spray site overlaps or be bordering on coincidence with the laser beam focus point fully in the scribing position of surface of the work, the scribing surface quality had both been optimized in the Compound Machining effect of the laser scribing of water jet, had improved again working (machining) efficiency; Be particularly suitable for the scribing of the ultra thin silicon wafers of electron trade; 3, laser beam just focuses on after passing through Water projectile, the damage jet nozzle of can not ablating, and the light path of laser beam in water is short, and water is minimum to Optical Absorption, and the laser energy loss is few; 4, system architecture is simple, is easy to install, overhaul, and is easy to operate, is suitable for applying.
Description of drawings
Fig. 1 is the structural representation of the method and system embodiment 1 of this water jet laser grooving and scribing fragile material superthin section;
Fig. 2 is the structural representation of the method and system embodiment 2 of this water jet laser grooving and scribing fragile material superthin section.
The figure internal label is:
1, laser controlling unit, 2, pulse laser, 3, speculum, 4, condenser lens, 5, jet nozzle, 6, workpiece, 7, working chamber, 8, workbench, 9, the pond, 10, filter, 11, pressure regulating overflow valve, 12, water pump, 13, ball valve.
The specific embodiment
The method and system embodiment 1 of water jet laser grooving and scribing fragile material superthin section
This routine water is deionized water.
The overfall of working chamber 7 is through overflow pipe access pond 9, pond 9 interior storages produce the deionized water of jet, the import of water pump 12 is through the deionized water in the filter 10 access ponds 9, in the absorption pond 9, and water pump 12 outlets produce Water projectile through ball valve 13 access jet nozzles 5 by jet nozzle 5.These routine jet nozzle 5 injection diameters are 3mm.
Also through three ends that connect pressure regulating overflow valve 11, the other end of pressure regulating overflow valve 11 takes back pond 12 through the overflow surge pipe to 12 outlets of described water pump.
The method of the water jet laser grooving and scribing fragile material superthin section that this is routine is, laser beam focuses on workpiece 6 surfaces, the focus point radius is 25 μ m, Water projectile is 20 μ m in spray site center and the distance of laser beam at the focus point center on workpiece 6 surfaces on workpiece 6 surfaces, less than laser beam at surface of the work focus point radius.As seen from Figure 1, the Water projectile that laser passes side direction incident arrives surface of the work, can not damage jet nozzle.The center line of laser beam becomes 60 degree angles in this example with the center line of Water projectile, but the intersection point of the two and workpiece interface only is 20 μ m.Water projectile cools off fully and washes away laser processing zone, guarantees the quality of Laser Processing face.
These routine pulse laser 2 running parameters are: laser power 50W, laser repetition rate 100Hz.Workpiece 6 be thickness less than the ultra thin silicon wafers of 150 μ m, scribing live width≤50 μ m, maximum scribing speed reaches 150mm/s.With Powerful Light Microscope and collecting image of computer system the ultra thin silicon wafers of delineating is carried out Analysis of Surface Topography, adopt the surface profile tester to measure etching depth, detect, the delineation gained without recast layer, reach 85% without the ratio of residual stress, non-microcracked ultra thin silicon wafers non-defective unit.
The method and system embodiment 2 of water jet laser grooving and scribing fragile material superthin section
These routine jet nozzle 5 injection diameters are 3mm.
The water of this routine water jet is distilled water.
The method of the water jet laser grooving and scribing fragile material superthin section that this is routine is, the center line of Water projectile and laser beam central lines, and Water projectile is at the spray site center of surface of the work and the laser beam focus point center superposition at surface of the work.
The distilled water pressure that water pump 12 is sent into jet nozzle 5 is 1.5Mpa.Pulse laser 2 running parameters are: laser power 50W, laser repetition rate 200Hz.Workpiece 6 is the following ultra thin silicon wafers of thickness 150 μ m, scribing live width≤50 μ m, and maximum scribing speed reaches 150mm/s.The yields that this routine result delineates ultra thin silicon wafers reaches 85%.
Above-described embodiment only is the specific case that purpose of the present invention, technical scheme and beneficial effect are further described, and the present invention is defined in this.All any modifications of within scope of disclosure of the present invention, making, be equal to replacement, improvement etc., all be included within protection scope of the present invention.
Claims (10)
1. the method for water jet laser grooving and scribing fragile material superthin section, laser beam focuses on surface of the work and processes, and it is characterized in that:
Described laser beam passes Water projectile, focuses on surface of the work, and Water projectile is equal to or less than laser beam at 1～2.5 times of surface of the work focus point radius in spray site center and the distance of laser beam at the focus point center of surface of the work of surface of the work.
2. the system of the water jet laser grooving and scribing fragile material superthin section of the method for water jet laser grooving and scribing fragile material superthin section design according to claim 1, comprise laser controlling unit, pulse laser and condenser lens, the laser controlling unit connects, the control impuls laser instrument, the laser beam line focus lens focus that pulse laser sends, workpiece is fixed on the workbench, and workbench is equipped with workbench X-axis driving mechanism and workbench Y-axis driving mechanism; It is characterized in that:
Described laser beam line focus lens (4) focus on workpiece (6) surface; Also comprise jet nozzle (5), the Water projectile of its generation is equal to or less than laser beam at 1～2.5 times of the surperficial focus point radius of workpiece (6) in spray site center and the distance of laser beam at the focus point center on workpiece (6) surface on workpiece (6) surface.
3. the system of water jet laser grooving and scribing fragile material superthin section according to claim 2 is characterized in that:
The longitudinal centre line of described water jet and laser beam central lines, laser beam line focus lens (4), pass pass water jet behind the spray orifice of jet nozzle (5), (6) surface that focuses on workpiece, laser beam is at the focus point center on workpiece (6) surface and the Water projectile spray site center superposition on workpiece (6) surface.
4. it is characterized in that according to claim 2 or the system of 3 described water jet laser grooving and scribing fragile material superthin sections:
Described jet nozzle (5) injection diameter is the mm magnitude.
5. it is characterized in that according to claim 2 or the system of 3 described water jet laser grooving and scribing fragile material superthin sections:
The water of described water jet is ultra-pure water, and described ultra-pure water is deionized water or distilled water.
6. it is characterized in that according to claim 2 or the system of 3 described water jet laser grooving and scribing fragile material superthin sections:
There is the working chamber (7) that water is housed described workbench (8) top, and the boss at workbench (8) top is positioned at working chamber (7), and workpiece (6) surface of workbench (8) boss end face is lower than the interior water surface 0.5mm～1.5mm of working chamber (7).
7. the system of water jet laser grooving and scribing fragile material superthin section according to claim 6 is characterized in that:
Described working chamber (7) has overfall, and the minimum point of overfall is higher than the upper surperficial 0.5mm～1.5mm of workpiece (6) of workbench (8).
8. the system of water jet laser grooving and scribing fragile material superthin section according to claim 7 is characterized in that:
The overfall of described working chamber (7) accesses pond (9) through overflow pipe, and storage produces the water of jet in pond (9), and the import of water pump (12) accesses in the pond (9) through filter (10), water pump (12) outlet access jet nozzle (5).
9. the system of water jet laser grooving and scribing fragile material superthin section according to claim 8 is characterized in that:
Described water pump (12) outlet is through ball valve (13) access jet nozzle (5).
10. the system of water jet laser grooving and scribing fragile material superthin section according to claim 9 is characterized in that:
Described water pump (12) outlet is through three ends that connect pressure regulating overflow valve (11), and the other end of pressure regulating overflow valve (11) takes back pond (9) through the overflow surge pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102977562A CN103358028A (en) | 2013-07-16 | 2013-07-16 | Method and system for scribing brittle ultrathin piece by water jet and laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102977562A CN103358028A (en) | 2013-07-16 | 2013-07-16 | Method and system for scribing brittle ultrathin piece by water jet and laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103358028A true CN103358028A (en) | 2013-10-23 |
Family
ID=49360754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102977562A Pending CN103358028A (en) | 2013-07-16 | 2013-07-16 | Method and system for scribing brittle ultrathin piece by water jet and laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103358028A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104493365A (en) * | 2014-12-15 | 2015-04-08 | 江南大学 | Water jet and laser etching machine and method for ceramics |
| CN104551393A (en) * | 2015-01-19 | 2015-04-29 | 桂林电子科技大学 | Liquid film protecting laser processing system and method |
| CN105195903A (en) * | 2015-10-21 | 2015-12-30 | 北京中科思远光电科技有限公司 | Laser microjet processing device for perforating turbine blade |
| CN108449937A (en) * | 2015-12-29 | 2018-08-24 | Eo科技股份有限公司 | Laser processing apparatus and laser processing method |
| CN108526091A (en) * | 2018-04-12 | 2018-09-14 | 桂林电子科技大学 | A kind of jet stream laser compound cleaning method and cleaning system |
| CN109483060A (en) * | 2018-11-23 | 2019-03-19 | 上海交通大学 | Air film hole ultrafast laser processing unit (plant) and method under water jet environment |
| CN109514078A (en) * | 2019-01-09 | 2019-03-26 | 桂林电子科技大学 | Water jet auxiliary laser system of processing and method |
| CN109551103A (en) * | 2018-12-27 | 2019-04-02 | 桂林电子科技大学 | Water Jet Guided Laser processing unit (plant) and method |
| CN110549500A (en) * | 2019-09-03 | 2019-12-10 | 安徽科信矿山机械制造有限公司 | Drilling machine that stone material surface machining used |
| CN110788483A (en) * | 2019-10-30 | 2020-02-14 | 上海润势科技有限公司 | Low-temperature cutting method and device suitable for HIT battery |
| CN111432976A (en) * | 2017-12-04 | 2020-07-17 | 辛诺瓦有限公司 | Device for 3D shaping of a workpiece by means of a fluid jet guided laser beam |
| CN111940907A (en) * | 2020-07-28 | 2020-11-17 | 南京理工大学 | Device and method for preparing micro-nano structure by flowing water assisted ultrafast laser |
| CN111940895A (en) * | 2019-05-16 | 2020-11-17 | 南京农业大学 | Method and device for micromachining liquid plasma through laser induction based on flowing water layer |
| CN112775563A (en) * | 2020-12-18 | 2021-05-11 | 成都中创光科科技有限公司 | Unidirectional four-time bidirectional eight-stage step cutting process for silicon carbide wafer |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5902499A (en) * | 1994-05-30 | 1999-05-11 | Richerzhagen; Bernold | Method and apparatus for machining material with a liquid-guided laser beam |
| CN101508060A (en) * | 2009-03-20 | 2009-08-19 | 厦门大学 | Micro laser beam precise finishing optical device |
| CN102248293A (en) * | 2011-07-08 | 2011-11-23 | 厦门大学 | Rotary adjustable water waveguide laser processing device |
| CN102528280A (en) * | 2012-01-16 | 2012-07-04 | 山东大学 | Laser-water jet composite micromachining process and device |
| CN202506971U (en) * | 2012-01-19 | 2012-10-31 | 昆山思拓机器有限公司 | Coaxial water-jet device for laser micromachining on thin-wall tubing |
| CN202506983U (en) * | 2012-01-19 | 2012-10-31 | 昆山思拓机器有限公司 | Laser cutting machine with coaxial water-jet structure |
| CN103071933A (en) * | 2013-01-18 | 2013-05-01 | 江南大学 | Laser composite ceramic cutting device and method |
-
2013
- 2013-07-16 CN CN2013102977562A patent/CN103358028A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5902499A (en) * | 1994-05-30 | 1999-05-11 | Richerzhagen; Bernold | Method and apparatus for machining material with a liquid-guided laser beam |
| CN101508060A (en) * | 2009-03-20 | 2009-08-19 | 厦门大学 | Micro laser beam precise finishing optical device |
| CN102248293A (en) * | 2011-07-08 | 2011-11-23 | 厦门大学 | Rotary adjustable water waveguide laser processing device |
| CN102528280A (en) * | 2012-01-16 | 2012-07-04 | 山东大学 | Laser-water jet composite micromachining process and device |
| CN202506971U (en) * | 2012-01-19 | 2012-10-31 | 昆山思拓机器有限公司 | Coaxial water-jet device for laser micromachining on thin-wall tubing |
| CN202506983U (en) * | 2012-01-19 | 2012-10-31 | 昆山思拓机器有限公司 | Laser cutting machine with coaxial water-jet structure |
| CN103071933A (en) * | 2013-01-18 | 2013-05-01 | 江南大学 | Laser composite ceramic cutting device and method |
Non-Patent Citations (1)
| Title |
|---|
| 陈雪辉等: ""水射流辅助激光刻蚀Al2O3陶瓷的试验研究"", 《中国机械工程》, vol. 24, no. 12, 30 June 2013 (2013-06-30) * |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104493365A (en) * | 2014-12-15 | 2015-04-08 | 江南大学 | Water jet and laser etching machine and method for ceramics |
| CN104551393A (en) * | 2015-01-19 | 2015-04-29 | 桂林电子科技大学 | Liquid film protecting laser processing system and method |
| CN105195903A (en) * | 2015-10-21 | 2015-12-30 | 北京中科思远光电科技有限公司 | Laser microjet processing device for perforating turbine blade |
| CN108449937A (en) * | 2015-12-29 | 2018-08-24 | Eo科技股份有限公司 | Laser processing apparatus and laser processing method |
| CN111432976A (en) * | 2017-12-04 | 2020-07-17 | 辛诺瓦有限公司 | Device for 3D shaping of a workpiece by means of a fluid jet guided laser beam |
| CN108526091A (en) * | 2018-04-12 | 2018-09-14 | 桂林电子科技大学 | A kind of jet stream laser compound cleaning method and cleaning system |
| CN108526091B (en) * | 2018-04-12 | 2023-09-19 | 桂林电子科技大学 | Jet laser composite cleaning method and cleaning system |
| CN109483060A (en) * | 2018-11-23 | 2019-03-19 | 上海交通大学 | Air film hole ultrafast laser processing unit (plant) and method under water jet environment |
| CN109551103A (en) * | 2018-12-27 | 2019-04-02 | 桂林电子科技大学 | Water Jet Guided Laser processing unit (plant) and method |
| CN109551103B (en) * | 2018-12-27 | 2023-04-11 | 桂林电子科技大学 | Water-guided laser processing device and method |
| CN109514078A (en) * | 2019-01-09 | 2019-03-26 | 桂林电子科技大学 | Water jet auxiliary laser system of processing and method |
| CN111940895A (en) * | 2019-05-16 | 2020-11-17 | 南京农业大学 | Method and device for micromachining liquid plasma through laser induction based on flowing water layer |
| CN110549500A (en) * | 2019-09-03 | 2019-12-10 | 安徽科信矿山机械制造有限公司 | Drilling machine that stone material surface machining used |
| CN110788483B (en) * | 2019-10-30 | 2021-10-01 | 上海润势科技有限公司 | Low-temperature cutting method and device suitable for HIT battery |
| CN110788483A (en) * | 2019-10-30 | 2020-02-14 | 上海润势科技有限公司 | Low-temperature cutting method and device suitable for HIT battery |
| CN111940907A (en) * | 2020-07-28 | 2020-11-17 | 南京理工大学 | Device and method for preparing micro-nano structure by flowing water assisted ultrafast laser |
| CN112775563A (en) * | 2020-12-18 | 2021-05-11 | 成都中创光科科技有限公司 | Unidirectional four-time bidirectional eight-stage step cutting process for silicon carbide wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103358028A (en) | Method and system for scribing brittle ultrathin piece by water jet and laser | |
| CN203390389U (en) | System for etching fragile material ultrathin sheet with water jet and laser | |
| CN105195903B (en) | A kind of micro- water knife processing unit (plant) of laser punched for turbo blade | |
| CN104551393B (en) | A kind of laser-processing system of liquid film protection and method | |
| CN109551103B (en) | Water-guided laser processing device and method | |
| CN103468925B (en) | Laser shock peening method and device of bottom plane of blade tenon groove of airplane | |
| CN113751900B (en) | Water-guided laser drilling system and method | |
| CN102500928A (en) | Micro-water-column guiding laser micromachining device | |
| CN110125532B (en) | Method, system and equipment for processing workpiece by water-guided laser | |
| CN108526091A (en) | A kind of jet stream laser compound cleaning method and cleaning system | |
| CN113333967A (en) | Splitting method and splitting device for laser cutting of glass | |
| CN103317234A (en) | Laser induced low pressure jet flow combined etching processing method and device | |
| CN110227884A (en) | Water Jet Guided Laser system of processing and method based on salt free ligands light path design | |
| Feng et al. | Investigation and modelling of hybrid laser-waterjet micromachining of single crystal SiC wafers using response surface methodology | |
| CN104526892A (en) | Wafer cutting device | |
| CN102248293B (en) | Rotary adjustable water waveguide laser processing device | |
| CN102229466A (en) | Method and device for performing nano-second laser cutting on glass | |
| CN110125540A (en) | A kind of method, system and its equipment of water guiding laser processing workpiece | |
| CN114043073A (en) | Water-assisted laser processing system and method based on acoustic signal real-time monitoring | |
| CN105772955A (en) | Device and method for improving taper of through hole through liquid scattering | |
| CN102381682B (en) | Method and device for preparing silicon-based three-dimensional (3D) microstructure | |
| JP4123390B2 (en) | Hybrid machining apparatus and hybrid machining method | |
| CN208662839U (en) | A kind of Water Jet Guided Laser system of processing | |
| CN102248294B (en) | Array type water waveguide laser processing device | |
| CN106541213A (en) | A kind of water jet and laser coupled timber cutting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131023 |